CN104034076A - Cryogenic refrigeration apparatus - Google Patents
Cryogenic refrigeration apparatus Download PDFInfo
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- CN104034076A CN104034076A CN201410077094.2A CN201410077094A CN104034076A CN 104034076 A CN104034076 A CN 104034076A CN 201410077094 A CN201410077094 A CN 201410077094A CN 104034076 A CN104034076 A CN 104034076A
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- 238000005057 refrigeration Methods 0.000 title abstract 3
- 238000001816 cooling Methods 0.000 claims abstract description 115
- 239000007788 liquid Substances 0.000 claims abstract description 114
- 238000001704 evaporation Methods 0.000 claims abstract description 15
- 230000008020 evaporation Effects 0.000 claims abstract description 14
- 239000003507 refrigerant Substances 0.000 claims description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 173
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 74
- 239000002826 coolant Substances 0.000 abstract description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 22
- 238000010586 diagram Methods 0.000 description 15
- 230000008014 freezing Effects 0.000 description 10
- 238000007710 freezing Methods 0.000 description 10
- 230000007423 decrease Effects 0.000 description 8
- 229920006395 saturated elastomer Polymers 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000011151 fibre-reinforced plastic Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 206010060904 Freezing phenomenon Diseases 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 208000018883 loss of balance Diseases 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The present invention provides a cryogenic refrigeration apparatus which is capable of achieving a balance of the evaporation amount and the liquidation amount through employing a simple structure. The cryogenic refrigeration apparatus is provided with liquid nitrogen (50) (cooling agent) which cools the object (60) to be cooled; a cooling box (20) which accommodates the liquid nitrogen (50); a refrigerator (30) which is configured on the cooling box (20) and cools nitrogen; a heat conducting part (40A), which is configured on the cooling box (20), a high temperature end portion (42) of which stretches toward the external part of the cooling box (20), and the low temperature end portion (44) of which stretches toward the internal part of the cooling box (20), so as to conducting the heat outside the cooling box (20) into the cooling box (20). The low temperature end portion (44) is disposed at a position higher than the liquid level (52) of the liquid nitrogen (50) and lower than a cooling bench (32) of the refrigerator (30), in a normal balance state of the evaporation amount and the liquidation amount.
Description
The present application claims priority based on japanese patent application No. 2013-044532, applied on 3/6/2013. The entire contents of the application are incorporated by reference into this specification.
Technical Field
The present invention relates to an ultra-low temperature cooling apparatus for cooling a refrigerant filled in a casing.
Background
In general, as an apparatus for cooling an object to be cooled, there is known an ultra-low temperature cooling apparatus for cooling the object to be cooled by immersing the object in a coolant (for example, liquid nitrogen) contained in a casing. The refrigerant in the tank evaporates by receiving heat from the cooled object. Therefore, the following structure is provided: the refrigerator is arranged on the box body, and the evaporated refrigerant is cooled by the refrigerator to be re-condensed. Further, a cryogenic cooling apparatus is proposed, which is provided with a heater for heating liquefied refrigerant, a sensor for detecting the liquid level of the refrigerant, and a heater control device.
Patent document 1: japanese laid-open patent publication No. 63-006354
However, in the structure in which the heater and the liquid level sensor are provided in the liquefied refrigerant, there is a problem that the structure of the ultra-low temperature cooling apparatus is complicated and the control thereof is troublesome.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object of the present invention is to provide an ultra-low temperature cooling apparatus capable of maintaining a balance between an evaporation amount and a liquefaction amount of a refrigerant with a simple structure.
One aspect of the present invention is an ultralow temperature cooling apparatus including:
a refrigerant for cooling an object to be cooled;
a tank containing the refrigerant;
a refrigerator disposed on the box body to cool the refrigerant; and
and a heat-conducting member having one end portion located outside the case and the other end portion located inside the case, for conducting heat from outside the case into the inside of the case.
The disclosed ultra-low-temperature cooling device heats the refrigerant by introducing heat from the outside of the casing into the casing through the heat-conducting member, and therefore, the balance between the evaporation amount and the liquefaction amount of the refrigerant can be achieved with a simple configuration.
