CN104036919A - High-frequency induction full-bridge resonance inductance device and manufacturing method thereof - Google Patents
High-frequency induction full-bridge resonance inductance device and manufacturing method thereof Download PDFInfo
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- CN104036919A CN104036919A CN201410250597.5A CN201410250597A CN104036919A CN 104036919 A CN104036919 A CN 104036919A CN 201410250597 A CN201410250597 A CN 201410250597A CN 104036919 A CN104036919 A CN 104036919A
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Abstract
The invention discloses a high-frequency induction full-bridge resonance inductance device and a manufacturing method thereof. The high-frequency induction full-bridge resonance inductance device comprises a base plate, wherein a layer of glass ceramics is arranged on the upper surface of the base plate; a row of eight epoxy boards which are uniformly distributed are fixed on the glass ceramics layer; coils are uniformly arranged on the epoxy boards; a draught fan is fixedly mounted at both ends of the base plate through end plates; a cover plate is fixedly arranged on the base plate and the end plates; air inlets are formed in the side walls on the two sides of the cover plate, air guide plates are arranged at two ends, and a mounting bracket is arranged on the upper wall. According to the invention, an enameled wire is selected, parameters of the resonance inductor, basketry of the resonance inductance coils, structural configuration of the whole resonance inductance device and the like are designed and set in an optimal manner, so that the resonance inductance device has the benefits that the high-frequency induction full-bridge resonance inductance device is scientific in electric connection type, material model selection and parameter selection, low in interference, low in temperature rise, and small in size, and facilitates production and maintenance.
Description
Technical field:
The present invention relates to high-frequency induction resonant inductance design field, concrete is a kind of high-frequency induction full-bridge resonant inductance device, for the coating of tinplate can body seam, solidifies.
Background technology:
The zinc-plated filling of tinplate is widely used in the metal cans such as packing tin for foodstuff, chemical tank, inhalator jar; because side seam reaches under the impact of 1200 ℃ at welding high temperature; leave a sheet iron strip that there is no protective coating and tin layer; the coating of can body weld seam must be toasted later; make paint solidification, with acid-resistance or sulphur-containing substance corrosion.Traditional baking method is conventional two kinds of electric heating and heated by natural gas, existing employing than the conventional method high-frequency induction heating mode of energy-conserving and environment-protective more, and high-frequency induction heating generally adopts series resonant circuit, indispensable resonant inductance coil device.The design of resonant inductance is the important step of resonant circuit, and at present, in existing like product, resonant inductance adopts half-bridge resonance coil parameter more, and the number of turn is few, and interference reaches, and temperature is high, and the life-span is short, and is difficult to meet existing high speed water operation.
Summary of the invention:
The present invention, for solving the deficiencies in the prior art, provides a kind of high-frequency induction full-bridge series resonance inductance device.
The technical solution used in the present invention is:
A kind of high-frequency induction full-bridge resonant inductance device and preparation method thereof, is characterized in that: comprising:
Mechanical structure: comprise base plate, plate upper surface is provided with one deck devitrified glass, in glass-ceramic layer, fix a row, uniform eight epoxy plates, on epoxy plate, be equipped with coil, the two ends of base plate all fixedly mount blower fan by end plate, on base plate and end plate, be installed with cover plate, on the both sides sidewall of cover plate, have that air inlet, two ends are provided with wind guide plate, upper wall is provided with mounting bracket;
Enamelled wire form of presentation: the enamelled wire of coil adopts high temperature resistant 180 ℃～200 ℃, top layer employing polyamidoimide composite bottom layer polyester imines enamel covered wire, 4 single enamelled wires of 0.31mm of enamelled wire employing totally 32 ingots are woven into through professional braiding machine, and being coiled into rear sectional area is 9.66 squares;
Inductance production method: the external diameter of epoxy bracket is 120mm, on it, adopt 4 above-mentioned 32 ingot 0.31mm enamel-cover establishment wire clamp mica cloths from epoxy bracket internal diameter, to be about the position coiling of 20mm, close around 17 circles and guarantee that external diameter is less than 110mm, adopt series system, coil directly contacts epoxy bracket, epoxy bracket is placed on devitrified glass;
Inductance principle: it is nearer that inductance coil leans on, because of magnetic flux coupling, for series connection, total inductance amount
K is coupling coefficient, two coils away from time, can be K=0, M=0.
Compared with prior art, beneficial effect of the present invention is:
The present invention is by the selection to enamelled wire, the parameter of resonant inductance, the basketry of resonant inductance coil, and the topology layout of whole resonant inductance device etc., make optimized design and layout, reach electric connecting mode science, material type selecting and parameter are chosen science, disturb minimum, temperature rise is low, volume is little, is convenient to produce simultaneously, safeguards.
Accompanying drawing explanation:
Fig. 1 is internal structure schematic diagram of the present invention;
Fig. 2,3 is respectively front view and the vertical view of cover plate of the present invention;
Fig. 4 is that 4 groups of induction coils of the present invention are connected in series mode figure;
Fig. 5 is the enlarged drawing of coil of the present invention.
