CN103969948B - Touch panel black photosensitive composition and touch panel - Google Patents
Touch panel black photosensitive composition and touch panel Download PDFInfo
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- CN103969948B CN103969948B CN201410040163.2A CN201410040163A CN103969948B CN 103969948 B CN103969948 B CN 103969948B CN 201410040163 A CN201410040163 A CN 201410040163A CN 103969948 B CN103969948 B CN 103969948B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
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- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Optics & Photonics (AREA)
- Materials For Photolithography (AREA)
- Position Input By Displaying (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Optical Filters (AREA)
Abstract
The present invention provides chemical resistance and the excellent touch panel black-colored photosensitive resin composition of developing property and the touch panel using the composition.The black-colored photosensitive resin composition contains: (A) alkali soluble resin, by make (a) dicarboxylic acids, tricarboxylic acids or its acid anhydrides and (b) tetrabasic carboxylic acid or its dianhydride with (a)/(b) 0.1~10 range molar ratio and the epoxide as derived from bisphenols with 2 glycidyl ethers reacted and obtained with the reactant of the monocarboxylic acid containing unsaturated group；(B) with the photopolymerizable monomer of at least one alkene unsaturated bond；(C) with the compound of epoxy group；(D) Photoepolymerizationinitiater initiater；(E) light screening material, wherein relative to (A) 100 mass parts, it (B) is 10~60 mass parts, (C) is 10~80 mass parts, 100 mass parts of total amount relative to (A) and (B), it (D) is 2~40 mass parts, (E) accounts for 40~60 mass % in solid component.
Description
Technical field
That the present invention relates to chemical resistances is excellent, can form desired pattern, the touch panel with high light-proofness
Use black-colored photosensitive resin composition.In particular it relates to touch panel black-colored photosensitive resin composition and use the combination
The touch panel of object.
Background technique
The colored filter of liquid crystal display device usually by the glass for being formed with the black film for separating each pixel,
The side of the pixel of red, green, blue is sequentially formed on the transparent substrates such as plastic plate surface with the multicolour pattern of striated or zyklopisch etc.
Method manufacture.This black film acts the reduction of contrast and excitation purity caused by preventing because of the light leakage between pixel, mainly makes
With the black-colored photosensitive resin composition containing the light screening materials such as carbon black, titanium oxynitride, titanium be black, alkali-developable.
Currently, touch panel has been used widely as the data input means in the display devices such as liquid crystal display,
Wherein, electrostatic capacity type touch panel is in practical application.Have in the picture of electrostatic capacity type touch panel transparent with ITO etc.
Conductive material is formed as two layers of zyklopisch electrode pattern.Two layers of electrode pattern are respectively displayed on phase on x-axis direction and y-axis direction
Shape even is taken out wiring via metal etc. and is connect with external control circuit.When touching picture with finger, electricity in its vicinity
In pole figure case, static capacity changes, and control circuit detects this variation with coordinate information, so as to identify finger
Position (see, for example, patent document 1).
In this touch panel substrate, black film same as colored filter be also used for shading, wiring it is hidden
Hiding etc., but according to the composition of substrate, it needs to form electrode, metal wiring etc. after forming black film, so, it is desirable that black film tool
There is the heat resistance to the temperature in these manufacturing procedures, to the high chemical resistance of the chemicals used in manufacturing procedure
Deng.For example, after black film is formed formed metal wiring in the case where, in the patterning using alkalinity or acidic etching liquid,
The treatment fluids such as alkaline anticorrosive additive stripping liquid controlling, especially using strong basicity treatment fluid, as with alkali contained in film
The compatibility of soluble resin, it may appear that film dissolve and the problem of remove or the problem of being unable to ensure sufficient adhesiveness.Thus
And increase the ratio for the light screening materials such as carbon black, titanium oxynitride, titanium be black, the ratio of the alkali soluble resin in black film can be reduced,
Chemical resistance is improved as a result, but the formation of photo-curable, pattern can be remarkably decreased, and be difficult to take into account development to generate
The problems such as characteristic and sufficient chemical resistance.
In order to solve this problem, also it has been proposed that touch panel with black-colored photosensitive resin composition (reference can be made to patent
Document 2,3), but still cannot be considered in terms of chemical resistance and pattern formed can, expect the material for developing higher performance.
Patent document:
Patent document 1: Japanese Unexamined Patent Publication 2011-186717 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2012-145699 bulletin
Patent document 3:WO2012/133148 Publication
Summary of the invention
Therefore, the present invention is intended to provide can solve above-mentioned each problem in the prior art, there is sufficient chemical-resistant resistance
Property and the excellent touch panel black-colored photosensitive resin composition of developing property and the touch panel using the resin combination.
To solve the above-mentioned problems, present inventor has made intensive studies, as a result, it has been found that, pass through the change for making that there is epoxy group
Object is closed to coexist in containing alkali soluble resin, photopolymerizable monomer (photopolymerization monomer), Photoepolymerizationinitiater initiater, light screening material etc.
Black-colored photosensitive resin composition in, can be obtained, which can improve chemical resistance and pattern, forms the touch-control that can will not be reduced
Panel black-colored photosensitive resin composition.That is, main contents of the invention are as follows.
