CN103970578A - Method for upgrading master and slave MCUs (micro control units) - Google Patents
Method for upgrading master and slave MCUs (micro control units) Download PDFInfo
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- CN103970578A CN103970578A CN201410228342.9A CN201410228342A CN103970578A CN 103970578 A CN103970578 A CN 103970578A CN 201410228342 A CN201410228342 A CN 201410228342A CN 103970578 A CN103970578 A CN 103970578A
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Abstract
The embodiment of the invention discloses a method for upgrading master and slave MCUs, and aims at avoiding the waste of hardware resources and reducing hardware cost; meanwhile, each MCU does not need to be upgraded independently, so that the working time of an operator is saved, and the upgrading time cost is lowered. The method disclosed by the invention comprises the steps that a first-stage MCU acquires an upgrading file through an upgrading interface of the first-stage MCU, wherein the upgrading file comprises an upgrading program of an MCU to be upgraded; the nth-stage MCU acquires the upgrading file from the (n-1)th-stage MCU through a communication link, wherein n is greater than or equal to 2; the (n-1)th-stage MCU is cascaded with the nth-stage MCU; the upgrading program corresponds to the MCU; the MCU is upgraded according to the acquired corresponding upgrading program.
Description
Technical field
The present invention relates to microcomputer field, relate in particular to principal and subordinate MCU upgrade method.
Background technology
At present, along with the development of Microcomputer Technology and the diversification of application function, single MCU (MicroControl Unit, micro-control unit) cannot meet the requirement of function or performance, current most product selects the mode that adopts principal and subordinate MCU (may comprise several slaves, slave is controlled the multistage connection of several slaves again) to control to reach higher performance and requirement.
In using principal and subordinate MCU, need to upgrade to principal and subordinate MCU, to strengthen performance and the applicability of principal and subordinate MCU.General way is: in principal and subordinate MCU, all reserved at least one upgrade interface of all MCU (comprise main MCU and from MCU), in needs upgrading, respectively each MCU is upgraded separately by these upgrade interface, after all MCU upgrade successfully, principal and subordinate MCU upgrades successfully.
But above-mentioned way requires all reserved at least one upgrade interface of each MCU, has caused the waste of hardware resource, has increased hardware cost; , each MCU is upgraded separately meanwhile, need to expend a large amount of working time of operating personnel, therefore the time cost of upgrading is high.
Summary of the invention
The embodiment of the present invention provides a kind of principal and subordinate MCU upgrade method, can avoid causing the waste of hardware resource, reduces hardware cost; Without separately each MCU being upgraded, save operating personnel's working time simultaneously, reduce the time cost of upgrading.
A kind of principal and subordinate MCU upgrade method that the embodiment of the present invention provides, comprising:
The 1st grade of MCU gets upgrade file by the upgrade interface of described the 1st grade of MCU, the ROMPaq of the MCU that described upgrade file comprises needs upgrading;
N level MCU obtains described upgrade file by communication link to n-1 level MCU, and n is more than or equal to 2;
Described n-1 level MCU and described n level MCU cascade;
There is corresponding relation in described ROMPaq and described MCU;
Described MCU upgrades according to the corresponding ROMPaq getting.
Alternatively, described n level MCU also comprised before n-1 level MCU obtains described upgrade file by communication link:
N level MCU applies for described upgrade file by communication link to n-1 level MCU.
Alternatively, described n level MCU applies for also comprising after described upgrade file to n-1 level MCU by communication link:
N-1 level MCU gets upgrading mark, and described upgrading is labeled as the mark of all MCU that need upgrading under described n level MCU and n level MCU cascade;
N-1 level MCU gets corresponding ROMPaq according to described upgrading mark;
The ROMPaq of described correspondence is packaged as new upgrade file by n-1 level MCU.
Alternatively, described n level MCU also comprises after n-1 level MCU obtains described upgrade file by communication link:
Described n level MCU obtains the ROMPaq in described upgrade file.
Alternatively, described method also comprises:
When described ROMPaq, corresponding all MCU all complete after upgrading, and described MCU deletes described ROMPaq.