Drawings
Fig. 1 is a schematic configuration diagram of a cryogenic cooling apparatus according to an embodiment of the present invention, fig. 1(a) is a diagram showing a state in which a liquid surface of a refrigerant is separated from a low-temperature-side end portion of a heat-conducting member, and fig. 1(B) is a diagram showing a state in which the liquid surface of the refrigerant is in contact with the low-temperature-side end portion of the heat-conducting member.
Fig. 2 is a schematic configuration diagram of the ultra-low-temperature cooling apparatus according to another embodiment of the present invention, fig. 2(a) is a diagram showing a state in which a liquid surface of the refrigerant is separated from a low-temperature-side end portion of the heat-conducting member, and fig. 2(B) is a diagram showing a state in which the liquid surface of the refrigerant is in contact with the low-temperature-side end portion of the heat-conducting member.
Fig. 3 is a schematic configuration diagram of a cryogenic cooling apparatus according to still another embodiment of the present invention, fig. 3(a) is a diagram showing a state in which a liquid surface of a refrigerant is separated from a low-temperature-side end portion of a heat-conducting member, and fig. 3(B) is a diagram showing a state in which the liquid surface of the refrigerant is in contact with the low-temperature-side end portion of the heat-conducting member.
Fig. 4 is a schematic configuration diagram of a cryogenic cooling apparatus according to still another embodiment of the present invention, fig. 4(a) is a diagram showing a state in which a liquid surface of a refrigerant is separated from a low-temperature-side end portion of a heat-conducting member, and fig. 4(B) is a diagram showing a state in which a liquid surface of a refrigerant is in contact with a low-temperature-side end portion of a heat-conducting member.
Fig. 5 is a graph showing the relationship between the liquid level and the tank internal pressure and saturated steam temperature.
Fig. 6 is a diagram for explaining a process in which the refrigerant freezes on the cooling stage of the refrigerator.
In the figure: 10A to 10D-a cryogenic cooling device, 20-a cooling box, 22-a space portion, 30-a refrigerator, 32-a cooling stage, 40A, 40B-a heat conducting member, 42-a high temperature side end portion, 44-a low temperature side end portion, 48-a heat exchanging portion, 50-a refrigerant, 52-a liquid surface, 60-a cooled object, 70-a heat insulating member, 80-a fan, 90-a height adjusting mechanism.
Detailed Description
Next, embodiments of the present invention will be described with reference to the drawings.
Fig. 1 is a schematic configuration diagram showing a cryogenic cooling apparatus 10A according to an embodiment of the present invention. The cryogenic cooling apparatus 10A includes a cooling box 20, a refrigerator 30, a heat-conducting member 40A, a refrigerant 50, and the like.
The cooling box 20 is an airtight metal container. The cooling tank 20 is a tank body that cools an object to be cooled 60, and contains a refrigerant 50 therein. In the present embodiment, liquid nitrogen is used as the refrigerant 50 (hereinafter, the refrigerant is referred to as liquid nitrogen 50).
The cooling tank 20 is not filled with the liquid nitrogen 50, but contains the liquid nitrogen 50 in an amount sufficient to immerse the object to be cooled 60. Therefore, inside the cooling tank 20 there are: a liquid phase part formed by the liquid nitrogen 50 staying at the lower part of the box body; and a gas phase portion in which the nitrogen gas vaporized by the evaporation of the liquid nitrogen 50 stagnates. A space portion 22 is formed above the liquid nitrogen 50 in the cooling tank 20, and the space portion 22 becomes a gas phase portion.
In the present embodiment, the liquid nitrogen 50 is used as the coolant, but the type of coolant is not limited to this, and can be appropriately selected according to the cooling temperature of the object 60 to be cooled. When the cooling is performed to a temperature lower than that of liquid nitrogen, helium or the like may be used as the refrigerant.
In the present embodiment, although not provided, the cooling box 20 may be accommodated in a vacuum container (vacuum dewar). With this configuration, it is possible to prevent radiant heat from entering the cooling box 20, and to improve the cooling efficiency of the object 60 to be cooled.
