CN104049311A - Optical-communication-module assembly device - Google Patents
Optical-communication-module assembly device Download PDFInfo
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- CN104049311A CN104049311A CN201310075944.0A CN201310075944A CN104049311A CN 104049311 A CN104049311 A CN 104049311A CN 201310075944 A CN201310075944 A CN 201310075944A CN 104049311 A CN104049311 A CN 104049311A
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- assembly device
- communication module
- optical communication
- module group
- group assembly
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Abstract
Disclosed is an optical-communication-module assembly device which is used for coating glue to a substrate. Electronic elements are arranged on the substrate. The optical-communication-module assembly device includes at least one image sensing unit and a dispensing needle which coats the glue surrounding the peripheries of the electronic elements. The image sensing units are used for sensing the glue outlet quantity of the dispensing needle.
Description
Technical field
The present invention is about a kind of optical communication module, especially a kind of optical communication module group assembly device.
Background technology
Optical communication module generally comprises substrate, is arranged at electronic component (light-emitting component and light receiving element) and lens unit on substrate, and electronic component scioptics unit transmitting-receiving light, that is to say that electronic component need align with lens unit.
At present, electronic component mainly bonds by conducting resinl and is electrically connected substrate, and lens unit is fixed on the optically-coupled with electronic component with realization on substrate by glue the location structure on substrate equally.When fixed lens, first apply glue in the periphery of electronic component, then lens are fixed on glue, in some glue process, due to glue quantity difference everywhere, thereby make lens produce the phenomenon of inclination, so that cannot accurately aim at and cause yield low between lens unit and electronic component.
Summary of the invention
In view of this, be necessary to provide a kind of optical communication module group assembly device that improves assembling yield.
A kind of optical communication module group assembly device, be used for glue application to substrate, on described substrate, be provided with electronic component, described optical communication module group assembly device comprises at least one image sensing unit and dispensing needle head, described dispensing needle head is the surrounding in described electronic component periphery by glue application, and described image sensing unit is used for the gel quantity of dispensing needle head described in sensing.
Compared to prior art, the optical communication module group assembly device of the present embodiment utilizes the gel quantity of image sensing unit acquisition point needle head, and judge according to the image obtaining whether gel quantity meets the requirements, then whether reference mark needle head continues to export glue, whether detect in real time glue meets the requirements, thereby the amount that makes the glue at every place is identical, run-off the straight when optical communication module can not make lens unit be fixed on substrate because of glue inhomogeneous, to improve the assembling yield of optical communication module.
Brief description of the drawings
Fig. 1 is the schematic perspective view of embodiment of the present invention optical communication module group assembly device.
Fig. 2 is the principle schematic of embodiment of the present invention optical communication module group assembly device.
Main element symbol description
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1 and Fig. 2, the optical communication module group assembly device 10 that the embodiment of the present invention provides is used for glue 110 to be applied on substrate 20 so that lens unit (not shown) is fixed on substrate 20, so with substrate 20 on electronic component 30 optically-coupled.Substrate 20 can be circuit board, for example, and hard circuit board or flexible PCB.Electronic component 30 comprises light-emitting component 31 and photoelectric detector 32, light-emitting component 31 can be light emitting diode (Light Emitting Diode, LED) or laser diode (Laser Diode, LD), photoelectric detector 32 can be photodiode (Photo Diode, PD).
Optical communication module group assembly device 10 comprises dispensing needle head 11, image sensing unit 12, processing unit 13 and a driver element 14.Dispensing needle head 11 is used for glue 110 to be coated on the substrate 20 of electronic component 30 peripheral surroundings.Image sensing unit 12 is used for the image of glue 110 on acquisition point needle head 11, image sensing unit 12 can adopt charge-coupled device (CCD) (charge-coupled device, or CMOS (complementary metal-oxide semiconductor CCD), CMOS), processing unit 13 process image that image sensing unit 12 obtains be used for the glue 110 that reference mark needle head 11 exports amount and control driver element 14 transfer point needle heads 11.Driver element 14 can make dispensing needle head 11 relative substrate 20 all arounds, move up and down to change the relative position relation between dispensing needle head 11 and substrate 20.