A kind of principal and subordinate MCU upgrade method that the embodiment of the present invention provides, comprising:
In the time that the 1st grade of MCU need to upgrade, according to corresponding ROMPaq, by the upgrade interface of described the 1st grade of MCU, the 1st grade of MCU upgraded;
According to corresponding ROMPaq, by the upgrade interface of pass-through channel and the 1st grade of MCU, the n level MCU of needs upgrading to be upgraded, described pass-through channel is the communication transmission passage between the 1st grade of MCU and described n level MCU, n is more than or equal to 2;
N-1 level MCU and described n level MCU cascade.
Alternatively,
In the time that n is 2, described communication transmission passage is the communication link between described the 1st grade of MCU and described the 2nd grade of MCU.
Alternatively,
In the time that n is 3, described communication transmission passage is communication link between described the 1st grade of MCU and described the 2nd grade of MCU and the communication link between described the 2nd grade of MCU and described 3rd level MCU.
Alternatively,
In the time that n is 4, described communication transmission passage is the communication link between communication link and described 3rd level MCU and described the 4th grade of MCU between communication link, described the 2nd grade of MCU and the described 3rd level MCU between described the 1st grade of MCU and described the 2nd grade of MCU.
Alternatively, described method also comprises:
After all MCU that need to upgrade have all upgraded, feed back the information of having upgraded.
As can be seen from the above technical solutions, the embodiment of the present invention has the following advantages:
In the embodiment of the present invention, the 1st grade of MCU gets upgrade file by the upgrade interface of described the 1st grade of MCU, the ROMPaq of the MCU that described upgrade file comprises needs upgrading; N level MCU obtains described upgrade file by communication link to n-1 level MCU, and n is more than or equal to 2; Described n-1 level MCU and described n level MCU cascade; There is corresponding relation in described ROMPaq and described MCU; Described MCU upgrades according to the corresponding ROMPaq getting.In embodiments of the present invention, only need the 1st grade of MCU (main MCU) to leave in advance upgrade interface and obtain upgrade file, just the mode that can transmit by communication link makes all MCU (main MCU or from MCU) that need upgrading get upgrade file, thereby getting corresponding ROMPaq upgrades, do not need each MCU to reserve at least one upgrade interface, avoid causing the waste of hardware resource, reduced hardware cost; Meanwhile, operating personnel only need will be for the 1st grade of MCU provides upgrade file, just can allow all MCU that need upgrading upgrade voluntarily, without separately each MCU being upgraded, saved operating personnel's working time, reduced the time cost of upgrading.
Brief description of the drawings
Fig. 1 is embodiment process flow diagram of principal and subordinate MCU upgrade method in the embodiment of the present invention;
Fig. 2 is another embodiment process flow diagram of principal and subordinate MCU upgrade method in the embodiment of the present invention;
Fig. 3 is embodiment process flow diagram of principal and subordinate MCU upgrade method in the embodiment of the present invention.
Embodiment
The embodiment of the present invention provides principal and subordinate MCU upgrade method, for avoiding causing the waste of hardware resource, reduces hardware cost; Without separately each MCU being upgraded, save operating personnel's working time simultaneously, reduce the time cost of upgrading.
For making goal of the invention of the present invention, feature, advantage can be more obvious and understandable, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, the embodiments described below are only the present invention's part embodiment, but not whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making all other embodiment that obtain under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, in the embodiment of the present invention, embodiment of principal and subordinate MCU upgrade method comprises:
101, the 1st grade of MCU gets upgrade file by the upgrade interface of the 1st grade of MCU;
In the time need to upgrading to the MCU in principal and subordinate MCU, the 1st grade of MCU can get upgrade file by the upgrade interface of the 1st grade of MCU, the ROMPaq of the MCU that this upgrade file comprises needs upgrading.
102, n level MCU obtains this upgrade file by communication link to n-1 level MCU;
After the 1st grade of MCU gets upgrade file by the upgrade interface of the 1st grade of MCU, n level MCU can obtain this upgrade file to n-1 level MCU by communication link, and n is more than or equal to 2.