The refrigerator 30 is disposed on the cooling box 20. The refrigerator 30 is a device that cools the nitrogen gas evaporated in the cooling box 20 to recondense the nitrogen gas and turns the nitrogen gas into liquid nitrogen 50 again. The type of the refrigerator 30 is not particularly limited as long as it can cool down to a temperature (about 60K) at which nitrogen gas is recondensed.
Therefore, as the refrigerator 30, various refrigerators such as a gifford-mcmahon refrigerator (GM refrigerator), a joule-thomson refrigerator, a pulse tube refrigerator, and a stirling refrigerator can be applied. In the present embodiment, an example in which a GM refrigerator is used as the refrigerator 30 is shown.
The refrigerator 30 is attached to the cooling tank 20 so that the cylinder extends from the upper portion of the tank toward the liquid surface 52 of the liquid nitrogen 50. A cooling stage 32 cooled by the cold generated by the refrigerator 30 is provided at the front end of the cylinder.
The evaporated nitrogen gas present in the space portion 22 of the cooling box 20 is cooled by contact with the cooling stage 32. Then, the liquid nitrogen 50 recondensed by cooling to below the freezing point drops toward the liquid nitrogen 50 stagnating in the lower portion of the cooling tank 20.
Next, the heat-conducting member 40A will be explained.
The heat conductive member 40A is a rod-shaped member and is formed of copper, aluminum, or the like having high thermal conductivity. The heat-conducting member 40A is disposed (fixed) on the upper portion of the cooling box 20 by welding or the like. Further, in the heat-conducting member 40A, an upper end portion (an end portion in the direction of arrow Z1 in the drawing) is a high-temperature-side end portion 42 (also referred to as an end portion), and a lower end portion (an end portion in the direction of arrow Z2 in the drawing) is a low-temperature-side end portion 44 (also referred to as another end portion).
In the disposed state, the high-temperature-side end portion 42 extends outward (Z1 direction side) from the cooling box 20. The low-temperature-side end 44 extends into the cooling box 20.
The high-temperature-side end portion 42 is set to have a diameter larger than the diameter of the heat-conductive member 40A in the cooling box 20. Therefore, the surface area of the high-temperature-side end portion 42 is wider than that of the other portion of the heat-conducting member 40A, and external heat can be efficiently absorbed.
The heat-conducting member 40A functions to guide the heat outside the case, which is absorbed by the high-temperature-side end portion 42, to the inside of the cooling box 20. Therefore, the low-temperature-side end portion 44 is heated to a temperature higher than or equal to a temperature at which the liquid nitrogen 50 can be evaporated by the heat outside the cooling tank 20.
The vertical height position of the low-temperature-side end 44 (the height position in the Z1 and Z2 directions) is set to a position higher than the height position of the liquid surface 52 of the liquid nitrogen 50 in a normal state (hereinafter, this height position is referred to as a normal-state height NL) and lower than the lower end of the cooling stage 32 of the refrigerator 30.
Here, the fluctuation in the height of the liquid surface 52 generated in the liquid nitrogen 50 will be described with reference to fig. 6.
Fig. 6 shows the ultra-low-temperature cooling apparatus 100A without the heat conductive member 40A. Note that, in fig. 6, the object to be cooled 60 is not shown.
The liquid nitrogen 50 in the cooling tank 20 is heated and evaporated by heat exchange with the object to be cooled 60, and turns into nitrogen gas. The nitrogen gas is cooled on the cooling stage 32 of the refrigerator 30, recondensed, liquefied, and then returned to the liquid nitrogen 50 stagnating at the bottom of the cooling tank 20.
Fig. 6 a shows a state in which the evaporation amount of the liquid nitrogen 50 is balanced with the liquefaction amount by cooling the vaporized nitrogen gas (in this specification, the state in which the evaporation amount and the liquefaction amount are balanced is referred to as a normal state).
Now, assuming that the cooling capacity of the refrigerator 30 is relatively large with respect to the heat quantity of the object 60 to be cooled with respect to the normal state, this phenomenon occurs when the heat quantity of the object 60 to be cooled is lower than the assumed value.
As described above, if the refrigerating capacity of the refrigerator 30 is large relative to the heat quantity of the object 60 to be cooled, a large amount of nitrogen gas is liquefied by the refrigerator 30. Therefore, as shown in fig. 6(B), the liquid surface 52 of the liquid nitrogen 50 rises.