(1) present invention is a kind of touch panel black-colored photosensitive resin composition, which is characterized in that is contained: (A) alkali can
Soluble resin, by make (a) dicarboxylic acids, tricarboxylic acids or its acid anhydrides and (b) tetrabasic carboxylic acid or its dianhydride with (a)/(b) 0.1~
The molar ratio of 10 range and as derived from bisphenols with 2 glycidyl ethers epoxide and contain unsaturated group
The reactant of the monocarboxylic acid of group, which is reacted, to be obtained；(B) with the photopolymerizable monomer of at least one alkene unsaturated bond；(C)
Compound with epoxy group；(D) Photoepolymerizationinitiater initiater；(E) light screening material, relative to (A) 100 mass parts, (B) is 10~60
Mass parts, (C) is 10~80 mass parts, and 100 mass parts of total amount relative to (A) and (B), (D) are 2~40 mass parts,
And (E) accounts for 40~60 mass % in solid component.
(2) touch panel black-colored photosensitive resin composition of the invention is further characterized in that, (C) has at least three
Epoxy group.
(3) present invention or a kind of solidfied material, by using above-mentioned black-colored photosensitive resin composition via photoetching process
Solidified again after formation and is obtained.
(4) present invention or a kind of touch panel with above-mentioned solidfied material.
The present invention is described in detail below.
(A) in touch panel black-colored photosensitive resin composition of the invention is alkali soluble resin, by making
(a) dicarboxylic acids, tricarboxylic acids or its acid anhydrides and (b) tetrabasic carboxylic acid or its dianhydride with molar ratio of (a)/(b) in 0.1~10 range and
The reactant of epoxide as derived from bisphenols with 2 glycidyl ethers and the monocarboxylic acid containing unsaturated group
It is reacted and is obtained.
The bisphenols of raw material as formation (A), can enumerate bis- (4- hydroxy phenyl) ketone, it is bis- (hydroxyl -3 4-,
5- 3,5-dimethylphenyl) ketone, bis- (4- hydroxyl -3,5- dichlorophenyl) ketone, bis- (4- hydroxy phenyl) sulfones, bis- (4- hydroxyls -
3,5- 3,5-dimethylphenyl) it is sulfone, bis- (4- hydroxyl -3,5- dichlorophenyl) sulfones, bis- (4- hydroxy phenyl) hexafluoropropane, double
(4- hydroxyl -3,5- 3,5-dimethylphenyl) hexafluoropropane, bis- (4- hydroxyl -3,5- dichlorophenyl) hexafluoropropane, bis- (4-
Hydroxy phenyl) dimethylsilane, bis- (4- hydroxyl -3,5- 3,5-dimethylphenyl) dimethylsilanes, bis- (4- hydroxyl -3,5-
Dichlorophenyl) dimethylsilane, bis- (4- hydroxy phenyl) methane, bis- (4- hydroxyl -3,5- dichlorophenyl) methane, bis- (4-
Hydroxyl -3,5- dibromo phenyl) methane, bis- (4- hydroxy phenyl) propane of 2,2-, the bis- (4- hydroxyl -3,5- diformazans of 2,2-
Base phenyl) propane, bis- (4- hydroxyl -3,5- dichlorophenyl) propane of 2,2-, 2,2- bis- (4- hydroxy-3-methyl phenyl)
Bis- (4- hydroxyl -3- chlorphenyl) propane of propane, 2,2-, bis- (4- hydroxy phenyl) ethers, bis- (4- hydroxyl -3,5- diformazans
Base phenyl) ether, bis- (4- hydroxyl -3,5- dichlorophenyl) ethers, bis- (4- hydroxy phenyl) fluorenes of 9,9-, bis- (the 4- hydroxyls of 9,9-
Base -3- aminomethyl phenyl) fluorenes, bis- (4- hydroxyl -3- chlorphenyl) fluorenes of 9,9-, 9,9- bis- (4- hydroxyl -3- bromophenyls)
Bis- (4- hydroxyl -3- fluorophenyl) fluorenes of fluorenes, 9,9-, bis- (4- hydroxyl -3,5- 3,5-dimethylphenyl) fluorenes of 9,9-, 9,9- are bis-
(4- hydroxyl -3,5- dichlorophenyl) fluorenes, 9,9- bis- (4- hydroxyl -3,5- dibromo phenyl) fluorenes, 4,4'- xenol, 3,
3 '-xenols etc. and their derivative.Wherein, the bisphenols with 9,9- fluorenyl can especially utilize well.
Then, it reacts above-mentioned bisphenols with epichlorohydrin, obtains the epoxide with 2 glycidyl ethers.By
In in the oligomerization for carrying out generally entailing 2-glycidyl ether compound when the reaction, thus the ring of the following general formula (I) can be obtained
Oxygen compound.
(changing 1)
In the formula of logical formula (I), R1、R2、R3And R4Separately indicate hydrogen atom, the alkyl of carbon number 1~5, halogen atom or
Phenyl, A expression-CO- ,-SO2-、-C(CF3)2-、-Si(CH3)2-、-CH2-、-C(CH3)2,-O-, 9,9- fluorenyl or direct key.
The integer that I is 0~10.It is preferred that R1、R2、R3、R4For hydrogen atom, preferably A is 9,9- fluorenyl.In addition, I is usually that multiple values mix
Together, though thus average value is that 0~10(is not limited to integer), the average value of I is preferably 0~3.If the value of I is more than the upper limit
Value, then when forming black-colored photosensitive resin composition using the alkali soluble resin synthesized with the epoxide, composition
Viscosity it is excessive, it may appear that coating can not be successfully progress or cannot sufficiently assign alkali-soluble, alkali-developable excessively poor situation.
Then, make the acrylic or methacrylic acid or both of which and general formula as the monocarboxylic acid containing unsaturated group
(I) compound reaction, obtains the reactant with hydroxyl, then make (a) dicarboxylic acids, tricarboxylic acids or its acid anhydrides and (b) tetrabasic carboxylic acid
Or its dianhydride is reacted with molar ratio of (a)/(b) in 0.1~10 range with above-mentioned reactant, and the following general formula (II) is obtained
The alkali soluble resin with epoxy (methyl) acrylate acid addition product structure indicated.
