CN103961205A - Cold compress device for head-mounted miniature semiconductor physical cooling ice belt - Google Patents
Cold compress device for head-mounted miniature semiconductor physical cooling ice belt Download PDFInfo
- Publication number
- CN103961205A CN103961205A CN201310515750.8A CN201310515750A CN103961205A CN 103961205 A CN103961205 A CN 103961205A CN 201310515750 A CN201310515750 A CN 201310515750A CN 103961205 A CN103961205 A CN 103961205A
- Authority
- CN
- China
- Prior art keywords
- flexible glue
- cold compress
- compress device
- cold
- guide sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Thermotherapy And Cooling Therapy Devices (AREA)
Abstract
A cold compress device for a head-mounted miniature semiconductor physical cooling ice belt comprises two fixing belts, soft rubber, a cold transfer sheet, and a cold transfer plate. The cold compress device is characterized in that the cold transfer sheet is arranged on the cold transfer plate and is integrally connected therewith by screwing or riveting, the cold transfer sheet is a metal sheet with good heat conductivity and certain elasticity, the connected combination of the cold transfer plate and the cold transfer sheet is molded at the center of the soft rubber by plastic injection molding, only one side of the cold transfer plate is exposed after integral molding and is used for mounting an ice belt cooler to absorb heat from the cooling face of the cooler, the cold transfer sheet is completely covered in the soft rubber, and the fixing belts connected to the left and right sides of the soft rubber respectively are used for wearing. The cold compression effect of the cold compress device is significantly improved, and the cold compress device is more comfortable to wear.
Description
Technical field
The present invention relates to semiconductor refrigerating and medical instruments field, be especially a kind ofly worn on miniature Physical temperature-lowering ice band or the ice cap cold compress device that human body head utilizes semiconductor refrigerating.
Background technology
Being worn on the miniature Physical temperature-lowering ice band that human body head utilizes semiconductor refrigerating, is a kind of physical hypothermal device that human body head is used, has refrigeration and temperature control performance that is directly worn on itself.It,, for the human body Physical temperature-lowering of having a fever, is used for child colony conventionally.In the structure of this product, a cold compress device all can be set, with it, stick on human body head forehead place and carry out cold compress cooling.Because cold compress device is that contact human body head is used, it is again product function applying portion.So its is reasonable, whether comfortable, the result of use of ice carries product will directly be had influence on.Therefore, cold compress device is one and causes and close important parts in ice carries product.
Be worn on a human body head micro semiconductor Physical temperature-lowering ice band cold compress device, prior art, has two kinds: a kind of is the cold compress device that adopts water-bag type, and a kind of is the cold compress device of not being with water-bag type.The present invention be directed to the improvement project that cold compress device does not put forward with the miniature semiconductor Physical temperature-lowering ice band of water pocket.
Existingly without water pocket, decline in type Semiconductor Physics temperature-decreasing ice belt with cold compress device, its structure, the conduction cooling plate in ice band, cold compress device is just directly made after applying the thin cloth of one deck in surface, wherein conduction cooling plate, is aluminium section bar, adopts extrusion molding processes to form, for similar with human head shapes, shape is curved.The shortcoming of this cold compress device: first, conduction cooling plate is aluminum profile products, its arc size is to extrude just to shape changelessly, it cannot accomplish to vary with each individual to regulate its arc.By such structure, do cold compress device, cold compress effect can be very poor.Secondly, use so aluminum products, only on its surface, apply the thin cloth of one deck, be just used for direct cold compress to forehead, be bound to allow people feel very uncomfortable, have a kind of very stiff sensation.Therefore, prior art, is very unscientific, and it can have a strong impact on application and the market of this technology and popularize.
Summary of the invention
The object of the invention: be in order to overcome the existing above-mentioned cold compress weak effect of prior art, to wear uncomfortable defect again.Invent a kind of Novel cold coating apparatus, this cold compress device, the arc size of its cold compress part can regulate arbitrarily, is applicable to different human body and uses, and cold compress effect can obviously improve, and its cold compress part, adopts flexible glue and skin of head to contact, and wearing can be very comfortable.By improvement of the present invention, will make whole ice band technology, aspect cold compress effect, practicality, comfortable wearing sense, obtain General Promotion, by contributing to, application and the market of its ice band technology are universal.