Fig. 5 is a diagram showing a relationship between the liquid surface level of the liquid nitrogen 50 in the cooling tank 20 and the tank internal pressure, and a relationship between the liquid surface level and the saturated steam temperature. In the figure, the horizontal axis represents the liquid level of the liquid nitrogen 50, the left vertical axis represents the tank internal pressure, and the right vertical axis represents the saturated steam temperature.
As shown in the figure, when the liquid level 52 of the liquid nitrogen 50 rises, the tank internal pressure in the cooling tank 20 falls, and the saturated steam temperature in the cooling tank 20 falls accordingly. As the saturated vapor temperature decreases, the refrigerating capacity of the refrigerator 30 also decreases, and the liquefaction amount of nitrogen decreases. However, if the cooling capacity of refrigerator 30 is maintained to be higher than the amount of heat generated by object to be cooled 60, the rise of liquid level 52 is maintained.
If the saturated steam temperature drops to about 63K (freezing point), the liquid nitrogen 50 freezes. The freezing phenomenon is caused by solidification of nitrogen gas after the nitrogen gas is liquefied by cooling by the cooling stage 32.
As the liquid level of the liquid nitrogen 50 staying in the cooling tank 20 rises, the liquid nitrogen 50 directly contacts the cooling platform 32, and nitrogen freezes. Fig. 6(C) shows a state where nitrogen is frozen on the cooling stage 32. Note that reference numeral 56 in fig. 6 denotes frozen nitrogen.
When the nitrogen ice covers the cold plate 32, the ice nitrogen 56 provides a thermal insulating effect that prevents the nitrogen from liquefying through the cold plate 32. As described above, when the frozen nitrogen 56 is generated on the cooling base 32, the cooling capacity of the refrigerator 30 actually decreases, and therefore the amount of heat generated by the object to be cooled 60 exceeds the actual cooling capacity of the refrigerator 30. Therefore, the liquid nitrogen 50 evaporates, and as shown in fig. 6(D), the liquid level 52 of the liquid nitrogen 50 falls.
In this way, even if the liquid surface 52 of the liquid nitrogen 50 falls, the frozen nitrogen 56 is maintained adhered to the periphery of the cooling base 32, and therefore, a state in which the liquefaction amount of the nitrogen gas in the cooling tank 20 by the refrigerator 30 is small is maintained (this state is shown in fig. 6E). If this state is maintained for a long time, the liquid surface 52 may be lowered from the normal state height NL, and the object 60 may not be cooled well.
In order to avoid such a situation,
(1) when the liquid surface 52 of the liquid nitrogen 50 in the cooling tank 20 is located at a position higher than the normal state height NL and lower than a height position (a position shown in fig. 6C) immediately before the liquid surface 52 comes into contact with the cooling stage 32,
or,
(2) when the liquid surface 52 of the liquid nitrogen 50 in the cooling tank 20 is located at a position higher than the normal state height NL and lower than the liquid surface height (indicated by an arrow H in fig. 5) of the liquid nitrogen 50 at which the saturated steam temperature corresponds to the temperature at which the liquid nitrogen 50 starts to freeze,
it is very effective to evaporate, in other words, heat, the liquid nitrogen 50 in the cooling tank 20.
Here, the description is continued again returning to fig. 1. In the present embodiment, the height of the low-temperature-side end 44 of the heat-conducting member 40A is set to be between the normal-state height NL and the pre-freezing height FL. Specifically, in the present embodiment, the low-temperature-side end portion 44 is set to be located slightly lower than the pre-icing height FL.
Fig. 1(B) shows a state in which the liquid level 52 of the liquid nitrogen 50 rises due to a loss of balance between the evaporation amount of the liquid nitrogen 50 and the liquefaction amount of the nitrogen gas in the cryogenic cooling apparatus 10A of the present embodiment. Since the low-temperature-side end 44 of the heat-conducting member 40A is provided at a position slightly lower than the pre-freezing height FL, the liquid surface 52 contacts the low-temperature-side end 44 of the heat-conducting member 40A before contacting the cooling base 32.