(changing 2)
(in formula, R1、R2、R3And R4Separately indicate hydrogen atom, the alkyl of carbon number 1~5, halogen atom or phenyl, R5Table
Show hydrogen atom or methyl, A expression-CO- ,-SO2-、-C(CF3)2-、-Si(CH3)2-、-CH2-、-C(CH3)2,-O-, 9,9- fluorenes
Base or direct key, X indicate 4 yuan of carboxylic acid residues, Y1And Y2Separately indicate hydrogen atom or-OC-Z- (COOH)m(wherein, Z table
Show 2 yuan or 3 yuan of carboxylic acid residues, m indicates 1~2 number), n indicates 1~20 integer.)
Due to epoxy (methyl) the acrylate acid addition product (II) be have concurrently alkene unsaturated double-bond and carboxyl alkali it is solvable
Property resin, therefore, (A) as touch panel black-colored photosensitive resin composition of the invention it is solid to assign excellent light
The property changed, good developability, pattern-forming characteristic, obtain good touch panel black film figure.
As (a) two used in epoxy (methyl) acrylate acid addition product in (A) of the invention i.e. logical formula (II)
Carboxylic acid, tricarboxylic acids or its acid anhydrides use chain hydrocarbon dicarboxylic acids, tricarboxylic acids or its acid anhydrides, ester ring type dicarboxylic acids, tricarboxylic acids or its acid
Acid anhydride, aromatic dicarboxylic acid, tricarboxylic acids or its acid anhydrides.Here, as chain hydrocarbon dicarboxylic acids, tricarboxylic acids or its acid anhydrides, such as there is amber
Acid, acetyl group succinic acid, maleic acid, adipic acid, itaconic acid, azelaic acid, citramalic acid, malonic acid, glutaric acid, citric acid, winestone
The compounds such as acid, ketoglutaric acid, pimelic acid, decanedioic acid, suberic acid, diglycolic acid can also be and import any substituent group
Dicarboxylic acids, tricarboxylic acids or its acid anhydrides.In addition, as ester ring type dicarboxylic acids, tricarboxylic acids or its acid anhydrides, such as have cyclobutane dicarboxyl
The compounds such as acid, cyclopentane dicarboxylic acid, hexahydrophthalic acid, tetrahydrophthalic acid, norbornane dicarboxylic acids, can also be
The dicarboxylic acids or tricarboxylic acids or its acid anhydrides of any substituent group are imported.In addition, as aromatic dicarboxylic acid or tricarboxylic acids or
Its acid anhydrides, such as have the compounds such as phthalic acid, M-phthalic acid, trimellitic acid, it can also be and imported any substitution
Dicarboxylic acids, tricarboxylic acids or its acid anhydrides of base.
In addition, as used in epoxy (methyl) acrylate acid addition product in (A) of the invention i.e. logical formula (II)
(b) tetrabasic carboxylic acid or its dianhydride use chain hydrocarbon tetrabasic carboxylic acid or its dianhydride, ester ring type tetrabasic carboxylic acid or its dianhydride or aromatic polyvalent
Carboxylic acid or its dianhydride.Here, as chain hydrocarbon tetrabasic carboxylic acid or its dianhydride, such as there are butane tetracarboxylic acid, pentane tetrabasic carboxylic acid, hexane tetracarboxylic acid
Acid etc. can also be the tetrabasic carboxylic acid for having imported substituent group or its dianhydride.In addition, as ester ring type tetrabasic carboxylic acid or its dianhydride, such as
There are cyclobutane tetrabasic carboxylic acid, pentamethylene tetrabasic carboxylic acid, cyclopentanetetracarboxylic, cycloheptane tetrabasic carboxylic acid, norbornane tetrabasic carboxylic acid etc., it can be with
It is the tetrabasic carboxylic acid or its dianhydride for having imported substituent group.In addition, as aromatic tetracarboxylic acid or its dianhydride, such as can be equal benzene four
Formic acid, benzophenone tetrabasic carboxylic acid, biphenyltetracarboxyacid acid, Biphenyl Ether tetrabasic carboxylic acid or its dianhydride, can also be and imported the four of substituent group
Carboxylic acid or its dianhydride.
(a) dicarboxylic acids, three used in epoxy (methyl) acrylate acid addition product of the i.e. logical formula (II) of (A) of the invention
Molar ratio (a)/(b) of carboxylic acid or its acid anhydrides and (b) tetrabasic carboxylic acid or its dianhydride in the range of 0.1~10, preferably 0.2~
In the range of 3.0.If molar ratio (a)/(b) be detached from above range, cannot most suitable molecular weight, the black sense to (A) is used
For photosensitive resin composition, alkali-developable, heat resistance, solvent resistance, pattern form etc. can be deteriorated, thus unsuitable.In addition, depositing
Molar ratio (a)/(b) is smaller, alkali-solubility is bigger, molecular weight also bigger tendency.
In addition, the weight average molecular weight of epoxy (methyl) acrylate acid addition product of (A) of the invention i.e. logical formula (II)
(Mw) preferably between 2000~10000, particularly preferably between 3000~7000.If weight average molecular weight (Mw) less than 2000,
The adhesiveness of pattern is then unable to maintain that in the development of the black-colored photosensitive resin composition of use (A), it may occur that pattern removing,
And when weight average molecular weight (Mw) is more than 10000, then development residue and the residual film in unexposed portion are easy residual.Furthermore it is preferred that (A)
Acid value in the range of 30~200mgKOH/g.If the value is less than 30mgKOH/g, the black-colored photosensitive resin of (A) is used
The alkali development of composition cannot be gone on smoothly, or the special development conditions such as need highly basic, and when the value is more than
When 200mgKOH/g, the infiltration of alkaline developer to the black-colored photosensitive resin composition for using (A) is too fast, it may occur that removing is aobvious
Shadow, thus be not suitable for.
