CN104010440B - The pcb board bonding wire and point gum machine of a kind of batch operation - Google Patents

The pcb board bonding wire and point gum machine of a kind of batch operation Download PDF

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Publication number
CN104010440B
CN104010440B CN201410234510.5A CN201410234510A CN104010440B CN 104010440 B CN104010440 B CN 104010440B CN 201410234510 A CN201410234510 A CN 201410234510A CN 104010440 B CN104010440 B CN 104010440B
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CN
China
Prior art keywords
bonding wire
pcb board
head
control box
glue dripping
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Application number
CN201410234510.5A
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Chinese (zh)
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CN104010440A (en
Inventor
杨俊民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saijing (Jiangsu) Vision Technology Co.,Ltd.
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Suzhou Kunen Electronic Technology Co Ltd
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Priority to CN201410234510.5A priority Critical patent/CN104010440B/en
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Abstract

The invention discloses pcb board bonding wire, the point gum machine of a kind of batch operation, including control box, the control box bottom is provided with just to being provided with micro- enlarging instrument at operating desk at the top of operating desk, the control box, and the micro- enlarging instrument is connected with display;The control box both sides are provided with perforate, and the perforate, which is located inside control box, is provided with motion arm, and the free end of the motion arm is connected with bonding wire head or Glue dripping head, and the perforate, which is located at outside control box, is provided with action bars, and the action bars can drive motion arm to move;The bonding wire head or Glue dripping head are provided with displacement transducer, the displacement route for detecting and recording bonding wire head or Glue dripping head;Advantages of the present invention has:The present apparatus makes operator be easy to watch the details of pcb board, is also easy to see clearly the operation of oneself;Displacement transducer is provided with bonding wire head or Glue dripping head, the mobile route of bonding wire head or Glue dripping head is can record so that when operating same pcb board again, just can be operated automatically.

