CN104017517A - Hot-melt adhesive for pipe adhesion of plate-type evaporator - Google Patents
Hot-melt adhesive for pipe adhesion of plate-type evaporator Download PDFInfo
- Publication number
- CN104017517A CN104017517A CN201410290037.2A CN201410290037A CN104017517A CN 104017517 A CN104017517 A CN 104017517A CN 201410290037 A CN201410290037 A CN 201410290037A CN 104017517 A CN104017517 A CN 104017517A
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- China
- Prior art keywords
- melt adhesive
- parts
- hot melt
- plate
- type evaporator
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Abstract
The invention discloses a hot-melt adhesive for the pipe adhesion of a plate-type evaporator. The hot-melt adhesive comprises the following components in parts by weight: 60-100 parts of basic resin, 4-6 parts of paraffins, 4-6 parts of hydrogenated rosin glycerin ester, less than 0.5 part of organic silicon and less than 0.5 part of nitrate The hot-melt adhesive disclosed by the invention overcomes the defects of the prior art and has the advantages of reasonable formula design, high solidifying speed and stable adhesive force.
Description
Technical field
The present invention relates to refrigeration technology field, specifically belong to a kind of hot melt adhesive that pastes pipe for plate-type evaporator.
Background technology
Plate-type evaporator is the main heat-exchanger rig in refrigeration system, its effect is to make the liquid refrigerant of low-temp low-pressure evaporate rapidly (boiling) therein for steam, the heat of the material that absorption is cooled, makes refrigeration (freezing) thereby the decline of the temperature of material reaches the object of refrigeration.Vaporizer is mainly made up of metal tube and metal sheet combined process, and aluminum pipe and aluminium sheet are directly bondd.Existing this mode bonding method, pastes by hot melt adhesive, to such hot melt adhesive, there are thermal conductivity and firm pasting to have higher requirement, the cohesive force of prior art hot melt adhesive is unstable, is subject in Working environment the impact that temperature and humidity change sooner or later, and this just can not ensure firmness.
Summary of the invention
The object of this invention is to provide a kind of hot melt adhesive that pastes pipe for plate-type evaporator, overcome the deficiencies in the prior art, formulating of recipe is reasonable, the hot melt adhesive that curing speed is fast, cohesive force is stable.
The technical solution used in the present invention is as follows:
A hot melt adhesive that pastes pipe for plate-type evaporator, formation raw material and the parts by weight of this hot melt adhesive are: by 60～100 parts of basic resin, paraffin 4-6 part; Staybelite glyceride 4-6 part; 0.5 part of organosilicon <; 0.5 part of nitrate <.
Described basic resin is ethylene-vinyl acetate copolymer.
In described ethylene-vinyl acetate copolymer, vinyl acetate between to for plastic account for described ethylene-vinyl acetate copolymer weight 19%～40%.
Formation raw material and the weight proportion of described hot melt adhesive are: 90 parts of ethylene-vinyl acetate copolymers; 5 parts, paraffin; 4 parts of staybelite glyceride; 0.3 part of organosilicon; 0.4 part, nitrate.
Formation raw material and the weight proportion of described hot melt adhesive are: 94 parts of polyamide resins; 4 parts, paraffin; 6 parts of staybelite glyceride; 0.4 part of organosilicon; 0.3 part, nitrate.
Compared with the prior art, beneficial effect of the present invention is as follows:
The hot melt adhesive that hot melt adhesive curing speed of the present invention is fast, cohesive force is stable; Not moisture and other any solvents of hot melt adhesive, be easy to transport, storage, long service life, and eliminated and damaged and waste, easy to use; Hot melt adhesive can not send register toxic smog containing solvent yet, and nonflammable, blast, has security, and can not cause to environment the health of secondary pollution and harmful to human.
Embodiment
Embodiment 1
A hot melt adhesive that pastes pipe for plate-type evaporator, formation raw material and the parts by weight of this hot melt adhesive are: 90 parts of ethylene vinyl acetates; 5 parts, paraffin; 4 parts of staybelite glyceride; 0.3 part of organosilicon; 0.4 part, nitrate.Described basic resin is ethylene-vinyl acetate copolymer; In described ethylene-vinyl acetate copolymer, vinyl acetate between to for plastic account for described ethylene-vinyl acetate copolymer weight 19%～40%.
Embodiment 2
A hot melt adhesive that pastes pipe for plate-type evaporator, formation raw material and the parts by weight of this hot melt adhesive are: formation raw material and the weight proportion of hot melt adhesive are: 94 parts of polyamide resins; 4 parts, paraffin; 6 parts of staybelite glyceride; 0.4 part of organosilicon; 0.3 part, nitrate.Described basic resin is ethylene-vinyl acetate copolymer;
In described ethylene vinyl acetate, vinyl acetate between to for plastic account for described ethylene-vinyl acetate copolymer weight 19%～40%.
