A kind of dipole dual polarization LTE broad-band antenna
Technical field
The present invention relates to a kind of LTE broad-band antenna, especially a kind of dipole dual polarization LTE broad-band antenna, belongs to wireless communication field.
Background technology
Developing rapidly of wireless communication technology, makes various electronic equipments all towards miniaturization and broadband development, and as wireless communication technology bridge and air interface, also inevitable towards this future development.Traditional antenna is to consist of a retaining element, and shielding is bad, and integrated level is not high, and size is large, and frequency band is narrower, and these factors have caused traditional antenna cannot meet following wireless communication needs.Therefore, the research of compact wideband antenna becomes an important problem.
Along with the development of broadband communication network technology, LTE technology 3G key one step of 4G process of marching toward especially now, LTE mobile communication technology is development trend in the future.But, the present large and complex structure of the size of broad-band antenna, this cost of manufacture for LTE antenna and utilization and extention are not ideal.
With understanding, disclosed prior art is as follows according to investigations:
The < < mobile communication > > of 16 phases in 2013, Xia little Yong becomes to deliver with Liao in the article that is entitled as " a kind of double-polarized printed dipole antenna for base station " and has proposed a kind of novel printed dipole antenna, because printed dipole antenna has thin profile, lightweight, volume is little, cost is low, it is integrated to be convenient to and form the advantages such as array and find broad application.This article adopts centre feed structure, regulates the size of the Ba Lun of feed, realizes spread bandwidth, and be applied in Bipolarization antenna for base station with this, and research shows that this dual polarized antenna has good electrical characteristics and pattern characteristics.But this prior art does not still solve the problems of the technologies described above.
Summary of the invention
The object of the invention is in order to solve the defect of above-mentioned prior art, a kind of dipole dual polarization LTE broad-band antenna is provided, this antenna has dipole and dual polarization characteristic, and easily processing, simple in structure, volume is little, cost is low, bandwidth, can be applied in the cellular base station of LTE of 1.61~2.8GHz.
Object of the present invention can be by taking following technical scheme to reach:
A kind of dipole dual polarization LTE broad-band antenna, the metal floor that comprises medium substrate and be positioned at medium substrate below, it is characterized in that: also comprise the first coaxial line, the second coaxial line, first signal metallic plate and secondary signal metallic plate, described first signal metallic plate and secondary signal metallic plate are uprightly arranged on medium substrate and are mutually vertical, and described the first coaxial line and the second coaxial line are parallel to each other; The inner wire of described the first coaxial line is connected with first signal metallic plate through after medium substrate, and outer conductor is close to medium substrate lower surface, and is connected with first signal metallic plate by medium substrate; The inner wire of described the second coaxial line is connected with secondary signal metallic plate through after medium substrate, and outer conductor is close to medium substrate lower surface, and is connected with secondary signal metallic plate by medium substrate; The bottom of described the first coaxial line and the second coaxial line connects SMA head through after metal floor respectively.
As a kind of preferred version, described first signal metallic plate and secondary signal metallic plate adopt surface coverage to have the pcb board of sheet metal.
As a kind of preferred version, the pcb board that described first signal metallic plate adopts upwards has the first grooving along bottom centre position, the pcb board that described secondary signal metallic plate adopts has the second grooving downwards along top center position, by matching and the matching without slot portion of the second grooving and first signal metallic plate without slot portion of the first grooving and secondary signal metallic plate, make first signal metallic plate block secondary signal metallic plate.
As a kind of preferred version, pcb board front or reverse side that described first signal metallic plate and secondary signal metallic plate adopt are coated with sheet metal.
As a kind of preferred version, on described medium substrate, offer the first via hole, the second via hole, the 3rd via hole and the 4th via hole, the inner wire of described the first coaxial line is connected with first signal metallic plate through after the first via hole, and the inner wire of described the second coaxial line is connected with secondary signal metallic plate through after the second via hole; Described medium substrate lower surface is provided with the first microstrip line being connected with the 3rd via hole, and the outer conductor of described the first coaxial line is close to medium substrate lower surface, and is connected with first signal metallic plate by the first microstrip line; Described medium substrate upper surface is provided with the second microstrip line being connected with the 4th via hole, and the outer conductor of described the second coaxial line is close to medium substrate lower surface, and is connected with secondary signal metallic plate by the second microstrip line.
