CN103969220A - Method for detecting dynamic optical properties of UV (Ultraviolet) glue in curing process - Google Patents

Method for detecting dynamic optical properties of UV (Ultraviolet) glue in curing process Download PDF

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Publication number
CN103969220A
CN103969220A CN201410212899.3A CN201410212899A CN103969220A CN 103969220 A CN103969220 A CN 103969220A CN 201410212899 A CN201410212899 A CN 201410212899A CN 103969220 A CN103969220 A CN 103969220A
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glue
waveguide
noble metal
metal film
laser
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CN201410212899.3A
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CN103969220B (en
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李大海
张�浩
徐敏
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Fudan University
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Fudan University
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Abstract

The invention belongs to an optoelectronic device and the technical field of manufacturing and particularly relates to a method for detecting dynamic optical properties of UV (Ultraviolet) glue in a curing process. The method comprises the following steps: preparing a mini-type waveguide cavity and pouring the UV glue into the mini-type waveguide cavity; connecting two glass sheets plated with a noble metal thin film on one side with the waveguide cavity to form a double-faced metal covered waveguide with a waveguide structure; establishing an incident light path; curing by a UV lamp on one side; detecting the transmission of laser in the waveguide structure and the lateral displacement of laser which is completely reflected in real time by utilizing a position sensitive detector; reversely deducing the dynamic change of dielectric constants of the UV glue at the lateral displacement part which is greatly enhanced when the laser is transmitted in the waveguide structure and generates a guided mode through a mode sequence number corresponding to a sharp peak of the lateral displacement, a known incident angle and a mode intrinsic equation of the waveguide structure; then calculating to obtain the dynamic change of the refractive index of the UV glue. The method has the advantages of simplicity and effectiveness.

