CN104012188A - Light-emitting component arrangement - Google Patents

Light-emitting component arrangement Download PDF

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Publication number
CN104012188A
CN104012188A CN201280062208.5A CN201280062208A CN104012188A CN 104012188 A CN104012188 A CN 104012188A CN 201280062208 A CN201280062208 A CN 201280062208A CN 104012188 A CN104012188 A CN 104012188A
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CN
China
Prior art keywords
luminescent device
printed circuit
circuit board
link
contact area
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Granted
Application number
CN201280062208.5A
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Chinese (zh)
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CN104012188B (en
Inventor
卡斯滕·狄克曼
西蒙·希克坦茨
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Publication of CN104012188A publication Critical patent/CN104012188A/en
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/005—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips for several lighting devices in an end-to-end arrangement, i.e. light tracks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F21Y2115/15—Organic light-emitting diodes [OLED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention relates to a light-emitting component arrangement (100) having: at least one flexible printed circuit board (102); at least one light-emitting component (200) which is coupled to the flexible printed circuit board; and at least one electromechanical connecting part (300, 400); wherein the connecting part (300, 400) is mechanically fixed to the flexible printed circuit board and electrically coupled to the light-emitting component (200), and the connecting part (300, 400) has an electromechanical connection (310, 410) for mechanically and electrically connecting a connecting element (320, 420) which is external to the printed circuit board.

Description

Luminescent device device
Technical field
The present invention relates to a kind of luminescent device device.
Background technology
For realize light source, Organic Light Emitting Diode), LED luminous plaque (LED:, conventionally adopt omnibearing contact to connect light-emitting diode) or the uniform luminescent image of the area source of OLEC light source (OLEC: the Organic Light Emitting Diode based on carbon)) for example, below for example, also referred to as being surface radiation device (oled light brick (OLED:.For this reason, not only on each area source but also between a plurality of these area sources, need to be electrically connected to.Described electrical connection and its electric return wire at least one common link position need space, and this especially causes the raising of area requirements or the increase of gross thickness in the region of area source itself.Guide on the position of a plurality of lines (crosspoint) must superpose each other in mode insulated from each other, this even cause almost by light source by the determined double thickness of cable.
From the known a kind of oled light source device of LEDON OLED Lighting GmbH & Co.KG company, wherein OLED is arranged on the printed circuit board (PCB) (Printed Circuit Board, PCB) of printing.
In addition known, via flexible printed circuit board and its pad, only guarantee the power supply to light source.For the interface of fixed printed circuit board outside mechanically, need additional mechanical permanent plant (for example additional clamping element).
Summary of the invention
Luminescent device device is provided in different execution modes, and described luminescent device device can be realized the light source of luminescent device device is electrically connected to and mechanical connection more simply with the interface of printed circuit board (PCB) outside.
In different execution modes, luminescent device device is provided, described luminescent device device has: at least one flexible printed circuit board; At least one luminescent device, described luminescent device and flexible printed circuit board are coupled; At least one mechatronics parts; Wherein link be mechanically fixed on flexible printed circuit board and with luminescent device electrical coupling, and wherein link have electromechanical interface for mechanically with electricity be connected the Connection Element of printed circuit board (PCB) outside.
In a design, at least one luminescent device can have at least one organic luminescent device.
In another design, luminescent device device can have a plurality of flexible printed circuit boards.
In another design, at least one luminescent device can have at least one Organic Light Emitting Diode.
In another design, at least one link can be fixed on the fringe region of luminescent device or be fixed therein.
In another design, at least one link can weld, bonding, peg graft and/or be clamped on flexible printed circuit board.
In another design, electromechanical interface can have socket connection parts.
In another design, electromechanical interface can have plug.
In another design, electromechanical interface can have at least one hook.
In another design, electromechanical interface can have at least one bayonet coupling.
In another design, electromechanical interface can have at least one clamping element.
In another design, flexible printed circuit board can have a plurality of contact areas, and wherein each contact area has anode contact area and territory, negative contact zone; Wherein can be provided with a plurality of links, wherein the anode contact area electrical coupling of the first contact area in the first link and a plurality of contact area and with territory, the negative contact zone electric insulation of the first contact area, and wherein the second contact area in the second link and a plurality of contact area territory, negative contact zone electrical coupling and with the anode contact area electric insulation of the second contact area.
Accompanying drawing explanation
Embodiments of the invention are shown in the drawings and illustrate in detail below.
