CN104014947A - Nanometer Ag3Sn particle reinforced composite lead-free soldering paste and preparation method thereof - Google Patents

Nanometer Ag3Sn particle reinforced composite lead-free soldering paste and preparation method thereof Download PDF

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Publication number
CN104014947A
CN104014947A CN201410295135.5A CN201410295135A CN104014947A CN 104014947 A CN104014947 A CN 104014947A CN 201410295135 A CN201410295135 A CN 201410295135A CN 104014947 A CN104014947 A CN 104014947A
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nanometer
paste
soldering tin
particle
leadless soldering
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赵修臣
汪源
刘颖
李红
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Beijing Institute of Technology BIT
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Beijing Institute of Technology BIT
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)

Abstract

The invention discloses nanometer Ag3Sn particle reinforced composite lead-free soldering paste and a preparation method thereof, belonging to the technical field of welding materials for assembly of electronic devices. The nanometer Ag3Sn particle reinforced composite lead-free soldering paste is prepared from nanometer Ag3Sn particles and low-Ag lead-free soldering paste through long-time mechanical stirring, and the nanometer Ag3Sn particles are prepared by a chemical reduction method. The preparation method is simple and convenient to operate and has good repeatability. The composite lead-free soldering paste is superior to non-reinforced low-Ag lead-free soldering paste in the processing properties such as melting point, wettability and welding joint mechanical property, and can meet the technological requirements of low cost and high performance on soldering paste in the current electronics manufacturing industry to a great degree.