As described above, the heat-conducting member 40A is formed of a material having good heat conductivity, and the high-temperature-side end 42, which is the end opposite to the low-temperature-side end 44, extends outside the cooling box 20. Therefore, heat outside the cooling box 20 is thermally conducted to the heat-conducting member 40A via the high-temperature-side end portion 42, and then is transferred to the low-temperature-side end portion 44.
Therefore, if the liquid nitrogen 50 comes into contact with the low-temperature-side end portion 44 as the liquid surface 52 rises, the amount of evaporation of the liquid nitrogen 50 per unit time increases due to the heat conducted from the high-temperature-side end portion 42. Then, the liquid level 52 of the liquid nitrogen 50 decreases as the evaporation amount increases.
In this way, in the ultra-low-temperature cooling apparatus 10A, the liquid nitrogen 50 automatically comes into contact with the heat conductive member 40A and evaporates until the height of the liquid surface 52 reaches the pre-freezing height FL (the height at which the frozen nitrogen 56 is generated on the cooling stage 32).
Therefore, according to the ultra-low-temperature cooling apparatus 10A of the present embodiment, the liquid surface 52 of the liquid nitrogen 50 can be suppressed from exceeding the pre-freezing height FL. Further, it is also possible to suppress the liquid surface 52 from falling below the normal state height NL due to the freezing of nitrogen occurring on the cooling table 32.
This enables the object to be cooled 60 to be stably cooled. The heat-conducting member 40A is a rod-shaped member, and the structure thereof is extremely simple. Therefore, the balance between the evaporation amount and the liquefaction amount of the liquid nitrogen 50 can be achieved with a simple configuration.
In the above-described embodiment, the height of the low-temperature-side end 44 of the heat-conducting member 40A is set to be between the normal-state height NL and the pre-freezing height FL. However, the height of the low-temperature-side end 44 is not limited to this, and may be set higher than the normal-state height NL and lower than the liquid surface height (indicated by arrow H in fig. 5) of the liquid nitrogen 50 at which the saturated steam temperature corresponds to the temperature at which the liquid nitrogen 50 starts to freeze. With this configuration, the same effects as those of the above-described embodiment can be obtained.
Next, another embodiment will be described with reference to fig. 2 to 4.
In fig. 2 to 4, the same reference numerals are given to the components corresponding to the ultra-low-temperature cooling apparatus 10A according to the embodiment shown in fig. 1, and the description thereof will be omitted. In the drawings, (a) shows a state where the liquid surface 52 of the liquid nitrogen 50 has the normal state height NL, and (B) shows a state where the liquid nitrogen 50 is in contact with the low-temperature-side end portion 44.
In the ultra-low-temperature cooling apparatus 10B shown in fig. 2, the heat-conducting member 40A is covered with a heat-insulating member 70. As the heat insulating member 70, a material having a small thermal conductivity is used. Specifically, in the present embodiment, FRP (fiber reinforced plastic) is used as the heat insulating member 70. However, the heat insulating member 70 is not limited thereto, and any other material may be used as long as it has heat non-conductivity and can withstand low temperature.
The heat insulating member 70 is disposed in a portion of the heat conductive member 40A located inside the cooling box 20. However, the heat insulating member 70 is not provided to the low-temperature-side end 44 of the heat-conducting member 40A.
Specifically, the following structure is adopted: an opening 70a is provided at a height position of the heat insulating member 70 at which the liquid level is to be stopped from rising, for example, in the vicinity of the low-temperature-side end portion 44, and the low-temperature-side end portion 44 is exposed through the opening 70 a. Therefore, when the liquid surface 52 of the liquid nitrogen 50 rises due to the loss of the balance between the evaporation amount and the liquefaction amount as described above, the low-temperature side end portion 44 contacts the liquid nitrogen 50 via the opening 70 a.
As in the present embodiment, by covering the heat-conducting member 40A with the heat-insulating member 70 except for the height position at which the liquid level is to be stopped from rising, the generation efficiency of nitrogen gas when the liquid nitrogen 50 contacts the low-temperature-side end portion 44 can be improved. The reason for this will be explained below.
