CN103928736A - Self-positioning narrow-side bridge waveguide and vacuum brazing technology thereof - Google Patents
Self-positioning narrow-side bridge waveguide and vacuum brazing technology thereof Download PDFInfo
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- CN103928736A CN103928736A CN201410167345.6A CN201410167345A CN103928736A CN 103928736 A CN103928736 A CN 103928736A CN 201410167345 A CN201410167345 A CN 201410167345A CN 103928736 A CN103928736 A CN 103928736A
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Abstract
The invention discloses a self-positioning narrow-side bridge waveguide and a vacuum brazing technology thereof. The self-positioning narrow-side bridge waveguide comprises a cover plate (1), a cavity (2) and a flange (3), wherein the flange (3) comprises an upper flange body and a lower flange body, the upper flange body and the cover plate (1) are formed integrally, the lower flange body and the cavity (2) are formed integrally, bosses (4) are arranged around the cover plate (1), grooves (5) matched with the bosses (4) are formed around the cavity (2), and the cover plate (1) and the cavity (2) are welded together through vacuum brazing. Due to the adoption of the vacuum brazing technology in which the cover plate and the cavity are combined in a self-positioning mode, the accuracy of the whole waveguide is improved, the problem of deformation of the waveguide caused by flame welding is solved, and the corrosion resistance of the waveguide is improved due to the fact that electrochemical treatment is conducted on the waveguide subjected to vacuum brazing.
Description
Technical field
The present invention relates to a kind of narrow limit electric bridge waveguide and vacuum brazing technique thereof, particularly relate to a kind of self-align narrow limit electric bridge waveguide and vacuum brazing technique thereof.
Background technology
Waveguide is a kind of constraint or structure of guide electromagnetic waves of being used for, for radio fields such as radio communication, radar, navigation.The electric bridge waveguide fabrication process that now microwave device manufacturing firm continues to use is normally divided into standard waveguide waveguide A12, waveguide B13, shrouding A14, shrouding B15 and shrouding C16, waveguide A12 and waveguide B13 weld together, shrouding A14 is welded on the rear end of waveguide B13, shrouding B15 is welded on the outside end face of waveguide B13, shrouding C16 is welded on the outside end face of waveguide A12, ring flange 11 is welded on respectively the connecting end surface outside of waveguide A12 and waveguide B13, as shown in Figure 1.The waveguide that adopts aforesaid way to make, has the following disadvantages:
1, the production cycle is long: most of waveguide processing process are complicated, and welding need repeatedly be carried out, and the production cycle is long;
2, operating personnel's workload is large, and technical ability is had relatively high expectations;
3, in order to make, solder is wetting in mother metal gap, capillary flow, joint filling are used brazing flux, and brazing flux is large to the corrosiveness of mother metal, after soldering, cannot thoroughly remove its residue, causes antiseptic property greatly to reduce;
4, be subject to localized heating to affect cavity welding deflection large, the size of components precision such as waveguide are difficult to guarantee.
Traditional narrow limit electric bridge waveguide, its technological process is as follows:
1. part process flow process:
1.1, waveguide 1 technological process: blanking (increases by 200 on theoretical length, while bending, size Control error is larger) → pickling (heat treatment needs, if direct heat is difficult for processing after processing the heat treatments such as greasy dirt of waveguide inside) → heat treatment (bend and need) → wear steel band (assurance guarantee the minimum the angle of the bending) → milling → pincers (correction waveguide bore) that bend.
1.2, waveguide 2 technological processes: blanking (increasing by 5 for milling processing and milling surplus on theoretical length) → milling → pincers (proofreading and correct waveguide bore).
1.3, ring flange: the milling → pincers of getting the raw materials ready → count.
1.4, shrouding 1: the milling → pincers of getting the raw materials ready → count.
1.5, shrouding 2: the milling → pincers of getting the raw materials ready → count.
1.6, shrouding 3: the milling → pincers of getting the raw materials ready → count.