It should be noted that this n-1 level MCU and this n level MCU cascade; There is corresponding relation in this ROMPaq and this MCU.
103, this MCU upgrades according to the corresponding ROMPaq getting.
After the MCU of needs upgrading gets corresponding ROMPaq, this MCU just can upgrade according to the corresponding ROMPaq getting.
In the present embodiment, before said principal and subordinate MCU upgrade method step be: the 1st grade of MCU gets upgrade file by the upgrade interface of the 1st grade of MCU, the ROMPaq of the MCU that this upgrade file comprises needs upgradings; Then, n level MCU obtains this upgrade file by communication link to n-1 level MCU, and n is more than or equal to 2; This n-1 level MCU and this n level MCU cascade; There is corresponding relation in this ROMPaq and this MCU; Meanwhile, this MCU upgrades according to the corresponding ROMPaq getting.In the present embodiment, only need the 1st grade of MCU (main MCU) to leave in advance upgrade interface and obtain upgrade file, just the mode that can transmit by communication link makes all MCU (main MCU or from MCU) that need upgrading get upgrade file, thereby getting corresponding ROMPaq upgrades, do not need each MCU to reserve at least one upgrade interface, avoid causing the waste of hardware resource, reduced hardware cost; Meanwhile, operating personnel only need will be for the 1st grade of MCU provides upgrade file, just can allow all MCU that need upgrading upgrade voluntarily, without separately each MCU being upgraded, saved operating personnel's working time, reduced the time cost of upgrading.
For ease of understanding, below the principal and subordinate MCU method in the embodiment of the present invention is described in detail, refer to Fig. 2, in the embodiment of the present invention, another embodiment of principal and subordinate MCU method comprises:
201, the 1st grade of MCU gets upgrade file by the upgrade interface of the 1st grade of MCU;
In the time need to upgrading to the MCU in principal and subordinate MCU, the 1st grade of MCU can get upgrade file by the upgrade interface of the 1st grade of MCU, the ROMPaq of the MCU that this upgrade file comprises needs upgrading.
Be understandable that, the 1st grade of MCU is the main MCU in principal and subordinate MCU, and the 1st grade of MCU need to reserve at least one upgrade interface for upgrading.
It should be noted that, there is corresponding relation in this ROMPaq and this MCU.
202, n level MCU applies for this upgrade file by communication link to n-1 level MCU;
After the 1st grade of MCU gets upgrade file by the upgrade interface of the 1st grade of MCU, n level MCU can apply for this upgrade file to n-1 level MCU by communication link.
It should be noted that, for n level MCU, may have several MCU at the same level, also may only have a MCU; In like manner, for n-1 level MCU, may there is several MCU at the same level, also may only have a MCU.Certainly, the 1st grade of MCU, main MCU only exists one.Therefore, be understandable that, n-1 level MCU can the following MCU with several n levels.
It should be noted that this n-1 level MCU and this n level MCU cascade.
203, n-1 level MCU gets upgrading mark;
When n level MCU by communication link after n-1 level MCU applies for this upgrade file, n-1 level MCU gets upgrading mark, this upgrading is labeled as all marks of MCU that need upgrading under this n level MCU and n level MCU cascade.
It should be noted that, n-1 level MCU can be with several n levels MCU below, and a n level MCU also can be with several n+1 levels MCU below, so analogizes.Therefore,, in the time that n level MCU applies for this upgrade file to n-1 level MCU, first n-1 level MCU needs to confirm which ROMPaq this n level MCU needs.Because n level MCU not only will get its lower required ROMPaq of several n+1 levels MCU, also to get the required ROMPaq of several n+2 levels MCU under several n+1 levels MCU, so analogize, i.e. the ROMPaq of the MCU of all needs upgradings under n level MCU cascade.Now n-1 level MCU learns by getting upgrading mark.