Embodiment:
Below in conjunction with accompanying drawing, by embodiment, the present invention is described in further detail:
A high-frequency induction full-bridge resonant inductance device, comprising:
Mechanical structure: comprise base plate 1, base plate 1 upper surface is provided with one deck devitrified glass 2, on 2 layers of devitrified glasses, fix a row, uniform eight epoxy plates 3, on epoxy plate 3, be equipped with coil 4, the two ends of base plate 1 are all by end plate 5 fixed installation blower fans 6, on base plate 1 and end plate 5, be installed with cover plate 7, on the both sides sidewall of cover plate 7, have that air inlet 71, two ends are provided with wind guide plate 72, upper wall is provided with mounting bracket 73;
Enamelled wire form of presentation: the enamelled wire of coil adopts high temperature resistant 200 ℃, top layer to adopt polyamidoimide composite bottom layer, polyester imines enamel covered wire, 4 single enamelled wires of 0.31mm of enamelled wire employing totally 32 ingots are woven into through professional braiding machine, and being coiled into rear sectional area is 9.66 squares;
Inductance production method: the external diameter of epoxy bracket is 120mm, on it, adopt 4 above-mentioned 32 ingot 0.31mm enamel-cover establishment wire clamp mica cloths from epoxy bracket internal diameter, to be about the position coiling of 20mm, close around 17 circles and guarantee that external diameter is less than 110mm, adopt series system, coil directly contacts epoxy bracket, epoxy bracket is placed on devitrified glass;
Inductance principle: it is nearer that inductance coil leans on, because of magnetic flux coupling, for series connection, total inductance amount
K is coupling coefficient, two coils away from time, can be K=0, M=0, conventionally every 4 inductance devices can meet dry tank 200 tanks/minute.
Above-described embodiment is only preferably execution mode of the present invention, and in addition, the present invention can also have other implementations.It should be noted that, do not departing under the prerequisite of the present invention's design, within any apparent improvement and modification all should fall into protection scope of the present invention.
Claims (1)
1. high-frequency induction full-bridge resonant inductance device and preparation method thereof, is characterized in that: comprising:
Mechanical structure: comprise base plate, plate upper surface is provided with one deck devitrified glass, in glass-ceramic layer, fix a row, uniform eight epoxy plates, on epoxy plate, be equipped with coil, the two ends of base plate all fixedly mount blower fan by end plate, on base plate and end plate, be installed with cover plate, on the both sides sidewall of cover plate, have that air inlet, two ends are provided with wind guide plate, upper wall is provided with mounting bracket;
Enamelled wire form of presentation: the enamelled wire of coil adopts high temperature resistant 180 ℃～200 ℃, top layer employing polyamidoimide composite bottom layer polyester imines enamel covered wire, 4 single enamelled wires of 0.31mm of enamelled wire employing totally 32 ingots are woven into through professional braiding machine, and being coiled into rear sectional area is 9.66 squares;
Inductance production method: the external diameter of epoxy bracket is 120mm, on it, adopt 4 above-mentioned 32 ingot 0.31mm enamel-cover establishment wire clamp mica cloths from epoxy bracket internal diameter, to be about the position coiling of 20mm, close around 17 circles and guarantee that external diameter is less than 110mm, adopt series system, coil directly contacts epoxy bracket, epoxy bracket is placed on devitrified glass.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410250597.5A CN104036919B (en) | 2014-06-05 | 2014-06-05 | A kind of high-frequency induction full-bridge resonant inductance device and preparation method thereof |
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| CN201410250597.5A CN104036919B (en) | 2014-06-05 | 2014-06-05 | A kind of high-frequency induction full-bridge resonant inductance device and preparation method thereof |
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| CN104036919A true CN104036919A (en) | 2014-09-10 |
| CN104036919B CN104036919B (en) | 2016-05-18 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04372104A (en) * | 1991-06-21 | 1992-12-25 | Nippon Telegr & Teleph Corp <Ntt> | High frequency inductor |
| CN1801412A (en) * | 2005-01-07 | 2006-07-12 | 三星电机株式会社 | Planar magnetic inductor and method for manufacturing the same |
| JP5057534B1 (en) * | 2011-03-31 | 2012-10-24 | 株式会社アイキューフォー | High frequency transformer |
| CN103377818A (en) * | 2012-04-13 | 2013-10-30 | 乾坤科技股份有限公司 | A high-frequency device with through-hole via inductor and manufacture method thereof |
| CN203950631U (en) * | 2014-06-05 | 2014-11-19 | 合肥顺昌分布式能源综合应用技术有限公司 | A kind of high-frequency induction full-bridge resonant inductance device |
-
2014
- 2014-06-05 CN CN201410250597.5A patent/CN104036919B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04372104A (en) * | 1991-06-21 | 1992-12-25 | Nippon Telegr & Teleph Corp <Ntt> | High frequency inductor |
| CN1801412A (en) * | 2005-01-07 | 2006-07-12 | 三星电机株式会社 | Planar magnetic inductor and method for manufacturing the same |
| JP5057534B1 (en) * | 2011-03-31 | 2012-10-24 | 株式会社アイキューフォー | High frequency transformer |
| CN103377818A (en) * | 2012-04-13 | 2013-10-30 | 乾坤科技股份有限公司 | A high-frequency device with through-hole via inductor and manufacture method thereof |
| CN203950631U (en) * | 2014-06-05 | 2014-11-19 | 合肥顺昌分布式能源综合应用技术有限公司 | A kind of high-frequency induction full-bridge resonant inductance device |
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| CN104036919B (en) | 2016-05-18 |
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Denomination of invention: High-frequency induction full-bridge resonance inductance device and manufacturing method thereof Effective date of registration: 20170323 Granted publication date: 20160518 Pledgee: Huizhou Merchants Bank Hefei three Xiao Kou branch Pledgor: Shunchang, Hefei distributed energy comprehensive application technology Co., Ltd Registration number: 2017340000040 |
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Date of cancellation: 20180504 Granted publication date: 20160518 Pledgee: Huizhou Merchants Bank Hefei three Xiao Kou branch Pledgor: Shunchang, Hefei distributed energy comprehensive application technology Co., Ltd Registration number: 2017340000040 |
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