CN103969761B - The joints of optical fibre - Google Patents
The joints of optical fibre Download PDFInfo
- Publication number
- CN103969761B CN103969761B CN201310037822.2A CN201310037822A CN103969761B CN 103969761 B CN103969761 B CN 103969761B CN 201310037822 A CN201310037822 A CN 201310037822A CN 103969761 B CN103969761 B CN 103969761B
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- CN
- China
- Prior art keywords
- hole
- layer
- joints
- substrate
- optical fibre
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- Expired - Fee Related
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- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention provides a kind of joints of optical fibre, and it includes a circuit board, a substrate, at least one optoelectronic wafers, a lens element and at least one optical fiber.This substrate uses multilayer lamination structure, and is arranged on this circuit board, and this at least one optoelectronic wafers is contained in this substrate by routing mode and is connected in this circuit board by this substrate.This at least one optoelectronic wafers is packaged in this substrate and this at least one optoelectronic wafers is optically coupled to this at least one optical fiber by this lens element.It is connected with this circuit board again, so to this substrate owing to using lower-cost routing mode to connect this at least one optoelectronic wafers, it is possible to decrease cost.
Description
Technical field
The present invention relates to optical-fibre communications, particularly to a kind of joints of optical fibre.
Background technology
The joints of optical fibre have generally comprised a circuit board, a laser diode wafer (laser diode die) and a light
Electric diode wafer (photo diode die).This laser diode wafer and this photo diode wafer are by viscous crystalline substance (die
Bond) technology and other chip on boards (chip on board) encapsulation technology be set directly on this circuit board and with this circuit
Plate is electrically connected to form chip on board encapsulation, it is therefore desirable to the viscous crystalline substance of various costlinesses and chip on board sealed in unit, and cost is high.
Summary of the invention
In view of this, it is necessary to a kind of joints of optical fibre reducing cost are provided.
A kind of joints of optical fibre, comprising:
One circuit board；
One substrate, including the ground floor stacked gradually on this circuit board, a second layer, a third layer and one the 4th
Layer, the 4th layer, this third layer and this second layer offer coaxially respectively, be interconnected and that size reduces successively is one first logical
Hole, one second through hole and a third through-hole, this ground floor is formed with at least one pad being electrically connected with this circuit board, and this is second years old
What the layer surface opposing with this ground floor was exposed to this second through hole is formed in part with at least one weld pad, and this substrate also includes at least
One runs through this ground floor and this second layer and is electrically connected with the via of this at least one pad and this at least one weld pad；
At least one is contained in this third through-hole and is arranged at the optoelectronic wafers on this ground floor；
In at least one is contained in this third through-hole and this second through hole and it is electrically connected with this at least one photoelectricity in routing mode
Wafer and the wire of this at least one weld pad；
One lens element being contained in this first through hole, be arranged in this third layer and close this second through hole, this is saturating
Mirror element includes that a light guide structure and at least is formed at this lens element outer surface and by this light guide structure respectively with this extremely
The lens of a few optoelectronic wafers optical coupling；And
At least one with these at least one lens just to optical fiber.
Due to use lower-cost routing mode connect this at least one optoelectronic wafers to after this substrate again with this circuit board
Connect, so, it is possible to decrease cost.
Accompanying drawing explanation
Fig. 1 is the generalized section of the joints of optical fibre of better embodiment of the present invention.
Main element symbol description
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Refer to Fig. 1, the joints of optical fibre 10 of better embodiment of the present invention include circuit board 100, substrate 200,
At least one optoelectronic wafers 300, an at least wire 400, lens element 500 and at least one optical fiber 600.
This circuit board 100 includes an end face 110, and is formed with at least one welded disc 120 on this end face 110.This circuit
Plate 100 is internally formed circuit (not shown) and connects purpose to realize set circuit, such as by this at least one welded disc 120 even
Receive external circuit (not shown).
This substrate 200 includes ground floor 210, second layer 220, third layer 230 that stacks gradually and one the 4th layer
240, the 4th layer 240, this third layer 230 and this second layer 220 offer coaxially respectively, be interconnected and size reduces successively
One first through hole 242,1 second through hole 232 and a third through-hole 222, this ground floor 210 be formed at least one with this at least
The pad 212 of one welded disc 120 correspondence, this second layer 220 surface opposing with this ground floor 210 is exposed to this second through hole
232 be formed in part with at least one weld pad 224, this substrate 200 also includes that at least one runs through this ground floor 210 and this second layer
220 and be electrically connected with the via 250 of this at least one pad 212 and this at least one weld pad 224.
This substrate 200 is arranged on this circuit board 100, and each pad 212 welds with a corresponding welded disc 120, it is achieved
The electric connection of this substrate 200 and this circuit board 100 is to realize set purpose electrical communication.In present embodiment, this substrate 200
Use ceramic bases.It is appreciated that this substrate 200 is formed with circuit (not shown) and connects purpose to realize set circuit.
In this at least one optoelectronic wafers 300 is contained in this third through-hole 222 and be arranged on this ground floor 210.This is at least
One optoelectronic wafers 300 can be laser diode wafer or photo diode wafer.In present embodiment, this at least one photoelectricity is brilliant
Sheet 300 includes a laser diode wafer and the photo diode wafer being set up in parallel.
