CN103944529B - Constant-temperature crystal oscillator - Google Patents
Constant-temperature crystal oscillator Download PDFInfo
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- CN103944529B CN103944529B CN201410169116.8A CN201410169116A CN103944529B CN 103944529 B CN103944529 B CN 103944529B CN 201410169116 A CN201410169116 A CN 201410169116A CN 103944529 B CN103944529 B CN 103944529B
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- crystal
- wiring board
- installed surface
- heater members
- constant
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Abstract
The invention discloses a constant-temperature crystal oscillator which comprises a circuit board, a heating device and a crystal. The heating device is provided with a crystal installing face and a circuit board installing face, wherein the circuit board installing face is located on one side of the heating device away from the crystal installing face. The circuit board is provided with a first welding face, the circuit board installing face is smaller than a first welding face in size, the crystal is provided with a second welding face, the crystal installing face is larger than a second welding face in size, the heating device is directly installed on the first welding face of the circuit board though the circuit board installing face, and the crystal is directly installed on the crystal installing face of the heating device through the second welding face. The constant-temperature crystal oscillator is free of a constant-temperature bath, a copper block, a thermal fuse and other structures, directly heats the crystal through the heating device and achieves the purposes of a small occupied space and stable temperature control.
Description
Technical field
The present invention relates to crystal oscillator technologies field, more particularly, to one kind take up room, less, temperature control is more stable
Constant-temperature crystal oscillator.
Background technology
Quartz oscillator is the agitator of a kind of high accuracy and high stability, be widely used in colour TV, computer,
In all kinds of oscillating circuit such as remote control, and it is used for frequency generator in communication system, produces clock letter for data handling equipment
Number and for particular system provide reference signal.
Mode to constant temperature crystal heating commonly used in the art includes: 1, heating mos pipe first heats to circuit board, Ran Hou electricity
The copper billet heating paving crystal given by road plate, and last copper billet heats to crystal；2nd, heating mos pipe first heats to temperature chamber, Ran Houheng
Warm groove heats to crystal；3rd, heating wire is centered around crystal surrounding, by heating heating wire, indirectly to crystal heating etc..
One good mode of heating is not only huge to the stability influence of constant temperature crystal output frequency, and can reduce unit
Taking up room of device, meets the demand of crystal oscillator miniaturization.In order to lift the temperature control performance of crystal oscillator, subtract simultaneously
The size of small crystalss agitator, people have been working hard, and technology is also improved all the time.
Chinese patent literature cn102916672a discloses a kind of crystal oscillator with constant temperature control and its manufacture method, described perseverance
Temperature control agitator includes temperature chamber, heater members, printed circuit board and signal generator component, and described signal generator component is used for
Produce frequency signal, described heater members, printed circuit board and described signal generator component are arranged in described temperature chamber, described
The one side of printed circuit board forms fluted, and described signal generator component is installed in described groove, and described heater members are close to
Described printed circuit board is arranged on the relative another side of described groove.This crystal oscillator with constant temperature control has temperature chamber relatively
Other agitators have the advantages that volume is less.
But above-mentioned agitator still has temperature chamber, take up room still larger, in addition described heater members and described letter
Need between number generating element to conduct heat by described printed circuit board, thermal losses is big, and described signal generator component
Being changed by ambient temperature is affected larger, and temperature control precision is low.Based on above-mentioned situation, we are necessary to provide a kind of occupancy empty
Between less, constant-temperature crystal oscillator that temperature control is more stable.
Content of the invention
It is an object of the present invention to: a kind of constant temperature crystal less, that temperature control is more stable that takes up room is provided
Agitator.
For reaching this purpose, the present invention employs the following technical solutions:
A kind of constant-temperature crystal oscillator, including wiring board, heater members and crystal, described heater members have crystal and install
Face and wiring board installed surface, described wiring board installed surface is located at the side away from described crystal installed surface for the described heater members, institute
State wiring board and there is the first solder side, the size being smaller in size than described first solder side of described wiring board installed surface, described crystalline substance
Body has the second solder side, and the size of described crystal installed surface is more than the size of described second solder side, described heater members
Described wiring board installed surface is arranged on described first solder side of described wiring board so that described heater members be fixed on described
On wiring board, the second solder side of described crystal is arranged on the described crystal installed surface of described heater members, so that described crystalline substance
Body is fixed on described heater members.