Accompanying drawing illustrates:
Fig. 1 illustrates according to the vertical view of a part for the luminescent device device of an embodiment;
Fig. 2 illustrates the cross-sectional view running through according to the luminescent device of the luminescent device device in Fig. 1 of an embodiment;
Fig. 3 A to 3D illustrates according to the different element of the luminescent device device in Fig. 1 of an embodiment;
Fig. 4 A to 4D illustrates according to the different element of the luminescent device device in Fig. 1 of an embodiment;
Fig. 5 illustrate have link according to the stereogram of the luminescent device device in Fig. 1 of an embodiment; With
Fig. 6 A to 6C illustrates according to the different element of the luminescent device device in Fig. 1 of an embodiment.
Embodiment
Below in detailed explanation with reference to accompanying drawing, described accompanying drawing forms a part for described explanation, and for graphic extension illustrates, can implement concrete execution mode of the present invention in described accompanying drawing.In this regard, about the orientation of described accompanying drawing and application direction term for example " on ", D score, 'fornt', 'back', " front portion ", " rear portion " etc.Because the part of execution mode can be located with a plurality of different orientations, so direction term is used for graphic extension and is restricted never in any form.It being understood that and can use other execution mode and can carry out change structural or in logic, and do not depart from protection scope of the present invention.Unless it being understood that separately and be specifically noted, the feature of the execution mode of different example described here can combine mutually.Therefore, it is restricted that the following detailed description should not be construed as, and protection scope of the present invention limits by appended claim.
In the scope of this specification, term " connection ", " connection " and " being coupled " for describe directly and be indirectly connected, directly or indirectly connection and directly or being indirectly coupled.In the accompanying drawings, so long as suitable, same or similar element is just provided with identical Reference numeral.
Fig. 1 illustrates according to the vertical view of a part for the luminescent device device 100 of an embodiment.In different embodiment, luminescent device device 100 has at least one Organic Light Emitting Diode (OLED).Yet, in a further embodiment, luminescent device device 100 also can have other area source, for example one or more light-emitting diodes (LED) arbitrarily, the form that is for example LED luminous plaque, or one or more Organic Light Emitting Diode (OLEC) based on carbon.Luminescent device device 100 forms light source module intuitively, and described light source module can interconnect in mode arbitrarily with other light source module.
Fig. 2 illustrate run through have OLED as light source, in other words as luminescent device according to the cross-sectional view of the luminescent device device 100 in Fig. 1 of an embodiment.Be noted that in different embodiment and can in luminescent device device 100, be provided with any heteroid OLED.
In different embodiment, the light source 200 of light source 100, for example OLED have substrate 202 and the first electrode 204, below also referred to as basic electrode 204, and described the first electrode is applied to, is for example deposited on substrate.
At this applied " substrate " 202, for example can there is the substrate 202 that is generally used for electronic device.Substrate 202 can be transparent substrate 202.Yet substrate 202 can be also nontransparent substrate 202.For example, substrate 202 can have glass, quartz, sapphire, plastic film, metal, metallic film, silicon wafer or other applicable material.Metal substrate is for example applied in the situation that electrode growth layer is not directly set thereon.In different designs, following layer is interpreted as to substrate 202, on described layer, when manufacturing light source 100, subsequently apply all other layers.This follow-up layer can be for example for the necessary layer of radiation-emitting in light source 100.
Metal substrate for example can be applied in the situation that is not directly provided with the electrode growth layer as also elaborated below thereon.In different embodiment, basic electrode 204 can be for example that anode and the tin oxide (ITO) that for example adulterated by indium form or the tin oxide that adulterated by indium forms.
The first electrode 204 can be male or female.The first electrode 204 can have hole function that inject or electronic injection.
In different embodiment, it is transparent that substrate 202 and/or the first electrode 204 can be configured to.
In different embodiment, the first electrode 204 can apply by means of sputter or by means of hot evaporation.In different embodiment, the first electrode 204 can have about 5nm to the layer thickness in the scope of about 300nm, for example at about 100nm to the layer thickness in the scope of about 200nm.
In different embodiment, on the first electrode 204, apply one or more organic function layers 206 for electric charge transmission with for generation of light, for example apply fluorescigenic and/or phosphorescent emission layer.
