CN103985959B - A kind of communication antenna and preparation method thereof - Google Patents
A kind of communication antenna and preparation method thereof Download PDFInfo
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- CN103985959B CN103985959B CN201410182625.4A CN201410182625A CN103985959B CN 103985959 B CN103985959 B CN 103985959B CN 201410182625 A CN201410182625 A CN 201410182625A CN 103985959 B CN103985959 B CN 103985959B
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- binder course
- communication antenna
- molectron
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Abstract
The invention discloses a kind of communication antenna, described communication antenna includes substrate and is attached at the aerial coil of substrate surface, described communication antenna still further comprises the first binder course, the second binder course and the 3rd binder course, described first binder course, the second binder course and the 3rd binder course are cascading and jointly surround a receiving space, described substrate and aerial coil are contained in described receiving space, described first binder course is attached at substrate, described 3rd binder course is attached at aerial coil, and described second binder course is around described substrate and all sides of aerial coil.Present invention also offers a kind of method making described communication antenna simultaneously.The present invention solves ferrite powder particles and can enter into the inside of communication antenna structure and be distributed in the outer surface of communication antenna, thus it is bad to result in communication antenna finished product, the problem of poor electrical performance.
Description
[technical field]
The present invention relates to wireless communication field, particularly relate to a kind of communication antenna and preparation method thereof.
[background technology]
NFC (Near Field Communication, near-field communication) is by RFID (Radio Frequency
Identification Devices, radio frequency identification) and Technology Integration differentiation of interconnecting, it is
A kind of technology for wireless near field communication.NFC on one chip combining induction card reader,
Vicarious card and point-to-point function, can be identified with compatible equipment in short distance and data are handed over
Change.NFC technique is based primarily upon the radio-frequency technique that 13.56MHz frequency is run, and its transmission range compares RFID
Little, the transmission range of RFID can reach several meters, even tens meters, owing to NFC takes uniqueness
Signal attenuation technique, for RFID, NFC has the features such as distance is near, bandwidth is high, energy consumption is low.
NFC compared with infrared transmission faster, more reliable, simpler；It addition, more pacify compared with Bluetooth transmission
Entirely.NFC plays huge effect in the fields such as gate inhibition, public transport, mobile-phone payment.
But in correlation technique, communication antenna molding is prepared in punching press when, the mistake of punching press ferrite sheet
The ferrite powder particles formed in journey can enter into the inside of communication antenna structure and be distributed in the sky that communicates
The outer surface of line, thus it is bad to result in communication antenna finished product, the problem of poor electrical performance.
Therefore, it is necessary in fact to provide a kind of new communication antenna and manufacture method to solve above-mentioned deficiency.
[summary of the invention]
The present invention is to solve that ferrite powder particles can enter into inside and the distribution of communication antenna structure
At the outer surface of communication antenna, thus it is bad to result in communication antenna finished product, the problem of poor electrical performance,
Thus provide a kind of new communication antenna and preparation method thereof.
The object of the present invention is achieved like this:
A kind of communication antenna, described communication antenna includes substrate and is attached at the aerial coil of substrate surface,
Described communication antenna still further comprises the first binder course, the second binder course and the 3rd binder course, described
First binder course, the second binder course and the 3rd binder course are cascading and jointly surround a receiving space,
Described substrate and aerial coil are contained in described receiving space, and described first binder course is attached at substrate,
Described 3rd binder course is attached at aerial coil, and described second binder course is around described substrate and antenna
All sides of coil.
As the selection of a kind of preferred implementation, described communication antenna can be NFC antenna or low merit
Consumption Bluetooth antenna.
As the selection of a kind of preferred implementation, described communication antenna still further comprises the 4th combination
Layer, described aerial coil is attached to the surface of substrate by the 4th binder course.
As the selection of a kind of preferred implementation, described substrate is ferrite-plate.
As the selection of a kind of preferred implementation, described communication antenna also includes flexible PCB, institute
State flexible PCB electrically connect with aerial coil and extend to described communication through described second binder course
The outside of antenna.