Description

A kind of method that detects UV glue curing process dynamics optical characteristics
Technical field
The invention belongs to optoelectronic device design and manufacturing technology field, be specifically related to a kind of method of the UV of detection glue curing process dynamics characteristic.
Background technology
Along with the fast development of microelectric technique, the integrated level of integrated chip is more and more higher, and its characteristic line breadth is more and more less, and what the preparation of traditional semiconductor technology approached nano-precision receives that microcomponent difficulty is increasing, cost is more and more higher.The nanometer embossing that the mid-90 occurs, need to and not carry out electron beam exposure by various expensive complicated optical systems, copies at an easy rate high precision on large area wafer repeat, prepare in enormous quantities various nano graph structures by precision.In recent years, the optics of having prepared various superior performances based on ultraviolet solidified nano stamping technique was received microscale components and parts, such as sub-wave length grating wave filter, polarizer, optics integrated chip etc.
In ultraviolet solidified nano stamping technique, solidified glue is to prepare the core material that components and parts adopt, and the mechanics in its forming process, the differentiation of optical characteristics, have decisive influence to the usability of the element including optical homogeneity.Therefore the dynamic quantization that optical properties of material in the solidification process, solidified glue being launched under varying strength UV-irradiation (being mainly refractive index) develops detects significant.
The solidified glue that adopted in the market, its variations in refractive index before and after solidifying is less, and due to the introducing of ultraviolet source, makes traditional Ellipsometric be difficult to this type of measurement task, need to be by optical principle, independently measure optical design and build.
Summary of the invention
For above-mentioned problems of the prior art, the present invention adopts double-sided metal to be coated waveguiding structure, and the laser reflection light lateral shift during by mensuration incident light generation total reflection excitation wave waveguide mode, surveys UV glue curing process dynamics optical characteristics.Its method is simply effective.
The coated waveguiding structure of double-sided metal is a kind of optical waveguide structure of specific type.Compared with traditional Medium Wave Guide structure, it is stronger to the restriction ability of electromagnetic field, and the effective refractive index scope of guided mode is larger, can start from scratch, like this, need not be by means of the coupled apparatus such as prism or grating, just can be by energy of electromagnetic field coupled into waveguide from free space.In the time that the thickness of the coated waveguide ducting layer of double-sided metal reaches submillimeter yardstick, waveguide can be held thousands of guided modes, while using free space coupling, if incident angle is larger, the mode density in waveguide is quite large, attenuated total reflection (Attenuated Total Reflecton, ATR) the mutual crossover of total reflection absorption peak of spectrum, cannot differentiate, and hour can inspire a series of discrete guided modes, i.e. Ultra-High Order guided mode when incident angle.The coated waveguide of double-sided metal has the Gu Sihanxin effect of enhancing near attenuated total reflection peak, and the Gu Sihanxin displacement of generation can reach even millimeter magnitude of hundreds of micron.
In the present invention, we are using the waveguide cavity of placing sample as ducting layer, light wave is propagated in ducting layer with oscillating field form, the concentration of energy of light wave here, very strong with the interaction of ducting layer medium, strengthen GH displacement by strengthening incident optical energy in sensitive zones like this, improved the sensitivity of surveying.
Technical scheme of the present invention specifically describes as follows.
Detect a method for UV glue curing process dynamics optical characteristics, it adopts the coated waveguiding structure waveguide of double-sided metal to detect, and specifically comprises the following steps:
Step a. adopts magnetron sputtering method on two blocks of glass sheet, to plate respectively the different noble metal film of thickness;
Step b. adopts photoetching method on thicker noble metal film, to make the fence of submillimeter yardstick, as waveguide cavity;
Step c is cleaned above-mentioned device with alcohol, after drying, UV glue is injected to waveguide cavity, the glass sheet of coated thinner noble metal film is covered in waveguide cavity, the noble metal film contact UV glue of upper glass plate, the coated waveguiding structure waveguide of double-sided metal that formation waveguide cavity is ducting layer;
Steps d. adopt fixture that above-mentioned waveguiding structure is fixed;
Step e. collimates laser beam, with angle incide on upper glass plate, allow upper strata glass and noble metal film interface, upper strata that total reflection occurs, the catoptrical position of laser beam is surveyed and is received with Position-Sensitive Detector;
Step f. incides width of light beam the UV glue of waveguide cavity from below less times greater than the UV light of fence size, and its intensity is according to modulating the set time of curing glue;
Step g. regulate light path, the laser vertical that makes to reflect in the time that the upper strata glass of the coated waveguide of double-sided metal, with noble metal film interface, upper strata, total reflection occurs incides Position-Sensitive Detector pops one's head in, the position coordinates of laser reflection light in real-time detection UV glue curing process, calculate the hot spot of variation and the distance of its initial position, initial position is flare present position while not producing guided mode before solidifying;
Lateral shift place that step h. strengthens when total reflection occurring in waveguiding structure according to laser beam and producing guided mode greatly, i.e. there is the pattern ordinal number that sharp peak place is corresponding, known incident angle in lateral shift , the specific inductive capacity of noble metal film and glass, the pattern eigen[value of waveguide, the counter dynamic change of releasing UV glue specific inductive capacity, and then calculate the dynamic change that obtains UV glue refractive index.
In above-mentioned steps e, first send incipient beam of light by He-Ne laser instrument, incipient beam of light becomes TE or TM light beam after by a polarizing prism afterwards, then exports after spatial filtering filtering high order component, finally incides on upper glass plate.
In above-mentioned steps e, during with laser beam incident, first by matlab simulation calculation, obtain in UV glue curing process, observing the angle of multiple lateral shift sharp peak theoretical value, then carry out angle scanning among a small circle near theoretical value, selected by Position-Sensitive Detector result.
In above-mentioned steps h, during with laser beam incident, the dynamic change of UV glue specific inductive capacity calculates by the pattern eigen[value of waveguide, and pattern eigen[value is for ducting layer is perpendicular to the propagation constant of noble metal film direction, d is ducting layer thickness, and m is pattern ordinal number, phase shift while there is total reflection for laser in ducting layer and noble metal film interface.