Can be located at according to the example of the emissive material in the OLED of different embodiment and comprise organic or organometallic compound, for example, as the derivative of poly-fluorenes, polythiophene and polyphenylene (gather-p-phenylene vinylene that 2-or 2,5-replace); And metal complex, iridium complex for example, as sent out FIrPic (Ru (dtb-bpy) 3*2 (PF of the Ir (ppy) 3 (three (2-phenylpyridine) iridium III) of two (the fluoro-2-of 3,5-bis-(2-pyridine radicals) phenyl-(2-carboxyl pyridine base)-iridium III), green-emitting phosphorescence, a red phosphorescent of blue phosphorescent 6)) (three [4,4 '-bis--tert-butyl-(2,2 ')-bipyridine] ruthenium (III) complex compound) and the DPAVBi (4 that sends out blue-fluorescence, 4-two [4-(two-p-tolyl is amino) styryl] biphenyl), the TTPA (9 of green-emitting fluorescence, two [N, N-bis--(the p-tolyl)-amino] anthracenes of 10-) and DCM2 (4-dicyano methylene)-2-methyl-6-julolidine groups-9-thiazolinyl-4H-pyrans of a red fluorescence) as non-polymer emitter.This non-polymer emitter for example can deposit by means of hot evaporation.In addition, can use polymeric emitters, described polymeric emitters especially can deposit by means of wet chemistry method, for example spin-coating method (also referred to as Spin Coating).
Emissive material can embed in basis material in the mode being applicable to.
The emissive material of the emission layer of OLED for example can be chosen as, and makes opto-electronic device transmitting white.Emission layer can have the emissive material of multiple transmitting different colours (for example blue and yellow or blue, green and red), as an alternative, emission layer also can be constructed by a plurality of sublayers, as sent out the emitter of blue-fluorescence, the emission layer of green-emitting phosphorescence and send out the emission layer of red phosphorescent.By mixing different colors, can access the transmitting of the light with white color impression.As an alternative, also can propose, in the light path of the primary emission by these layer of generation, be provided with transition material, described transition material absorbs the secondary radiation of primary radiation and transmitting different wave length at least in part, makes from (not being also white) primary radiation by primary radiation and secondary radiation combination are obtained to white color impression.
Can be provided with other organic function layer, described organic function layer is for example for further improving function and then the efficiency of electronic device.
It is pointed out that in the embodiment of alternative, can be provided with the light emitting functional layer, for example organic function layer that are applicable to arbitrarily form, and the present invention is not restricted to the functional layer of particular type.
In different embodiment, alternatively can be on one or more organic function layers 206 (for example metal) covering contact site 208 that can conduct electricity of deposit transparent, be for example the form of the second electrode 208.The second electrode 208 can form by following manner: applied layer thickness is that 5nm for example, to about 300nm, for example layer thickness (optically transparent) metal level in the scope of the extremely about 200nm of about 100nm.
Metal level can have at least one in following material: the combination of aluminium, barium, indium, silver, copper, gold, magnesium, samarium, platinum, palladium, calcium and lithium and these metals or described metal or the compound, for example alloy that described one or more metals, consist of.
Second electrode 208 with metal level is for example negative electrode at the first electrode 204 for anode in the situation that.
In different embodiment, transparent metal coated electrode 208 has the layer that the 10nm that consists of silver is thick or is made by it, and wherein transparent metal coated electrode 208 can apply by means of hot evaporation.
In different embodiment, transparent metal coated electrode 208 has the layer that the 10nm that consists of silver is thick or is made by it, and wherein transparent metal coated electrode 208 can apply by means of hot evaporation.
As also shown in figure 2, the regulating course 210 apply on the surface of exposing of the transparent covering contact site 208 that can conduct electricity, for example deposition or sputter having optics, exports for optical coupling.
As being configured to top/bottom reflector according to the OLED shown in figure 2 of the implementation of the light source 100 of different embodiment.In the embodiment of alternative, light source 100 can be configured to " bottom emitter " or be configured to " top emitters ".
Completely blanket, in top emitters or bottom emitter, it is transparent and another electrode can be configured to and reflects that being of the equipment of emitted radiation can be configured to according to the electrode of the form of the growth electrode of different embodiment.Alternative is in this, and it is transparent that these two electrodes also can all be configured to.
As the term in this application " bottom emitter ", represent following embodiment, the substrate side that described embodiment is configured to towards OLED is transparent.For example, for this reason, at least substrate 202, electrode and to be arranged on that electrode growth layer between substrate 202 and electrode can be configured to be transparent.Therefore the radiation that the OLED that, is configured to bottom emitter produces in for example can being transmitted in organic function layer 208 in the substrate side 202 of OLED.
As the term in this application " top emitters ", for example represent following embodiment, the second electrode side that described embodiment is configured to towards OLED is transparent.Especially, for this reason, it is transparent that electrode growth layer and the second electrode can be configured to.Therefore the radiation that the OLED that, is configured to top emitters produces in for example can being transmitted in organic function layer in the supplemantary electrode side of OLED.
According to the luminescent device device 100 that is configured to top emitters of different embodiment, can there is in an advantageous manner high optical coupling output and the extremely low angle-dependence of radiation density, in described top emitters, be provided with the metal level that electrode growth layer and conduct cover contact site.Can be in an advantageous manner for example, for illumination, room lighting according to the equipment of the emitted radiation of different embodiment.