As a kind of preferred version, described the first grooving and the second grooving the degree of depth be 11mm.
As a kind of preferred version, the pcb board tow sides that described first signal metallic plate and secondary signal metallic plate adopt are all coated with sheet metal, have a plurality of through holes on described pcb board, and described a plurality of through holes run through the double-edged sheet metal of pcb board.
As a kind of preferred version, on described medium substrate, offer the first via hole, the second via hole, the 3rd via hole and the 4th via hole, the inner wire of described the first coaxial line is connected with first signal metallic plate through after the first via hole, outer conductor is close to medium substrate lower surface, and is connected with first signal metallic plate by the 3rd via hole; The inner wire of described the second coaxial line is connected with secondary signal metallic plate through after the second via hole, and outer conductor is close to medium substrate lower surface, and connects by the 4th via hole secondary signal metallic plate.
As a kind of preferred version, the degree of depth of described the first grooving is 2.2mm, and the degree of depth of described the second grooving is 19mm; Medium substrate is run through in the bottom of described first signal metallic plate and secondary signal metallic plate.
As a kind of preferred version, also comprise four support columns, one end of described four support columns is fixed on four corners of metal floor, and the other end runs through medium substrate.
The present invention has following beneficial effect with respect to prior art:
1, LTE broad-band antenna of the present invention is compared with the design of prior art, there are two block signal metallic plates, two block signal metallic plates are vertical formation a pair of dipole antenna (two doublet units) mutually, dipole antenna completes transmitting or the reception of aerial signal as radiant body, owing to using a pair of radiant body, under the equal number of unit of antenna array, there is good gain.
2, LTE broad-band antenna of the present invention is compared with the design of prior art, can improve performance in frequency band, from the simulation result of input port return loss, show, this antenna is in the band limits of 1.61Ghz~2.8Ghz, there is longer bandwidth, larger gain, functional, can meet LTE cellular base station antenna applications in the requirement of the broadband high-speed wireless telecommunication system of 1.61Ghz~2.8Ghz.
3, two doublet units that LTE broad-band antenna of the present invention has, can adopt the pcb board of single or double covering metal sheet to form, and adopt the pcb board of two-sided covering metal, and stamp via hole at pcb board, can further improve the stability of radiation.
4, the medium substrate processing technology of LTE broad-band antenna of the present invention is ripe, and cost is low, and rate of finished products is high, and manufacturing process is simple, can meet the requirement of this LTE antenna low cost.
5, LTE broad-band antenna of the present invention have advantages of simple in structure, low section and size little, need the parameter of adjustment less, easily fabrication design, is applicable to engineering application, some LTE antenna structures of having solved prior art are complicated, size is large, and the bad problem of characteristic inside and outside band.
Accompanying drawing explanation
Fig. 1 is the stereogram that the LTE broad-band antenna coaxial line of the embodiment of the present invention 1 is connected with metal floor, medium substrate, signal metal plate.
Fig. 2 is the LTE broad-band antenna front view of the embodiment of the present invention 1
Fig. 3 is the LTE broad-band antenna left view of the embodiment of the present invention 1.
Fig. 4 is the LTE broad-band antenna vertical view of the embodiment of the present invention 1.
Fig. 5 is the structure chart of the LTE broad-band antenna medium base lower surface of the embodiment of the present invention 1.
Fig. 6 is the structure chart of the LTE broad-band antenna medium upper surface of base plate of the embodiment of the present invention 1.
Fig. 7 is the Facad structure figure of first signal metallic plate in the LTE broad-band antenna of the embodiment of the present invention 1.