204, n-1 level MCU gets corresponding ROMPaq according to this upgrading mark;
After n-1 level MCU gets upgrading mark, n-1 level MCU can get corresponding ROMPaq according to this upgrading mark.Be understandable that, all can there is corresponding relation with certain ROMPaq in the MCU upgrading due to the needs of any one rank, therefore can get easily corresponding ROMPaq by this upgrading mark.
205, this corresponding ROMPaq is packaged as new upgrade file by n-1 level MCU;
After n-1 level MCU gets corresponding ROMPaq according to this upgrading mark, n-1 level MCU can be packaged as new upgrade file by this corresponding ROMPaq.Be understandable that, after these corresponding ROMPaq are packaged into new upgrade file, more convenient transmission, use and manage.
206, n level MCU obtains this upgrade file by communication link to n-1 level MCU;
N level MCU can obtain this upgrade file to n-1 level MCU by communication link, and wherein, n is more than or equal to 2.Be understandable that, due to when the step 205, this corresponding ROMPaq is packaged as new upgrade file by n-1 level MCU, therefore this upgrade file that n level MCU gets can be new upgrade file, in this upgrade file, comprised n level MCU with and the required corresponding upgrade file of MCU of subordinate's connection.
207, this n level MCU obtains the ROMPaq in this upgrade file;
When n level MCU by communication link after n-1 level MCU obtains this upgrade file, this n level MCU can obtain the ROMPaq in this upgrade file.
208, this MCU upgrades according to the corresponding ROMPaq getting;
After the MCU of needs upgrading gets corresponding ROMPaq, each MCU that need to upgrade can upgrade according to the corresponding ROMPaq getting.
209,, when all MCU corresponding to this ROMPaq all complete after upgrading, this MCU deletes this ROMPaq.
Can know by step 206, n level MCU obtains this upgrade file by communication link to n-1 level MCU, according to the different values of n, we can draw in last whole principal and subordinate MCU needs the MCU of upgrading can get corresponding ROMPaq, therefore, finally all MCU that need upgrading can complete upgrading.But for MCU, ROMPaq can be also a kind of burden, need to clear up in time.So corresponding all MCU all complete after upgrading when this ROMPaq, this MCU deletes this ROMPaq.
In the present embodiment, only need the 1st grade of MCU (main MCU) to leave in advance upgrade interface and obtain upgrade file, just the mode that can transmit by communication link makes all MCU (main MCU or from MCU) that need upgrading get upgrade file, thereby getting corresponding ROMPaq upgrades, do not need each MCU to reserve at least one upgrade interface, avoid causing the waste of hardware resource, reduced hardware cost; Meanwhile, operating personnel only need will be for the 1st grade of MCU provides upgrade file, just can allow all MCU that need upgrading upgrade voluntarily, without separately each MCU being upgraded, safeguard and upgrade conveniently, and having saved operating personnel's working time, having reduced the time cost of upgrading.Further, n-1 level MCU is by getting upgrading mark, get corresponding ROMPaq and be packaged as new upgrade file according to this upgrading mark again, can reduce the data volume of n-1 level MCU to n level MCU transmission, all be transferred to n level MCU without all ROMPaq, only need the ROMPaq that transmission is necessary, be conducive to improve data user rate and transfer efficiency.Again further, when this ROMPaq, corresponding all MCU all complete after upgrading, and this MCU deletes this ROMPaq, can save to a great extent storage resources, avoids these ROMPaq that completed upgrading to cause burden to MCU.
For ease of understanding, according to the described embodiment of Fig. 2, with a practical application scene, the principal and subordinate MCU upgrade method in the embodiment of the present invention is described below:
1, computing machine is packaged as all ROMPaq after upgrade file, writes this upgrade file by the upgrade interface of the 1st grade of MCU (main MCU).
2, the 2nd grade of MCU can apply for required upgrade file to the 1st grade of MCU.
3, the 1st grade of MCU obtain the 2nd grade of MCU with and cascade under the upgrading marks of all MCU that need upgrading.
4, the 1st grade of MCU goes out required corresponding ROMPaq according to this upgrading marker extraction and is repackaged into upgrade file.