The nitrogen gas generated by the evaporation of the liquid nitrogen 50 performs natural convection in the space portion 22. The natural convection nitrogen gas comes into contact with the portion of the heat conductive member 40A extending into the cooling box 20.
The heat-conducting member 40A conducts heat outside the tank from the high-temperature-side end 42 toward the low-temperature-side end 44. The heat-conducting member 40A is lower in temperature than the nitrogen gas, and therefore the contact of the nitrogen gas by natural convection with the heat-conducting member 40A causes the temperature of the heat-conducting member 40A to decrease, and with this, the temperature of the low-temperature-side end portion 44 also decreases. Therefore, when the liquid nitrogen 50 comes into contact with the low-temperature-side end portion 44, the amount of nitrogen gas generated at the low-temperature-side end portion 44 may decrease.
However, as in the present embodiment, by covering the heat-conducting member 40A with the heat-insulating member 70, it is possible to prevent the temperature of the heat-conducting member 40A from dropping due to the nitrogen gas by natural convection, and thereby it is possible to improve the generation efficiency of the nitrogen gas when the liquid nitrogen 50 comes into contact with the low-temperature side end portion 44.
Next, another embodiment shown in fig. 3 will be described.
In the ultra-low-temperature cooling apparatus 10C shown in fig. 3, the heat exchanging portion 48 is provided in the heat conducting member 40B. The heat exchanging portion 48 is provided at the high-temperature-side end 42 of the heat conducting member 40B.
The heat exchanging portion 48 has a fin structure and is formed of a material having good thermal conductivity, such as copper or aluminum. As described above, the heat absorption efficiency is improved by increasing the surface area of the high-temperature-side end portion 42, but the heat absorption efficiency of the external heat at the high-temperature-side end portion 42 including the heat exchanging portion 48 can be further improved by providing the heat exchanging portion 48 at the high-temperature-side end portion 42.
This allows the liquid nitrogen 50 to be smoothly evaporated when the low-temperature-side end 44 comes into contact with the liquid nitrogen 50.
As shown in the drawing, a fan 80 that sends outside air to the heat exchanging portion 48 may be further provided. With this configuration, heat exchange between the heat outside the cooling tank 20 and the heat exchanging portion 48 can be performed more efficiently.
Further, a heater, not shown, may be provided in the heat exchanging portion 48. In this configuration, since the heat exchanging portion 48 is forcibly heated, the temperature of the low-temperature-side end portion 44 can be more reliably increased.
Next, another embodiment shown in fig. 4 will be described.
In the ultra-low-temperature cooling apparatus 10D shown in fig. 3, a height adjustment mechanism 90 is provided to adjust the height of the heat conduction member 40A relative to the cooling box 20.
As described above, in order to cool the object 60 satisfactorily, the height of the low-temperature-side end portion 44 needs to be set between the normal-state height NL and the pre-freezing height FL. At this time, the height of the low-temperature-side end portion 44 may need to be adjusted according to the amount of heat generation of the object to be cooled 60, the amount of fluctuation in the cooling capacity of the refrigerator 30, the amount of liquid nitrogen 50 stored in the cooling box 20, and the like.
The height adjustment mechanism 90 can perform this height adjustment. The height adjusting mechanism 90 includes: a sealing mechanism for maintaining an airtight state between the heat-conducting member 40A and the cooling box 20; and a movement adjusting mechanism for adjusting the movement of the heat-conducting member 40A in the vertical direction (the direction of arrows Z1, Z2) with respect to the cooling box 20.
By providing the height adjustment mechanism 90 capable of adjusting the height of the low-temperature-side end portion 44 in this manner, the liquid surface 52 of the liquid nitrogen 50 can be brought into contact with the low-temperature-side end portion 44 at the optimum timing for evaporating the liquid nitrogen 50, in accordance with the amount of heat generation of the object to be cooled 60 and the like.
The height adjusting mechanism 90 is not limited to a height adjusting mechanism provided with a sealing mechanism and a movement adjusting mechanism. For example, a bellows may be provided between the heat-conductive member 40A and the cooling box 20, and the movement of the heat-conductive member 40A with respect to the cooling box 20 may be adjusted by hermetically sealing the space between the heat-conductive member 40A and the cooling box 20 with the bellows.