Fig. 8 is the Facad structure figure of secondary signal metallic plate in the LTE broad-band antenna of the embodiment of the present invention 1.
Fig. 9 is the LTE broad-band antenna of the embodiment of the present invention 1 | S
11| the simulation result curve chart of parameter.
Figure 10 a is LTE broad-band antenna CST simulation model first signal metallic plate antenna pattern when 1.8GHz of the embodiment of the present invention 1.
Figure 10 b is LTE broad-band antenna CST simulation model secondary signal metallic plate antenna pattern when 1.8GHz of the embodiment of the present invention 1.
Figure 11 a is LTE broad-band antenna CST simulation model first signal metallic plate antenna pattern when 2.2GHz of the embodiment of the present invention 1.
Figure 11 b is LTE broad-band antenna CST simulation model secondary signal metallic plate antenna pattern when 2.2GHz of the embodiment of the present invention 1.
Figure 12 a is LTE broad-band antenna CST simulation model first signal metallic plate antenna pattern when 2.6GHz of the embodiment of the present invention 1.
Figure 12 b is LTE broad-band antenna CST simulation model secondary signal metallic plate antenna pattern when 2.6GHz of the embodiment of the present invention 1.
Figure 13 is the stereogram that in the LTE broad-band antenna of the embodiment of the present invention 2, coaxial line is connected with metal floor, medium substrate, signal metal plate.
Figure 14 is the LTE broad-band antenna front view of the embodiment of the present invention 2
Figure 15 is the LTE broad-band antenna left view of the embodiment of the present invention 2.
Figure 16 is the LTE broad-band antenna vertical view of the embodiment of the present invention 2.
Figure 17 is the Facad structure figure of first signal metallic plate in the LTE broad-band antenna of the embodiment of the present invention 2.
Figure 18 is the Facad structure figure of secondary signal metallic plate in the LTE broad-band antenna of the embodiment of the present invention 2.
Figure 19 is the LTE broad-band antenna of the embodiment of the present invention 2 | S
11| the simulation result curve chart of parameter.
Figure 20 a is LTE broad-band antenna CST simulation model first signal metallic plate antenna pattern when 1.8GHz of the embodiment of the present invention 1.
Figure 20 b is LTE broad-band antenna CST simulation model secondary signal metallic plate antenna pattern when 1.8GHz of the embodiment of the present invention 1.
Figure 21 a is LTE broad-band antenna CST simulation model first signal metallic plate antenna pattern when 2.2GHz of the embodiment of the present invention 1.
Figure 21 b is LTE broad-band antenna CST simulation model secondary signal metallic plate antenna pattern when 2.2GHz of the embodiment of the present invention 1.
Figure 22 a is LTE broad-band antenna CST simulation model first signal metallic plate antenna pattern when 2.6GHz of the embodiment of the present invention 1.
Figure 22 b is LTE broad-band antenna CST simulation model secondary signal metallic plate antenna pattern when 2.6GHz of the embodiment of the present invention 1.
Wherein, 1-medium substrate, 2-metal floor, 3-the first coaxial line, 4-the second coaxial line, 5-first signal metallic plate, 6-secondary signal metallic plate, 7-support column, 8-the first via hole, 9-the second via hole, 10-the 3rd via hole, 11-the 4th via hole, 12-the first microstrip line, 13-the second microstrip line, 14-sheet metal, 15-the first grooving, 16-the second grooving, 17-through hole.