Description

The pcb board bonding wire and point gum machine of a kind of batch operation
Technical field
The present invention relates to pcb board wire-soldering device, the pcb board bonding wire and point gum machine of particularly a kind of batch operation.
Background technology
Existing pcb board wire bonding process usually requires operating personnel and operated under the microscope, and PCB is first fixed under the microscope Plate, then by cursor to needing position of bonding wire to position on pcb board, then carries out careful bonding wire, in wire bonding process, Eyes will watch the high-power microscope of nation's machine attentively, check whether bonding wire conveys normal and bond pad locations and have unchanged, it is therefore desirable to Operating personnel concentrate, and eyes will dig-in microscope camera lens, easy excessive wear eyes;And during pcb board dispensing, Need operating personnel to accurately hold dispensing position, and to ensure required part dispensing in place, same easily excessive wear eyes, Cause certain injury to operating personnel, and whole process will lean on the experience and careful degree of operating personnel, thus bonding wire or Dispensing is inefficient, cut can not batch, be rapidly performed by bonding wire or dispensing.
The content of the invention
To solve the deficiencies in the prior art, it is an object of the invention to provide a kind of pcb board bonding wire of batch operation and point Glue machine, can batch operation, save manpower, it is simple to operate, quick.
In order to realize above-mentioned target, the present invention is adopted the following technical scheme that:
The pcb board bonding wire and point gum machine of a kind of batch operation, it is characterised in that including control box, the control box bottom Provided with operating desk, just to being provided with micro- enlarging instrument at operating desk at the top of the control box, the micro- enlarging instrument is connected with display Device;The control box both sides are provided with perforate, and the perforate, which is located inside control box, is provided with motion arm, the free end of the motion arm Bonding wire head or Glue dripping head are connected with, the perforate, which is located at outside control box, is provided with action bars, and the action bars can drive motion arm It is mobile;The bonding wire head or Glue dripping head are provided with displacement transducer, the displacement road for detecting and recording bonding wire head or Glue dripping head Line.
The pcb board bonding wire and point gum machine of a kind of batch operation, it is characterised in that be additionally provided with displacement sensing on the motion arm Device, the displacement route for further detecting and recording bonding wire head or Glue dripping head.
The pcb board bonding wire and point gum machine of a kind of batch operation, it is characterised in that the micro- enlarging instrument both sides are provided with light Source.
The pcb board bonding wire and point gum machine of a kind of batch operation, it is characterised in that the quantity of light source is more than 2.
The pcb board bonding wire and point gum machine of a kind of batch operation, it is characterised in that the multiplication factor of the micro- enlarging instrument can Regulation.
The pcb board bonding wire and point gum machine of a kind of batch operation, it is characterised in that the motion arm and bonding wire head or Glue dripping head Between to be flexibly connected, and can be moved by the operation adjustment bonding wire head or Glue dripping head of action bars.
The pcb board bonding wire and point gum machine of a kind of batch operation, it is characterised in that the operating desk is fixed provided with pcb board Device, bonding wire or pcb board for dispensing glue are wanted for fixation.
The pcb board bonding wire and point gum machine of a kind of batch operation, it is characterised in that the pcb board fixing device is removable , the pcb board fixing device includes 4 fixed lobes, and 4 fixed lobes constitute rectangle, each fixed lobe Lower end is provided with sliding rail in operating desk, for sliding fixed lobe, so as to adjust the position of fixed lobe.
The present invention is advantageous in that:1. the present apparatus amplifies pcb board, bonding wire head or Glue dripping head and including in display On, operator is easy to watch the details of pcb board, be also easy to see clearly the operation of oneself, on the one hand improve operating efficiency, separately On the one hand operating personnel's excess eye-using is also avoided, causes damage;2. being provided with displacement transducer on bonding wire head or Glue dripping head, it can remember Record the mobile route of bonding wire head or Glue dripping head so that when operating same pcb board again, just can automatically be operated, saved Manpower;3. easy to use, simple to operate, low manufacture cost, it is adaptable to widely use.
Brief description of the drawings
Fig. 1 is the pcb board bonding wire and point gum machine schematic diagram of the batch operation of the present invention;
Fig. 2 be the present invention batch operation pcb board bonding wire and point gum machine in pcb board fixing device schematic diagram.
The implication of reference in figure:
1. control box, 2. micro- enlarging instruments, 3. light sources, 4. operating desks, 5. action bars, 6. motion arms, 7. bonding wires Head or Glue dripping head, 8. displacement transducers, 9. fixed lobes, 10. displays, 11. sliding rails.
Embodiment
Make specific introduce to the present invention below in conjunction with the drawings and specific embodiments.
With reference to Fig. 1, the pcb board bonding wire and point gum machine of batch operation of the invention, including control box 1, the bottom of control box 1 Portion is provided with operating desk 4, and the top of the control box 1 is just to being provided with micro- enlarging instrument 2 at operating desk 4, the micro- enlarging instrument 2 is put Big adjustable magnification section, the micro- enlarging instrument 2 is connected with display 10, and the micro- one side of enlarging instrument 2 can be by operating desk 4 On pcb board amplification, on the other hand the image after amplification can be shown on display 10, allow the operator to clearly see Any details on to pcb board;The both sides of control box 1 are provided with perforate, and the perforate, which is located inside control box, is provided with motion arm 6, The free end of the motion arm 6 is connected with bonding wire head or Glue dripping head 7, is living between the motion arm 6 and bonding wire head or Glue dripping head 7 Dynamic connection, the perforate, which is located at outside control box, is provided with action bars 5, and the action bars 5 can drive motion arm 6 to move, in use, Operator operates action bars 5, and action bars 5 drives motion arm 6 to move, and then drives bonding wire head or Glue dripping head 7 to move, and action bars The movement of adjustable bonding wire head or Glue dripping head 7, the action of bonding wire head or Glue dripping head 7 is also exaggerated simultaneously, and is shown in display On 10, operator can carry out trickle operation according to the image amplified on display 10, not only greatly improve operating efficiency, The problems such as avoiding bonding wire mistake, while also having liberated the eyes of operating personnel, it is to avoid stare at microscope consume eyes for a long time; The bonding wire head or Glue dripping head 7 and motion arm 6 are provided with displacement transducer 8, for detecting and recording bonding wire head or Glue dripping head 7 Displacement route, when operating the pcb board again, is not required to manual operation, you can make the displacement of bonding wire head or Glue dripping head 7 before Route carries out automatic bonding wire or dispensing;The both sides of micro- enlarging instrument 2 are respectively equipped with 1 light source 3, for illuminating, make image more To become clear, clearly;The operating desk 4 wants bonding wire or pcb board for dispensing glue provided with 4 pcb board fixed lobes 9 for fixation.
The pcb board bonding wire and point gum machine of the batch operation of the present invention, in addition to said structure, its difference is, described The micro- both sides of enlarging instrument 2 are respectively equipped with 2 light sources 3, for illuminating, and make image more bright, clear;With reference to Fig. 2, the fixation Projection 9 is moveable, and 4 fixed lobes constitute rectangle, and each side for fixing pcb board is described each solid Fixed raised 9 lower end is provided with sliding rail 11 in operating desk 4, for sliding fixed lobe, so as to adjust the position of fixed lobe Put.
In use, first piece of pcb board is put on operating desk 4, and fixed with fixed lobe 9, then carry out bonding wire, point Glue;Displacement transducer 8 detects and records bonding wire head or the displacement route of Glue dripping head 7, is carrying out the weldering of next piece of same pcb board When line, dispensing operation, artificial operation is not required to, lastblock pcb board need to only be removed, fixed lobe 9 is not moved, then by next piece Pcb board is put into corresponding fixed lobe 9, i.e., be consistent with lastblock pcb board position, opens action bars 5, action bars 5 The circuit recorded according to displacement transducer 8 drives motion arm 6 and bonding wire head or Glue dripping head 7 to be grasped according to first time functional arrangement Make, replicate the operating procedure of last time, it is ensured that the synchronous bonding wire of pcb board or dispensing, improve precision, save simultaneously Manpower, improves operating efficiency.
The pcb board bonding wire and point gum machine of the batch operation of the present invention can overcome existing operating personnel to pass through under microscope Bonding wire, shortcoming for dispensing glue are carried out to pcb board, the eyes of operating personnel have not only been liberated, while also being capable of batch operation, liberation behaviour Make the both hands of personnel, greatly improve pcb board bonding wire efficiency
The pcb board bonding wire and point gum machine of the batch operation of the invention of the present invention have put into production, and are tried out, and imitate Fruit is good, is adapted to widely use.
The basic principles, principal features and advantages of the present invention have been shown and described above.The technical staff of the industry should Understand, the invention is not limited in any way for above-described embodiment, it is all to be obtained by the way of equivalent substitution or equivalent transformation Technical scheme, all falls within protection scope of the present invention.