Specifically, described heater members are fixed between described wiring board and described crystal, and described heater members with
Described wiring board, described crystal are directly fixedly connected respectively, enable described heater members directly to described wiring board and described
Crystal heats, it is to avoid by the de-stabilising effect of third party's conduction heat.The size of described crystal installed surface is more than described the
The size of two solders side, is made the whole side of described crystal all can be contacted with described heater members and realizes conducting heat, therefore pass
Thermal effect is relatively reliable, and described crystal is influenced by ambient temperature less.Meanwhile, by described heater members directly to described crystal
Heating, constant-temperature crystal oscillator need not arrange the structures such as temperature chamber, copper billet and heating wire, be effectively saved space.
As a kind of preferred technical scheme, described heater members are welded on described wiring board, described crystal welding in
On described heater members.
Preferably, described welding manner is soldering.
Preferably, the described wiring board installed surface of described heater members is close to described wiring board, and described crystal is close to described
The described crystal installed surface of heater members.Described heater members are fitted tightly with described wiring board, described crystal, makes described sending out
Thermal device and described crystal, the conduction heat of described wiring board better.
As a kind of preferred technical scheme, described heater members include body and pin, described crystal installed surface setting
On the body, described body is extended towards described wiring board installed surface described pin.
Preferably, described pin is realized electrically connecting towards described wiring board and with described wiring board by soldering.
As a kind of preferred technical scheme, described pin is extended and has bending plate away from one end of described body, institute
State bending plate parallel to described wiring board, described bending plate is welded on the first solder side of described wiring board.
Described bending plate has the folding surface being parallel to each other and joint face, and described folding surface is located near described crystal
Side, described joint face is located at the side near described wiring board, and described pin is welded on described wiring board by described bending plate
On.
The described joint face of the described pin of described heater members is mutually flat with described first solder side of described wiring board
OK, bonding area is greatly it is ensured that described heater members are relatively reliable with the electrical connection of described wiring board.
As a kind of preferred technical scheme, the one side of described crystal has flange, and described flange is near described bending
The side of plate is provided with distal face, and the distance between described distal face and described second solder side are less than described bending plate away from institute
State the distance between the side of wiring board and described crystal installed surface.
Specifically, the distance between described distal face and described second solder side are less than described folding surface and described crystal peace
The distance between dress face.
Specifically, the purpose that the described pin of described heater members arranges described bending plate is exactly to described in described crystal
Flange is stepped down, and the distance between the described distal face of described crystal and described second solder side are less than the described of described heater members
The distance between folding surface and described crystal installed surface, it is to avoid the described flange of described crystal is described with described heater members
Pin is interfered, and so that described second solder side of described crystal is more fully connect with the described crystal installed surface of described heater members
Touch, make both fit structures compacter with thermal conduction effect more preferably.
As a kind of preferred technical scheme, the distance between described wiring board installed surface and described crystal installed surface are equal to
Described bending plate is near the distance between the side of described wiring board and described crystal installed surface.If described wiring board installed surface
With the distance between described crystal installed surface less than described pin the distance between described joint face and described crystal installed surface,
There is gap by leading between the described wiring board installed surface of described heater members and described first solder side of described wiring board,
Impact thermal conduction effect, the structure of the present invention can make the described wiring board installed surface of described heater members with described wiring board more
Fit well, improve thermal conduction effect.
As a kind of preferred technical scheme, the distance between described wiring board installed surface and described crystal installed surface are more than
Described bending plate is near the distance between the side of described wiring board and described crystal installed surface.This structure equally can make described
The described wiring board installed surface of heater members is preferably fitted with described wiring board, improves thermal conduction effect.
As a kind of preferred technical scheme, described second solder side is the maximum side of size in described crystal.With
Big side, as described second solder side, makes described crystal bigger with the contact area of described heater members, thermal conduction effect
More preferably.