Description

A kind of nanometer Ag 3compound leadless soldering tin paste and preparation method that Sn particle strengthens
Technical field
The present invention relates to a kind of nanometer Ag 3compound leadless soldering tin paste and preparation method that Sn particle strengthens, belong to the technical field of welding materials that electronic devices and components are assembled use.
Background technology
The most frequently used leadless soldering tin paste alloying component is Sn-3.0Ag-0.5Cu at present, because it is measured up to 3.0% containing Ag, has the problem of high cost in actual application; Meanwhile, too much the membership that adds of Ag element causes a large amount of thick Ag of appearance in solder joint 3sn intermetallic compound (IMC), causes reliability of solder joints to reduce.Therefore, the range of application of low Ag leadless soldering tin paste in electronics manufacturing just progressively expands, but himself also has the shortcomings such as fusing point is too high, wettability is poor, welding joint mechanical property is poor.Research shows, to adding nano particle in solder(ing) paste, to form Combined Welding tin cream be a kind of comparatively effective method that improves solder(ing) paste processing performance, improves reliability of solder joints.As can be seen here, up-to-date nano material technology of preparing is combined and becomes a kind of inevitable development trend in electronic tiny joint field with welding material with existing Electronic Assemblies.
Summary of the invention
One of object of the present invention is to provide a kind of nanometer Ag 3the compound leadless soldering tin paste that Sn particle strengthens, described Combined Welding tin cream fusing point is low, wetability good, mechanical property is excellent; Two of object is to provide a kind of nanometer Ag 3the preparation method of the compound leadless soldering tin paste that Sn particle strengthens; Described method is simple to operate, and fast and easy has good repeatability;
Object of the present invention is realized by following technical scheme:
A kind of nanometer Ag 3the compound leadless soldering tin paste that Sn particle strengthens, described solder(ing) paste is by nanometer Ag 3sn particle and low Ag leadless soldering tin paste form;
The described Combined Welding tin cream gross mass of take is 100%, nanometer Ag 3sn granule content is 0.1%～1.0%, and low Ag leadless soldering tin paste content is 99.0%～99.9%;
The preferred SAC0307 solder(ing) paste of described low Ag leadless soldering tin paste, S represents Sn, and A represents Ag, and C represents Cu, and the alloyed powder gross mass in SAC0307 solder(ing) paste of take is 100%, wherein, Sn content is that 99.0%, Ag content is that 0.3%, Cu content is 0.7%;
A kind of nanometer Ag 3the preparation method of the compound leadless soldering tin paste that Sn particle strengthens, described method step is as follows:
(1) organic tin salt, inorganic silver salt are dissolved in solvent 1, obtain solution a, add surfactant, mix, obtain solution b; (2) oleic acid is added dropwise in ammoniacal liquor, obtains solution c, reducing agent dissolution of solid, in solution c, is mixed, obtain solution d;
(3) solution d is dropwise added in solution b, vibrate, mix, make it abundant reaction, standing 2～8h then, centrifuge washing, obtains solid 1;
(4) by solid 1 vacuum drying 6～20 hours, obtain nanometer Ag 3sn particle;
(5) by nanometer Ag 3sn particle adds in low Ag leadless soldering tin paste, mixes, and obtains nanometer Ag described in the present invention 3the compound leadless soldering tin paste that Sn particle strengthens.
Wherein, the sub-tin of the described organic tin salt preferably octanoic acid of step (1), concentration preferably 5 * 10 -3～5 * 10 -2mol/L, the preferred silver nitrate of described inorganic silver salt, concentration preferably 1.5 * 10 -2～1.5 * 10 -1mol/L; Described surfactant preferably 1,10-ferrosin, concentration preferably 1 * 10 -2～1 * 10 -1mol/L, the preferred absolute methanol of solvent 1;
N (Ag in the described organic tin salt of step (1) and inorganic silver salt +): n (Sn 2+) preferred 3:1, preferably 20～60 ℃ of reaction temperatures, the reaction time is 0.5～2h preferably;
Oleic acid and the preferred 1:39～1:199 of ammoniacal liquor volume ratio in the described solution c of step (2), the preferred sodium borohydride of reducing agent solid, concentration 0.1～1mol/L; Preferably 20～60 ℃ of reaction temperatures, the reaction time is 0.25～2h preferably;
The described centrifuge washing of step (3), centrifugal washing times preferably 5～20 times, each centrifugation time is 5～20min preferably, and centrifugal rotational speed is 3000～7000r/min preferably.
Beneficial effect
(1) nanometer Ag of the present invention 3in the compound leadless soldering tin paste that Sn particle strengthens, under normal temperature and the Ag that all has nano-scale in welding process 3sn particle, meets the principle that strengthens granule-morphology " thin, little, even, round ", can obviously improve the mechanical property of welding point;
(2) described Combined Welding tin cream fusing point is lower than low Ag leadless soldering tin paste fusing point, and welding temperature required during reflow soldering is lower, thereby reduces process costs, simultaneously better with the matching of traditional Sn-Pb solder(ing) paste process equipment;