In different embodiment, be provided with equally the combination of bottom emitter and top emitters.In this embodiment, luminescent device device 100 can---namely not only towards substrate side but also towards the second electrode side---be launched conventionally by the light producing in organic function layer 208 on both direction.
In another embodiment, between electrode and supplemantary electrode, be provided with at least one third electrode and electrode growth layer is arranged on third electrode in a side of substrate 202.
" third electrode " can be used as middle contact site.Described third electrode can be used in the electric charge transmission improving through the layer of luminescent device device 100, and then improves the efficiency of luminescent device device 100.Third electrode can be configured to ambipolar layer; Described third electrode can be configured to negative electrode or anode.
As electrode and supplemantary electrode, third electrode electrically contacts equally.
In an improved form of luminescent device device 100, comprise as the emission layer of organic function layer and one or more other organic function layer.Described other organic function layer can be selected from hole injection layer, hole transmission layer, hole blocking layer, electron injecting layer, electron transfer layer and electronic barrier layer.
In different embodiment, OLED has lambert's radioactive nature substantially.The desirable radiological performance that represents so-called Lambertian radiator as the term in this application " lambert's radioactive nature ".As " substantially " lambert radioactive nature in this expression, at this, especially refer to according to formula I (Θ)=I 0the radioactive nature that cos Θ calculates, and wherein, I 0about the intensity of face normal and the angle of Θ explanation and face normal, for given angle, especially in the situation that-70 ° and+angle between 70 °, for the angle Θ providing arbitrarily, deviation is not more than according to 10% of the intensity of above-mentioned formula, namely I (Θ)=I 0cos Θ x, wherein x=90% to 110%.
With which likely, realize constant radiation density or the optical density in whole directions of OLED, make OLED all in directions, seem bright equally.Therefore,, when OLED tilts with respect to direction of observation, the brightness of OLED even also can be constant in an advantageous manner.
In another embodiment, the transparency of OLED is for being more than or equal to 60%.For example, transparency can be for being more than or equal to 65%.By scanning default wave-length coverage and detecting the light quantity through the equipment ejaculation of emitted radiation, by means of ionization meter, measure transparency.In the situation that transparent OLED, flexible PCB can be constructed so that repertoire is positioned at outside light-emitting face.
As the term in this application " transparency ", represent to allow electromagnetic wave according to each layer of the electronic device of different embodiment---and especially visible ray---ability seeing through.
According to the transparency of the OLED of different embodiment conventionally at least at least one concrete wavelength for being greater than 60%, being preferably more than 65%.For example, transparency for about 400nm at least one wavelength in the wave-length coverage of about 650nm can be for being greater than 60% and for example for being greater than 65%.
In addition, can have other functional layer according to the OLED of different embodiment, for example, be anti-reflecting layer, scattering layer, for layer and/or the mechanical protection layer of the color conversion of light.This layer for example can be arranged on the metal level of growth electrode.Functional layer for example can deposit by means of hot evaporation.Described layer can further improve function and the efficiency of OLED.
In addition can as shown in Figure 2, the surface of exposing of substrate 202 be arranged on flexible printed circuit board 102 (Flexible Printed Circuit Board, FPCB, flexible printed circuit board).Printed circuit board (PCB) 102 can have material layer or a plurality of (any amount in principle) layer printed circuit board.In addition, printed circuit board (PCB) 102 can have the layer that one or more (structurized) can conduct electricity, and described layer that can conduction can have one or more (for example metal) ribbon conductors that can conduction.Printed circuit board (PCB) for example can have plastics or be made by it, for example polyimides.
The setting with the printed circuit board (PCB) of ribbon conductor can realize to be abandoned for drawing the cable in the remarkable space of needs through luminescent device device 100 of telegram in reply gesture, cross-over connection luminescent device device 100 wherein, and there is no the electric current that draws back of guiding through luminescent device device 100 (and then for example pass through OLED layer shown in figure 2) itself, but the ribbon conductor that is provided for drawing back of process printed circuit board (PCB) 102 only.
Therefore,, in different embodiment, the application of printed circuit board (PCB) or a plurality of thin printed circuit board (PCB) that also can form flexibly can realize the simple wiring of one or more area sources.These printed circuit board (PCB)s extremely unfertile land form, to reduce thickness stack (Dickenauftrag).The printed circuit board (PCB) of multilayer (printed circuit board (PCB) for example in other words, with a plurality of ribbon conductor planes) can be realized with extremely thin type and method and realize crosspoint.The series connection of a plurality of area sources can be by one or more portions of connecting are integrated in this printed circuit board (PCB) and are realized, and do not need additional cable.This portion that connects forms by the plane that can conduct electricity that only needs to be included in the specific part of printed circuit board (PCB) 102 in printed circuit board (PCB) 102.The region of other of printed circuit board (PCB) 102 can intentionally be vacated, to also do not affect at these locational transparent area sources.Embodiment as flexible printed circuit board also can realize for contacting the application of flexible surface light source.