2, parts technological process:
2.1, waveguide 1,2 is shaped: equipped waveguide 1, waveguide 2 → pickling → gas brazing → cleaning → milling → pincers
2.2, ring flange (3) is shaped with waveguide 1,2: equipped ring flange and waveguide → pickling → gas brazing → cleaning → milling → pincers → plating → paint → assembling
Traditional handicraft method manual operations ratio is large, human factor is to large (the waveguide angle of bending of the quality influence of whole product, waveguide bore is proofreaied and correct, the cleaning of inner brazing flux etc.) therefore people's technical ability is had relatively high expectations, the waveguide mold cavity deformation producing because of multiple welding impels rectification difficulty to increase, its production efficiency is lower, quality is unstable, can not meet the demand of new product development and batch production.The antiseptic property of this process in existing Radar Products is poor, and in view of the solder flux in traditional gas brazing is large on anticorrosion impact, the cleaning of brazing flux not exclusively causes product seriously corroded.Therefore adopt conventional combination version can not effectively guarantee design accuracy and the product quality requirement of waveguide.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of employing cover plate, cavity to combine self-align formation in conjunction with vacuum brazing technique, thereby improve the precision of whole waveguide, overcome by flame and weld and cause the problem of waveguide distortion, waveguide after vacuum brazing is carried out to electrochemical treatments, thereby strengthen the electric bridge waveguide of self-align narrow limit and the vacuum brazing technique thereof of the corrosion resistance of waveguide.
The object of the invention is to be achieved through the following technical solutions: self-align narrow limit electric bridge waveguide, it comprises cover plate, cavity and flange, flange comprises first half flange and Lower Half flange, first half flange and cover plate are one-body molded, Lower Half flange and cavity are one-body molded, the surrounding of cover plate is provided with boss, and the surrounding of cavity is provided with the groove matching with boss, and cover plate, cavity and flange weld together by vacuum brazing.
Self-align narrow limit electric bridge waveguide vacuum soldering processes, it comprises the following steps:
S1: the machining that completes cover plate, cavity according to design;
S2: the cover plate that machining is completed, cavity carry out respectively surface treatment;
S3: make solder, the contact-making surface size combining according to cover plate, cavity is made solder, and solder is assemblied on cavity, and cover plate, cavity assemble;
S4: vacuum brazing, the waveguide assembling is fixed on frock clamp, to put into vacuum Aluminum brazing stove and carry out vacuum brazing, the brazing temperature in vacuum Aluminum brazing stove completes vacuum brazing while being 615 ℃, cooling with stove;
S5: the profile of waveguide and flange are done to further digital control processing, hole and ring flange is carried out to fraising;
S6: electrochemical treatments, its concrete steps are:
S61: oil removing: adopt organic solvent to carry out oil removing to electric bridge waveguide;
S62: etch: with the electric bridge waveguide after 8%～10%NaOH aqueous solution etch oil removing;
S63: rinse for the first time: repeatedly rinse the electric bridge waveguide after etch with hot water;
S64: bright pickling: under room temperature with 30%～50%HNO
3solution carries out bright pickling;
S65: rinse for the second time: repeatedly rinse the electric bridge waveguide after bright pickling with cold water;
S66: electric conductive oxidation: electric bridge waveguide is immersed by 0.5%～0.7%CrO
3, 0.05%～0.1%K
3fe(CN)
6in the mixed liquor forming with 0.1%～0.15%NaF, carry out etch;
S67: rinse for the third time: the electric bridge waveguide after electric conductive oxidation is immersed in flowing water and repeatedly rinsed;
S68: dry.
The processing technology of described cover plate comprises following sub-step:
S11: cutting, cuts into cover plate profile according to electric bridge waveguide design by raw material water, reserved allowance 3～5mm, thickness surplus 3～5mm;
S12: rough milling, CNC milling machine is programmed, complete the rough milling of cover plate, reserved allowance 1～3mm;
S13: stress relief annealing, the temperature of stress relief annealing is: 250 ℃～280 ℃;
S14: finish-milling processing, CNC milling machine is programmed again, complete the finish-milling processing of cover plate.
