CN103963389B - Flexible membrane chip ceramic material and preparation method thereof - Google Patents
Flexible membrane chip ceramic material and preparation method thereof Download PDFInfo
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- CN103963389B CN103963389B CN201410182764.7A CN201410182764A CN103963389B CN 103963389 B CN103963389 B CN 103963389B CN 201410182764 A CN201410182764 A CN 201410182764A CN 103963389 B CN103963389 B CN 103963389B
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Abstract
The invention discloses a kind of flexible membrane chip ceramic material and preparation method thereof, described flexible membrane chip ceramic material comprise ceramic material layer and be fitted in ceramic material layer at least one side on flexible support diaphragm, described ceramic material layer is made up of the potsherd of size uniform, queueing discipline; The step of described preparation method is: 1) preparation is printed on the ceramic post sintering sheet of latticed groove; 2) at least one side of ceramic post sintering sheet is fitted with the flexible support diaphragm with binding agent; 3) the ceramic post sintering sheet being fitted with flexible support diaphragm exerted pressure or bent, making it split along groove lines and become the potsherd of size uniform, queueing discipline, obtaining flexible membrane chip ceramic material.Compared with prior art, the ceramic material layer fragment that the present invention obtains neatly ensure that the good pliability of flexible membrane chip ceramic material because of size uniform, section, makes it can bend to any direction, also effectively improves the physical property of product simultaneously.
Description
Technical field
The invention belongs to ceramic material field, more particularly, the present invention relates to a kind of flexible membrane chip ceramic material and preparation method thereof.
Background technology
Ceramic material is the class Inorganic Non-metallic Materials made through shaping and high temperature sintering with natural or synthesis compound, and it has the advantages such as high-melting-point, high rigidity, high-wearing feature, resistance to oxidation, and purposes widely.But, the hardness of ceramic material is very high, to be often difficult in satisfied reality some application to its flexible demand, such as: the application of ferrite sintered body in NFC field, due to the encapsulation condition of NFC device, need the characteristic that ferrite diaphragm has flexible, easy cutting, should not rupture.In order to solve the problem, the method adopted at present sticks one deck in the one side of ceramic post sintering sheet to have flexible film, and then carry out bending or extruding to ceramic material layer and make it be fragmented into a lot of fractionlets; Certain one side due to ceramic material layer is connected to one deck flexible film, therefore ceramic material fragment can not drop, so just make the flexible membrane that can bend because comprising a lot of small ceramic material fragments, thus solve the flexibility problems of diaphragm type ceramic material.
At present, conventional ceramic material layer breaking method is calendering crush method, and the method ferrite diaphragm is regulated between the stack of spacing from two pass through, and utilizes the pressure effect between two rollers that ferrite diaphragm is fragmented into some fractionlets.But, use the ferrite fragment very irregular that calendering crush method is fragmented into, often not of uniform size, different, cause the physical property of the flexible ferrite diaphragm obtained and result of use all to receive impact.
In view of this, necessary flexible membrane chip ceramic material providing a kind of fragment evenly regular and preparation method thereof.
Summary of the invention
The object of the invention is to: flexible membrane chip ceramic material providing a kind of fragment evenly regular and preparation method thereof, to improve physical property and the result of use of flexible membrane chip ceramic material.
In order to realize foregoing invention object, the invention provides a kind of preparation method of flexible membrane chip ceramic material, it comprises the following steps:
1) preparation is printed on the ceramic post sintering sheet of latticed groove;
2) at least one side of ceramic post sintering sheet is fitted with the flexible support diaphragm with binding agent;
3) the ceramic post sintering sheet being fitted with flexible support diaphragm exerted pressure or bent, making it split along groove lines and become the potsherd of size uniform, queueing discipline, obtaining flexible membrane chip ceramic material.
One as the preparation method of flexible membrane chip ceramic material of the present invention is improved, described step 1) comprise the following steps:
1a) by formula modulation ceramic size;
1b) provide a kind of shaping mould with latticed projection, this step and step 1a) in no particular order;
1c) ceramic size modulated is coated on the shaping mould with latticed projection;
1d) drying of ceramic slurry and obtain the ceramic green sheet being printed on latticed groove;
1e) ceramic green sheet being printed on latticed groove is taken off from shaping mould, after firing, obtain the ceramic post sintering sheet being printed on latticed groove.