In different embodiment, luminescent device device 100 has shape arbitrarily in vertical view, for example circular (be for example circular or oval-shaped), as an alternative, for example have, with (the polygonal shape of the angle of any amount and the shape on limit in principle, for example leg-of-mutton, tetragonal (for example rectangle), pentagonal, hexagonal, heptagonal, octagonal shape etc., it is regular or irregular).
In implementation shown in Figure 1, the well-regulated octagonal shape of luminescent device device 100 tool in vertical view.
Printed circuit board (PCB) 102 can have the shape of the shape that is matched with luminescent device device 100, for example, in global shape or only in a part, for example, in the fringe region or perimeter of luminescent device, in described fringe region or perimeter, for example, can be provided with for delivery of or provide the interface of (being the form of electromotive force or electric current) electric energy.In different embodiment, printed circuit board (PCB) 102 has annular shape, and described annular shape has annular region 104 and on some regions, has outward extending region of ring week (for example rectangular area) 106 along annular region 104 (for example, below also referred to as being fringe region).
Printed circuit board (PCB) 102 has a plurality of interfaces 108 that are coupled with light source 200 in different embodiment, and described interface can be used as input interface or be used as output interface according to outside contact.
In different embodiment, each in interface 108 can have the first electromotive force interface 110 (for example, for delivery of the first electromotive force input interface 110 of the first electromotive force or for the first electromotive force output interface 110 of the first electromotive force is provided) for contacting in device external with the first electromotive force and have the second electromotive force interface 112 (described the second electromotive force can be identical or different with the first electromotive force) (for example, for delivery of the second electromotive force input interface 112 of the second electromotive force or for the second electromotive force output interface 112 of the second electromotive force is provided) for contacting in device external with the second electromotive force.The first electromotive force can also use higher than the second electromotive force and in Fig. 1 symbol "+" to represent; Correspondingly, the second electromotive force also uses symbol "-" to represent in Fig. 1.Therefore, in different embodiment, the first electromotive force interface 110 can be referred to as cathode zone, and the second electromotive force interface 112 can be referred to as anode region.Corresponding the first electromotive force interface 110 and corresponding the second electromotive force interface 112 are included in common contact area.
Even according to being provided with eight interfaces 108 in the printed circuit board (PCB) 102 of Fig. 1, be noted that the interface that can be provided with in principle any amount, for example two, three, four, five, six, seven, eight or more interface.
The first electromotive force interface 110 in different embodiment can with the first contact site of light source 200, for example the first electrode (for example the first electrode 204), for example anodic bonding, and the second electromotive force interface 112 can be with the second contact site of light source 200, for example the second electrode (for example the second electrode 208), for example negative electrode are connected.In the embodiment of alternative, the first electromotive force interface 110 can be connected with the negative electrode of light source 200 and the second electromotive force interface 112 can with the anodic bonding of light source 200.
In addition,, according to different embodiment, each in interface 108 can have cross-over connection interface 114 (below also referred to as connecting interface 114).Cross-over connection interface 114 in different embodiment not with the electrical coupling of light source 200 own, but be coupled by means of other cross-over connection interface 114 of one or more ribbon conductors of printed circuit board (PCB) 102 and printed circuit board (PCB) 102, be applied to thus electromotive force on a cross-over connection interface 114 of printed circuit board (PCB) 102 and only walk around light source 200 " successively by (durchgeschleift) " printed circuit board (PCB) 102 and externally offer another light source 102 or another electronic equipment being coupled on another cross-over connection interface 114 of described cross-over connection interface 114.In different embodiment, at least one ribbon conductor (integrally) that is used as the portion of drawing is go back to integrated in printed circuit board (PCB) 102.
Be noted that in different embodiment, one or more cross-over connection interfaces 114 can be independent of interface 108 and for example be independent of the electromotive force interface of interface 108 as described above and arrange individually.
In addition, printed circuit board (PCB) 102 can also have protection diode 116, for example, be the form of Schottky diode 116.
In addition, luminescent device device can have one or more air suction elements in different embodiment, and described air suction element is made by gettering material or had described gettering material for such as in conjunction with oxygen and/or water etc.
In different embodiment, can be provided with membrane encapsulation devices.For example " membrane encapsulation devices " or " block film " can be interpreted as in the application's scope to following layer or layer structure, described layer or layer structure are suitable for forming opposing chemical impurity or atmospheric substance, especially resist stopping of water (moisture) and oxygen.In other words, membrane encapsulation devices is configured to, and it can not or at most extremely marginally be passed as water, oxygen or solvent by the material that damages OLED.