The processing technology of described cavity comprises following sub-step:
S21: cutting, cuts into cavity profile according to electric bridge waveguide design by raw material water, reserved allowance 3～5mm, thickness surplus 3～5mm;
S22: rough milling, CNC milling machine is programmed, complete the rough milling of cavity die cavity, reserved allowance 1～3mm;
S23: stress relief annealing, the temperature of stress relief annealing is: 250 ℃～280 ℃;
S24: finish-milling processing, CNC milling machine is programmed again, complete the finish-milling processing of cavity die cavity.
Described cover plate and each end face of cavity surrounding respectively stay 2～3mm allowance.
Described cover plate is provided with boss; Described cavity is provided with the groove matching with boss, the embedding thickness of boss and groove deduction weld tabs, monolateral 0.02～0.04mm gap of respectively staying again.
The invention has the beneficial effects as follows:
1) waveguide is divided into cover plate, cavity, processes respectively cover plate, cavity, and by vacuum brazing by cover plate, cavity welding together, thereby production process and number of spare parts reduced;
2) on cover plate and cavity, be equipped with groove and boss and adopt multi-faceted location, thereby having realized self-alignly, having improved aligning accuracy;
3) waveguide is carried out to a vacuum brazing moulding, thereby reduced welding times, overcome because multiple welding causes wave-guide cavity wave to be welded localized heating and affected the problem that deflection is large, guaranteed the dimensional accuracy of waveguide assemblies; Because Process of Vacuum Brazing does not need brazing flux, thereby overcome brazing flux, waveguide is corroded, thereby strengthened the corrosion resistance of waveguide, extended the useful life of waveguide, guaranteed that the light of soldered fitting is fine and close simultaneously, improved the mechanical performance of soldered fitting;
4) groove and boss are monolateral respectively leaves gap, thus the mobile joint filling of solder while having guaranteed welding;
5) the electric bridge waveguide after vacuum brazing is carried out to electric conductive oxidation processing, thereby strengthened the corrosion resistance of electric bridge waveguide.
Accompanying drawing explanation
Fig. 1 is traditional narrow limit electric bridge waveguiding structure schematic diagram;
Fig. 2 is narrow limit of the present invention electric bridge waveguiding structure schematic diagram;
Fig. 3 is narrow limit electric bridge waveguide pictorial diagram schematic diagram of the present invention;
Fig. 4 is processing process figure of the present invention;
Fig. 5 is electrochemical treatments flow chart of steps of the present invention;
Fig. 6 is cover plate processing process figure of the present invention;
Fig. 7 is base plate processing process figure of the present invention;
In figure, 1-cover plate, 2-cavity, 3-flange, 4-boss, 5-groove, 11-ring flange, 12-waveguide A, 13-waveguide B, 14-shrouding A, 15-shrouding B, 16-shrouding C.
Embodiment
Below in conjunction with drawings and Examples, technical scheme of the present invention is described in further detail, but protection scope of the present invention is not limited to the following stated.
As shown in Figures 2 and 3, self-align narrow limit electric bridge waveguide, self-align narrow limit electric bridge waveguide and vacuum brazing technique thereof, it comprises cover plate 1, cavity 2 and flange 3, flange 3 comprises first half flange and Lower Half flange, and first half flange and cover plate 1 are one-body molded, and Lower Half flange and cavity 2 are one-body molded; The surrounding of cover plate 1 is provided with boss 4, and the surrounding of cavity 2 is provided with the groove 5 matching with boss 4, and cover plate 1, cavity 2 weld together by vacuum brazing.