In this at least one wire 400 is contained in this third through-hole 222 and this second through hole 232 and electrically connect in routing mode
Connect this at least one optoelectronic wafers 300 and this at least one weld pad 224.In present embodiment, this at least one wire 400 uses gold thread,
And each optoelectronic wafers 300 is connected to the weld pad 224 of correspondence.
This lens element 500 is contained in this first through hole 242, be arranged in this third layer 230 and close this second leads to
Hole 232, this lens element 500 includes that a light guide structure 510 and at least is formed at this lens element 500 outer surface and by being somebody's turn to do
Light guide structure 510 and the lens 520 of this at least one optoelectronic wafers 300 optical coupling.In present embodiment, this lens element 500 is adopted
Make with transparent material, molded for example with transparent plastic.This lens element 500 includes that one is brilliant towards this at least one photoelectricity
The plane of incidence 530 of sheet 300 and one with this plane of incidence 530 exit facet connected vertically 540.These at least one lens 520 are formed at this
On exit facet 540.This light guide structure 510 be at least one be formed within this lens element 500 and with this plane of incidence 530 and should
Exit facet 540 all becomes the reflecting mirror 550 of 45 degree.
This at least one optical fiber 600 is the most right with these at least one lens 520 respectively.
In present embodiment, to should the quantity of at least one optoelectronic wafers 300, this at least one reflecting mirror 550, this at least one
The number of lens 520 and this at least one optical fiber 600 is two.
Due to use lower-cost routing mode connect this at least one optoelectronic wafers 300 to after this substrate 200 again with this
Circuit board 100 connects, so, it is possible to decrease cost.
In a word, those skilled in the art are it should be appreciated that above embodiment is intended merely to explanation originally
Invention, and it is not used as limitation of the invention, as long as within the spirit of the present invention, to above example institute
That makees suitably changes and changes all to fall within the scope of protection of present invention.
Claims (6)
1. joints of optical fibre, comprising: a circuit board, a substrate, at least one optoelectronic wafers, at least one wire, lens
Element and at least one optical fiber, it is characterised in that: a ground floor that this substrate includes stacking gradually on this circuit board, one second
Layer, a third layer and one the 4th layer, the 4th layer, this third layer and this second layer offer respectively coaxially, are interconnected and chi
Very little one first through hole, one second through hole and the third through-hole reduced successively, this ground floor be formed at least one with this circuit board
The pad being electrically connected with, what this second layer surface opposing with this ground floor was exposed to this second through hole is formed in part with at least one
Weld pad, this substrate also include at least one run through this ground floor and this second layer and be electrically connected with this at least one pad with this at least one
The via of weld pad；
Described at least one optoelectronic wafers is contained in this third through-hole and is arranged on this ground floor；
In described at least one wire is contained in this third through-hole and this second through hole and with routing mode be electrically connected with this at least one
Optoelectronic wafers and this at least one weld pad；
Described lens element is contained in this first through hole, is arranged in this third layer and closes this second through hole, this lens cells
Part include a light guide structure and at least be formed at this lens element outer surface and by this light guide structure respectively with this at least one
The lens of optoelectronic wafers optical coupling；
Described at least one optical fiber is the most right with these at least one lens.
2. the joints of optical fibre as claimed in claim 1, it is characterised in that this circuit board includes an end face, and on this end face
It is formed with at least one welded disc being electrically connected with this at least one pad.
3. the joints of optical fibre as claimed in claim 1, it is characterised in that this substrate is ceramic bases.
4. the joints of optical fibre as claimed in claim 1, it is characterised in that this photoelectric cell is laser diode wafer or photoelectricity
Diode wafer.
5. the joints of optical fibre as claimed in claim 1, it is characterised in that this wire is gold thread.
6. the joints of optical fibre as claimed in claim 1, it is characterised in that this lens element includes towards this at least one photoelectricity
The plane of incidence of wafer and one with this plane of incidence exit facet connected vertically；This at least one lens forming is on this exit facet；This is led
Photo structure is at least one to be formed within this lens element and all become the reflecting mirror of 45 degree with this plane of incidence and this exit facet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310037822.2A CN103969761B (en) | 2013-01-31 | 2013-01-31 | The joints of optical fibre |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310037822.2A CN103969761B (en) | 2013-01-31 | 2013-01-31 | The joints of optical fibre |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103969761A CN103969761A (en) | 2014-08-06 |
| CN103969761B true CN103969761B (en) | 2016-12-28 |
Family
ID=51239471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310037822.2A Expired - Fee Related CN103969761B (en) | 2013-01-31 | 2013-01-31 | The joints of optical fibre |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103969761B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4732446A (en) * | 1985-10-02 | 1988-03-22 | Lamar Gipson | Electrical circuit and optical data buss |
| US6595700B2 (en) * | 2000-04-04 | 2003-07-22 | Shipley Company, L.L.C. | Optoelectronic packages having insulation layers |
| US6821027B2 (en) * | 2000-10-16 | 2004-11-23 | Opti Japan Corporation | Miniaturized parallel optical transmitter and receiver module |
| US6998691B2 (en) * | 2003-09-19 | 2006-02-14 | Agilent Technologies, Inc. | Optoelectronic device packaging with hermetically sealed cavity and integrated optical element |
-
2013
- 2013-01-31 CN CN201310037822.2A patent/CN103969761B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN103969761A (en) | 2014-08-06 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161228 Termination date: 20180131 |
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| CF01 | Termination of patent right due to non-payment of annual fee |