One as the preparation method of flexible membrane chip ceramic material of the present invention is improved, described step 1b) in latticed projection be the pattern intersected by the projection of some different directions; The width of wall scroll projection is 0.05mm ~ 0.3mm, is highly 0.1mm ~ 0.5mm.
One as the preparation method of flexible membrane chip ceramic material of the present invention is improved, described step 1b) in latticed projection on shaping mould be by some orthogonal lateral projection and longitudinally protruding rectangle of intersecting or square pattern; Parallel distance between any two adjacent transverse projections or between adjacent longitudinal projection is all 0.5mm ~ 5mm.
One as the preparation method of flexible membrane chip ceramic material of the present invention is improved, and lateral projection and the longitudinally protruding cross section of described shaping mould are inverted U-shaped or inverted V-shaped; Lateral projection and longitudinally projection can be elected as independently continuously at infall or disconnect; When having disconnection, disconnection spacing is 0.1mm ~ 0.5mm; Article two, when all disconnecting, the crossing center of leaving a blank because of disconnection is separately provided with the spike projection that a diameter is 0.1mm ~ 0.5mm.
One as the preparation method of flexible membrane chip ceramic material of the present invention is improved, described step 1c) in, the coating thickness of ceramic size on shaping mould is between 0.15mm ~ 0.8mm, and coating thickness 0.05mm ~ 0.2mm higher than the latticed projection on shaping mould.
One as the preparation method of flexible membrane chip ceramic material of the present invention is improved, described step 2) in, flexible support diaphragm be fitted in ceramic post sintering sheet without on groove surface.
In order to realize foregoing invention object, present invention also offers a kind of flexible membrane chip ceramic material, it comprise ceramic material layer and be fitted in ceramic material layer at least one side on flexible support diaphragm, described ceramic material layer is made up of the potsherd of size uniform, queueing discipline.
One as flexible membrane chip ceramic material of the present invention is improved, arbitrary length of side of described potsherd all between 0.5mm ~ 5mm, and on single fragment farthest the distance of point-to-point transmission be no more than 7.5mm; Potsherd is preferably rectangle or the square of length of side 0.5mm ~ 5mm.
One as flexible membrane chip ceramic material of the present invention is improved, and described ceramic material layer is formed through calendering or bending fragmentation by the ceramic post sintering sheet with latticed groove.
One as flexible membrane chip ceramic material of the present invention is improved, the latticed groove of described ceramic post sintering sheet by not in the same way grooves intersect formed, the width of each groove is 0.05mm ~ 0.3mm, and the degree of depth is 0.1mm ~ 0.5mm.
Compared with prior art, the ceramic material layer fragment that the present invention obtains neatly ensure that the good pliability of flexible membrane chip ceramic material because of size uniform, section, makes it can bend to any direction, also effectively improves the physical property of product simultaneously.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, flexible membrane chip ceramic material of the present invention, its preparation method and beneficial effect are described in detail.
The shaping moudle structure schematic diagram of Fig. 1 for using during preparation flexible membrane chip ceramic material of the present invention.
The protruding lines schematic diagram of difference that Fig. 2 to Fig. 5 is the shaping mould used when preparing flexible membrane chip ceramic material of the present invention.
Fig. 6 is the ceramic green sheet structural representation obtained in preparation flexible membrane chip ceramic material process of the present invention.
Fig. 7 be in preparation flexible membrane chip ceramic material process of the present invention the ceramic post sintering sheet that obtains and flexible support diaphragm in conjunction with schematic diagram
Fig. 8 to Fig. 9 is the different directions bending shape schematic diagram of flexible membrane chip ceramic material of the present invention.