Present invention also offers the manufacture method of a kind of communication antenna, described manufacture method includes following
Step:
1) making the first molectron, it comprises the following steps that
A: provide ferrite-plate and the first mould, utilizes described first mould punching ferrite-plate to obtain the
One parts；
B: provide the second binder course, described second binder course to be provided with the second knot running through the second binder course
Close layer receiving area, the first component obtained in step a is assembled in described second binder course receiving area
Inside obtain second component；
C: the first binder course is provided, the second component patch that will obtain in described first binder course and step b
Being attached to obtain the 3rd parts together, in described 3rd parts, the second binder course and first component are all with described
First binder course attaches；
D: provide the second mould, utilizes the 3rd parts upper punch that described second mould obtains in step c
Extrude port part and obtain the 4th parts；
E: flexible PCB is provided, described flexible PCB is assembled in the 4th obtained in step d
The first molectron is obtained at the port part of part；
2) making the second molectron, it comprises the following steps that
A: aerial coil and the 3rd binder course are provided, described aerial coil and the 3rd binder course are attached to
Obtain the second molectron together；
3) the first molectron and the second molectron are attached onto obtaining the 5th parts, wherein, described
3rd binder course of the second molectron and the second binder course of described first molectron are attached onto, institute
The aerial coil stating the second molectron is contained in the second binder course receiving area of described second binder course
In；
4) provide the 3rd mould, utilize described 3rd mould punching step 3) in the 5th parts that obtain
Obtain described communication antenna.
As the selection of a kind of preferred implementation, described step 1) make step a of the first molectron
Offer the 4th binder course is be provided, first the 4th binder course and ferrite-plate is attached onto
To conjunction, utilize coalition described in described first mould punching thus obtain first component.
As the selection of a kind of preferred implementation, described communication antenna can be NFC antenna or low merit
Consumption Bluetooth antenna.
It is an advantage of the current invention that: the present invention solves ferrite powder particles can enter into communication antenna
The inside of structure and the outer surface being distributed in communication antenna, thus it is bad to result in communication antenna finished product,
The problem of poor electrical performance.The communication antenna finished product yield that the present invention provides is high, and performance is guaranteed.
[accompanying drawing explanation]
The Making programme figure of the communication antenna that Fig. 1 provides for the present invention；
The communication antenna manufacture method that Fig. 2 provides for the present invention utilizes the first mould punching ferrite-plate
View before operation；
The communication antenna manufacture method that Fig. 3 provides for the present invention utilizes the first mould punching ferrite-plate
The first component schematic diagram obtained after operation；
First component is assembled in the second combination by the communication antenna manufacture method that Fig. 4 provides for the present invention
View before layer operation；
First component is assembled in the second combination by the communication antenna manufacture method that Fig. 5 provides for the present invention
The second component schematic diagram obtained after layer operation；
First binder course and second component are pasted by the communication antenna manufacture method that Fig. 6 provides for the present invention
It is attached to operate front view together；
First binder course and second component are pasted by the communication antenna manufacture method that Fig. 7 provides for the present invention
The 3rd block diagram obtained after being attached to operate together；
The communication antenna manufacture method that Fig. 8 provides for the present invention utilizes the second mould punching the 3rd parts
View before operation；
The communication antenna manufacture method that Fig. 9 provides for the present invention utilizes the second mould punching the 3rd parts
The 4th block diagram obtained after operation；
Flexible PCB is assembled in the 4th by the communication antenna manufacture method that Figure 10 provides for the present invention
View before part operation:
Flexible PCB is assembled in the 4th by the communication antenna manufacture method that Figure 11 provides for the present invention
The the first molectron schematic diagram obtained after part operation；
Aerial coil and the 3rd are combined laminating by the communication antenna manufacture method that Figure 12 provides for the present invention
It is attached to operate front view together；
Aerial coil and the 3rd are combined laminating by the communication antenna manufacture method that Figure 13 provides for the present invention
The the second molectron schematic diagram obtained after being attached to operate together；
By the first molectron and the second molectron in the communication antenna manufacture method that Figure 14 provides for the present invention
It is attached onto operating front view；
By the first molectron and the second molectron in the communication antenna manufacture method that Figure 15 provides for the present invention
The 5th block diagram obtained after being attached onto operation；
The communication antenna manufacture method that Figure 16 provides for the present invention utilizes the 3rd mould punching the 5th parts
View before operation；
The communication antenna manufacture method that Figure 17 provides for the present invention utilizes the 3rd mould punching the 5th parts
The communication antenna schematic diagram obtained after operation；
The structural representation of the communication antenna that Figure 18 provides for the present invention；
In the communication antenna manufacture method that Figure 19 provides for the present invention, punching press obtains the mould punching of communication antenna
Pressure position view；
Figure 20 be correlation technique communication antenna manufacture method in punching press obtain the mould punching of communication antenna
Position view.
[detailed description of the invention]
Below in conjunction with the accompanying drawings, the present invention is elaborated.