Claims (5)
1. a hot melt adhesive that pastes pipe for plate-type evaporator, is characterized in that: formation raw material and the parts by weight of this hot melt adhesive are: by 60～100 parts of basic resin, paraffin 4-6 part; Staybelite glyceride 4-6 part; 0.5 part of organosilicon <; 0.5 part of nitrate <.
2. the hot melt adhesive that pastes pipe according to one kind of claim 1 for plate-type evaporator, is characterized in that: described basic resin is ethylene-vinyl acetate copolymer.
3. the hot melt adhesive that pastes pipe according to one kind of claim 2 for plate-type evaporator, is characterized in that: in described ethylene-vinyl acetate copolymer, vinyl acetate between to for plastic account for described ethylene-vinyl acetate copolymer weight 19%～40%.
4. the hot melt adhesive that pastes pipe according to one kind of claim 1 for plate-type evaporator, is characterized in that: formation raw material and the weight proportion of described hot melt adhesive are: 90 parts of ethylene-vinyl acetate copolymers; 5 parts, paraffin; 4 parts of staybelite glyceride; 0.3 part of organosilicon; 0.4 part, nitrate.
5. the hot melt adhesive that pastes pipe according to one kind of claim 1 for plate-type evaporator, is characterized in that: formation raw material and the weight proportion of described hot melt adhesive are: 94 parts of polyamide resins; 4 parts, paraffin; 6 parts of staybelite glyceride; 0.4 part of organosilicon; 0.3 part, nitrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410290037.2A CN104017517A (en) | 2014-06-20 | 2014-06-20 | Hot-melt adhesive for pipe adhesion of plate-type evaporator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410290037.2A CN104017517A (en) | 2014-06-20 | 2014-06-20 | Hot-melt adhesive for pipe adhesion of plate-type evaporator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104017517A true CN104017517A (en) | 2014-09-03 |
Family
ID=51434530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410290037.2A Pending CN104017517A (en) | 2014-06-20 | 2014-06-20 | Hot-melt adhesive for pipe adhesion of plate-type evaporator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104017517A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107663441A (en) * | 2017-11-17 | 2018-02-06 | 东莞市诚信兴智能卡有限公司 | A kind of IC-card encapsulates PUR |
| CN109777348A (en) * | 2018-12-26 | 2019-05-21 | 衢州市富星和宝黏胶工业有限公司 | A kind of hot melt adhesive |
| CN109971346A (en) * | 2019-04-11 | 2019-07-05 | 惠州市嘉淇涂料有限公司 | A kind of screw socket connection gasket coating |
| CN109971418A (en) * | 2019-04-11 | 2019-07-05 | 惠州市嘉淇涂料有限公司 | Sealant is used in a kind of filling of compressor screw socket connection gap |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1268540A (en) * | 1999-03-24 | 2000-10-04 | 韩学军 | Raw material formula for sealing thermosol for medicine column and production method of said thermosol |
-
2014
- 2014-06-20 CN CN201410290037.2A patent/CN104017517A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1268540A (en) * | 1999-03-24 | 2000-10-04 | 韩学军 | Raw material formula for sealing thermosol for medicine column and production method of said thermosol |
Non-Patent Citations (2)
| Title |
|---|
| 刘文胜: "EVA热熔胶对金属与塑料粘结性能的研究", 《弹性体》, vol. 19, no. 1, 25 February 2009 (2009-02-25), pages 33 - 34 * |
| 吴迎霞等: "管道防腐用改性EVA热熔胶的研制", 《化学与黏合》, vol. 28, no. 3, 31 December 2006 (2006-12-31), pages 166 - 168 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107663441A (en) * | 2017-11-17 | 2018-02-06 | 东莞市诚信兴智能卡有限公司 | A kind of IC-card encapsulates PUR |
| CN109777348A (en) * | 2018-12-26 | 2019-05-21 | 衢州市富星和宝黏胶工业有限公司 | A kind of hot melt adhesive |
| CN109971346A (en) * | 2019-04-11 | 2019-07-05 | 惠州市嘉淇涂料有限公司 | A kind of screw socket connection gasket coating |
| CN109971418A (en) * | 2019-04-11 | 2019-07-05 | 惠州市嘉淇涂料有限公司 | Sealant is used in a kind of filling of compressor screw socket connection gap |
| CN109971418B (en) * | 2019-04-11 | 2021-08-17 | 惠州市嘉淇涂料有限公司 | Sealant for filling screw connection gap of compressor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140903 |
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| RJ01 | Rejection of invention patent application after publication |