For the amount of the glue 110 that accurately judging point needle head 11 is exported in everywhere, in other embodiments, image sensing unit 12 can be two, three or four etc., and whether the image that processing unit 13 is exported in conjunction with multiple image sensing units 12 meets the requirements with the gel quantity of judging point needle head 11.In the time that image sensing unit 12 is two, be separately positioned on the both sides that substrate 20 is relative; In the time that image sensing unit 12 is four, in the surrounding of substrate 20, an image sensing unit 12 is respectively set respectively.
The identification region of image sensing unit 12 is that the region, electronic component 30 at electronic component 30 places needs the region between region and dispensing needle head 11 and the substrate 20 of glue coating 110 around.The image of the glue 110 that image sensing unit 12 Real-time Obtaining dispensing needle heads 11 are exported is also exported to processing unit 13 in real time by image signal.
Processing unit 13 is connected to process in real time image signal that image sensing unit 12 exports and according to the gel quantity of result reference mark needle head 11 with control driver element 14 transfer point needle heads 11 with image sensing unit 12.In the time that found that of processing of processing unit 13 image signal that image sensing unit 12 obtains shows that the amount of glue 110 meets the requirements, processing unit 13 reference mark needle heads 11 stop exporting glue 110, because gel quantity meets the requirements, so processing unit 13 just together with time control driver element 14 to the direction transfer point needle head 11 away from substrate 20 or need to put the position transfer point needle head 11 of glue to the next one.
The built-in preset pattern of processing unit 13, the image of the corresponding satisfactory glue 110 of this pattern, the pie chart sample of for example certain diameter.Pattern and the preset pattern of the glue 110 that the dispensing needle head 11 that processing unit 13 is obtained image sensing unit 12 is exported compare, if both identical or errors within the specific limits, the amount that the glue 110 that dispensing needle head 11 exports is described meets the requirements, otherwise, undesirable.
Optical communication module group assembly device 10 utilizes the gel quantity of image sensing unit 12 acquisition point needle heads 11, and judge according to the image obtaining whether gel quantity meets the requirements, then whether reference mark needle head 11 continues to export glue 110, whether detect in real time glue 110 meets the requirements, thereby it is identical making the amount of the glue 110 at every place, run-off the straight when optical communication module can not make lens unit be fixed on substrate 20 because of glue 110 inhomogeneous, and then improve the assembling yield of optical communication module.
Be understandable that, those skilled in the art also can do other variation etc. and be used in design of the present invention in spirit of the present invention, as long as it does not depart from technique effect of the present invention and all can.The variation that these do according to spirit of the present invention, within all should being included in the present invention's scope required for protection.
Claims (9)
1. an optical communication module group assembly device, be used for glue application to substrate, on described substrate, be provided with electronic component, described optical communication module group assembly device comprises at least one image sensing unit and dispensing needle head, described dispensing needle head is the surrounding in described electronic component periphery by glue application, and the image of the glue of the output that described image sensing unit is used for obtaining described dispensing needle head also judges gel quantity.
2. optical communication module group assembly device as claimed in claim 1, it is characterized in that, described apparatus for assembling further comprises processing unit, described processing unit is connected with described image sensing unit, receives and process the image signal of described image sensing unit output to control the gel quantity of described dispensing needle head.
3. optical communication module group assembly device as claimed in claim 2, it is characterized in that, described apparatus for assembling further comprises driver element, and described driver element moves described dispensing needle head to change the distance between described dispensing needle head and described substrate under the control of described processing unit.
4. optical communication module group assembly device as claimed in claim 1, is characterized in that, described electronic component comprises light-emitting component and photoelectric detector.
5. optical communication module group assembly device as claimed in claim 4, is characterized in that, described light-emitting component is light emitting diode or laser diode.
6. optical communication module group assembly device as claimed in claim 1, is characterized in that, described at least one image sensing unit is four, lays respectively at the four direction of described substrate.
7. optical communication module group assembly device as claimed in claim 1, is characterized in that, described image sensing unit is CCD sensor or CMOS sensor.