Communication antenna of the present invention can be NFC antenna or low-power consumption Bluetooth antenna, and this is concrete real
The present invention is elaborated as a example by NFC antenna by mode of executing, but, protection scope of the present invention is also
It is not limited.
Referring to Fig. 1 to Figure 17, for the manufacture method of the NFC antenna that the present invention provides, described method has
Body includes:
1, the first molectron 25 is made
As shown in Figures 2 and 3, it is provided that ferrite-plate 20 and the first mould 11, described first mould is utilized
11 punching press ferrite-plates 20 thus obtain first component 21；
As shown in Figure 4 and Figure 5, it is provided that the second binder course 30, described second binder course 30 is provided with and runs through
Second binder course receiving area 31 of the second binder course 30, the first component 21 that will obtain in previous step
In being assembled in the second binder course receiving area 31 of described second binder course 30 thus obtain second component
22；
As shown in Figure 6 and Figure 7, it is provided that the first binder course 40, by described first binder course 40 and previous step
The second component 22 obtained in Zhou is attached onto thus obtains the 3rd parts 23, described 3rd parts 23
In the second binder course 30 and first component 21 all attach with described first binder course 40；
As shown in Figure 8 and Figure 9, it is provided that the second mould 12, utilize described second mould 12 in previous step
In stamp out port part 121 on the 3rd parts 23 that obtain thus obtain the 4th parts 24, described port part
121 run through described second binder course 30 and the first binder course 40；
As shown in Figure 10 and Figure 11, it is provided that flexible PCB 13, described flexible PCB 13 is assembled in
At the port part 121 of the 4th parts 24 obtained in previous step thus obtain the first molectron 25, described
In first molectron 25, flexible circuit board 13 can be attached at the first binder course 40, simultaneously flexible circuit board
13 pass the second binder course 30.
At this it should be noted that utilize described first mould 11 punching press in making the first molectron 25
Ferrite-plate 20 thus before obtaining the step of first component 21, it is also possible to farther include to provide the 4th knot
Close layer 60, first the 4th binder course 60 and ferrite-plate 20 are attached onto obtaining conjunction, then profit
With coalition described in described first mould 11 punching press thus obtain first component 21.
2, the second molectron 26 is made
As shown in Figures 12 and 13, it is provided that aerial coil 15 and the 3rd binder course 50, by described aerial coil
15 and the 3rd binder course 50 be attached onto thus obtain the second molectron 26, described 3rd binder course 50
It is provided with the 3rd binder course through hole 51 of the corresponding setting of port part 121 with described first molectron 25.
3, as shown in Figure 14 and Figure 15, the first molectron 25 and the second molectron 26 are attached onto from
And obtain the 5th parts 27, the 3rd binder course 50 of described second molectron 26 and described first molectron
The second binder course 30 be attached onto, the aerial coil 15 of described second molectron 26 is contained in described
In second binder course receiving area 31 of the second binder course 30, flexible PCB 13 He in the 5th parts 27
Aerial coil 15 electrically connects.
4, as shown in Figure 16 and Figure 17, it is provided that the 3rd mould 14, utilize in described 3rd mould 14 punching press
The 5th parts 27 that obtain in one step thus obtain NFC antenna 28.
As shown in figure 18, for the structural representation of a kind of NFC antenna 28 that the present invention provides, described NFC
Antenna 28 includes ferrite substrate 21 and is attached at the aerial coil 15 on ferrite substrate 21 surface, described
NFC antenna 28 still further comprises the first binder course the 40, second binder course 30 and the 3rd binder course 50,
Described first binder course the 40, second binder course 30 and the 3rd binder course 50 are cascading and jointly surround
One receiving space 100, described ferrite substrate 21 and aerial coil 15 are contained in described receiving space 100
In, described first binder course 40 is attached at ferrite substrate 21, and described 3rd binder course 50 is attached at sky
Line coil 15, described second binder course 30 is around described ferrite substrate 21 and the week of aerial coil 15
Side.As preferred embodiment, described aerial coil 15 can be attached to by the 4th binder course 60
The surface of ferrite substrate 51.
As illustrated in figures 19 and 20, in the NFC antenna manufacture method that the present invention provides, punching press obtains NFC
The position of antenna mold punching press is the first binder course the 40, second binder course 30 and the 3rd binder course 50,
Position as shown in phantom in Figure 19, will not be stamped into ferrite part in punching course, from without
Producing ferrite powder particles, secondly the second binder course 30 can also stop that ferrite powder particles enters
Inside NFC antenna；In the NFC antenna manufacture method of correlation technique, punching press obtains NFC antenna mould
The position of punching press is binder course 40 ', binder course 50 ', binder course 60 ' and ferrite part 21 ', such as figure
Position shown in dotted line in 20, can produce ferrite powder particles, ferrite powder in punching course
Grain can be distributed in the outer surface of NFC antenna, furthermore, ferrite powder particles also can be entered by gap 70 '
Enter the inside to NFC antenna structure, thus it is bad to result in NFC antenna finished product, asking of poor electrical performance
Topic.