The technical scheme that the present invention takes is: a kind of human body head micro semiconductor Physical temperature-lowering ice band cold compress device that is worn on, it is comprised of fixing band, flexible glue, cool guide sheet, conduction cooling plate.It is characterized in that: on conduction cooling plate, an if cool guide sheet, between them, adopt screw to connect or riveting method links into an integrated entity, cool guide sheet is that heat conductivility is relatively good and have a certain elastic foil, the conduction cooling plate linking into an integrated entity and cool guide sheet molectron, by plastic injection-moulded technique, its note is central at flexible glue again, form after one, only have conduction cooling plate to expose outside a face, for cooling piece is installed, absorption refrigeration sheet huyashi-chuuka (cold chinese-style noodles) heat, cool guide sheet is all wrapped in flexible glue the inside; At fixing band of each side connection of flexible glue, for wearing.Adopting this design, on the one hand, as the part of cold compress, is all flexible glue, and contact skin can not allow people feel under the weather.On the other hand, what be wrapped in flexible glue the inside is to have certain elastic cool guide sheet, can be arbitrarily crooked, can do not used object to limit, for guaranteeing cold compress effect, the flexible glue thickness of parcel cool guide sheet is conventionally thinner, and the shape size of cool guide sheet can be designed to similar with flexible glue slightly smaller, even to guarantee flexible glue surface surrounding temperature.
On described conduction cooling plate, be provided with screw and be connected with the radiator screw on ice band.
On described cool guide sheet, be provided with a plurality of through holes, object is to allow the flexible glue of cool guide sheet both sides interconnect by these holes, and delamination appears in its both sides flexible glue when preventing flexural deformation.
On described flexible glue, be provided with blind hole, for slotting ice band temperature sensor.
The syndeton of described fixing band and flexible glue, they adopt the identical flexible glue plastics of fusing point, with high frequency, are welded.Material is generally TPU, TPE, EVA.
Described fixing band, it is banded that shape is, and is ice band; Shape is medicated cap shape, is ice cap.
Beneficial effect of the present invention: cold compress successful improves, wears more comfortable, and the serviceability of ice carries product is significantly improved thus, contributes to the market of its technology universal.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1, be organigram of the present invention.
Fig. 2, be that the present invention constructs exploded perspective view.
1. fixing bands in figure, 2. flexible glue, 2-1. blind hole, 3. cool guide sheet, 3-1. through hole, 3-2. through hole, 4. conduction cooling plate, 4-1. screw, 4-2. screw, 5. screw.
The specific embodiment
As shown in Figure 1, 2, a kind of human body head micro semiconductor Physical temperature-lowering ice band cold compress device that is worn on, it is comprised of fixing band 1, flexible glue 2, cool guide sheet 3, conduction cooling plate 4.It is characterized in that: on conduction cooling plate 4, an if cool guide sheet 3, between them, adopt screw 5 connections or riveting method to link into an integrated entity, cool guide sheet 3 is for heat conductivility is relatively good and have certain elastic foil, the conduction cooling plate 4 linking into an integrated entity and cool guide sheet 3 molectrons, by plastic injection-moulded technique, its is noted in flexible glue 2 central authorities again, form after one, only have conduction cooling plate 4 to expose outside a face, for ice band cooling piece is installed, absorption refrigeration sheet huyashi-chuuka (cold chinese-style noodles) heat, cool guide sheet 3 quilt is all wrapped in flexible glue 2 the insides; At fixing band 1 of each side connection of flexible glue 2, for wearing.Adopting this design, on the one hand, as the part of cold compress, is all flexible glue 2, and contact skin can not allow people feel under the weather.On the other hand, what be wrapped in flexible glue 2 the insides is to have certain elastic cool guide sheet 3, can be arbitrarily crooked, can do not used object to limit, for guaranteeing cold compress effect, flexible glue 2 thickness of parcel cool guide sheet 3 are conventionally thinner, and the shape size of cool guide sheet 3 can be designed to similar slightly smaller with flexible glue 2, even to guarantee the surperficial surrounding temperature of flexible glue 2.
As shown in Figure 2, on described conduction cooling plate 4, be provided with screw 4-1,4-2, be connected with the radiator screw on ice band with cool guide sheet 3 respectively.