The present invention first prepares composite waveguide structure, UV glue to be measured is put to waveguide cavity, use laser alignment light beam to incide upper surface, at UV glue internal excitation waveguide mode, what thereby the energy that causes incident light was more is transferred in waveguide mode by evanescent wave, while causing total reflection, lateral shift strengthens greatly, therefore can on PSD, obtain the reading in error range.Simultaneously because the factors such as lateral shift and incident light wavelength, angle are relevant, need to design corresponding waveguiding structure, make can excite multiple waveguide modes in UV glue curing process, thereby can on PSD, observe the sharp peak of multiple lateral shifts, then utilize corresponding pattern ordinal number, and known incident angle, the specific inductive capacity of noble metal film and glass, the pattern eigen[value of waveguide, the anti-dynamic change of releasing UV glue specific inductive capacity, just can calculate the dynamic change that obtains UV glue refractive index subsequently.The inventive method is simple, and that the process of dynamic change can occur is very effective for measuring refractive index.
Brief description of the drawings
Fig. 1 is optical path figure: 101 is He-Ne laser instrument, and 102 is polaroid, and 103,108 is variable circular hole diaphragm, and 104 is UV light, 105 is waveguide sample, and 106 is optical synchronous tracking table, and 107 is sample stage, 109 is PSD probe, and 110 is PSD, and 111 is computing machine.
Fig. 2 is the schematic diagram of waveguiding structure of the present invention: 201 is waveguide cavity, and 202 is upper strata metal silverskin, and 203 is upper strata glass, and 204 is lower metal silverskin, and 205 is lower floor's glass.
Fig. 3 is the lateral shift that embodiment 1 emulation obtains with incident light incident angle graph of a relation.
Fig. 4 is the Gu Sihanxin displacement that obtains of embodiment 2 emulation and the graph of a relation of ducting layer specific inductive capacity.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention will be further described.
Embodiment 1
Step a. waveguiding structure is shown in Fig. 2, adopting magnetically controlled sputter method is 30mm at radius, thickness is 1mm, surfaceness is on other lower floor's glass 205 of wavelength level, to make the lower metal silverskin 204 that thickness is 500nm, makes the upper strata metal silverskin 202 that thickness is 40nm in identical upper strata glass 203 substrates of another block size;
It is highly the fence of 200 microns that step b. adopts photoetching method to make on lower metal silverskin 204, as waveguide cavity 201;
Step c is cleaned two devices with alcohol, after drying, quantitative UV glue is poured in waveguide cavity 201, and upper strata glass 203 is covered to waveguide cavity 201, and ensures that upper strata metal silverskin 202 contacts UV glue, covers the generation of carefully avoiding bubble in process;
Steps d. adopt fixture that two glass plates are fixed;
Step e. optical path is shown in Fig. 1, and the laser that He-Ne laser instrument 101 sends becomes TE or TM light beam after polaroid 102, then exports after the first adjustable circular hole diaphragm 103 spatial filtering filtering high order components, incides on waveguide sample 105; UV light 104 incides on waveguide sample and is cured; Optical synchronous tracking table 106 and sample stage 107, by computing machine 111 programming Control, conveniently carry out angle scanning; The second adjustable circular hole diaphragm 108 is selected the reflection light point needing.
He-Ne laser instrument 101 corresponding wavelength , after collimation, incide on upper strata glass 203, allow upper strata glass 203 and upper strata metal silverskin 202 interfaces that total reflection occurs, adopt PSD probe 109 to receive catoptrical position;
Step f. will measure lateral shift with incident light incident angle graph of a relation, need to change the size of incident angle, all the other parameters are constant, therefore close UV lamp, ducting layer UV glue does not solidify, its specific inductive capacity immobilize into ;
Step g. survey vertical incidence to the variation relation of the flare position coordinates of popping one's head on PSD109 with incident angle with PSD 110, calculate the hot spot and the distance of initial position that change, initial position flare present position when not producing guided mode before curing;
Below step h., utilize matlab to carry out emulation, each parameter is: ducting layer 201 thickness d=200 μ m, refractive index , corresponding specific inductive capacity ; The specific inductive capacity at upper strata metal silverskin 202 and lower metal silverskin 204 corresponding wavelength 632.8nm places , upper strata metal silverskin 202 thickness h=40nm; Glass refraction , specific inductive capacity ;
Step I. calculate and find that this waveguide can produce 951 guided modes under TM pattern,, from 0 Mo Dao950 rank, rank mould, pattern ordinal number m maximum can be 950.Known mode exponent number is larger, corresponding angle (angle in ducting layer) and (airborne incident angle) is less, can select m=945, when time, calculate corresponding , .Meanwhile, in order to make incident light produce total reflection at upper strata metal silverskin 202 with glass interface place, θ should be not less than .Consider after above factor, make GH displacement and incident angle θ relation as shown in Figure 3, can find, while producing guided mode in waveguide, the GH displacement of glass and silverskin interface, upper strata is had to obvious humidification.
Embodiment 2
Step a. waveguiding structure is shown in Fig. 3, adopting magnetically controlled sputter method is 30mm at radius, thickness is 1mm, surfaceness is on other lower floor's glass 205 of wavelength level, to make the lower metal silverskin 204 that thickness is 500nm, makes the upper strata metal silverskin 202 that thickness is 40nm in identical upper strata glass 203 substrates of another block size;
It is highly the fence of 200 microns that step b. adopts photoetching method to make on lower metal silverskin 204, as waveguide cavity 201;
Step c is cleaned two devices with alcohol, after drying, quantitative UV glue is poured in waveguide cavity 201, and upper strata glass 203 is covered to waveguide cavity 201, and ensures that upper strata metal silverskin 202 contacts UV glue, covers the generation of carefully avoiding bubble in process;
Steps d. adopt fixture that two glass plates are fixed;
Step e. optical path is shown in Fig. 1, He-Ne laser instrument 101 corresponding wavelength , through collimation after with angle incide on upper strata glass 203, allow upper strata glass 203 and upper strata metal silverskin 202 interfaces that total reflection occurs, adopt PSD probe 109 to receive catoptrical position;
Step f. incides width of light beam the UV glue of waveguide cavity 201 from below less times greater than the UV light of fence size, and its intensity is according to modulating the set time of curing glue;
Step g. on PSD 110, survey vertical incidence to the variation that the flare position coordinates on PSD probe 109 carries out with solidification process, calculate the hot spot of variation and the distance of initial position, initial position is flare present position while not producing guided mode before solidifying;
Below step h., utilize matlab to carry out emulation, waveguiding structure parameter is with embodiment 1;
Step I. measure lateral shift with ducting layer specific inductive capacity graph of a relation, need to first study this waveguiding structure before and after solidifying be changed to angle corresponding to different mode ordinal number m 2.3134 processes from 2.2620, shown in being listed as follows.
Incident angle in step j. fixed air , along with the carrying out of solidification process, we by PSD110 can successively observe start from m=941 after the GH displacement peak of multiple enhancings, i.e. the sharp peak of lateral shift, just can carry out the calculating of the ducting layer specific inductive capacity that each peak is corresponding subsequently.Below to each pattern at fixing incident angle the lower ducting layer specific inductive capacity of correspondence respectively calculates, and the results are shown in following table.
m 941 942 943 944 945 946 947 948 949 950
2.2665 2.2712 2.2760 2.2807 2.2854 2.2901 2.2949 2.2996 2.3044 2.3091
Step k. makes GH displacement and ducting layer specific inductive capacity relation as shown in Figure 4.

