CN103993263A - Gas release device for film coating process - Google Patents
Gas release device for film coating process Download PDFInfo
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- CN103993263A CN103993263A CN201310052138.1A CN201310052138A CN103993263A CN 103993263 A CN103993263 A CN 103993263A CN 201310052138 A CN201310052138 A CN 201310052138A CN 103993263 A CN103993263 A CN 103993263A
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Abstract
The invention relates to a gas release device for a film coating process. The device comprises two plates butted with each other, wherein each plate is provided with a gas inlet groove; a gas inlet is formed at the top end of the gas inlet groove, and the bottom end of each gas inlet groove is connected with a first distribution groove; each of the two ends of each first distribution groove is connected with a second distribution groove; each of the two ends of each second distribution groove is connected with a third distribution groove; each of the two ends of each third distribution groove is connected with a fourth distribution groove; each of the two ends of each fourth distribution groove is connected with a fifth distribution groove; and the bottom end of each fifth distribution groove is provided with an exhaust port. Thus, a gas of an evaporation source enters the gas inlet grooves, and then successively passes through all the distribution grooves, and finally substantially same amount of gas is released from the exhaust ports, therefore, the uniformity of the film thickness and the quality of the film coating process are improved.
Description
Technical field
The present invention is relevant with film-plating process, refers to especially a kind of gas releasing device for film-plating process.
Background technology
In simple terms, so-called vacuum plating is that a thing to be plated (for example substrate) is put in a vacuum cavity, then a vapor deposition source (for example selenium) is heated to the state of vaporization distillation, makes the gas of vapor deposition source be attached to the surface of thing to be plated and form thin film.
Yet, in the middle of current film-plating process, can only wait for that the gas of vapor deposition source is attached to the surface of thing to be plated voluntarily, except quite consuming time, finally at the formed film thickness in the surface of thing to be plated, also easily there is inhomogeneous situation, and then the coating quality of related impact thing to be plated.
Summary of the invention
Main purpose of the present invention is to provide a kind of gas releasing device for film-plating process, and it can improve the homogeneity of film thickness, to promote the quality of film-plating process.
In order to reach above-mentioned purpose, gas releasing device of the present invention includes two plates, each plate has an end face, one bottom surface, and one in abutting connection with this top, the engagement sides on two sides, the end, this two plate is bonded with each other together by this two engagement sides, the engagement sides of each plate has an air inlet duct, the top of this air inlet duct forms an inlet mouth in this end face, the bottom of this air inlet duct is connected one first distribution trough, the two ends of this first distribution trough are connected respectively one second distribution trough, the two ends of each the second distribution trough are connected respectively one the 3rd distribution trough, the two ends of each the 3rd distribution trough are connected respectively one the 4th distribution trough, the two ends of each the 4th distribution trough are connected respectively one the 5th distribution trough, the Yu Gai bottom surface, bottom of each the 5th distribution trough forms a venting port.By this, when the gas of vapor deposition source can be by this first distribution trough, each second distribution trough, each the 3rd distribution trough, each the 4th distribution trough after this inlet mouth enters this air inlet duct, and the evenly distribute of each the 5th distribution trough, finally from each venting port, disengage gas volume about equally again, so just can effectively improve the homogeneity of film thickness, and then reach the object that promotes film-plating process quality.
Accompanying drawing explanation
Fig. 1 is the end face stereographic map of a preferred embodiment of the present invention.
Fig. 2 is the three-dimensional exploded view of a preferred embodiment of the present invention.
Fig. 3 is the bottom isometric view of a preferred embodiment of the present invention.
Embodiment
In order to describe structure of the present invention, feature and effect place in detail, hereby enumerate a preferred embodiment and coordinate following graphic explanation as after.
Referring to Fig. 1 to Fig. 3, is the gas releasing device 10 that a preferred embodiment of the present invention provides, and is in the present embodiment to use at vacuum plating processing procedure, certainly can also use according to actual needs the film-plating process operating under any atmosphere surrounding.Gas releasing device 10 of the present invention includes two plates 20, and each plate 20 is by the made cuboid structure of high temperature resistant and erosion-resisting material, and has an end face 22, a bottom surface 24, and a perpendicular abutment is pushed up, the engagement sides 26 on two sides, the end 22,24.