5, the 2nd grade of MCU gets the upgrade file of repacking.It is noted that the 2nd grade of MCU here may be a MCU herein, may be also several MCU, 3rd level below, and the 4th grade ... n level is identical.
6, then, 3rd level MCU applies for required upgrade file to the 2nd grade of MCU.
7, the 2nd grade of MCU obtain 3rd level MCU with and cascade under the upgrading marks of all MCU that need upgrading.
8, the 2nd grade of MCU goes out required corresponding ROMPaq according to this upgrading marker extraction and is repackaged into upgrade file.
9,3rd level MCU gets the upgrade file of repacking.Then, the 4th grade of MCU applies for required upgrade file to the 2nd grade of MCU ... so analogize, until all n level MCU that needs upgrading get corresponding ROMPaq.
10, in above-mentioned steps 1 to 9, when MCU gets after corresponding ROMPaq, can Upgrade Now, also can wait all MCU to get upgrading together after corresponding ROMPaq, or the ROMPaq that MCU is corresponding is pre-set the time of upgrading, is not construed as limiting herein.
The principal and subordinate MCU upgrade method of utilizing the mode of packing to upgrade has mainly been described above, to another kind be described in detail about the principal and subordinate MCU upgrade method of transparent transmission below, refer to Fig. 3, in the embodiment of the present invention, embodiment of a kind of principal and subordinate MCU upgrade method is:
301,, in the time that the 1st grade of MCU need to upgrade, according to corresponding ROMPaq, by the upgrade interface of the 1st grade of MCU, the 1st grade of MCU upgraded;
In the time that the 1st grade of MCU need to upgrade, can, according to corresponding ROMPaq, by the upgrade interface of the 1st grade of MCU, the 1st grade of MCU be upgraded.Be understandable that, to the escalation process of the 1st grade and similar to the escalation process of certain MCU separately.
302,, according to corresponding ROMPaq, by the upgrade interface of pass-through channel and the 1st grade of MCU, the n level MCU of needs upgrading is upgraded;
In the time that certain n level MCU need to upgrade, can be according to corresponding ROMPaq, upgrade interface by pass-through channel and the 1st grade of MCU is upgraded to the n level MCU of needs upgrading, and this pass-through channel is the communication transmission passage between the 1st grade of MCU and this n level MCU, and n is more than or equal to 2.Be understandable that, this pass-through channel can be while communicating between the 1st grade of MCU and this n level MCU, for transmitting the link of data or signaling.Transparent transmission two word tables show that, when the 1st grade of MCU and n level MCU communicate, MCU is between the two transparent for the 1st grade of MCU and n level MCU, and MCU between the two only plays the effect of forwarding.
It should be noted that, in the time that n is 2, this communication transmission passage is the communication link between the 1st grade of MCU and the 2nd grade of MCU; In the time that n is 3, this communication transmission passage is the communication link between communication link and the 2nd grade of MCU and this 3rd level MCU between the 1st grade of MCU and the 2nd grade of MCU; In the time that n is 4, this communication transmission passage is the communication link between communication link and this 3rd level MCU and the 4th grade of MCU between communication link, the 2nd grade of MCU and this 3rd level MCU between the 1st grade of MCU and the 2nd grade of MCU, so analogizes.
It should be noted that n-1 level MCU and this n level MCU cascade.
303, after all MCU that need to upgrade have all upgraded, feed back the information of having upgraded.
Can know from step 302, it is inadequate that the n level MCU that only need to upgrade to certain upgrades, and need to carry out updating operation to all MCU that need upgrading in whole principal and subordinate MCU.After all MCU that need to upgrade have all upgraded, feed back the information of having upgraded.