Claims (4)

1. the pcb board bonding wire and point gum machine of a kind of batch operation, it is characterised in that including control box, the control box bottom are set Have just to being provided with micro- enlarging instrument at operating desk at the top of operating desk, the control box, the micro- enlarging instrument is connected with display; The control box both sides are provided with perforate, and the perforate, which is located inside control box, is provided with motion arm, and the free end of the motion arm connects Bonding wire head or Glue dripping head are connected to, the perforate, which is located at outside control box, is provided with action bars, and the action bars can drive motion arm to move It is dynamic;The bonding wire head or Glue dripping head are provided with displacement transducer, the displacement route for detecting and recording bonding wire head or Glue dripping head;
Displacement transducer is additionally provided with the motion arm, the displacement road for further detecting and recording bonding wire head or Glue dripping head Line;
The micro- enlarging instrument both sides are provided with light source;The operating desk is provided with pcb board fixing device, for it is fixed want bonding wire or Pcb board for dispensing glue;The pcb board fixing device is moveable, and the pcb board fixing device includes 4 fixed lobes, described 4 fixed lobes constitute rectangle, and each fixed lobe lower end is provided with sliding rail in operating desk, for making fixed lobe Slide, so as to adjust the position of fixed lobe.
2. the pcb board bonding wire and point gum machine of batch operation according to claim 1, it is characterised in that the quantity of light source For more than 2.
3. the pcb board bonding wire and point gum machine of batch operation according to claim 1, it is characterised in that the micro- amplification The multiplication factor of instrument can adjust.
4. the pcb board bonding wire and point gum machine of batch operation according to claim 1, it is characterised in that the motion arm with To be flexibly connected between bonding wire head or Glue dripping head, and it can be moved by the operation adjustment bonding wire head or Glue dripping head of action bars.
CN201410234510.5A 2014-05-29 2014-05-29 The pcb board bonding wire and point gum machine of a kind of batch operation Active CN104010440B (en)