As shown in Figure 2, on described cool guide sheet 3, be provided with a plurality of through hole 3-1, object is to allow the flexible glue 2 of cool guide sheet 3 both sides interconnect by these holes, and delamination appears in its both sides flexible glue 2 when preventing flexural deformation.Corresponding conduction cooling plate 4 screw 4-1 positions on cool guide sheet 3, are also provided with through hole 3-2 and are connected with conduction cooling plate 4 screws 5.
As shown in Figure 2, on described flexible glue 2, be provided with blind hole 2-1, for slotting ice band temperature sensor.
As shown in Figure 2, the syndeton of described fixing band 1 and flexible glue 2, they adopt the identical flexible glue plastics of fusing point, with high frequency, are welded.Material is generally TPU, TPE, EVA.
As shown in Figure 2, described fixing band 1, it is banded that shape is, and is ice band; Shape is medicated cap shape, is ice cap.
Claims (6)
1. be worn on a human body head micro semiconductor Physical temperature-lowering ice band cold compress device, it is comprised of fixing band, flexible glue, cool guide sheet, conduction cooling plate.It is characterized in that: on conduction cooling plate, establish a cool guide sheet, connect or be riveted into one between them by screw, cool guide sheet is that heat conductivility is relatively good and have certain elastic foil; The conduction cooling plate linking into an integrated entity and cool guide sheet molectron, then by plastic injection-moulded technique, its note is central at flexible glue, form after one, only have conduction cooling plate to expose outside a face, for ice band cooling piece is installed, absorption refrigeration sheet huyashi-chuuka (cold chinese-style noodles) heat, cool guide sheet is all wrapped in flexible glue the inside; In the left and right sides of flexible glue, each connects a fixing band, for wearing.
2. a kind of human body head micro semiconductor Physical temperature-lowering ice band cold compress device that is worn on according to claim 1.It is characterized in that: on described conduction cooling plate, be provided with screw and be connected with ice band radiator screw.
3. a kind of human body head micro semiconductor Physical temperature-lowering ice band cold compress device that is worn on according to claim 1.It is characterized in that: on described cool guide sheet, be provided with a plurality of through holes, object is to allow the flexible glue of cool guide sheet both sides interconnect by these through holes, there is delamination in its both sides flexible glue when preventing flexural deformation.
4. a kind of human body head micro semiconductor Physical temperature-lowering ice band cold compress device that is worn on according to claim 1.It is characterized in that: on described flexible glue, be provided with blind hole, for slotting temperature sensor.
5. a kind of human body head micro semiconductor Physical temperature-lowering ice band cold compress device that is worn on according to claim 1.It is characterized in that: the syndeton of described fixing band and flexible glue, they adopt the identical flexible glue plastics of fusing point, with high frequency, are welded.
6. a kind of human body head micro semiconductor Physical temperature-lowering ice band cold compress device that is worn on according to claim 1.It is characterized in that: described fixing band, it is banded that shape is, and is ice band; Shape is medicated cap shape, is ice cap.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310515750.8A CN103961205A (en) | 2013-10-25 | 2013-10-25 | Cold compress device for head-mounted miniature semiconductor physical cooling ice belt |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310515750.8A CN103961205A (en) | 2013-10-25 | 2013-10-25 | Cold compress device for head-mounted miniature semiconductor physical cooling ice belt |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103961205A true CN103961205A (en) | 2014-08-06 |
Family
ID=51231540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310515750.8A Pending CN103961205A (en) | 2013-10-25 | 2013-10-25 | Cold compress device for head-mounted miniature semiconductor physical cooling ice belt |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103961205A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015058605A1 (en) * | 2013-10-21 | 2015-04-30 | 深圳天赋健医疗器械科技有限公司 | Anhydrous capsule miniature semiconductor physical cooling ice belt worn on human head |