(3) wettability between described Combined Welding tin cream and substrate is excellent, compares with low Ag leadless soldering tin paste, and in solderability test, wetting power is larger, and wetting time is shorter;
(4) described Combined Welding tin cream, after surface mount reflow soldering, mounts device welding point interior tissue tiny, and IMC size still keeps Nano grade, thick Ag 3mutually seldom, device welding point is higher than the made device shearing strength of joint of low Ag leadless soldering tin paste for Sn.
(5) nanometer Ag of the present invention 3the preparation method of the compound leadless soldering tin paste that Sn particle strengthens is simple, easy to operate, has good repeatability.
Accompanying drawing explanation
Fig. 1 is nanometer Ag in embodiment 1 3the X-ray diffraction analysis spectrogram of Sn particle;
Fig. 2 is nanometer Ag in embodiment 1 3the photo of Sn particle under cold field emission scanning electron microscope;
Fig. 3 is nanometer Ag in embodiment 1 3photo under Sn particle transmission electron microscope on the scene;
Fig. 4 is heterogeneity Combined Welding tin cream gained variation of melting point curve in DSC test in embodiment 1;
Fig. 5 is nanometer Ag in embodiment 2 3the X-ray diffraction analysis spectrogram of Sn particle;
Fig. 6 is nanometer Ag in embodiment 2 3the photo of Sn particle under cold field emission scanning electron microscope;
Fig. 7 is heterogeneity Combined Welding tin cream gained wetting power change curve in solderability test in embodiment 2;
Fig. 8 is heterogeneity Combined Welding tin cream gained wetting time change curve in solderability test in embodiment 2;
Fig. 9 is nanometer Ag in embodiment 3 3the X-ray diffraction analysis spectrogram of Sn particle;
Figure 10 is nanometer Ag in embodiment 3 3the photo of Sn particle under cold field emission scanning electron microscope;
Figure 11 is the obtained device welding point of heterogeneity Combined Welding tin cream in embodiment 3, gained shearing strength of joint change curve in the test of solder joint shear strength.
The specific embodiment
Below in conjunction with the drawings and specific embodiments in detail the present invention is described in detail, but is not limited to this.
The main agents information of mentioning in following examples is in Table 1; Key instrument and facility information are in Table 2.
Table 1
Table 2
In following examples, use chemical preparation nanometer Ag 3the reaction equation of Sn particle is as follows:
Embodiment 1
(1) stannous octoate, silver nitrate are dissolved in absolute methanol, stannous octoate concentration is 0.01mol/L, and silver nitrate concentration is 0.03mol/L, obtain solution a, add 1,10-ferrosin, 1,10-ferrosin concentration is 0.05mol/L, mix, obtain solution b, wherein, reaction temperature is 40 ℃, and the reaction time is 1h;
(2) 5ml oleic acid is added dropwise in 395ml ammoniacal liquor, mixes, obtain solution c, sodium borohydride solids is dissolved in solution c, sodium borohydride concentration 0.5mol/L, mixes, and obtains solution d;
(3) solution d is dropwise added in solution b, vibrate, mix, make it abundant reaction, 40 ℃ of reaction temperatures, reaction time 0.5h, standing 4h then, centrifuge washing 10 times, each 10min, rotating speed 5000r/min, obtains solid 1;
(4) by solid 1 vacuum drying 8 hours, obtain black powder, use X-ray diffraction analysis instrument to carry out material phase analysis to black powder, obtain X-ray diffraction spectrogram, as Fig. 1, as shown in Figure 1, black powder is Ag 3sn crystal (pdf01-071-0530);
Use cold field emission scanning electron microscope to take Ag 3sn granule-morphology photo, as Fig. 2, as shown in Figure 2, Ag 3sn even particle size, spherical in shape, size range is 50～200nm; By Ag 3it is online that Sn particle is scattered in ultra-fine Cu, makes use transmission electron microscope take Ag 3sn granule-morphology photo, as Fig. 3, as shown in Figure 3, Ag 3sn particle size range is 20～80nm.
(5) nanometer Ag 3the preparation of the compound leadless soldering tin paste that Sn particle strengthens
By nanometer Ag 3sn particle adds in SAC0307 solder(ing) paste by 0～1.0% mass fraction, and mechanical agitation 2h, mixes it, obtains nanometer Ag of the present invention 3the compound leadless soldering tin paste that Sn particle strengthens.
(6) described Combined Welding tin cream DSC fusing point test experiments
The fusing point of Combined Welding tin cream described in use high temperature difference scanning calorimeter instrument test heterogeneity, as Fig. 4, as shown in Figure 4, the fusing point of Combined Welding tin cream is all lower than SAC0307 solder(ing) paste described in heterogeneity, the fusing point that records SAC0307 solder(ing) paste is 221.2 ℃, nanometer Ag in described Combined Welding tin cream 3when the addition of Sn particle is 1.0%, melting point depression 3.7 ℃, be reduced to 217.5 ℃.
Embodiment 2
(1) stannous octoate, silver nitrate are dissolved in absolute methanol, stannous octoate concentration is 5 * 10 -3mol/L, silver nitrate concentration is 1.5 * 10 -2mol/L, obtains solution a, adds 1,10-ferrosin, and 1,10-ferrosin concentration is 1 * 10 -2mol/L, mixes, and obtains solution b, 20 ℃ of reaction temperatures, reaction time 0.5h;
(2) 10ml oleic acid is added dropwise in 390ml ammoniacal liquor, mixes, obtain solution c, sodium borohydride solids is dissolved in solution c, sodium borohydride concentration 0.1mol/L, mixes, and obtains solution d;