According to a design, membrane encapsulation devices can be configured to independent layer (in other words, being configured to individual layer).According to the design of an alternative, membrane encapsulation devices can have a plurality of sublayers that stack forms each other.In other words, according to a design, membrane encapsulation devices can be configured to layer heap (Stack).One or more sublayers of membrane encapsulation devices or membrane encapsulation devices for example can form by means of suitable deposition process, for example according to a design by means of atomic layer deposition method (Atomic Layer Depostion (ALD)), the atomic layer deposition method (Plasma Enhanced Atomic Layer Depostion (PEALD)) that for example plasma strengthens or without isoionic atomic layer deposition method (Plasma-less Atomic Layer Depostion (PLALD)), or according to another design by means of chemical vapour deposition technique (Chemical Vapor Deposition (CVD)), the chemical vapour deposition technique (Plasma Enhanced Chemical Vapor Deposition (PECVD)) that for example plasma strengthens or without isoionic chemical vapour deposition technique (Plasma-less Chemical Vapor Deposition (PLCVD)), or as an alternative by means of other applicable deposition process.
In different embodiment, for example, in different application (light fixture, furniture, vehicle or the consumer goods) by avoiding the thickness of line after area source to superpose providing the extremely flat integrated of area source.
Fig. 3 A to Fig. 3 D illustrates according to the different element of the luminescent device device in Fig. 1 of an embodiment;
Fig. 3 A illustrates the reduced graph of luminescent device device 100 with vertical view, for example, be flexible printed circuit board and the luminescent device with fringe region 106, and described fringe region forms with the form of (stair-stepping) edge indentations in this case.
Fig. 3 B illustrates the vertical view of mechatronics parts 300.Corresponding mechatronics parts 300 can be arranged in the corresponding fringe region 106 that is provided with edge indentations and be fixed on there as illustrated by means of arrow 302,304,306,308 in Fig. 3 A and 3B, for example welding, bonding, peg graft and/or be clamped in there.Therefore, link 300 is mechanically fixed on flexible printed circuit board (be for example fixed on the corresponding fringe region 106 of luminescent device or be fixed therein).
On the lip-deep downside 312 exposing (seeing Fig. 3 C) that lies in edge 106 not illustrating of mechatronics parts 300, be provided with at least one contact area that can conduct electricity 314 in Fig. 3 B, can be by the first electromotive force interface 110 and/or second electromotive force interface 112 electrical couplings of mechatronics parts 300 and flexible printed circuit board 102 by means of described contact area.
Mechatronics parts 300 can have link body (being generally supporting body) 316, on the downside of described link body, apply the contact area 314 that can conduct electricity and in side 318, apply electromechanical interface 310 thereon, for mechanically with electricity be connected the Connection Element 320 (seeing Fig. 3 D) of printed circuit board (PCB) outside.Electromechanical interface 310 can be configured to plug (be configured in other words convex socket connection parts or be configured to pin) or be configured to socket (be configured in other words spill socket connection parts, be configured in other words plug receiving element).The contact area 314 that can conduct electricity is electrically connected to electromechanical interface 310 through link body 316 in different embodiment.
Link body 316 can be made by electrical insulating material in different embodiment, for example, be made of plastics.
Fig. 3 C illustrates the end view of mechatronics parts 300.
Fig. 3 D illustrates the end view of the Connection Element 320 of printed circuit board (PCB) outside, and described Connection Element forms with mechatronics parts 300 with matching.
Shown at Fig. 3 D, the Connection Element 320 of printed circuit board (PCB) outside has and the corresponding mating member 322 of electromechanical interface 310, in the example shown in Fig. 3 C and 3D, be plug receiving element 322 (be for example the form of clamping element 322, be for example the form of metal clamp part 322), described plug receiving element is arranged in the first side 326 of Connection Element body 324 (being generally supporting body).In different embodiment, Connection Element body 324 with opposed the second side 328 of the first side 326 on be provided with the structure 330,332 that can conduct electricity, for example line 330,332 (for example metal wire 330,332) or can conduct electricity be with 330,332, and by means of the connector that can conduct electricity 334 and mating member 322 electrical couplings that stretch through Connection Element body 324.
With which, extremely simply and at low cost provide externally between conductor, for example cable or line and flexible printed circuit board 102 so that with luminescent device 200, be for example coupled with electrical coupling and the machinery of OLED200.