The engagement sides 26 of each plate 20 has an air inlet duct 28, the top of air inlet duct 28 forms an inlet mouth 282 in end face 22, the bottom of air inlet duct 28 is connected the central authorities of one first traversing section 32, the two ends of the first traversing section 32 be connected respectively one first longitudinally section 34 and and two first longitudinally between section 34, form one first distribution trough 30, the bottom of each first longitudinal section 34 is connected the central authorities of one second traversing section 42, the two ends of each second traversing section 42 be connected respectively one second longitudinally section 44 and and two second longitudinally between section 44, form one second distribution trough 40, the bottom of each second longitudinal section 44 is connected the central authorities of one the 3rd traversing section 52, the two ends of each the 3rd traversing section 52 be connected respectively one the 3rd longitudinally section 54 and and two the 3rd longitudinally between section 54, form one the 3rd distribution trough 50, the bottom of each the 3rd longitudinal section 54 is connected the central authorities of one the 4th traversing section 62, the two ends of each the 4th traversing section 62 be connected respectively one the 4th longitudinally section 64 and and two the 4th longitudinally between section 64, form one the 4th distribution trough 60, the bottom of each the 4th longitudinal section 64 is connected the central authorities of one the 5th traversing section 72, the two ends of each the 5th traversing section 72 be connected respectively one the 5th longitudinally section 74 and and two the 5th longitudinally between section 74, form one the 5th distribution trough 70, the bottom of each the 5th longitudinal section 74 is 24 formation one venting ports 742 in bottom surface, as shown in Figure 2.
In addition, the section form of air inlet duct 28, the section form of the first distribution trough 30, the section form of each second distribution trough 40, the section form of each the 3rd distribution trough 50, the section form of each the 4th distribution trough 60, and the section form of each the 5th distribution trough 70 all be take semicircle as the best aspect of implementing, certainly can also be rectangle or other geometrical shape, and, the groove footpath of air inlet duct 28 equals the groove footpath of the first distribution trough 30, the groove footpath of the first distribution trough 30 is greater than the groove footpath of each second distribution trough 40, the groove footpath of each second distribution trough 40 is greater than the groove footpath of each the 3rd distribution trough 50, the groove footpath of each the 3rd distribution trough 50 is greater than the groove footpath of each the 4th distribution trough 60, the groove footpath of each the 4th distribution trough 60 is greater than the groove footpath of each the 5th distribution trough 70.
When assembling, two plates 20 are to be bonded with each other together by two engagement sides 26, after being bonded with each other, the air inlet duct 28 of two plates 20, the first distribution trough 30, each second distribution trough 40, each the 3rd distribution trough 50, each the 4th distribution trough 60, and each the 5th distribution trough 70 meeting formation one distribution passages 80, as shown in Figure 1.
Known via said structure, when the gas of vapor deposition source enters the air inlet duct 28 by two plates 20 from the inlet mouth 282 of each air inlet duct 28, the first distribution trough 30, each second distribution trough 40, each the 3rd distribution trough 50, each the 4th distribution trough 60, and after each formed distribution passage 80 of the 5th distribution trough 70, finally can jointly be released into from each venting port 742 surface of a thing to be plated, in whole process, due to the first distribution trough 30, each second distribution trough 40, each the 3rd distribution trough 50, each the 4th distribution trough 60, and each the 5th distribution trough 70 is to be multiple increase and be symmetric, make inlet mouth 282 there is identical path length between each venting port 742, so the gas volume disengaging from each venting port 742 can be about equally, therefore, the gas of vapor deposition source can form the film with uniform thickness on the surface of thing to be plated, to reach the object that improves film-plating process quality and efficiency.
Finally, the present invention takes off disclosed composed component in embodiment in front, only for illustrating, is not used for limiting the protection domain of this case, the alternative or variation of other equivalence element, and the claim that also should be this case contains.
Claims (4)
1. for a gas releasing device for film-plating process, it is characterized in that, include:
Two plates, there is respectively an end face, one bottom surface, and one in abutting connection with this top, the engagement sides on two sides, the end, this two plate is bonded with each other together by this two engagement sides, the engagement sides of each plate has an air inlet duct, the top of this air inlet duct forms an inlet mouth in this end face, the bottom of this air inlet duct is connected one first distribution trough, the two ends of this first distribution trough are connected respectively one second distribution trough, the two ends of each the second distribution trough are connected respectively one the 3rd distribution trough, the two ends of each the 3rd distribution trough are connected respectively one the 4th distribution trough, the two ends of each the 4th distribution trough are connected respectively one the 5th distribution trough, the Yu Gai bottom surface, bottom of each the 5th distribution trough forms a venting port.