8. the optical communication module group assembly device as described in as arbitrary in claim 1-7, is characterized in that, described substrate is circuit board.
9. optical communication module group assembly device as claimed in claim 8, is characterized in that, described substrate is hard circuit board or flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310075944.0A CN104049311A (en) | 2013-03-11 | 2013-03-11 | Optical-communication-module assembly device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310075944.0A CN104049311A (en) | 2013-03-11 | 2013-03-11 | Optical-communication-module assembly device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104049311A true CN104049311A (en) | 2014-09-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310075944.0A Pending CN104049311A (en) | 2013-03-11 | 2013-03-11 | Optical-communication-module assembly device |
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| CN (1) | CN104049311A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104932077A (en) * | 2015-03-19 | 2015-09-23 | 南昌欧菲光电技术有限公司 | Shooting module assembling device and shooting module assembling method |
| CN108772247A (en) * | 2018-06-14 | 2018-11-09 | 业成科技（成都）有限公司 | Sandwich-type spot gluing equipment and its dispensing method |
| CN109078814A (en) * | 2018-09-20 | 2018-12-25 | 武汉光迅科技股份有限公司 | A kind of coupling of slab guide class device automatic dispensing device and method |
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| CN2525543Y (en) * | 2002-01-15 | 2002-12-11 | 陈韦妏 | Improved duplex transmit-recieve module set |
| EP1431788A2 (en) * | 2002-12-18 | 2004-06-23 | TDK Corporation | Optical transceiver module and a method of fabricating the same |
| CN1573387A (en) * | 2003-06-04 | 2005-02-02 | 三星电子株式会社 | Optical element module package and method for manufacturing the same |
| CN1577776A (en) * | 2003-07-18 | 2005-02-09 | 新光电气工业株式会社 | Manufacturing method of a semiconductor device |
| JP2008116861A (en) * | 2006-11-08 | 2008-05-22 | Opnext Japan Inc | Optical module |
| CN201892538U (en) * | 2010-12-13 | 2011-07-06 | 深圳市鹰眼在线电子科技有限公司 | LAMP-LED (light-emitting diode) stand glue content detector |
| CN202238520U (en) * | 2011-09-19 | 2012-05-30 | 四川光恒通信技术有限公司 | Intelligent peripheral glue dispensing device for optical devices |
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2525543Y (en) * | 2002-01-15 | 2002-12-11 | 陈韦妏 | Improved duplex transmit-recieve module set |
| EP1431788A2 (en) * | 2002-12-18 | 2004-06-23 | TDK Corporation | Optical transceiver module and a method of fabricating the same |
| CN1573387A (en) * | 2003-06-04 | 2005-02-02 | 三星电子株式会社 | Optical element module package and method for manufacturing the same |
| CN1577776A (en) * | 2003-07-18 | 2005-02-09 | 新光电气工业株式会社 | Manufacturing method of a semiconductor device |
| JP2008116861A (en) * | 2006-11-08 | 2008-05-22 | Opnext Japan Inc | Optical module |
| CN201892538U (en) * | 2010-12-13 | 2011-07-06 | 深圳市鹰眼在线电子科技有限公司 | LAMP-LED (light-emitting diode) stand glue content detector |
| CN202238520U (en) * | 2011-09-19 | 2012-05-30 | 四川光恒通信技术有限公司 | Intelligent peripheral glue dispensing device for optical devices |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104932077A (en) * | 2015-03-19 | 2015-09-23 | 南昌欧菲光电技术有限公司 | Shooting module assembling device and shooting module assembling method |
| CN108772247A (en) * | 2018-06-14 | 2018-11-09 | 业成科技（成都）有限公司 | Sandwich-type spot gluing equipment and its dispensing method |
| CN108772247B (en) * | 2018-06-14 | 2020-02-07 | 业成科技（成都）有限公司 | Sandwich type dispensing equipment and dispensing method thereof |
| CN109078814A (en) * | 2018-09-20 | 2018-12-25 | 武汉光迅科技股份有限公司 | A kind of coupling of slab guide class device automatic dispensing device and method |
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Application publication date: 20140917 |
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