(3) solution d is dropwise added in solution b, vibrate, mix, make it abundant reaction, 20 ℃ of reaction temperatures, reaction time 0.25h, standing 2h then, centrifuge washing 5 times, each 5min, rotating speed 3000r/min, obtains solid 1;
(4) by solid 1 vacuum drying 6 hours, obtain black powder, use X-ray diffraction analysis instrument to carry out material phase analysis to black powder, obtain X-ray diffraction spectrogram, as Fig. 5, as shown in Figure 5, black powder is Ag 3sn crystal (pdf00-004-0800);
Use cold field emission scanning electron microscope to take Ag 3sn granule-morphology photo, as Fig. 6, as shown in Figure 6, Ag 3sn even particle size, spherical in shape, size range is 50～150nm.
(5) nanometer Ag 3the preparation of the compound leadless soldering tin paste that Sn particle strengthens
By nanometer Ag 3sn particle adds in SAC0307 solder(ing) paste by 0～1.0% mass fraction, and mechanical agitation 2h, mixes it, obtains nanometer Ag of the present invention 3the compound leadless soldering tin paste that Sn particle strengthens.
(6) described Combined Welding tin cream solderability test experiments
The wetting and spreading performance of Combined Welding tin cream on Cu substrate described in service weldability tester test heterogeneity, obtain Combined Welding tin cream wetting power result of variations described in heterogeneity, as Fig. 7, as shown in Figure 7, described in heterogeneity, the wetting power of Combined Welding tin cream is all greater than SAC0307 solder(ing) paste, the wetting power that records SAC0307 solder(ing) paste is 3.945mN, nanometer Ag in described Combined Welding tin cream 3when the addition of Sn particle is 0.25%, wetting power has increased 0.133mN, increases to 4.078mN; Obtain Combined Welding tin cream wetting time result of variations described in heterogeneity, as Fig. 8, as shown in Figure 8, wetting time is all less than SAC0307 solder(ing) paste, and the wetting power that records SAC0307 solder(ing) paste is 3.945mN, nanometer Ag in described Combined Welding tin cream 3when the addition of Sn particle is 0.25%, wetting power has increased 0.133mN, increases to 4.078mN, illustrates that the wettability of described Combined Welding tin cream is better than SAC0307 solder(ing) paste.
Embodiment 3
(1) stannous octoate, silver nitrate are dissolved in absolute methanol, stannous octoate concentration is 5 * 10 -2mol/L, silver nitrate concentration is 1.5 * 10 -1mol/L, obtains solution a, adds 1,10-ferrosin, and 1,10-ferrosin concentration is 1 * 10 -1mol/L, mixes, and obtains solution b, 60 ℃ of reaction temperatures, reaction time 2h;
(2) 2ml oleic acid is added dropwise in 398ml ammoniacal liquor, mixes, obtain solution c, sodium borohydride solids is dissolved in solution c, sodium borohydride concentration 1mol/L, mixes, and obtains solution d;
(3) solution d is dropwise added in solution b, vibrate, mix, make it abundant reaction, 60 ℃ of reaction temperatures, reaction time 2h, standing 8h then, centrifuge washing 20 times, each 20min, rotating speed 7000r/min, obtains solid 1;
(4) by solid 1 vacuum drying 20 hours, obtain black powder, use X-ray diffraction analysis instrument to carry out material phase analysis to black powder, obtain X-ray diffraction spectrogram, as Fig. 9, as shown in Figure 9, black powder is Ag 3sn crystal (pdf00-004-0800);
Use cold field emission scanning electron microscope to take Ag 3sn granule-morphology photo, as Figure 10, as shown in Figure 10, Ag 3sn even particle size, spherical in shape, size range is 80～180nm.
(5) nanometer Ag 3the preparation of the compound leadless soldering tin paste that Sn particle strengthens
By nanometer Ag 3sn particle adds in SAC0307 solder(ing) paste by 0～1.0% mass fraction, and mechanical agitation 2h, mixes it, obtains nanometer Ag of the present invention 3the compound leadless soldering tin paste that Sn particle strengthens.
(6) mount the preparation of device welding point
Use the method for SMT surface-mounting equipment and serigraphy, by described Combined Welding tin cream, SAC0307 solder(ing) paste respectively with 103 models mount resistance device through solder reflow process, welding obtains mounting device welding point.
(7) mount the test of device welding point cutting performance
Use solder joint mechanical property tester to test the cutting performance that mounts device welding point prepared by described Combined Welding tin cream, as Figure 11, as shown in Figure 11, that uses prepared by described Combined Welding tin cream mounts device welding point cutting performance all higher than the made welding point of SAC0307 solder(ing) paste, the shear strength that records the made welding point of SAC0307 solder(ing) paste is 135.52gf, nanometer Ag in described Combined Welding tin cream 3when the addition of Sn particle is 0.10%, shearing strength of joint has increased 28.68gf, increases to 164.20gf, illustrates that the device welding point cutting performance that mounts prepared by described Combined Welding tin cream is better than the made welding point of SAC0307 solder(ing) paste.
The present invention includes but be not limited to above embodiment, every any being equal to of carrying out under principle of the present invention, replaces or local improvement, all will be considered as within protection scope of the present invention.