In different embodiment, being coupled of plug 310 that the machinery between electromechanical interface 310 and the Connection Element 320 of printed circuit board (PCB) outside is coupled, is for example contained in clamping element 322 is designed to mechanically unclamp.As an alternative, be coupled also and can releasably do not form, for example in mating member 322, be provided with structure, for example barb in this case, described structure prevents that electromechanical interface 310 from unclamping from mating member 322.
Fig. 4 A to Fig. 4 D illustrates according to the different element of the luminescent device device in Fig. 1 of an embodiment.
Fig. 4 A illustrates the simplification view of luminescent device device 100 with vertical view, for example, be flexible printed circuit board and the luminescent device with fringe region 106, and described fringe region forms with the form of (stair-stepping) edge indentations in this case.
Fig. 4 B illustrates the vertical view of mechatronics parts 400.Corresponding mechatronics parts 400 can be arranged in the corresponding fringe region 106 that is provided with edge indentations and be fixed on there as illustrated by means of arrow 402,404,406,408 in Fig. 4 A and 4B, for example welding, bonding, peg graft and/or be clamped in there.Therefore, link 400 is mechanically fixed on flexible printed circuit board (be for example fixed on the corresponding fringe region 106 of luminescent device or be fixed therein).
On the lip-deep downside 412 exposing (seeing Fig. 4 C) that lies in fringe region 106 not illustrating of mechatronics parts 400, be provided with at least one contact area that can conduct electricity 414 in Fig. 4 B, by means of described contact area can by mechatronics parts 400 and the first electromotive force interface 110 and/or with the second electromotive force interface 112 electrical couplings.
Mechatronics parts 400 can have link body (being generally supporting body) 416, on the downside of described link body, apply the contact area 414 that can conduct electricity and in side 418, apply electromechanical interface 410 thereon, for mechanically with electricity be connected the Connection Element 420 (seeing Fig. 4 D) of printed circuit board (PCB) outside.Electromechanical interface 410 can be configured to hook.The contact area 414 that can conduct electricity is electrically connected to electromechanical interface 410 through link body 416 in different embodiment.
Link body 416 can be made by electrical insulating material in different embodiment, for example, be made of plastics.
Fig. 4 C illustrates the end view of mechatronics parts 400.
Fig. 4 D illustrates the end view of the Connection Element 420 of printed circuit board (PCB) outside, and described Connection Element forms with mechatronics parts 400 with matching.
Shown at Fig. 4 D, the Connection Element 420 of printed circuit board (PCB) outside has and the corresponding mating member 422 of electromechanical interface 410, hook 422 for matching in the example shown in Fig. 4 C and 4D, described hook is arranged in the first side 426 of Connection Element body 424 (being generally supporting body).In different embodiment, Connection Element body 424 with opposed the second side 428 of the first side 426 on be provided with the structure 430,432 that can conduct electricity, for example line 430,432 (for example metal wire 430,432) or can conduct electricity be with 430,432, and by means of the connector that can conduct electricity 434 and mating member 422 electrical couplings that stretch through Connection Element body 424.
With which, extremely simply and at low cost provide externally between conductor, for example cable or line and flexible printed circuit board 102 so that with luminescent device 200, be for example coupled with electrical coupling and the machinery of OLED200.
In the embodiment of unshowned alternative, as long as mating member provides electrical coupling, electromechanical interface also can form with different forms.Therefore, for example electromechanical interface can be configured to bayonet coupling or form with the form of clamping element or other applicable form.
In different embodiment, the machinery between electromechanical interface 410 and the Connection Element 420 of printed circuit board (PCB) outside is coupled, being coupled of for example hook 410,422 is designed to mechanically unclamp.As an alternative, be coupled also and can releasably do not form, for example in mating member 422, be provided with structure, for example barb in this case, described structure prevents that electromechanical interface 410 from unclamping from mating member 422.
Fig. 5 illustrate have link 300,400 according to the stereogram of the luminescent device device 100 in Fig. 1 of an embodiment.As shown in fig. 5, link 300,400 is applied in the recess of fringe region 106.
Fig. 6 A to 6C illustrates according to the different element of the luminescent device device in Fig. 1 of an embodiment.
In different embodiment, at least one flexible printed circuit board can have a plurality of contact areas, and wherein each contact area has anode contact area and territory, negative contact zone.As illustrated by means of arrow 602,604,606,608 in Fig. 6 A, for example corresponding link 300,400 can be arranged on accordingly, in (being provided with recess) fringe region 106, wherein can provide reverse polarity protection.
The first link can with a plurality of contact areas in the first contact area anode contact area electrical coupling and with territory, the negative contact zone electric insulation of the first contact area.In addition, the second link can with a plurality of contact areas in the second contact area territory, negative contact zone electrical coupling and with the anode contact area electric insulation of the second contact area.
