CN103955262A - Lateral cooling device for high-density cabinet - Google Patents
Lateral cooling device for high-density cabinet Download PDFInfo
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- CN103955262A CN103955262A CN201410122458.4A CN201410122458A CN103955262A CN 103955262 A CN103955262 A CN 103955262A CN 201410122458 A CN201410122458 A CN 201410122458A CN 103955262 A CN103955262 A CN 103955262A
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- cooling
- side direction
- cooling device
- header pipe
- lateral
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Abstract
The invention discloses a lateral cooling device for a high-density cabinet. The lateral cooling device comprises a lateral cooling host and a header pipe communicated with the lateral cooling host, wherein a loop is formed by the lateral cooling host and the header pipe, and the header pipe is arranged on two sides of a server cabinet. According to the lateral cooling device, the cooling effect of a device adopting lateral airflow is realized, the device is cooled by adopting a manner of lateral air supply, reduction of reliability of the device due to high temperature is avoided, the air distribution in the server cabinet is improved, the energy loss caused by mixture of cold air and heat in a conveying process is avoided, the cold air conveying efficiency is improved, the cooling efficiency is improved, and the lateral cooling device is suitable for the high-density server cabinet.
Description
Technical field
The present invention relates to a kind of high density rack side direction cooling device.
Background technology
In current data center, adopt the equipment of lateral airflow to propose special challenge aspect cooling.Common rack and conventional shelf layout and side direction are cooling not compatible, thereby cause the reliability of excess Temperature final reduction equipment.In the time that chassis equipment presents vertical cooling draught, it is best in design, adopting the passage of heat/data center of cold passage flow pattern and the cooling effectiveness of network computer room.Most of servers and frame mounting storage device adopt vertical air-flow.But, permitted eurypalynous switch and router because the design of self is limit, need to adopt lateral airflow.This situation is for generally adopting the trend of integration data/sound/video network to propose a difficult problem now.In the past, telephone system is dispersed and is placed in some safe cubicles.But along with the arrival in integrated epoch, need to lay data equipment, speech ciphering equipment and video equipment with standardized rack.Another promotes integrated trend is storage area network (SAN), and in storage area network, memory device uses together with switching equipment (as router).Along with these trend constantly strengthen, data center just need to by adopt the equipment of lateral airflow and traditional employing from front to back the device combination of air-flow get up.
Summary of the invention
For above-mentioned technological deficiency, the present invention proposes a kind of high density rack side direction cooling device.
In order to solve the problems of the technologies described above, technical scheme of the present invention is as follows:
A kind of high density rack side direction cooling device, comprises the cooling main frame of side direction, header pipe with the cooling main frame of side direction UNICOM, and the cooling main frame of described side direction and header pipe form loop, and described header pipe is arranged on the both sides of server cabinet.
Further, the cooling main frame of described side direction comprises air inlet and air-supply arrangement, described air inlet UNICOM external cooling device, and described air-supply arrangement provided with fan, the cold wind of cooling device is blown to header pipe by air-supply arrangement after entering by air inlet.
Further, also comprise blowpipe, it is upper that described blowpipe is arranged on header pipe uniformly, and cold wind is divided into multichannel by described blowpipe, and described blowpipe can be closed.
The invention has the beneficial effects as follows: solved the cooling problem of the equipment that adopts lateral airflow, adopted the mode of sidewall air supply to carry out equipment cooling, avoided answering excess Temperature and cause the reliability of equipment to reduce.Improve the air current composition in server cabinet, in course of conveying, avoided the mixing of cold wind and heat and the energy loss that causes, improved cold wind transfer efficiency, improved cooling effectiveness, applicable to high density server rack.
Brief description of the drawings
Fig. 1 is structural representation of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described further.