2. according to the gas releasing device for film-plating process described in Patent right requirement 1, it is characterized in that, the section form of the section form of the section form of the section form of the section form of this air inlet duct, this first distribution trough, each the second distribution trough, each the 3rd distribution trough, each the 4th distribution trough, and the equal semicircular in shape of the section form of each the 5th distribution trough.
3. according to the gas releasing device for film-plating process described in Patent right requirement 2, it is characterized in that, the groove footpath of this air inlet duct equals the groove footpath of this first distribution trough, the groove footpath of this first distribution trough is greater than the groove footpath of each the second distribution trough, the groove footpath of each the second distribution trough is greater than the groove footpath of each the 3rd distribution trough, the groove footpath of each the 3rd distribution trough is greater than the groove footpath of each the 4th distribution trough, and the groove footpath of each the 4th distribution trough is greater than the groove footpath of each the 5th distribution trough.
4. according to the gas releasing device for film-plating process described in Patent right requirement 3, it is characterized in that, this first distribution trough has longitudinally section of one first traversing section and 2 first, the central authorities of this first traversing section are connected the bottom of this air inlet duct, the two ends of this first traversing section are connected respectively this first longitudinal section, each second distribution trough has longitudinally section of one second traversing section and 2 second, the central authorities of this second traversing section are connected the bottom of this first longitudinal section, the two ends of this second traversing section are connected respectively this second longitudinal section, each the 3rd distribution trough has longitudinally section of one the 3rd traversing section and 2 the 3rd, the central authorities of the 3rd traversing section are connected the bottom of this second longitudinal section, the two ends of the 3rd traversing section are connected respectively one the 3rd longitudinal section, each the 4th distribution trough has longitudinally section of one the 4th traversing section and 2 the 4th, the central authorities of the 4th traversing section are connected the bottom of the 3rd longitudinal section, the two ends of the 4th traversing section are connected respectively one the 4th longitudinal section, each the 5th distribution trough has longitudinally section of one the 5th traversing section and 2 the 5th, the central authorities of the 5th traversing section are connected the bottom of the 4th longitudinal section, the two ends of the 5th traversing section are connected respectively one the 5th longitudinal section, the bottom of each the 5th longitudinal section forms this venting port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310052138.1A CN103993263A (en) | 2013-02-18 | 2013-02-18 | Gas release device for film coating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310052138.1A CN103993263A (en) | 2013-02-18 | 2013-02-18 | Gas release device for film coating process |
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| Publication Number | Publication Date |
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| CN103993263A true CN103993263A (en) | 2014-08-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310052138.1A Pending CN103993263A (en) | 2013-02-18 | 2013-02-18 | Gas release device for film coating process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113481469A (en) * | 2021-06-04 | 2021-10-08 | 广东铭丰包装材料有限公司 | Even gas mechanism and aluminizing machine |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201473586U (en) * | 2009-07-15 | 2010-05-19 | 仕贯真空科技股份有限公司 | Vacuum process air conduction device |
| CN201924070U (en) * | 2010-11-23 | 2011-08-10 | 苏贵方 | Device for distributing gas supplied to target strip for vacuum deposition |
| CN202705451U (en) * | 2012-07-09 | 2013-01-30 | 中国建材国际工程集团有限公司 | Process gas binary gas distribution device for vacuum coating |
| CN203187742U (en) * | 2013-02-18 | 2013-09-11 | 生阳新材料科技（宁波）有限公司 | Gas release device for film coating process |
-
2013
- 2013-02-18 CN CN201310052138.1A patent/CN103993263A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201473586U (en) * | 2009-07-15 | 2010-05-19 | 仕贯真空科技股份有限公司 | Vacuum process air conduction device |
| CN201924070U (en) * | 2010-11-23 | 2011-08-10 | 苏贵方 | Device for distributing gas supplied to target strip for vacuum deposition |
| CN202705451U (en) * | 2012-07-09 | 2013-01-30 | 中国建材国际工程集团有限公司 | Process gas binary gas distribution device for vacuum coating |
| CN203187742U (en) * | 2013-02-18 | 2013-09-11 | 生阳新材料科技（宁波）有限公司 | Gas release device for film coating process |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113481469A (en) * | 2021-06-04 | 2021-10-08 | 广东铭丰包装材料有限公司 | Even gas mechanism and aluminizing machine |
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Application publication date: 20140820 |