Used in the present invention lead to formula (II) epoxy (methyl) acrylate acid addition product can by above-mentioned operation, with
The method recorded in the method known such as Japanese Unexamined Patent Publication 8-278629 report or Japanese Unexamined Patent Publication 2008-9401 bulletin etc. is made
It makes.Firstly, as the method for reacting the monocarboxylic acid containing unsaturated group with the epoxide of logical formula (I), for example, have by
It is added in solvent with the equimolar monocarboxylic acid containing unsaturated group of the epoxy group of epoxide, in catalyst (benzyl
Triethyl ammonium chloride, 2,6- diisobutyl phenol etc.) in the presence of, it heats, stir at 90~120 DEG C when being blown into air,
The method reacted.Then, as keeping the hydroxyl of acid anhydrides and the epoxy acrylic ester compounds for above-mentioned reaction product anti-
The method answered has the specified amount by epoxy acrylic ester compounds and dianhydride and an acid anhydride to be added in solvent, in catalyst (tetrem
Base ammonium bromide, triphenylphosphine etc.) in the presence of, it heats, stir, the method reacted at 90~130 DEG C.
At least there is 1 alkene unsaturation as (B) in touch panel black-colored photosensitive resin composition of the invention
The photopolymerizable monomer of key, such as (methyl) acrylic acid 2- hydroxyl ethyl ester, (methyl) acrylic acid 2- hydroxypropyl acrylate, (first can be enumerated
Base) (methyl) esters of acrylic acid with hydroxyl such as 2-EHA, ethylene glycol two (methyl) acrylate, diethyl
Glycol two (methyl) acrylate, triethylene glycol two (methyl) acrylate, tetraethylene glycol two (methyl) acrylate, four methylenes
Base glycol two (methyl) acrylate, trimethylolpropane tris (methyl) acrylate, trimethylolethane trimethacrylate (methyl) propylene
Acid esters, pentaerythrite two (methyl) acrylate, pentaerythrite three (methyl) acrylate, pentaerythrite four (methyl) acrylic acid
Ester, dipentaerythritol four (methyl) acrylate, glycerol (methyl) acrylate, D-sorbite five (methyl) acrylate, two
(methyl) acrylate of pentaerythrite five or dipentaerythritol six (methyl) acrylate, D-sorbite six (methyl) acrylic acid
(the first such as ester, modified six (methyl) acrylate of alkylene oxide of phosphonitrile, caprolactone modification dipentaerythritol six (methyl) acrylate
Base) esters of acrylic acid, it can be used one kind or two or more in these.The photopolymerization at least one alkene unsaturated bond
Monomer it is preferable to use have 3 or more polymerism groups, can be by the molecule phase of the alkali soluble resin containing unsaturated group
The compound being mutually crosslinked.In addition, (B) there is the photopolymerizable monomer of at least one alkene unsaturated bond not have free carboxy.
There is the compound of epoxy group as (C) in touch panel black-colored photosensitive resin composition of the invention,
Such as can to enumerate bisphenol A type epoxy compound, bisphenol F type epoxy compound, bisphenol fluorene type ring oxygen compound, phenol novolac clear
Paint shaped epoxide, cresol novolak type epoxy compound, the glycidol ether of polyalcohol, polybasic carboxylic acid glycidol
Ester, contain (methyl) glycidyl acrylate as polymerized unit polymer, with 3,4- 7-oxa-bicyclo[4.1.0 carboxylic acid (3 ',
4 '-epoxycyclohexyls) cycloaliphatic epoxy of the methyl esters for representative, the multi-functional epoxyization with bicyclopentadiene skeleton
Close the 1,2- epoxy group -4- of object (such as HP7200 series of DIC company production), bis- (the methylol)-n-butyl alcohols of 2,2-
(2- epoxy ethyl) hexamethylene addition product (such as Daicel Products " EHPE3150 "), epoxidized polybutadiene (such as day
This Cao reaches Products " NISSO-PBJP-100 "), epoxide with silicone backbone etc..As these ingredients,
It is preferred that the compound that epoxide equivalent is 100~300g/eq and number-average molecular weight is 100~5000.It more preferably uses and has in 1 molecule
There is the epoxide of 3 or more epoxy groups.In addition, the compound of 1 type can be used only in (C), it can also be with multiple types
It is applied in combination.