Claims (4)

1. a method that detects UV glue curing process dynamics optical characteristics, is characterized in that, it adopts double-sided metal coated
Waveguiding structure waveguide detects, and specifically comprises the following steps:
Step a. adopts magnetron sputtering method on two blocks of glass sheet, to plate respectively the different noble metal film of thickness;
Step b. adopts photoetching method on thicker noble metal film, to make the fence of submillimeter yardstick, as waveguide cavity;
Step c is cleaned above-mentioned device with alcohol, after drying, UV glue is injected to waveguide cavity, the glass sheet of coated thinner noble metal film is covered in waveguide cavity, the noble metal film contact UV glue of upper glass plate, the coated waveguiding structure waveguide of double-sided metal that formation waveguide cavity is ducting layer;
Steps d. adopt fixture that above-mentioned waveguiding structure is fixed;
Step e. collimates laser beam, incides on upper glass plate with angle q, allows upper strata glass and noble metal film interface, upper strata that total reflection occurs, and the catoptrical position of laser beam is surveyed and received with Position-Sensitive Detector;
Step f. incides width of light beam the UV glue of waveguide cavity from below less times greater than the UV light of fence size, and its intensity is according to modulating the set time of curing glue;
Step g. regulate light path, the laser vertical that makes to reflect in the time that the upper strata glass of the coated waveguide of double-sided metal, with noble metal film interface, upper strata, total reflection occurs incides Position-Sensitive Detector pops one's head in, the position coordinates of laser reflection light in real-time detection UV glue curing process, calculate the hot spot of variation and the distance of its initial position, initial position is flare present position while not producing guided mode before solidifying;
There is according to lateral shift the pattern ordinal number that sharp peak place is corresponding in step h., known incident angle q, the specific inductive capacity of noble metal film and glass, the pattern eigen[value of waveguide, the anti-dynamic change of releasing UV glue specific inductive capacity, and then calculate the dynamic change that obtains UV glue refractive index.
2. method according to claim 1, it is characterized in that: in step e, first send incipient beam of light by He-Ne laser instrument, incipient beam of light becomes TE or TM light beam after by a polaroid afterwards, after spatial filtering filtering high order component, export again, finally incide on upper glass plate.
3. method according to claim 1, it is characterized in that, in step e, during with laser beam incident, first by matlab simulation calculation, obtain in UV glue curing process, observing the theoretical value of the angle q of multiple lateral shift sharp peak, then carry out angle scanning among a small circle near theoretical value, selected by Position-Sensitive Detector result.
4. method according to claim 1, is characterized in that: in step h, and during with laser beam incident, UV glue
The dynamic change of specific inductive capacity calculates by the pattern eigen[value of waveguide, and pattern eigen[value is , for ducting layer is perpendicular to the propagation constant of noble metal film direction, d is ducting layer thickness, and m is pattern ordinal number, phase shift while there is total reflection for laser in ducting layer and noble metal film interface.
CN201410212899.3A 2014-05-20 2014-05-20 A kind of method detecting UV glue curing process dynamics optical characteristics Expired - Fee Related CN103969220B (en)

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CN104677315A (en) * 2015-03-05 2015-06-03 上海光刻电子科技有限公司 Measuring method of surface roughness of silicon wafers
CN110737046A (en) * 2019-11-21 2020-01-31 南通大学 light trap for manipulating silica microspheres

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CN104677315A (en) * 2015-03-05 2015-06-03 上海光刻电子科技有限公司 Measuring method of surface roughness of silicon wafers
CN110737046A (en) * 2019-11-21 2020-01-31 南通大学 light trap for manipulating silica microspheres

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