In the present embodiment, first, in the time that the 1st grade of MCU need to upgrade, according to corresponding ROMPaq, by the upgrade interface of the 1st grade of MCU, the 1st grade of MCU upgraded; Then,, according to corresponding ROMPaq, by the upgrade interface of pass-through channel and the 1st grade of MCU, the n level MCU of needs upgrading is upgraded; Finally, after all MCU that need to upgrade have all upgraded, feed back the information of having upgraded.In the present embodiment, only need the 1st grade of MCU (main MCU) to leave in advance upgrade interface and be used as the access port of upgrading, then utilize communication link between n-1 level MCU and this n level MCU to fetch and set up pass-through channel, thereby any one MCU that need to upgrade under principal and subordinate MCU is upgraded, do not need each MCU to reserve at least one upgrade interface, avoid causing the waste of hardware resource, reduced hardware cost.
For ease of understanding, according to the described embodiment of Fig. 3, with a practical application scene, the principal and subordinate MCU upgrade method in the embodiment of the present invention is described below:
1, in computing machine, prepared the ROMPaq that all needs are used, if the 1st grade of MCU (main MCU) needs upgrading, according to corresponding ROMPaq, by the upgrade interface of the 1st grade of MCU, the 1st grade of MCU upgraded.
2, then, computing machine accesses to the 1st grade of MCU by this upgrade interface, then is connected upper n level MCU by the pass-through channel between the 1st grade of MCU and n level MCU, thereby realizes communicating by letter of computing machine and n level MCU, thereby computing machine is upgraded to n level MCU.For example, in the time that the 2nd grade of MCU need to upgrade, corresponding pass-through channel is: the 2nd grade of MCU of 1 grade of MCU-of computing machine-; In the time that the 4th grade of MCU need to upgrade, corresponding pass-through channel is: the 4th grade of MCU of the 2nd grade of MCU-3rd level MCU-of 1 grade of MCU-of computing machine-; In the time that n level MCU need to upgrade, corresponding pass-through channel is: the 2nd grade of MCU-of 1 grade of MCU-of computing machine-...--n-1 level MCU-n level MCU (n is greater than 2 here).
3, computing machine communicates all MCU that need to upgrade in principal and subordinate MCU, and then upgrading, after all MCU that need to upgrade have all upgraded, is fed back the information of having upgraded.As the display of computing machine can show " upgrading completes " or send jingle bell prompting.
Those skilled in the art can be well understood to, for convenience and simplicity of description, the system of foregoing description, the specific works process of device and unit, can, with reference to the corresponding process in preceding method embodiment, not repeat them here.
In the several embodiment that provide in the application, should be understood that, disclosed system, apparatus and method, can realize by another way.For example, device embodiment described above is only schematic, for example, the division of described unit, be only that a kind of logic function is divided, when actual realization, can have other dividing mode, for example multiple unit or assembly can in conjunction with or can be integrated into another system, or some features can ignore, or do not carry out.Another point, shown or discussed coupling each other or direct-coupling or communication connection can be by some interfaces, indirect coupling or the communication connection of device or unit can be electrically, machinery or other form.
The described unit as separating component explanation can or can not be also physically to separate, and the parts that show as unit can be or can not be also physical locations, can be positioned at a place, or also can be distributed in multiple network element.Can select according to the actual needs some or all of unit wherein to realize the object of the present embodiment scheme.
In addition, the each functional unit in each embodiment of the present invention can be integrated in a processing unit, can be also that the independent physics of unit exists, and also can be integrated in a unit two or more unit.Above-mentioned integrated unit both can adopt the form of hardware to realize, and also can adopt the form of SFU software functional unit to realize.
If described integrated unit is realized and during as production marketing independently or use, can be stored in a computer read/write memory medium using the form of SFU software functional unit.Based on such understanding, the all or part of of the part that technical scheme of the present invention contributes to prior art in essence in other words or this technical scheme can embody with the form of software product, this computer software product is stored in a storage medium, comprise that some instructions (can be personal computers in order to make a computer equipment, server, or the network equipment etc.) carry out all or part of step of method described in each embodiment of the present invention.And aforesaid storage medium comprises: USB flash disk, portable hard drive, ROM (read-only memory) (ROM, Read-OnlyMemory), the various media that can be program code stored such as random access memory (RAM, Random Access Memory), magnetic disc or CD.