Detailed description of the invention
The preparation method of flexible membrane chip ceramic material of the present invention comprises the following steps:
1) preparation is printed on the ceramic post sintering sheet of latticed groove, and its detailed process is:
1a) according to different ceramic material formulas, modulate ceramic size according to a certain percentage;
1b) provide a kind of shaping mould 10 with latticed projection; Refer to Fig. 1, described shaping mould 10 can be the Plastic such as cutting die or PET, PVC, PP, PE, PU fexible film, and the latticed lines on it is the pattern intersected by the projection of some different directions; Such as, by lateral projection 12 and longitudinally protruding 14 rectangles of intersecting or square pattern (namely lateral projection 12 is parallel to each other and spacing is equal, longitudinal projection 14 is parallel to each other and spacing is equal), the parallel distance wherein between any two adjacent transverse projections 12 or between adjacent longitudinal protruding 14 is all 0.5mm ~ 5mm; The width of every bar lateral projection 12 and longitudinally projection 14 is all 0.05mm ~ 0.3mm, is highly all 0.1mm ~ 0.5mm; In various embodiments, lateral projection 12 can be different with longitudinal shape of protruding 14 and interleaved mode, and such as: in the exemplary embodiment illustrated in fig. 2, lateral projection 12a is inverted U-shaped with the cross section of longitudinal protruding 14a; In the embodiment shown in fig. 3, lateral projection 12b is inverted V-shaped with the cross section of longitudinal protruding 14b; In Fig. 2 and Fig. 3 illustrated embodiment, lateral projection 12a, 12b and longitudinal protruding 14a, 14b are continuous print at infall, but in an embodiment shown in fig. 4, lateral projection 12c is disconnect at the infall with longitudinal protruding 14c, disconnects spacing and is preferably 0.1mm ~ 0.5mm; And in the embodiment illustrated in figure 5, lateral projection 12d is disconnect with longitudinal protruding 14d at infall, the crossing center of leaving a blank because lateral projection 12d disconnects with longitudinal protruding 14d is separately provided with a spike projection 16d, the diameter of the protruding 16d of spike is 0.1mm ~ 0.5mm, and itself and the spacing between lateral projection 12d and longitudinal protruding 14d are all 0.1mm ~ 0.5mm; Certainly, in various embodiments, pattern on shaping mould 10 also can be the waffle-like patterns such as the parallelogram intersected by some different directions projection, trapezoidal, triangle, as long as these patterns have certain rule, and arbitrary length of side of each grid all between 0.5mm ~ 5mm, farthest the distance of point-to-point transmission be no more than 7.5mm;
1c) be coated on the shaping mould 10 of latticed projection by the ceramic size modulated, coating layer thickness, and need 0.05mm ~ 0.2mm higher than the latticed projection of shaping mould 10 between 0.15mm ~ 0.8mm;
1d) refer to Fig. 6, shaping mould 10 horizontal positioned of ceramic size will be scribbled, make its natural drying or put into the baking box of less than 120 degrees Celsius dry, obtain the larger ceramic green sheet 20 of hardness, ceramic green sheet 20 is printed on and the latticed convex shape of shaping mould 10 and highly all identical latticed groove 22;
1e) ceramic green sheet 20 being printed on latticed groove 22 is taken off from shaping mould 10, and insert in sintering furnace and fire, according to different ceramic material formulas, sintering temperature is generally 800 ~ 1200 degrees Celsius, sintering time is 3 ~ 12 hours, solvent in ceramic green sheet 20 after sintering is discharged and hardness and density all increase, and becomes the ceramic post sintering sheet 30 (shown in Fig. 7) being printed on latticed groove 32;
2) refer to Fig. 7, from sintering furnace, take out ceramic post sintering sheet 30, by cover glue machine at ceramic post sintering sheet 30 without the flexible support diaphragm 40 of compound one deck on groove surface with binding agent 42, described flexible support diaphragm 40 is generally double faced adhesive tape;
3) Fig. 8 and Fig. 9 is referred to, the ceramic post sintering sheet 30 being fitted with flexible support diaphragm 40 is exerted pressure or bent, make it split along groove lines and become the little potsherd 34 of queueing discipline, owing to being connected with flexible support diaphragm 40, little potsherd 34 can not come off; Be flexible due to flexible support diaphragm 40 and be not easily torn, the ceramic material layer be therefore made up of some little potsherds 34 can bend and can not rupture, and has also just been prepared into flexible membrane chip ceramic material;
4) the flexible membrane chip ceramic material that above-mentioned steps is obtained is cut into undersized potsherd for subsequent use.
In order to make goal of the invention of the present invention, technical scheme and Advantageous Effects more clear, below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail, but, should be understood that, embodiments of the invention are only used to explain the present invention, be not intended to limit the present invention, and embodiments of the invention are not limited to the embodiment provided in description.