While the preferred embodiments of the present invention have been described above in detail, the present invention is not limited to the specific embodiments described above, and various modifications and changes can be made within the spirit of the present invention described in the claims.
For example, in the above embodiments, the heat-conducting members 40A and 40B are made of rods made of a metal material such as copper or aluminum, but the heat-conducting members may be made of heaters. At this time, the same effects as those of the above embodiments can be achieved by setting the height of the low-temperature-side end portion of the heater (the end portion on the side facing the liquid surface 52 of the liquid nitrogen 50) between the normal-state height NL and the pre-freezing height FL.
Claims (8)
1. An ultra-low temperature cooling apparatus, comprising:
a refrigerant for cooling an object to be cooled;
a tank containing the refrigerant;
a refrigerator disposed in the tank and configured to cool the refrigerant; and
and a heat-conducting member disposed in the case, one end portion of the heat-conducting member extending to the outside of the case and the other end portion of the heat-conducting member extending toward the liquid surface of the refrigerant in the case, and configured to conduct heat from the outside of the case to the inside of the case.
2. The ultra-low-temperature cooling apparatus as set forth in claim 1,
the other end portion is located between a liquid surface of the refrigerant and a cooling stage of the refrigerator, and the liquid surface of the refrigerant is a liquid surface in a normal state in which an evaporation amount of the refrigerant and a liquefaction amount by cooling of the vaporized refrigerant are balanced.
3. The ultra-low-temperature cooling apparatus as set forth in claim 1 or 2,
the heat conductive member is covered with a heat insulating member having an opening.
4. The ultra-low-temperature cooling apparatus as set forth in claim 3,
the opening is provided near the other end of the heat-conducting member.
5. The ultra-low-temperature cooling apparatus as set forth in any one of claims 1 to 4,
the ultra-low temperature cooling device is provided with an adjusting mechanism which adjusts the distance between the heat conducting member and the liquid level of the refrigerant.
6. The ultra-low-temperature cooling apparatus as set forth in any one of claims 1 to 5,
a heat exchanger is provided at a position of the heat-conducting member extending outward from the case.
7. The ultra-low-temperature cooling apparatus as set forth in any one of claims 1 to 6,
the heat conductive member is formed of copper or aluminum.
8. A liquid level adjustment mechanism used in a tank for containing a refrigerant for cooling an object to be cooled, the liquid level adjustment mechanism comprising:
a refrigerator that cools the refrigerant; and
and a heat-conducting member disposed on the case, one end portion of the heat-conducting member extending to the outside of the case and the other end portion of the heat-conducting member extending to a liquid surface of the refrigerant in the case, and configured to conduct heat from the outside of the case to the inside of the case.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013044532A JP5913157B2 (en) | 2013-03-06 | 2013-03-06 | Cryogenic cooling device and liquid level adjustment mechanism |
| JP2013-044532 | 2013-03-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104034076A true CN104034076A (en) | 2014-09-10 |
| CN104034076B CN104034076B (en) | 2016-05-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410077094.2A Active CN104034076B (en) | 2013-03-06 | 2014-03-04 | Ultra-low temperature cold radiator cooler |
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| Country | Link |
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| JP (1) | JP5913157B2 (en) |
| CN (1) | CN104034076B (en) |
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| CN111912132A (en) * | 2020-06-05 | 2020-11-10 | 中国空间技术研究院 | Joule-Thomson refrigerating device and preparation method thereof |
| CN117739612A (en) * | 2023-07-12 | 2024-03-22 | 西湖大学 | Liquid helium consumption free circulating refrigerating system and liquid helium temperature zone electron microscope |
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|---|---|---|---|---|
| JP2016085014A (en) * | 2014-10-29 | 2016-05-19 | 株式会社日立製作所 | Air conditioning control method and system |
| CN113294953B (en) * | 2021-06-11 | 2022-10-28 | 四川大学华西医院 | Laboratory low temperature cabinet of drawing materials |
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Also Published As
| Publication number | Publication date |
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| CN104034076B (en) | 2016-05-25 |
| JP5913157B2 (en) | 2016-04-27 |
| JP2014173755A (en) | 2014-09-22 |
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