The above, above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. a principal and subordinate MCU upgrade method, is characterized in that, comprising:
The 1st grade of MCU gets upgrade file by the upgrade interface of described the 1st grade of MCU, the ROMPaq of the MCU that described upgrade file comprises needs upgrading;
N level MCU obtains described upgrade file by communication link to n-1 level MCU, and n is more than or equal to 2;
Described n-1 level MCU and described n level MCU cascade;
There is corresponding relation in described ROMPaq and described MCU;
Described MCU upgrades according to the corresponding ROMPaq getting.
2. method according to claim 1, is characterized in that, described n level MCU also comprised before n-1 level MCU obtains described upgrade file by communication link:
N level MCU applies for described upgrade file by communication link to n-1 level MCU.
3. method according to claim 2, is characterized in that, described n level MCU applies for also comprising after described upgrade file to n-1 level MCU by communication link:
N-1 level MCU gets upgrading mark, and described upgrading is labeled as the mark of all MCU that need upgrading under described n level MCU and n level MCU cascade;
N-1 level MCU gets corresponding ROMPaq according to described upgrading mark;
The ROMPaq of described correspondence is packaged as new upgrade file by n-1 level MCU.
4. method according to claim 3, is characterized in that, described n level MCU also comprises after n-1 level MCU obtains described upgrade file by communication link:
Described n level MCU obtains the ROMPaq in described upgrade file.
5. according to the method described in any one in claim 1 to 4, it is characterized in that, described method also comprises:
When described ROMPaq, corresponding all MCU all complete after upgrading, and described MCU deletes described ROMPaq.
6. a principal and subordinate MCU upgrade method, is characterized in that, comprising:
In the time that the 1st grade of MCU need to upgrade, according to corresponding ROMPaq, by the upgrade interface of described the 1st grade of MCU, the 1st grade of MCU upgraded;
According to corresponding ROMPaq, by the upgrade interface of pass-through channel and the 1st grade of MCU, the n level MCU of needs upgrading to be upgraded, described pass-through channel is the communication transmission passage between the 1st grade of MCU and described n level MCU, n is more than or equal to 2;
N-1 level MCU and described n level MCU cascade.
7. method according to claim 6, is characterized in that,
In the time that n is 2, described communication transmission passage is the communication link between described the 1st grade of MCU and described the 2nd grade of MCU.
8. method according to claim 6, is characterized in that,
In the time that n is 3, described communication transmission passage is communication link between described the 1st grade of MCU and described the 2nd grade of MCU and the communication link between described the 2nd grade of MCU and described 3rd level MCU.
9. method according to claim 6, is characterized in that,
In the time that n is 4, described communication transmission passage is the communication link between communication link and described 3rd level MCU and described the 4th grade of MCU between communication link, described the 2nd grade of MCU and the described 3rd level MCU between described the 1st grade of MCU and described the 2nd grade of MCU.
10. according to the method described in any one in claim 6 to 9, it is characterized in that, described method also comprises:
After all MCU that need to upgrade have all upgraded, feed back the information of having upgraded.
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| CN106126277A (en) * | 2016-06-17 | 2016-11-16 | 深圳拓邦股份有限公司 | Multi-microprocessor and the upgrade method of external memory system |
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| CN110769057A (en) * | 2019-10-25 | 2020-02-07 | 广东博智林机器人有限公司 | Automatic upgrading method, device and system based on cascade system |
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| CN111831309A (en) * | 2020-07-16 | 2020-10-27 | 深圳市朗科智能电气股份有限公司 | Upgrading method, device, equipment and medium for multiple MCUs (micro control units) in Wifi (wireless fidelity) of Internet of things |
| CN113127038A (en) * | 2021-04-21 | 2021-07-16 | 北京顶象技术有限公司 | Product upgrading method and system |
| CN115686586A (en) * | 2022-11-16 | 2023-02-03 | 深圳市拓邦自动化技术有限公司 | Terminal device program upgrading method and device and electric equipment |
| CN117453256A (en) * | 2023-12-22 | 2024-01-26 | 季华实验室 | Serial multi-singlechip upgrading method and upgrading system |
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