Embodiment 1
Preparation method of the present invention is utilized to prepare a kind of flexible sintered ferrite sheet:
Step one: by ferrite powder and bonding agent mix and blend, be modulated into slurry according to the ratio of weight ratio 75:25;
Step 2: prepare the PET film having latticed projection, its lateral projection is connected with longitudinally protruding infall; Lateral projection and longitudinally protruding cross section are all inverted U-shaped, and the width of all projections is all 0.05mm, is highly 0.1mm, and the parallel distance of two adjacent protrusion is all 1mm;
Step 3: be evenly coated in the PET film having latticed projection of step 2 preparation by ferrite slurry with coating machine, coating thickness is 0.15mm;
Step 4: by coating after PET film and ferrite coating horizontal positioned, ferrite coating under, PET film upper, natural drying 12 hours;
Step 5: PET film torn carefully, obtains the ferrite embryo sheet with latticed groove;
Step 6: ferrite embryo sheet is inserted sintering furnace, sinters 5 hours under 1000 DEG C of sintering temperatures;
Step 7: ferrite sintered is taken out from sintering furnace, be placed on plane operations platform, adopt laminating machine to be mounted by double faced adhesive tape and overlay on the ferrite sintered one side without groove, then the direction to double faced adhesive tape face bends ferrite sintered, bending radius is greater than 200mm, obtains flexible sintered ferrite sheet;
Step 8: flexible sintered ferrite sheet is cut into required size, for subsequent use.
By ferrite sintered of the flexibility obtained by above step, the fragment of its ferrite sintered lamella is that section is neat, the square fragment of 1mm*1mm of queueing discipline, and therefore full wafer pliability is good, can bend to any direction.
Embodiment 2
Preparation method of the present invention is utilized to prepare a kind of flexible small alumina sintering sheet:
Step one: by alumina powder and bonding agent mix and blend, be modulated into slurry according to the ratio of weight ratio 80:20;
Step 2: prepare the PP film having latticed projection, its lateral projection is being disconnect with longitudinally protruding infall, and disconnection spacing is 0.1mm; Lateral projection and longitudinally protruding cross section are all inverted V-shaped, and the width of all projections is all 0.1mm, is highly 0.15mm, and the parallel distance of two adjacent transverse projections is 1.5mm, and two adjacent longitudinally protruding parallel distances are 2.0mm;
Step 3: what alumina slurry is evenly coated in step 2 prepares with coating machine has on the PP film of latticed projection, and coating thickness is 0.2mm;
Step 4: by PP film and aluminum oxide coating layer horizontal positioned after coating, aluminum oxide coating layer under, PP film, upper, inserts drying box drying 5 hours;
Step 5: torn by PP film carefully, obtains the aluminium oxide embryo sheet with latticed groove;
Step 6: aluminium oxide embryo sheet is inserted sintering furnace, sinters 8 hours at 800 DEG C;
Step 7: alumina sintering sheet is taken out from sintering furnace, mount in the one side without groove and cover double faced adhesive tape, then be placed on plane operations platform, adopt calender roll-in, alumina sintering sheet is cracked and be prepared into the small alumina sintering sheet of 1.5mmx2.0mm along groove.
Neat by the alumina sintering sheet section obtained by above step, full wafer pliability is good, capable of being bent in any direction.
Embodiment 3
Preparation method of the present invention is utilized to prepare a kind of responsive to temperature potsherd:
Step one: by Mn
3o
4, Co
3o
4, Fe
2o
3, NiO mixed metal oxide powders and bonding agent mix and blend, be modulated into ceramic size according to the ratio of weight ratio 78.5:21.5;
Step 2: prepare the PVC film having latticed projection, its lateral projection and longitudinal projection are all disconnect at infall, and lateral projection and longitudinally protruding infall have a spike projection, and disconnection spacing is 0.15mm; Lateral projection and longitudinally protruding cross section are all inverted V-shaped, and the width of all projections is all 0.15mm, is highly 0.2mm, and the parallel distance of two adjacent protrusion is all 4.0mm; The diameter of spike projection is 0.15mm;
Step 3: be evenly coated in the PVC film having latticed projection of step 2 preparation by ceramic size with coating machine, coating thickness is 0.4mm;
Step 4: by PVC film and ceramic coating horizontal positioned after coating, ceramic coating under, PVC film, upper, inserts drying box drying 5 hours;
Step 5: PVC film torn carefully, obtains the ceramic green sheet with latticed groove;
Step 6: ceramic green sheet is inserted sintering furnace, sinters 8 hours at 1200 DEG C;
Step 7: ceramic post sintering sheet is taken out from sintering furnace, be placed on plane operations platform, mount in the one side without groove and cover double faced adhesive tape, then adopt calender roll-in, make ceramic post sintering sheet cracked and be prepared into the small diaphragm type responsive to temperature potsherd of 4.0mmx4.0mm along groove.
