CN104002066B - 一种太阳电池自动焊接光纤定位装置及其应用 - Google Patents
一种太阳电池自动焊接光纤定位装置及其应用 Download PDFInfo
- Publication number
- CN104002066B CN104002066B CN201410174862.6A CN201410174862A CN104002066B CN 104002066 B CN104002066 B CN 104002066B CN 201410174862 A CN201410174862 A CN 201410174862A CN 104002066 B CN104002066 B CN 104002066B
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- optical fiber
- cell piece
- gauge head
- sucker
- fiber gauge
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 123
- 238000003466 welding Methods 0.000 title claims abstract description 25
- 238000007689 inspection Methods 0.000 claims description 12
- 239000003086 colorant Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 230000002459 sustained effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Sustainable Energy (AREA)
- Electromagnetism (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410174862.6A CN104002066B (zh) | 2014-04-28 | 2014-04-28 | 一种太阳电池自动焊接光纤定位装置及其应用 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410174862.6A CN104002066B (zh) | 2014-04-28 | 2014-04-28 | 一种太阳电池自动焊接光纤定位装置及其应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104002066A CN104002066A (zh) | 2014-08-27 |
CN104002066B true CN104002066B (zh) | 2015-11-18 |
Family
ID=51363128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410174862.6A Expired - Fee Related CN104002066B (zh) | 2014-04-28 | 2014-04-28 | 一种太阳电池自动焊接光纤定位装置及其应用 |
Country Status (1)
Country | Link |
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CN (1) | CN104002066B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201789447U (zh) * | 2010-09-06 | 2011-04-06 | 王小牛 | 太阳能电池片位置校正装置 |
KR101029772B1 (ko) * | 2009-10-28 | 2011-04-19 | 주식회사 퓨처라인 | 중대형 이차전지의 전극용접장치 |
CN102244144A (zh) * | 2011-06-28 | 2011-11-16 | 无锡先导自动化设备有限公司 | 一种硅片自动纠偏装置 |
CN102248249A (zh) * | 2011-07-11 | 2011-11-23 | 无锡市斯威克光伏自动化设备有限公司 | 一种太阳能电池片涂锡带焊接机用上料装置 |
CN203887400U (zh) * | 2014-04-28 | 2014-10-22 | 中电电气(上海)太阳能科技有限公司 | 一种太阳电池自动焊接光纤定位装置 |
-
2014
- 2014-04-28 CN CN201410174862.6A patent/CN104002066B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101029772B1 (ko) * | 2009-10-28 | 2011-04-19 | 주식회사 퓨처라인 | 중대형 이차전지의 전극용접장치 |
CN201789447U (zh) * | 2010-09-06 | 2011-04-06 | 王小牛 | 太阳能电池片位置校正装置 |
CN102244144A (zh) * | 2011-06-28 | 2011-11-16 | 无锡先导自动化设备有限公司 | 一种硅片自动纠偏装置 |
CN102248249A (zh) * | 2011-07-11 | 2011-11-23 | 无锡市斯威克光伏自动化设备有限公司 | 一种太阳能电池片涂锡带焊接机用上料装置 |
CN203887400U (zh) * | 2014-04-28 | 2014-10-22 | 中电电气(上海)太阳能科技有限公司 | 一种太阳电池自动焊接光纤定位装置 |
Non-Patent Citations (1)
Title |
---|
太阳能电池焊接工艺改进及全自动焊机的介绍;施学斌;《制造业自动化》;20130831;第35卷(第8期);第17-18页 * |
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Publication number | Publication date |
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CN104002066A (zh) | 2014-08-27 |
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