CN110495987A (en) * | 2018-05-17 | 2019-11-26 | 深圳天赋健医疗器械科技有限公司 | A kind of Worn type physical cooling instrument host refrigeration module |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2187448Y (en) * | 1993-12-14 | 1995-01-18 | 陕西省电力电子技术产业集团 | Semi-conductor cold compress band |
US20040059400A1 (en) * | 2002-09-25 | 2004-03-25 | Ray-Ming Lin | Electric fever relief device |
JP2005218811A (en) * | 2004-02-03 | 2005-08-18 | Satsuki Nagatomo | Head cooling hair band with storage space for cold insulator |
CN203089512U (en) * | 2013-01-25 | 2013-07-31 | 罗心悦 | Cartoon cap type physical cooling device |
CN203555876U (en) * | 2013-10-25 | 2014-04-23 | 深圳天赋健医疗器械科技有限公司 | Cold compression device for mini semiconductor physical cooling ice strip worn on human head |
CN103961204A (en) * | 2013-10-21 | 2014-08-06 | 深圳天赋健医疗器械科技有限公司 | Head-mounted no-bag miniature semiconductor physical cooling ice belt |
-
2013
- 2013-10-25 CN CN201310515750.8A patent/CN103961205A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2187448Y (en) * | 1993-12-14 | 1995-01-18 | 陕西省电力电子技术产业集团 | Semi-conductor cold compress band |
US20040059400A1 (en) * | 2002-09-25 | 2004-03-25 | Ray-Ming Lin | Electric fever relief device |
JP2005218811A (en) * | 2004-02-03 | 2005-08-18 | Satsuki Nagatomo | Head cooling hair band with storage space for cold insulator |
CN203089512U (en) * | 2013-01-25 | 2013-07-31 | 罗心悦 | Cartoon cap type physical cooling device |
CN103961204A (en) * | 2013-10-21 | 2014-08-06 | 深圳天赋健医疗器械科技有限公司 | Head-mounted no-bag miniature semiconductor physical cooling ice belt |
CN203555876U (en) * | 2013-10-25 | 2014-04-23 | 深圳天赋健医疗器械科技有限公司 | Cold compression device for mini semiconductor physical cooling ice strip worn on human head |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015058605A1 (en) * | 2013-10-21 | 2015-04-30 | 深圳天赋健医疗器械科技有限公司 | Anhydrous capsule miniature semiconductor physical cooling ice belt worn on human head |
CN110495987A (en) * | 2018-05-17 | 2019-11-26 | 深圳天赋健医疗器械科技有限公司 | A kind of Worn type physical cooling instrument host refrigeration module |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103961204A (en) | Head-mounted no-bag miniature semiconductor physical cooling ice belt | |
CN203647564U (en) | Water bag type micro semi-conductor cooling ice band worn at human head | |
CN104224429A (en) | Eye massager | |
CN103961205A (en) | Cold compress device for head-mounted miniature semiconductor physical cooling ice belt | |
CN103961210A (en) | Head-mounted bag-type miniature semiconductor cooling ice belt | |
CN203555876U (en) | Cold compression device for mini semiconductor physical cooling ice strip worn on human head | |
CN209547185U (en) | A kind of smartwatch of watchband heat preservation | |
CN109043691A (en) | A kind of rapid wearable device to cool down or heat GPS positioning | |
CN211381326U (en) | Health data thing networking monitoring devices | |
CN204379532U (en) | One is worn on human body head without water-bag type micro semiconductor Physical temperature-lowering ice bank | |
CN209405054U (en) | A kind of cold/hot dressing instrument massaged using cycle pulse water flow | |
CN206822773U (en) | A kind of special cold compress eyeshade of pouch | |
CN206214721U (en) | A kind of improved structure leads sweat headband | |
CN211674849U (en) | Wearable physical cooling instrument without water bag device | |
CN207783407U (en) | A kind of head-mounted display apparatus | |
CN104546278A (en) | Human head wearing physical cooling device ice belt | |
CN205491590U (en) | Help radiating digital equipment protection device | |
WO2020258923A1 (en) | Massager head | |
CN116035794A (en) | Heat conduction mode of wearable semiconductor refrigeration physical cooling instrument | |
CN210932187U (en) | Charging ice pack | |
CN208338176U (en) | A kind of wearable smart machine and its bandage | |
CN110755193A (en) | Eye cold and hot compress instrument universal for eyes and heads and adopting water bag applying mode | |
CN201216675Y (en) | Sport headband with refrigerating/heating function | |
CN205213016U (en) | Headset | |
CN204379525U (en) | One wears human body head micro semiconductor Physical temperature-lowering ice bank heat-pipe radiator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
DD01 | Delivery of document by public notice |
Addressee: The strong medical apparatus and instruments science and technology of Shenzhen talent company limited Document name: Notification that Application Deemed to be Withdrawn |
|
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140806 |