Neat by the responsive to temperature ceramic post sintering sheet section obtained by above step, full wafer pliability is good, capable of being bent in any direction.
Known by describing above, the preparation method of flexible membrane chip ceramic material of the present invention has that step is simple, device requirement is few, preparation efficiency is high, volume production feasibility advantages of higher, therefore, it is possible to effectively improve yield rate, and reduces production cost; And, adopt the ceramic material layer fragment that obtains of the method to have the neat advantage of size uniform, section, which ensure that flexible membrane chip ceramic material pliability is good and can bend to any direction, also effectively improve the physical property of product simultaneously.
The announcement of book and instruction according to the above description, those skilled in the art in the invention can also carry out suitable change and amendment to above-mentioned embodiment.Therefore, the present invention is not limited to detailed description of the invention disclosed and described above, also should fall in the protection domain of claim of the present invention modifications and changes more of the present invention.In addition, although employ some specific terms in this description, these terms just for convenience of description, do not form any restriction to the present invention.
Claims (3)
1. a preparation method for flexible membrane chip ceramic material, is characterized in that comprising the following steps:
1) preparation is printed on the ceramic post sintering sheet of latticed groove, specifically comprises: 1a) by formula modulation ceramic size, 1b) provide a kind of shaping mould with latticed projection, this step and step 1a) in no particular order, wherein, latticed projection on shaping mould is the rectangle or square pattern of being intersected by some orthogonal lateral projection and longitudinal projection, parallel distance between any two adjacent transverse projections or between adjacent longitudinal projection is all 0.5mm ~ 5mm, lateral projection and the longitudinally protruding cross section of described shaping mould are inverted U-shaped or inverted V-shaped, lateral projection and longitudinally projection disconnect at infall, disconnection spacing is 0.1mm ~ 0.5mm, the crossing center of leaving a blank because of disconnection is separately provided with the spike projection that a diameter is 0.1mm ~ 0.5mm, 1c) ceramic size modulated is coated on the shaping mould with latticed projection, 1d) drying of ceramic slurry and obtain the ceramic green sheet being printed on latticed groove, 1e) ceramic green sheet being printed on latticed groove is taken off from shaping mould, after firing, obtain the ceramic post sintering sheet being printed on latticed groove,
2) at least one side of ceramic post sintering sheet is fitted with the flexible support diaphragm with binding agent;
3) the ceramic post sintering sheet being fitted with flexible support diaphragm exerted pressure or bent, making it split along groove lines and become the potsherd of size uniform, queueing discipline, obtaining flexible membrane chip ceramic material.
2. the preparation method of flexible membrane chip ceramic material according to claim 1, it is characterized in that: described step 1c) in, the coating thickness of ceramic size on shaping mould is between 0.15mm ~ 0.8mm, and coating thickness 0.05mm ~ 0.2mm higher than the latticed projection on shaping mould.
3. a flexible membrane chip ceramic material, it comprise ceramic material layer and be fitted in ceramic material layer at least one side on flexible support diaphragm, ceramic material layer is made up of the potsherd of size uniform, queueing discipline, it is characterized in that: described flexible membrane chip ceramic material is by the preparation method's preparation described in claim 1 or 2.
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| KR101732944B1 (en) * | 2015-11-11 | 2017-05-08 | 주식회사 이엠따블유 | Complex ferrite magnetic field shielding sheet, manufacturing method thereof, and antenna module using the same |
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Address after: 511356 No.4, Canghai 4th Road, Yonghe Economic Development Zone, Luogang District, Guangzhou City, Guangdong Province Patentee after: Guangzhou xinlaifu New Material Co.,Ltd. Address before: 511356 No.4, Canghai 4th Road, Yonghe Economic Development Zone, Luogang District, Guangzhou City, Guangdong Province Patentee before: Guangzhou Newlife Magnet Electricity Co.,Ltd. |
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