Embodiment
Embodiment 1:
As Figure 1-Figure 8, the dipole dual polarization LTE broad-band antenna of the present embodiment, comprises medium substrate 1, metal floor 2, the first coaxial line 3, the second coaxial line 4, first signal metallic plate 5, secondary signal metallic plate 6 and four support columns 7; Described first signal metallic plate 5 and secondary signal metallic plate 6 are uprightly arranged on medium substrate 1 and are mutually vertical, and described the first coaxial line 3 and the second coaxial line 4 are parallel to each other; Described metal floor 2 is positioned at medium substrate 1 below, one end of described four support columns 7 is fixed on four corners of metal floor 2, the other end runs through medium substrate 1, and the inner wire diameter of described the first coaxial line 3 and the second coaxial line 4 is 2.17mm, and the diameter of outer conductor is 5mm;
The diameter that offers the first via hole 8, the second via hole 9, the 3rd via hole 10 and the 4th via hole 11, the first via holes 8 and the second via hole 9 on described medium substrate 1 is 2.17mm, and the diameter of the 3rd via hole 10 and the 4th via hole 11 is 0.6mm; The inner wire of described the first coaxial line 3 is connected with first signal metallic plate 5 after passing the first via hole 8, and the inner wire of described the second coaxial line 4 is connected with secondary signal metallic plate 6 after passing the second via hole 9; Described medium substrate 1 lower surface is provided with the first microstrip line 12 being connected with the 3rd via hole 10, and the outer conductor of described the first coaxial line 3 is close to medium substrate 1 lower surface, and is connected with first signal metallic plate 5 by the first microstrip line 12; Described medium substrate 1 upper surface is provided with the second microstrip line 13 being connected with the 4th via hole 11, and the outer conductor of described the second coaxial line 4 is close to medium substrate 1 lower surface, and is connected with secondary signal metallic plate 6 by the second microstrip line 13; The bottom of described the first coaxial line 3 and the second coaxial line 4 connects SMA head through after metal floor 2 respectively;
Described first signal metallic plate 5 and secondary signal metallic plate 6 adopt the positive pcb board that is coated with sheet metal 14, the pcb board that wherein first signal metallic plate 5 adopts upwards has the first grooving 15 along bottom centre position, the pcb board that described secondary signal metallic plate 6 adopts has the second grooving 16 downwards along top center position, by matching and the matching without slot portion of the second grooving 16 and first signal metallic plate 5 without slot portion of the first grooving 15 and secondary signal metallic plate 6, make first signal metallic plate 5 block secondary signal metallic plate 6, 16 the degree of depth of described the first grooving 15 and the second grooving is 11mm.
The dielectric constant of described medium substrate 1 is 3.8, and loss angle is 0.002, and its processing technology is ripe, and cost is low, and rate of finished products is high, and manufacturing process is simple, can meet the requirement of this LTE broad-band antenna low cost.
Described first signal metallic plate 5 and secondary signal metallic plate 6 form a pair of dipole antenna (two doublet units), and dipole antenna completes transmitting or the reception of aerial signal as a pair of radiant body; Signal, from the first coaxial line 3 and the second coaxial line 4 bottoms, is accessed or is picked out by SMA head.
Adjust after the dimensional parameters of LTE broad-band antenna each several part of the present embodiment, by calculating and electromagnetic-field simulation, the LTE broad-band antenna of the present embodiment carried out to checking emulation, as shown in Figure 9, provided this antenna in 1~4Ghz frequency range | S
11| the curve of parameter (input port return loss) simulation result, in figure, there are two curves, S1 (1), 1 (1) curve refers to first signal metallic plate 5 | S
11| simulation parameter, S1 (2), 1 (2) curve refers to secondary signal metallic plate 6 | S
11| simulation parameter; Can see, in 1.61GHz~2.8GHz band limits, article two, be all less than-10dB of the value of curve, simulation result shows that the LTE broad-band antenna of the present embodiment has longer bandwidth, larger gain, functional, can meet LTE cellular base station antenna applications in the requirement of the broadband high-speed wireless telecommunication system of 1.61GHz~2.8GHz.
The antenna pattern of the model of the LTE broad-band antenna CST emulation of the present embodiment when 1.8GHz is as shown in Figure 10 a and Figure 10 b, antenna pattern when 2.2GHz is as shown in Figure 11 a and Figure 11 b, antenna pattern when 2.6GHz is (10a, 11a and 12a are the antenna patterns of first signal metallic plate 5, and 10b, 11b and 12b are the antenna patterns of secondary signal metallic plate 6) as shown in Figure 12 a and Figure 12 b.