As (D) Photoepolymerizationinitiater initiater in touch panel black-colored photosensitive resin composition of the invention, such as can
With enumerate acetophenone, 2,2- diethoxy acetophenone, to dimethyl acetophenone, to dimethylamino propiophenone, dichloroacetophenone,
The acetophenones such as trichloroacetophenone, p-tert.-butyl acetophenone, benzophenone, 2- chlorobenzophenone, p, the bis- dimethylaminos two of p '-
The benzophenones such as Benzophenone, the benzoin ethers such as benzyl, styrax, benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether
Class, 2-(Chloro-O-Phenyl) -4,5- phenyl double imidazoles, 2-(Chloro-O-Phenyl) the double imidazoles of -4,5- bis- (m-methoxyphenyl),
2-(o-fluorophenyl) -4,5- diphenyl double imidazoles, 2-(o-methoxyphenyl) -4,5- diphenyl double imidazoles, 2,4,5-
Double imidazole compound classes such as the double imidazoles of triaryl, 2- trichloromethyl -5- styryl -1,3,4- oxadiazoles, 2- tri-
Chloromethyl -5-(is to cyano styrene base) -1,3,4- oxadiazoles, 2- trichloromethyl -5-(is to methoxy styrene
Base) -1, the halogen methyls diazole compounds class such as 3,4- oxadiazoles, 2,4,6- tri- (trichloromethyl) -1,3,5-triazines, 2- first
Bis- (the trichloromethyl) -1,3,5- triazines of base -4,6-, bis- (the trichloromethyl) -1,3,5- triazines of 2- phenyl -4,6-,
2-(4- chlorphenyl) bis- (the trichloromethyl) -1,3,5-triazines of -4,6-, 2-(4- methoxyphenyl) -4,6- bis- (three
Chloromethyl) -1,3,5- triazine, 2-(4- methoxyl group naphthalene) bis- (the trichloromethyl) -1,3,5- triazines of -4,6-, 2-
Bis- (the trichloromethyl) -1,3,5- triazines of (4- methoxyl-styrene) -4,6-, 2-(3,4,5- trimethoxy styrene
Base) bis- (the trichloromethyl) -1,3,5- triazines of -4,6-, 2-(4- methyl thio styryl) bis- (three chloromethanes of -4,6-
Base) halogen methyls-S- triazine based compound class such as -1,3,5-triazines, 1- (4- (thiophenyl) phenyl) -1,2- octane two
Ketone 2- (O- benzoyl oxime), 1-(4- phenyl sulfur phenenyl) butane -1,2- diketone -2- oxime-O- benzoic ether, 1-
(4- methyl thio phenyl) butane -1,2- diketone -2- oxime-O- acetic acid esters, 1-(4- methyl thio phenyl) butane -1-
The O- acyl group oxime compound class such as ketoxime-O- acetic acid esters, benzyl dimethyl ketal, thioxanthones, 2-chlorothioxanthone, 2,4-
The sulphur compounds such as diethyl thioxanthone, 2- methyl thioxanthones, 2-isopropylthioxanthone, 2- ethyl hydrazine, prestox anthraquinone,
The Anthraquinones such as 1,2- benzo anthraquinone, 2,3- diphenyl anthraquinone, azodiisobutyronitrile, benzoyl peroxide, cumene peroxide etc.
Organic peroxide, the sulphur compounds such as 2-mercaptobenzimidazole, 2- mercaptobenzoxazole, 2-mercaptobenzothiazole, three ethyl alcohol
Tertiary amines such as amine, triethylamine, etc..Wherein, from the point of view of being easy to get highly sensitive black-colored photosensitive resin composition,
It is preferable to use O- acyl group oxime compound classes.In addition, two or more also can be used in these Photoepolymerizationinitiater initiaters.It needs to illustrate
It is that described one word of Photoepolymerizationinitiater initiater is used with the meaning comprising sensitizer in the present invention.
It, can not be by spy as (E) light screening material in touch panel black-colored photosensitive resin composition of the invention
Different limitation ground uses black organic pigment, colour mixture organic pigment or inorganic system's pigment etc..As black organic pigment, such as can be with
Be it is black, Hua Jing is black, nigrosine etc..As colour mixture organic pigment, can be mixing selected from red, blue, green, purple, yellow, cyanic colours,
At least two kinds of in carmetta etc. with paint, carried out intending blackened organic pigment.As inorganic system's pigment, charcoal can be
Black, chromium oxide, iron oxide, titanium be black, titanium oxynitride, titanium nitride etc..These light screening materials can be used alone, can also be appropriate
Select two or more use, but from light-proofness, surface smoothness, dispersion stabilization, examine with the good angle of compatibility of resin
Consider, particularly preferred carbon black.
In black-colored photosensitive resin composition of the invention, it is preferable to use solvent adjustment in addition to above-mentioned (A)~(E)
Viscosity.As solvent, such as it can be the alcohols such as methanol, ethyl alcohol, normal propyl alcohol, isopropanol, ethylene glycol, propylene glycol, α-or β-
The terpenes such as terpineol, the ketones such as acetone, methyl ethyl ketone, cyclohexanone, n-methyl-2-pyrrolidone, toluene, dimethylbenzene, four
The aromatic hydrocarbons such as methylbenzene, cellosolve, methyl cellosolve, ethyl cellosolve, carbitol, methyl carbitol, ethyl carbitol, butyl
Carbitol, propylene glycol monomethyl ether, dihydroxypropane single-ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, triethylene glycol list first
The glycol ethers such as ether, Triethylene glycol ethyl ether, ethyl acetate, butyl acetate, cellosolve acetate, ethyl cellosolve acetate,
Butyl cellosolve acetate, carbitol acetate, ethylcarbitol acetate, acetate of butyl carbitol, propylene glycol monomethyl ether
Acetate esters such as acetic acid esters, propylene glycol monoethyl ether acetate, etc., by dissolving, mixing, can be formed using these solvents
Even molten liquid composition.
In addition, curing accelerator, thermal polymerization suppression can be added as needed in black-colored photosensitive resin composition of the invention
The additives such as preparation, plasticizer, packing material, solvent, levelling agent, defoaming agent, coupling agent, surfactant.As thermal polymerization
Inhibitor can enumerate quinhydrones, hydroquinone monomethyl ether, pyrogallol, tert-butyl catechol, phenthazine etc., as plasticizer, Ke Yilie
Dibutyl phthalate, dioctyl phthalate, tricresyl phosphate etc. are lifted, as packing material, glass can be enumerated
Fiber, silica, mica, alumina etc. can enumerate silicone-based, fluorine system, acrylic compounds as defoaming agent and levelling agent.