[embodiment mono-] self-align narrow limit electric bridge waveguide vacuum soldering processes, as shown in Figure 4, it comprises the following steps
S1: the machining that completes cover plate 1, cavity 2 according to design;
S2: the cover plate 1 that machining is completed, cavity 2 carry out respectively surface treatment;
S3: make solder, the contact-making surface size combining according to cover plate 1, cavity 2 is made solder, and solder is assemblied on cavity 2, and cover plate 1, cavity 2 assemble;
S4: vacuum brazing, the waveguide assembling is fixed on frock clamp, to put into vacuum Aluminum brazing stove and carry out vacuum brazing, the brazing temperature in vacuum Aluminum brazing stove completes vacuum brazing while being 615 ℃, cooling with stove;
S5: the profile of waveguide and flange are done to further digital control processing, hole and ring flange is carried out to fraising;
S6: electrochemical treatments, as shown in Figure 4, its concrete steps are:
S61: oil removing: adopt organic solvent to carry out oil removing to electric bridge waveguide;
S62: etch: with the electric bridge waveguide after 8%NaOH aqueous solution etch oil removing, aqueous temperature is 70 ℃, and the etch time is 1.5min;
S63: rinse for the first time: repeatedly rinse the electric bridge waveguide after etch with hot water;
S64: bright pickling: use 30%HNO under room temperature
3solution carries out bright pickling, and the etch time is 0.8min;
S65: rinse for the second time: repeatedly rinse the electric bridge waveguide after bright pickling with cold water;
S66: electric conductive oxidation: electric bridge waveguide is immersed by 0.7%CrO
3, 0.1%K
3fe(CN)
6in the mixed liquor forming with 0.15%NaF, carry out etch, the temperature of mixed liquor is 35 ℃, and the etch time is 2min;
S67: rinse for the third time: the electric bridge waveguide after electric conductive oxidation is immersed in flowing water and repeatedly rinsed;
S68: dry.
As shown in Figure 6, the processing technology of described cover plate comprises following sub-step:
S11: cutting, cuts into cover plate profile according to electric bridge waveguide design by raw material water, reserved allowance 5mm, thickness surplus 5mm;
S12: rough milling, CNC milling machine is programmed, complete the rough milling of cover plate, reserved allowance 2mm;
S13: stress relief annealing, the temperature of stress relief annealing is: 250 ℃;
S14: finish-milling processing, CNC milling machine is programmed again, complete the finish-milling processing of cover plate.
As shown in Figure 7, the processing technology of described cavity comprises following sub-step:
S21: cutting, cuts into cavity profile according to electric bridge waveguide design by raw material water, reserved allowance 3mm, thickness surplus 3mm;
S22: rough milling, CNC milling machine is programmed, complete the rough milling of cavity die cavity, reserved allowance 2mm;
S23: stress relief annealing, the temperature of stress relief annealing is: 250 ℃;
S24: finish-milling processing, CNC milling machine is programmed again, complete the finish-milling processing of cavity die cavity.
Described cover plate 1 and each end face of cavity 2 surroundings respectively stay 2mm allowance.
Described cover plate 1 is provided with boss 4, the embedding thickness of boss 4 deduction weld tabs, the monolateral 0.02mm gap of respectively staying again.
Described cavity 2 is provided with the groove 5 matching with boss 4, the embedding thickness of groove 5 deduction weld tabs, the monolateral 0.02mm gap of respectively staying again.
[embodiment bis-] self-align narrow limit electric bridge waveguide vacuum soldering processes, as shown in Figure 4, it comprises the following steps
S1: the machining that completes cover plate 1, cavity 2 according to design;
S2: the cover plate 1 that machining is completed, cavity 2 carry out respectively surface treatment;
S3: make solder, the contact-making surface size combining according to cover plate 1, cavity 2 is made solder, and solder is assemblied on cavity 2, and cover plate 1, cavity 2 assemble;
S4: vacuum brazing, the waveguide assembling is fixed on frock clamp, to put into vacuum Aluminum brazing stove and carry out vacuum brazing, the brazing temperature in vacuum Aluminum brazing stove completes vacuum brazing while being 615 ℃, cooling with stove;
S5: numerical control is done further processing to the profile of waveguide and flange, holes and ring flange is carried out to fraising;
S6: electrochemical treatments, as shown in Figure 5, its concrete steps are:
S61: oil removing: adopt organic solvent to carry out oil removing to electric bridge waveguide;
S62: etch: with the electric bridge waveguide after 9%NaOH aqueous solution etch oil removing, aqueous temperature is 65 ℃, and the etch time is 1min;
S63: rinse for the first time: repeatedly rinse the electric bridge waveguide after etch with hot water;
S64: bright pickling: use 40%HNO under room temperature
3solution carries out bright pickling, and the etch time is 0.5min;
S65: rinse for the second time: repeatedly rinse the electric bridge waveguide after bright pickling with cold water;
S66: electric conductive oxidation: electric bridge waveguide is immersed by 0.5%CrO
3, 0.05%K
3fe(CN)
6in the mixed liquor forming with 0.1%NaF, carry out etch, the temperature of mixed liquor is 30 ℃, and the etch time is 1min;
S67: rinse for the third time: the electric bridge waveguide after electric conductive oxidation is immersed in flowing water and repeatedly rinsed;
S68: dry.