As shown in Figure 1, the present embodiment comprises server cabinet 1, the cooling main frame 7 of side direction, header pipe 2, blowpipe 3.The cooling main frame 7 of described side direction, header pipe 2, blowpipe 3 are installed in server cabinet 1.The cooling main frame 7 of described side direction is made up of air inlet 8, air-supply arrangement 6, and described air-supply arrangement 6 is provided with fan 5.Cold wind enters to blow to air supply duct by air-supply arrangement 6 after the cooling main frame 7 of side direction.The cooling main frame 7 of described side direction and header pipe 2 form loop, and the cooling main frame 7 of side direction is arranged on server cabinet 1 bottom or top, and header pipe 2 is arranged on server cabinet 1 both sides.Described air inlet 8 is connected with external refrigeration system.Cold wind is all to flow in the cooling main frame 7 of side direction and air supply duct arriving before refrigeration position, and the contact of discord hot blast, is convenient to improve cold wind transfer efficiency.It is upper that described blowpipe 3 is arranged on header pipe, and air outlet is just to server middle part.Cold wind 4 is divided into multichannel by blowpipe 3, and blowpipe 3 can be closed, and every Lu Douke is directly cooling to server, promotes refrigerating efficiency.If interior of equipment cabinet number of servers is few, can closed portion blowpipe 3, make refrigeration more targeted.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, without departing from the inventive concept of the premise; can also make some improvements and modifications, these improvements and modifications also should be considered as in protection domain of the present invention.
Claims (3)
1. a high density rack side direction cooling device, is characterized in that, comprise the cooling main frame of side direction, with the header pipe of the cooling main frame of side direction UNICOM, the cooling main frame of described side direction and header pipe form loop, described header pipe is arranged on the both sides of server cabinet.
2. a kind of high density rack side direction cooling device according to claim 1, it is characterized in that, the cooling main frame of described side direction comprises air inlet and air-supply arrangement, described air inlet UNICOM external cooling device, described air-supply arrangement provided with fan, the cold wind of cooling device is blown to header pipe by air-supply arrangement after entering by air inlet.
3. a kind of high density rack side direction cooling device according to claim 2, is characterized in that, also comprises blowpipe, and it is upper that described blowpipe is arranged on header pipe uniformly, and cold wind is divided into multichannel by described blowpipe, and described blowpipe can be closed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410122458.4A CN103955262A (en) | 2014-03-28 | 2014-03-28 | Lateral cooling device for high-density cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410122458.4A CN103955262A (en) | 2014-03-28 | 2014-03-28 | Lateral cooling device for high-density cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103955262A true CN103955262A (en) | 2014-07-30 |
Family
ID=51332547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410122458.4A Pending CN103955262A (en) | 2014-03-28 | 2014-03-28 | Lateral cooling device for high-density cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103955262A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101452325A (en) * | 2007-11-30 | 2009-06-10 | 中国科学院理化技术研究所 | Active refrigeration type thermal management system for easily inserting heating element |
| CN102378551A (en) * | 2010-08-24 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Server machine cabinet and liquid-cooled radiating system thereof |
| US20120147562A1 (en) * | 2009-06-15 | 2012-06-14 | Taqing Feng | Heat exchanger, heat dissipation method of the same and communication apparatus |
| CN102566711A (en) * | 2010-12-09 | 2012-07-11 | 鸿富锦精密工业（深圳）有限公司 | Server cabinet |
-
2014
- 2014-03-28 CN CN201410122458.4A patent/CN103955262A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101452325A (en) * | 2007-11-30 | 2009-06-10 | 中国科学院理化技术研究所 | Active refrigeration type thermal management system for easily inserting heating element |
| US20120147562A1 (en) * | 2009-06-15 | 2012-06-14 | Taqing Feng | Heat exchanger, heat dissipation method of the same and communication apparatus |
| CN102378551A (en) * | 2010-08-24 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Server machine cabinet and liquid-cooled radiating system thereof |
| CN102566711A (en) * | 2010-12-09 | 2012-07-11 | 鸿富锦精密工业（深圳）有限公司 | Server cabinet |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140730 |