Embodiment 2:
As shown in Figure 13-18, for improving performance, further obtain stable antenna pattern, the first signal metallic plate 5 of the present embodiment and secondary signal metallic plate 6 adopt tow sides to be all coated with the pcb board of sheet metal 14, on described pcb board, have a plurality of through holes 17, described a plurality of through hole 17 runs through the double-edged sheet metal 14 of pcb board, and the diameter of each through hole 17 is 2mm;
On described medium substrate 1, offer the first via hole 8, the second via hole 9, the 3rd via hole 10 and the 4th via hole 11, the inner wire of described the first coaxial line 3 is connected with first signal metallic plate 5 after passing the first via hole 8, outer conductor is close to medium substrate 1 lower surface, and is connected with first signal metallic plate 5 by the 3rd via hole 10; The inner wire of described the second coaxial line 4 is connected with secondary signal metallic plate 6 after passing the second via hole 9, and outer conductor is close to medium substrate 1 lower surface, and is connected with secondary signal metallic plate 5 by the 4th via hole 11;
The pcb board that described first signal metallic plate 5 adopts upwards has the first grooving 15 along bottom centre position, the pcb board that described secondary signal metallic plate 6 adopts has the second grooving 16 downwards along top center position, by matching and the matching without slot portion of the second grooving 16 and first signal metallic plate 5 without slot portion of the first grooving 15 and secondary signal metallic plate 6, make first signal metallic plate 5 block secondary signal metallic plate 6, the degree of depth of described the first grooving 15 is 2.2mm, and the degree of depth of described the second grooving 16 is 19mm; Medium substrate 1 is run through in the bottom of described first signal metallic plate 5 and secondary signal metallic plate 6;
Adjust after the dimensional parameters of LTE broad-band antenna each several part of the present embodiment, by calculating and electromagnetic-field simulation, the LTE broad-band antenna of the present embodiment carried out to checking emulation, as shown in figure 19, provided this antenna in 1~4Ghz frequency range | S
11| the curve of parameter (input port return loss) simulation result, in figure, there are two curves, S1,1 curve refers to first signal metallic plate 5 | S
11| simulation parameter, S2,2 curve refers to secondary signal metallic plate | S
11| simulation parameter; Can see, in 1.61GHz~2.8GHz band limits, article two, be all less than-10dB of the value of curve, simulation result shows that the LTE broad-band antenna of the present embodiment has longer bandwidth, larger gain, functional, can meet LTE cellular base station antenna applications in the requirement of the broadband high-speed wireless telecommunication system of 1.61GHz~2.8GHz.
The antenna pattern of the model of the LTE broad-band antenna CST emulation of the present embodiment when 1.8GHz is as shown in Figure 20 a and Figure 20 b, antenna pattern when 2.2GHz is as shown in Figure 21 a and Figure 21 b, as shown in Figure 22 a and Figure 22 b, (20a, 21a and 22a are the antenna patterns of first signal metallic plate 5 to antenna pattern when 2.6GHz, 20b, 21b and 22b are the antenna patterns of secondary signal metallic plate 6), can see, compare the antenna pattern of embodiment 1, there is more stable and symmetrical feature.
In above-described embodiment 1 and 2, described pcb board adopts any one material of FR-4, polyimides, polytetrafluoroethylglass glass cloth and common burning porcelain to form; The metal that described metal floor 2, the first coaxial line 3, the second coaxial line 4, first signal metallic plate 5 and secondary signal metallic plate 6 adopt is any one of aluminium, iron, tin, copper, silver, gold and platinum, or is any one alloy of aluminium, iron, tin, copper, silver, gold and platinum.
The above; it is only patent preferred embodiment of the present invention; but the protection range of patent of the present invention is not limited to this; anyly be familiar with those skilled in the art in the disclosed scope of patent of the present invention; according to the present invention, the technical scheme of patent and inventive concept thereof are equal to replacement or are changed, and all belong to the protection range of patent of the present invention.