As a kind of preferred technical scheme, described heater members are managed for mos.
As a kind of preferred technical scheme, described mos manages the mos pipe for Double-side heating.Described heater members are not only given
Described crystal heating, and give described wiring board heating simultaneously, make the temperature of described wiring board keep constant, so described circuit
Amplifier on plate, audion, asic and resistance, electric capacity, inductance etc. can work at a constant temperature, thus ensureing defeated
Enter and stablizing of exporting.
The invention has the benefit that providing one kind no temperature chamber, copper billet and the vibration of heating wire isostructural constant temperature crystal
Device, this agitator passes through heater members directly to crystal heating it is achieved that the mesh less, that temperature control is more stable that takes up room
Mark.
Brief description
Below according to drawings and Examples, the present invention is described in further detail.
Fig. 1 is the structural representation of the constant-temperature crystal oscillator described in embodiment；
Fig. 2 is another kind of structural representation of the constant-temperature crystal oscillator described in embodiment.
In Fig. 1, Fig. 2:
1st, wiring board；11st, the first solder side；
2nd, heater members；21st, body；22nd, crystal installed surface；23rd, wiring board installed surface；24th, pin；241st, bending plate；
242nd, joint face；243rd, folding surface；
3rd, crystal；31st, the second solder side；32nd, flange；321st, distal face.
Specific embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by specific embodiment.
As shown in figure 1, in the present embodiment, a kind of constant-temperature crystal oscillator, including wiring board 1, heater members 2 and crystal
3, wiring board 1 has the first solder side 11, and crystal 3 has the second solder side 31, and the second solder side 31 is the side of the maximum of crystal 3
Face, heater members 2 are the mos pipe of Double-side heating, and heater members 2 include body 21 and pin 24, the both sides setting of heater members 2
There are crystal installed surface 22 and wiring board installed surface 23, wiring board installed surface 23 is located at heater members 2 away from crystal installed surface 22
Side.The size being smaller in size than the first solder side 11 of wiring board installed surface 23, the size of crystal installed surface 22 is more than the second weldering
The size of junction 31, wiring board installed surface 23 is arranged on the first solder side 11, and the second solder side 31 is arranged on crystal installed surface
On 22, wiring board 1, crystal 3 are directly fixedly connected with heater members 2 by soldering respectively.
Body 21 is extended towards wiring board 1 pin 24, and pin 24 is provided with and wiring board away from the side of body 21
The parallel bending plate of installed surface 23 241.Bending plate 241 has the folding surface 243 being parallel to each other and joint face 242, folding surface
243rd, joint face 242 is parallel with wiring board installed surface 23, and folding surface 243 is located at the side near crystal 3, and joint face 242 is located at
Near the side of wiring board 1, the distance between the joint face 242 of pin 24 and crystal installed surface 22 are equal to wiring board installed surface 23
The distance between with crystal installed surface 22, heater members 2 are completed soldering with wiring board 1 and are realized electrically connecting by pin 24.In
In other embodiments, the heater members of described constant-temperature crystal oscillator can be another kind of structure, as shown in Fig. 2 pin 24
The distance between joint face 242 and crystal installed surface 22 are less than the distance between wiring board installed surface 23 and crystal installed surface 22.
The one side of crystal 3 has flange 32, and flange 32 is provided with distal face 321, crystal near the side of bending plate 241
The distance between 3 distal face 321 and the second solder side 31 be less than heater members 2 folding surface 243 and crystal installed surface 22 it
Between distance.
Herein " first ", " second " is used for the purpose of being distinguish between in description, not special implication.
It is to be understood that, above-mentioned specific embodiment is only presently preferred embodiments of the present invention and institute's application technology is former
Reason, in technical scope disclosed in this invention, change that any those familiar with the art is readily apparent that or
Replace, all should cover within the scope of the present invention.