In addition, fluorine system surfactant, silicone-based surfactant etc. can be enumerated as surfactant, as silane coupling agent,
3-(glycidoxypropyl can be enumerated) propyl trimethoxy silicane, 3- isocyanate group propyl-triethoxysilicane, 3- urea
Base propyl-triethoxysilicane etc..
Ratio is preferably comprised about each ingredient of (A) in black-colored photosensitive resin composition~(E), relative to (A)
100 mass parts, (B) are 10~60 mass parts, and (C) is 10~80 mass parts, in addition, the total amount of (D) relative to (A) and (B)
100 mass parts are 2~40 mass parts.It is highly preferred that (B) is 30~50 mass parts relative to (A) 100 mass parts, (C) is 20
~70 mass parts, in addition, 100 mass parts of total amount of (D) relative to (A) and (B), are 3~30 mass parts.In solid component
In (monomer component including forming solid component because of photocuring reaction), (E) accounts for 40~60 mass % of solid component.
Touch panel of the invention uses black-colored photosensitive resin composition to contain above-mentioned (A)~(E) as main component.It is right
For photosensitive polymer combination solution, the solid component after removal of the solvent (list including forming solid component after photocuring
Body ingredient) in, (A)~(E) contains 70 mass % or more at subtotaling, preferably contains 80 mass % or more, more preferably contains 90 mass %
More than.The amount of solvent changes depending on target viscosities, but preferably 60~90 mass %'s in photosensitive polymer combination solution
In range.
Touch panel of the invention with black film be using touch panel black-colored photosensitive resin composition of the invention,
It is formed using photoetching process.Its manufacturing process can be with the following method: firstly, by photosensitive polymer combination solution coating
Onto substrate surface, then make solvent seasoning (prebake conditions), later, photomask is put on thus resulting film, irradiation is purple
Outside line solidifies exposure portion, then dissolves out unexposed portion with aqueous alkali, develops, and forms pattern, then toasts and make after carrying out
For rear solidification.Here, the substrate as photosensitive resin coating composition solution uses glass, hyaline membrane (such as poly- carbonic acid
Ester, polyethylene terephthalate, polyether sulfone etc.) etc..
As by the method in photosensitive polymer combination solution coating to substrate, in addition to well known solution dipping method, spray
Other than mist method, it can also use using any sides such as roll coater, die coating machine, the methods of slit coater, spin coater
Method.It after being coated into desired thickness by these methods, removes solvent (prebake conditions), forms film.Prebake conditions pass through use
Oven, hot plate etc. are heated and are carried out.Heating temperature and heating time when prebake conditions can suitably be selected according to used solvent,
Such as 60~110 DEG C at a temperature of toast 1~3 minute.
The exposure carried out after prebake conditions is carried out with exposure machine, by being exposed via photomask, is only made and pattern pair
Answer the photosensitive polymer combination of part photosensitive.Exposure machine and its exposure irradiation condition can be selected suitably, using ultrahigh pressure mercury lamp,
The light sources such as high-pressure sodium lamp, metal halide lamp, far ultraviolet lamp are exposed, and keep the photosensitive polymer combination light in film solid
Change.
Alkali development after exposure is carried out for the purpose of the photosensitive polymer combination for removing unexposed portion, aobvious by this
Shadow forms desired pattern.As being suitable for the developer solution of the alkali development, such as it can be alkali metal, alkaline-earth metal
Aqueous solution, aqueous solution of the hydroxide of alkali metal of carbonate etc., but use sodium carbonate, carbon containing 0.03~1 weight %
The weak alkaline aqueous solution of the carbonate such as sour potassium 23~27 DEG C at a temperature of developed when it is especially good, can be used commercially available aobvious
Shadow machine, supersonic wave cleaning machine etc. form accurate fine image.
After developing by this method, hot place is carried out under conditions of 200~240 DEG C of temperature, 20~60 minutes
Reason (rear baking).The purpose for carrying out the rear baking is to improve the adhesiveness etc. etched between figuratum black film and substrate.
The rear baking is carried out and being heated with baking oven, hot plate etc. as prebake conditions.The figuratum black film of etching of the invention is
It is formed by photolithographic each process utilized above.
Touch panel black-colored photosensitive resin composition of the invention can be by being lithographically formed pattern, and developing property is especially
Excellent, the black film of formation, which also has, is resistant to sufficient resistance toization that the circuit for making touch panel such as forms at the manufacturing procedures
Learn drug etc..
Specific embodiment
Below by embodiment, the present invention will be described in more detail, but the present invention is not limited to these embodiments.