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CN201410234510.5A CN104010440B (en) 2014-05-29 2014-05-29 The pcb board bonding wire and point gum machine of a kind of batch operation

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Application Number Priority Date Filing Date Title
CN201410234510.5A CN104010440B (en) 2014-05-29 2014-05-29 The pcb board bonding wire and point gum machine of a kind of batch operation

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CN104010440A CN104010440A (en) 2014-08-27
CN104010440B true CN104010440B (en) 2017-09-29

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0305698A2 (en) * 1987-08-31 1989-03-08 Siemens Aktiengesellschaft Dosage device for the coating of a printed circuit board by a soldering paste for the soldering of SMD-components
CN201603663U (en) * 2009-05-19 2010-10-13 深圳市科锐尔自动化设备有限公司 Automatic adhesive dispenser for cylindrical quartz crystal
CN102176068A (en) * 2011-02-17 2011-09-07 苏州日月明微电子科技有限公司 Stepping sensing device of welding wire machine
CN203343013U (en) * 2013-06-03 2013-12-18 上海深邦电气有限公司 Automatic dispenser with quantitative control
CN203565284U (en) * 2013-10-25 2014-04-30 惠州市桑莱士光电有限公司 Automatic dispensing equipment for mobile phone camera module with CCD (Charge Coupled Device) check, assembly and correction functions
CN203912343U (en) * 2014-05-29 2014-10-29 苏州锟恩电子科技有限公司 Batch operation PCB board welding and dispensing machine

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200236121Y1 (en) * 2000-03-10 2001-10-06 (주)에이알아이 Apparatus for inspecting and refilling solder paste printed on a PCB
CN203209820U (en) * 2013-04-26 2013-09-25 德州学院 Microscopic soldering platform
CN203457464U (en) * 2013-11-14 2014-02-26 大庆宏富来电气设备制造有限公司 Explosion-proof control box
CN103736539A (en) * 2013-12-09 2014-04-23 吴江市亿丰净化科技有限公司 Experiment table used for laboratories
CN103728246B (en) * 2013-12-18 2016-06-22 中国原子能科学研究院 A kind of sealed measurement apparatus of glove box

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0305698A2 (en) * 1987-08-31 1989-03-08 Siemens Aktiengesellschaft Dosage device for the coating of a printed circuit board by a soldering paste for the soldering of SMD-components
CN201603663U (en) * 2009-05-19 2010-10-13 深圳市科锐尔自动化设备有限公司 Automatic adhesive dispenser for cylindrical quartz crystal
CN102176068A (en) * 2011-02-17 2011-09-07 苏州日月明微电子科技有限公司 Stepping sensing device of welding wire machine
CN203343013U (en) * 2013-06-03 2013-12-18 上海深邦电气有限公司 Automatic dispenser with quantitative control
CN203565284U (en) * 2013-10-25 2014-04-30 惠州市桑莱士光电有限公司 Automatic dispensing equipment for mobile phone camera module with CCD (Charge Coupled Device) check, assembly and correction functions
CN203912343U (en) * 2014-05-29 2014-10-29 苏州锟恩电子科技有限公司 Batch operation PCB board welding and dispensing machine

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Effective date of registration: 20230220

Address after: Room 7070, Floor 7, Building 6, No. 2996, Taidong Road, Huangdai Town, Xiangcheng District, Suzhou City, Jiangsu Province, 215000

Patentee after: Saijing (Jiangsu) Vision Technology Co.,Ltd.

Address before: 215153 255-7 Hua Jin Road, Tongan town, Suzhou hi tech Zone, Jiangsu

Patentee before: SUZHOU KUEN ELECTRONIC TECH. Co.,Ltd.