Claims (6)
1. it is characterised in that including wiring board, heater members and crystal, described heater members have a kind of constant-temperature crystal oscillator
There are crystal installed surface and wiring board installed surface, described wiring board installed surface is located at described heater members away from described crystal installed surface
Side, described wiring board has the first solder side, the chi being smaller in size than described first solder side of described wiring board installed surface
Very little, described crystal has the second solder side, and the size of described crystal installed surface is more than the size of described second solder side, described
The described wiring board installed surface of thermal device is arranged on described first solder side of described wiring board, so that described heater members are solid
On described wiring board, the second solder side of described crystal is arranged on the described crystal installed surface of described heater members, with
Described crystal is made to be fixed on described heater members；
Described heater members are welded on described wiring board, and described crystal welding is on described heater members；
Described second solder side is the maximum side of size in described crystal；
Described heater members are managed for mos；Described mos manages the mos pipe for Double-side heating.
2. constant-temperature crystal oscillator according to claim 1 is it is characterised in that described heater members include body and draw
Foot, described crystal installed surface arranges on the body, described body be extended towards described wiring board installed surface have described
Pin.
3. constant-temperature crystal oscillator according to claim 2 it is characterised in that described pin away from described body one end
Being extended has bending plate, and described bending plate is welded on the first of described wiring board parallel to described wiring board, described bending plate
On solder side.
4. constant-temperature crystal oscillator according to claim 3 is it is characterised in that the one side of described crystal has flange,
Described flange is provided with distal face near the side of described bending plate, the distance between described distal face and described second solder side
Less than described bending plate away from described wiring board the distance between side and described crystal installed surface.
5. constant-temperature crystal oscillator according to claim 4 is it is characterised in that described wiring board installed surface and described crystal
The distance between installed surface is equal to described bending plate near the distance between the side of described wiring board and described crystal installed surface.
6. constant-temperature crystal oscillator according to claim 4 is it is characterised in that described wiring board installed surface and described crystal
The distance between installed surface is more than described bending plate near the distance between the side of described wiring board and described crystal installed surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410169116.8A CN103944529B (en) | 2014-04-24 | 2014-04-24 | Constant-temperature crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410169116.8A CN103944529B (en) | 2014-04-24 | 2014-04-24 | Constant-temperature crystal oscillator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103944529A CN103944529A (en) | 2014-07-23 |
| CN103944529B true CN103944529B (en) | 2017-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410169116.8A Active CN103944529B (en) | 2014-04-24 | 2014-04-24 | Constant-temperature crystal oscillator |
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| CN (1) | CN103944529B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107276583B (en) * | 2017-06-16 | 2023-08-25 | 广东昕海科技有限公司 | Constant temperature crystal oscillator |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1841920A (en) * | 2005-03-28 | 2006-10-04 | 日本电波工业株式会社 | Constant temperature crystal oscillator |
| CN101179262A (en) * | 2006-11-09 | 2008-05-14 | 西门子公司 | Filter circuit device |
| CN101719756A (en) * | 2008-10-08 | 2010-06-02 | 日本电波工业株式会社 | Constant-temperature type crystal oscillator |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7479835B2 (en) * | 2005-09-15 | 2009-01-20 | Nihon Dempa Kogyo Co., Ltd. | Constant temperature type crystal oscillator for high stability |
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2014
- 2014-04-24 CN CN201410169116.8A patent/CN103944529B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1841920A (en) * | 2005-03-28 | 2006-10-04 | 日本电波工业株式会社 | Constant temperature crystal oscillator |
| CN101179262A (en) * | 2006-11-09 | 2008-05-14 | 西门子公司 | Filter circuit device |
| CN101719756A (en) * | 2008-10-08 | 2010-06-02 | 日本电波工业株式会社 | Constant-temperature type crystal oscillator |
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| Publication number | Publication date |
|---|---|
| CN103944529A (en) | 2014-07-23 |
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Address after: 523000 Room 401 and 402, building 5, No. 24, industrial East Road, Songshanhu Park, Dongguan City, Guangdong Province Patentee after: Guangdong daguangxin Technology Co.,Ltd. Address before: 523808 buildings 13-16, small and medium-sized science and technology enterprise entrepreneurship Park, northern industrial city, Songshanhu science and Technology Industrial Park, Dongguan City, Guangdong Province Patentee before: Guangdong Dapu Telecom Technology Co.,Ltd. |