Claims (8)

1. a nanometer Ag 3the compound leadless soldering tin paste that Sn particle strengthens, is characterized in that: described solder(ing) paste is by nanometer Ag 3sn particle and low Ag leadless soldering tin paste form;
The described Combined Welding tin cream gross mass of take is 100%, nanometer Ag 3sn granule content is 0.1%～1.0%, and low Ag leadless soldering tin paste content is 99.0%～99.9%.
2. a kind of nanometer Ag according to claim 1 3the compound leadless soldering tin paste that Sn particle strengthens, it is characterized in that: described low Ag leadless soldering tin paste is SAC0307 solder(ing) paste, S represents Sn, A represents Ag, and C represents Cu, and the alloyed powder gross mass in SAC0307 solder(ing) paste of take is 100%, wherein, Sn content is that 99.0%, Ag content is that 0.3%, Cu content is 0.7%.
3. a nanometer Ag as claimed in claim 1 3the preparation method of the compound leadless soldering tin paste that Sn particle strengthens, is characterized in that: described method step is as follows:
(1) organic tin salt, inorganic silver salt are dissolved in solvent 1, obtain solution a, add surfactant, mix, obtain solution b;
(2) oleic acid is added dropwise in ammoniacal liquor, obtains solution c, reducing agent dissolution of solid, in solution c, is mixed, obtain solution d;
(3) solution d is dropwise added in solution b, vibrate, mix, make it abundant reaction, standing 2～8h then, centrifuge washing, obtains solid 1;
(4) by solid 1 vacuum drying 6～20 hours, obtain nanometer Ag 3sn particle;
(5) by nanometer Ag 3sn particle adds in low Ag leadless soldering tin paste, mixes, and obtains described nanometer Ag 3the compound leadless soldering tin paste that Sn particle strengthens.
4. a kind of nanometer Ag according to claim 2 3the preparation method of the compound leadless soldering tin paste that Sn particle strengthens, is characterized in that: the described organic tin salt of step (1) is stannous octoate, and concentration is 5 * 10 -3～5 * 10 -2mol/L, described inorganic silver salt is silver nitrate, concentration is 1.5 * 10 -2～1.5 * 10 -1mol/L; Described surfactant is 1,10-ferrosin, and concentration is 1 * 10 -2～1 * 10 -1m mol/L, solvent 1 is absolute methanol.
5. a kind of nanometer Ag according to claim 2 3the preparation method of the compound leadless soldering tin paste that Sn particle strengthens, is characterized in that: Ag in the described organic tin salt of step (1) and inorganic silver salt +with Sn 2+the ratio of amount of substance be 3:1, reaction temperature is 20～60 ℃, the reaction time is 0.5～2h.
6. a kind of nanometer Ag according to claim 2 3the preparation method of the compound leadless soldering tin paste that Sn particle strengthens, is characterized in that: in the described solution c of step (2), oleic acid and ammoniacal liquor volume ratio are 1:39～1:199, and reducing agent solid is sodium borohydride, concentration 0.1～1mol/L.
7. a kind of nanometer Ag according to claim 2 3the preparation method of the compound leadless soldering tin paste that Sn particle strengthens, is characterized in that: the described reaction temperature of step (3) is 20～60 ℃, and the reaction time is 0.25～2h.
8. a kind of nanometer Ag according to claim 2 3the preparation method of the compound leadless soldering tin paste that Sn particle strengthens, is characterized in that: the parameter of the described centrifuge washing of step (3) is washing times 5～20 times, each centrifugation time 5～20min, centrifugal rotational speed 3000～7000r/min.
CN201410295135.5A 2014-06-25 2014-06-25 Nanometer Ag3Sn particle reinforced composite lead-free soldering paste and preparation method thereof Pending CN104014947A (en)

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CN106624435B (en) * 2016-12-27 2019-08-13 深圳市荣昌科技有限公司 A kind of nano leadless solder(ing) paste and preparation method thereof
CN107175433A (en) * 2017-04-19 2017-09-19 天津大学 A kind of preparation method of low sintering tin dope nano mattisolda
CN112658277A (en) * 2020-12-08 2021-04-16 昆明理工大学 Chemical reaction method for preparing Ag3Method for Sn solder nano additive
CN112917045A (en) * 2021-01-28 2021-06-08 云南锡业锡材有限公司 Chemical reaction method for preparing tin-based solder Cu6Sn5Method for preparing nano additive
CN115592123A (en) * 2021-06-28 2023-01-13 厦门市敬微精密科技有限公司（Cn） Nano silver-tin alloy, preparation method and preparation device thereof
CN115592123B (en) * 2021-06-28 2023-11-17 厦门市敬微精密科技有限公司 Nano silver-tin alloy, preparation method and preparation device thereof
CN114473103A (en) * 2022-04-19 2022-05-13 合肥阿基米德电子科技有限公司 Liquid metal tin assisted nano-silver sintering process

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