Shown at Fig. 6 A, gang socket, the Connection Element 320,420 that is for example generally printed circuit board (PCB) outside can be with respect to the region division that is provided with link 300,400 above on fixing default position.The electromechanical interface 310,410 of corresponding link 300,400 is arranged to, make described electromechanical interface only for two rotational orientation of luminescent device device 100, be matched with interface socket 320,420, for directed shown in Fig. 6 A and for the orientation of rotating 180 ° with respect to it, wherein pivot center is perpendicular to drawing planar extension intuitively.If on the contrary luminescent device device 100 is only rotated to 90 °, observes so: electromechanical interface 310,410 does not match interface socket 320,420.With which, reach reliable reverse polarity protection.
In different embodiment, luminescent device can be designed to area source, also referred to as surface radiation device or surface radiation device light source.
Area source can be interpreted as following light source in different embodiment: in contrast to point-source of light, for example incandescent lamp, by the source with face expansion, produce light.The different example of area source is, Light-Emitting Diode (LED), the form that is for example the LED luminous plaque with a plurality of LED that are coupled each other, Organic Light Emitting Diode (OLED), the form that is for example the oled light brick with a plurality of OLED that are coupled each other, OLEC light source (wherein OLEC is interpreted as the Organic Light Emitting Diode based on carbon), for example, be the form of the OLEC light brick with a plurality of OLEC that are coupled each other.
Flexible printed circuit board can have a layer or a plurality of layer, for example, have a ribbon conductor plane or have a plurality of ribbon conductor planes (having respectively for example one or more ribbon conductors).
By by link (such as plug, hook etc.) conduction, machinery and flexible PCB (for example, by welding) combination, can realize the mechatronics of illuminated component (for example organic light emission member, for example OLED member).In different embodiment, by being set matchingly, link can additionally realize reverse polarity protection.
Link can adopt different forms.The mating member of coupling can be made as the conductor for fixed printed circuit board outside.
In different embodiment, no longer need other machinery to fix.

Claims (10)

1. a luminescent device device (100), described luminescent device device has:
At least one flexible printed circuit board (102);
At least one luminescent device (200), described luminescent device and described flexible printed circuit board (102) are coupled;
At least one dynamo-electric link (300,400);
Wherein said link (300,400) be mechanically fixed on described flexible printed circuit board (102) upper and with described luminescent device (200) electrical coupling, and
Wherein said link (300,400) has electromechanical interface (310,410) for mechanically and electricly connecting the Connection Element (320,420) of printed circuit board (PCB) outside.
2. luminescent device device according to claim 1 (100), wherein described at least one, luminescent device (200) has at least one organic luminescent device (200).
3. luminescent device device according to claim 2 (100), wherein described at least one, luminescent device (200) has at least one Organic Light Emitting Diode (200).
4. according to the luminescent device device (100) described in any one in claims 1 to 3, wherein described at least one, link (300,400) is fixed in the fringe region (106) of described luminescent device (200) or is fixed on the fringe region (106) of described luminescent device (200).
5. according to the luminescent device device (100) described in any one in claim 1 to 4, wherein link (300,400) welding described at least one, bonding, peg graft and/or be clamped on described flexible printed circuit board (102).
6. according to the luminescent device device (100) described in any one in claim 1 to 5, wherein said electromechanical interface (310,410) has socket connection parts (310).
7. luminescent device device according to claim 6 (100), wherein said electromechanical interface (310,410) has plug (310).
8. according to the luminescent device device (100) described in any one in claim 1 to 5, wherein said electromechanical interface (310,410) has at least one hook (410).
9. according to the luminescent device device (100) described in any one in claim 1 to 5, wherein said electromechanical interface (310,410) has at least one bayonet coupling or has at least one clamping element.
10. according to the luminescent device device (100) described in any one in claim 1 to 9,
Wherein described at least one, flexible printed circuit board (102) has a plurality of contact areas, and wherein each contact area has anode contact area and territory, negative contact zone;
Wherein be provided with a plurality of links (300,400), the first link (300 wherein, 400) with a plurality of described contact areas in the first contact area anode contact area electrical coupling and with territory, the negative contact zone electric insulation of described the first contact area, and wherein territory, the negative contact zone electrical coupling of the second contact area in the second link (300,400) and a plurality of described contact areas and with the anode contact area electric insulation of described the second contact area.
CN201280062208.5A 2011-12-16 2012-12-13 Luminescent device device Active CN104012188B (en)

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US9245929B2 (en) 2016-01-26
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CN104012188B (en) 2017-03-08
WO2013087745A1 (en) 2013-06-20
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KR101821292B1 (en) 2018-03-09
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