Embodiment
(modulation of black-colored photosensitive resin composition)
It is deployed by composition shown in table 1, modulates the black-colored photosensitive resin group of embodiment 1~15 and comparative example 1
Close object.Each ingredient used in allotment is as follows:
(A) alkali soluble resin: the propylene glycol methyl ether acetate of the epoxy acrylate acid addition product with fluorene skeleton
Solution (aurification Products, trade name V259ME live in resin solid content concentration 56.5%, Nippon Steel)
(B) photopolymerizable monomer: the mixture (day of dipentaerythritol hexaacrylate and Dipentaerythritol Pentaacrylate
This chemical drug Products, trade name DPHA)
(C) epoxide:
(C) -1: bisphenol A type epoxy resin (Mitsubishi Chemical Ind product J ER828, it is flat in 190,1 molecule of epoxide equivalent
Equal functional group number 2.0)
(C) -2:3,4- 7-oxa-bicyclo[4.1.0 carboxylic acid (3 ', 4 '-epoxycyclohexyl) methyl esters (Daicel Products
Celloxide2021P, the average functional group number 2.0 in 135,1 molecule of epoxide equivalent)
(C) -3: the multi-functional epoxy compound with bicyclopentadiene skeleton (work as by DIC Products HP7200L, epoxy
Measure the average functional group number 2.2 in 247,1 molecule)
(C) -4: the multi-functional epoxy compound with bicyclopentadiene skeleton (work as by DIC Products HP7200H, epoxy
Measure the average functional group number 3.0 in 276,1 molecule)
(C) -5: phenol novolak type epoxy resin (Mitsubishi Chemical Ind product J ER154,178,1 point of epoxide equivalent
Average functional group number 3.0 in son)
(D) Photoepolymerizationinitiater initiater: -3 base of 1- (9- ethyl -6-(2- methyl benzoyl) carbazole) ethyl ketone=O-
Acetyl group oxime (BASF AG's product, trade name Irgacure OXEO2)
(E) light screening material: 25 weight % of carbon black concentration, dispersion resin (use alkali soluble resin (A)) 8 weight %, height
The carbon black dispersion of the propylene glycol methyl ether acetate solvent of 2 weight % of dispersal agent molecule
(F) solvent:
(F) -1: propylene glycol methyl ether acetate
(F) -2: cyclohexanone
(F) -3: ethoxyl ethyl propionate
(G) surfactant
(H) silane coupling agent (1% cyclohexanone solution)
Table 1
Table 1-1
Table 1-2
(evaluation of black-colored photosensitive resin composition: developability)
The black-colored photosensitive resin composition solution of embodiment 1~15 and comparative example 1 is applied to spin coater de-
It on the glass plate for the thick 1.2mm that rouge cleaned, is dried, is formed after 1.2 μm of dry film thickness, photomask in attaching makes
It is 10mW/cm with the illumination under the high voltage mercury lamp radiation wavelength 365nm of 500W2Ultraviolet light 10 seconds.After exposure, with 0.4%
Aqueous sodium carbonate develops under conditions of 23 DEG C, 60 seconds, pressure 0.1MPa, removes the unexposed portion of film, later,
Be heating and curing at 230 DEG C processing 30 minutes using air drier.
The state of black film patterned surfaces to be formed is judged by visual observation, is formed with micro- sem observation filament, measurement reaches
The minimum pattern width of predetermined pattern size.
Surface state
Zero: surface is glossy, has no deterioration
△: tarnishing, and there is deterioration on discovery surface
×: surface is seriously coarse, discovery deterioration
(evaluation of black-colored photosensitive resin composition: chemical resistance)
The black-colored photosensitive resin composition solution of embodiment 1~15 and comparative example 1 is applied to spin coater de-
It on the glass plate for the thick 1.2mm that rouge cleaned, is dried, is formed after 1.2 μm of dry film thickness, do not use photomask,
Black film is formed in the entire surface with glass plate, the use of the illumination under the high voltage mercury lamp radiation wavelength 365nm of 500W is 10mW/
cm2Ultraviolet light 10 seconds.After exposure, with 0.4% aqueous sodium carbonate under conditions of 23 DEG C, 60 seconds, pressure 0.1MPa into
The processing of row developer solution.Later, be heating and curing at 230 DEG C processing 30 minutes using air drier.
Gained sample is impregnated into and is made of the mixed liquor of 30 mass parts of 2- ethylaminoethanol, 70 mass parts of glycol ether
It is maintained in 80 DEG C of solution, pulls out after ten minutes, cleaned with pure water, it is dry, the impregnated sample of chemicals is made.
Residual film ratio
Film thickness is measured to through chemicals impregnated sample surface roughness meter, calculates residual film ratio.
Film thickness (μm) × 100 before film thickness (μm)/dipping after residual film ratio (%)=dipping
Adhesiveness
It is cut through carrying out cross on the impregnated film of chemicals, keeps film grid-like at least 100 gos, then, used
Cellophane tape carries out disbonded test, evaluates the state of grid by visual observation.
Zero: having no a bit removing
△: a small amount of removing of discovery
×: film essentially peels
Black-colored photosensitive resin of the invention evaluation result is shown in table 2.
Table 2
Table 2-1
Table 2-2
It, can shape in addition to maintaining by embodiment 1~15 and the result of comparative example 1 it is found that by addition (C) epoxide
Other than characteristic at 7 μm of fine pattern, i.e., handled using strong basicity chemicals used in manufacturing procedure, black film
Film loss amount it is also few, also maintained with the adhesiveness of glass substrate.Especially there are 3 functional groups in using 1 molecule
In the embodiment 10~15 of epoxy resin, has no that grid is removed completely in adhesiveness test, be particularly effective.
The chemical resistance of black photosensitive composition of the invention is excellent, thus can use strong basicity stripper etc.
Manufacturing procedure before be pre-formed black film.Moreover, can by photoetching carry out pattern be formed, thus have can use existing light
The advantages of process is formed is carved, and can aid in the slimming of structural body because that can be formed in a manner of film, is suitable for touch-control
The formation of black film in panel production.