At this it should be noted that in claims the step numbers about manufacture method be intended merely to
The needs of easy-to-read, the when of actual fabrication operation, not necessarily priority in strict accordance with step numbers is suitable
Sequence is implemented, and all are all claims according to the operation order embodiments that present disclosure is feasible
The scope advocated.
The present invention solves ferrite powder particles and can enter into the inside of communication antenna structure and be distributed in
The outer surface of communication antenna, thus it is bad to result in communication antenna finished product, the problem of poor electrical performance.This
The communication antenna finished product yield that invention provides is high, and performance is guaranteed.
The foregoing is only the better embodiment of the present invention, protection scope of the present invention is not with above-mentioned
Embodiment is limited, as long as those of ordinary skill in the art according to disclosed content made etc.
Effect is modified or change, all should include in the protection domain described in claims.
Claims (3)
1. the manufacture method of a communication antenna, it is characterised in that: described manufacture method includes following
Step:
1) making the first molectron, it comprises the following steps that
A: provide ferrite-plate and the first mould, utilizes described first mould punching ferrite-plate to obtain the
One parts；
B: provide the second binder course, described second binder course to be provided with the second knot running through the second binder course
Close layer receiving area, the first component obtained in step a is assembled in described second binder course receiving area
Inside obtain second component；
C: the first binder course is provided, the second component patch that will obtain in described first binder course and step b
Being attached to obtain the 3rd parts together, in described 3rd parts, the second binder course and first component are all with described
First binder course attaches；
D: provide the second mould, utilizes the 3rd parts upper punch that described second mould obtains in step c
Extrude port part and obtain the 4th parts；
E: flexible PCB is provided, described flexible PCB is assembled in the 4th obtained in step d
The first molectron is obtained at the port part of part；
2) making the second molectron, it comprises the following steps that
A: aerial coil and the 3rd binder course are provided, described aerial coil and the 3rd binder course are attached to
Obtain the second molectron together；
3) the first molectron and the second molectron are attached onto obtaining the 5th parts, wherein, described
3rd binder course of the second molectron and the second binder course of described first molectron are attached onto, institute
The aerial coil stating the second molectron is contained in the second binder course receiving area of described second binder course
In；
4) provide the 3rd mould, utilize described 3rd mould punching step 3) in the 5th parts that obtain
Obtain described communication antenna.
The manufacture method of communication antenna the most according to claim 1, it is characterised in that: described step
Rapid 1) step a making the first molectron still further comprises offer the 4th binder course, first ties the 4th
Close layer and ferrite-plate is attached onto obtaining conjunction, utilize and combine described in described first mould punching
Part thus obtain first component.
The manufacture method of communication antenna the most according to claim 1 and 2, it is characterised in that: described
Communication antenna can be NFC antenna or low-power consumption Bluetooth antenna.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410182625.4A CN103985959B (en) | 2014-04-30 | 2014-04-30 | A kind of communication antenna and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410182625.4A CN103985959B (en) | 2014-04-30 | 2014-04-30 | A kind of communication antenna and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103985959A CN103985959A (en) | 2014-08-13 |
| CN103985959B true CN103985959B (en) | 2016-08-31 |
Family
ID=51277848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410182625.4A Expired - Fee Related CN103985959B (en) | 2014-04-30 | 2014-04-30 | A kind of communication antenna and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103985959B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201797034U (en) * | 2010-07-28 | 2011-04-13 | 北京偶极通信设备有限责任公司 | Electronic tag antenna |
| KR101806942B1 (en) * | 2011-09-28 | 2017-12-08 | 삼성전자주식회사 | Near field communication antenna device of a mobile terminal |
| US9178265B2 (en) * | 2012-02-09 | 2015-11-03 | Hid Global Gmbh | Anti-crack means for wire antenna in transponder |
| CN203205542U (en) * | 2013-04-07 | 2013-09-18 | 武汉天喻信息产业股份有限公司 | Small embedded ferrite core NFC antenna |
-
2014
- 2014-04-30 CN CN201410182625.4A patent/CN103985959B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN103985959A (en) | 2014-08-13 |
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