Claims (5)
1. touch panel black-colored photosensitive resin composition, contains: (A) alkali soluble resin, by make (a) dicarboxylic acids,
Tricarboxylic acids or its acid anhydrides and (b) tetrabasic carboxylic acid or its dianhydride are with molar ratio of (a)/(b) in the range of 0.1~10 and by bisphenols
The derivative epoxide with 2 glycidyl ethers is reacted with the reactant of the monocarboxylic acid containing unsaturated group
And it obtains；(B) with the photopolymerizable monomer of at least one alkene unsaturated bond；(C) with the compound of epoxy group；(D) photopolymerization
Initiator；(E) light screening material；Wherein, described (C) is selected from phenol novolak-type epoxy compound, cresol novolak type
Epoxide, the glycidol ether of polyalcohol, polybasic carboxylic acid ethylene oxidic ester, contain (methyl) glycidyl acrylate
As one or more of the polymer of polymerized unit and multi-functional epoxy compound with bicyclopentadiene skeleton, and 1
There is at least three epoxy group, relative to (A) 100 mass parts, (B) is 10~60 mass parts, and (C) is 10~80 mass in molecule
Part, and 100 mass parts of total amount relative to (A) and (B), (D) is 2~40 mass parts, also, (E) is accounted in solid component
40~60 mass %.
2. touch panel black-colored photosensitive resin composition according to claim 1, which is characterized in that (C) is
Phenol novolak-type epoxy compound and/or multi-functional epoxy compound with bicyclopentadiene skeleton, and in 1 molecule
With at least three epoxy group, relative to (A) 100 mass parts, (B) is 30~50 mass parts, and (C) is 20~70 mass parts, and phase
For 100 mass parts of total amount of (A) and (B), (D) is 3~30 mass parts.
3. solidfied material, after being formed by using black-colored photosensitive resin composition of any of claims 1 or 2 via photoetching process
It is heating and curing and is obtained again.
4. touch panel, with solidfied material as claimed in claim 3.
5. display device, with touch panel as claimed in claim 4.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2013013000A JP6139894B2 (en) | 2013-01-28 | 2013-01-28 | Black photosensitive composition for touch panel and touch panel |
| JP2013-013000 | 2013-01-28 |
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| JP (1) | JP6139894B2 (en) |
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| WO2015046018A1 (en) * | 2013-09-25 | 2015-04-02 | 東レ株式会社 | Photosensitive light-shielding paste and process for producing laminated pattern for touch sensor |
| JP6822758B2 (en) * | 2014-09-30 | 2021-01-27 | 日鉄ケミカル＆マテリアル株式会社 | A photosensitive resin composition for a touch panel, a cured film thereof, and a touch panel having the cured film. |
| KR102541614B1 (en) * | 2015-03-04 | 2023-06-09 | 다이요 홀딩스 가부시키가이샤 | Etching resist composition and dry film |
| JP6607682B2 (en) * | 2015-03-05 | 2019-11-20 | 日鉄ケミカル＆マテリアル株式会社 | Black resin composition for light-shielding film, substrate with light-shielding film having light-shielding film obtained by curing said composition, and color filter and touch panel having said substrate with light-shielding film |
| JP2017156590A (en) * | 2016-03-02 | 2017-09-07 | 太陽インキ製造株式会社 | Photosensitive resin composition, dry film, cured product and printed wiring board prepared therewith |
| WO2017208848A1 (en) * | 2016-05-31 | 2017-12-07 | 富士フイルム株式会社 | Photosensitive resin composition, transfer film, decorative pattern and touch panel |
| JP6886782B2 (en) * | 2016-06-30 | 2021-06-16 | 東京応化工業株式会社 | A photosensitive resin composition, a cured film, a bank for partitioning a light emitting layer in an organic EL element, a substrate for an organic EL element, an organic EL element, a method for producing a cured film, a method for producing a bank, and a method for producing an organic EL element. |
| JP6872302B2 (en) * | 2017-03-24 | 2021-05-19 | 株式会社タムラ製作所 | Black photosensitive resin composition |
| KR102227606B1 (en) * | 2018-04-06 | 2021-03-12 | 주식회사 엘지화학 | Cardo-based binder resin, photo-sensitive resin composition comprising the same, black matrix, color filter and display device |
| JP6797265B2 (en) * | 2019-10-21 | 2020-12-09 | 日鉄ケミカル＆マテリアル株式会社 | A black resin composition for a light-shielding film, a substrate with a light-shielding film having a light-shielding film obtained by curing the composition, and a color filter and a touch panel having the substrate with the light-shielding film. |
| JP7108670B2 (en) * | 2020-10-20 | 2022-07-28 | 日鉄ケミカル＆マテリアル株式会社 | Photosensitive resin composition for color filters |
| CN115145114A (en) | 2021-03-31 | 2022-10-04 | 日铁化学材料株式会社 | Photosensitive resin composition for light-shielding film, and light-shielding film, color filter and display device using same |
| KR20230099670A (en) | 2021-12-27 | 2023-07-04 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | Photosensitive resin composition, cured film, color filter and display device using the same |
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| TWI285297B (en) * | 2004-02-09 | 2007-08-11 | Chi Mei Corp | Light-sensitive resin composition for black matrix |
| TWI416174B (en) * | 2006-06-01 | 2013-11-21 | Nippon Steel & Sumikin Chem Co | Resit composition for color filter, method for making such composition and color filter using such composition |
| JP2011186717A (en) | 2010-03-08 | 2011-09-22 | Daiwa Sangyo:Kk | Capacitive touch panel and method of manufacturing the same |
| JP5431225B2 (en) * | 2010-03-29 | 2014-03-05 | 新日鉄住金化学株式会社 | Alkali-developable photosensitive resin composition, partition wall for display element formed using the same, and display element |
| KR101367253B1 (en) * | 2010-10-13 | 2014-03-13 | 제일모직 주식회사 | Photosensitive resin composition and black matrix using the same |
| TWI466931B (en) | 2011-03-25 | 2015-01-01 | Toray Industries | Black resin composition, resin black matrix substrate and touch panel |
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