As shown in Figure 6, the processing technology of described cover plate comprises following sub-step:
S11: cutting, cuts into cover plate profile according to electric bridge waveguide design by raw material water, reserved allowance 3mm, thickness surplus 3mm;
S12: rough milling, CNC milling machine is programmed, complete the rough milling of cover plate, reserved allowance 1mm;
S13: stress relief annealing, the temperature of stress relief annealing is: 270 ℃;
S14: finish-milling processing, CNC milling machine is programmed again, complete the finish-milling processing of cover plate.
As shown in Figure 7, the processing technology of described cavity comprises following sub-step:
S21: cutting, cuts into cavity profile according to electric bridge waveguide design by raw material water, reserved allowance 5mm, thickness surplus 5mm;
S22: rough milling, CNC milling machine is programmed, complete the rough milling of cavity die cavity, reserved allowance 1mm;
S23: stress relief annealing, the temperature of stress relief annealing is: 270 ℃;
S24: finish-milling processing, CNC milling machine is programmed again, complete the finish-milling processing of cavity die cavity.
Described cover plate 11 and each end face of cavity 2 surroundings respectively stay 3mm allowance.
Described cover plate 1 is provided with boss 4, the embedding thickness of boss 4 deduction weld tabs, the monolateral 0.03mm gap of respectively staying again.
Described cavity 2 is provided with the groove 5 matching with boss 4, the embedding thickness of groove 5 deduction weld tabs, the monolateral 0.03mm gap of respectively staying again.
[embodiment tri-] self-align narrow limit electric bridge waveguide vacuum soldering processes, as shown in Figure 4, it comprises the following steps
S1: the machining that completes cover plate 1, cavity 2 according to design;
S2: the cover plate 1 that machining is completed, cavity 2 carry out respectively surface treatment;
S3: make solder, the contact-making surface size combining according to cover plate 1, cavity 2 is made solder, and solder is assemblied on cavity 2, and cover plate 1, cavity 2 assemble;
S4: vacuum brazing, the waveguide assembling is fixed on frock clamp, to put into vacuum Aluminum brazing stove and carry out vacuum brazing, the brazing temperature in vacuum Aluminum brazing stove completes vacuum brazing while being 615 ℃, cooling with stove;
S5: the profile of waveguide and flange are done to further digital control processing, hole and ring flange is carried out to fraising;
S6: electrochemical treatments, as shown in Figure 5, its concrete steps are:
S61: oil removing: adopt organic solvent to carry out oil removing to electric bridge waveguide;
S62: etch: with the electric bridge waveguide after 10%NaOH aqueous solution etch oil removing, aqueous temperature is 75 ℃, and the etch time is 2min;
S63: rinse for the first time: repeatedly rinse the electric bridge waveguide after etch with hot water;
S64: bright pickling: use 50%HNO under room temperature
3solution carries out bright pickling, and the etch time is 1min;
S65: rinse for the second time: repeatedly rinse the electric bridge waveguide after bright pickling with cold water;
S66: electric conductive oxidation: electric bridge waveguide is immersed by 0.6%CrO
3, 0.07%K
3fe(CN)
6in the mixed liquor forming with 0.13%NaF, carry out etch, the temperature of mixed liquor is 40 ℃, and the etch time is 3min;
S67: rinse for the third time: the electric bridge waveguide after electric conductive oxidation is immersed in flowing water and repeatedly rinsed;
S68: dry.
As shown in Figure 6, the processing technology of described cover plate 1 comprises following sub-step:
S11: cutting, cuts into cover plate profile according to electric bridge waveguide design by raw material water, reserved allowance 4mm, thickness surplus 4mm;
S12: rough milling, CNC milling machine is programmed, complete the rough milling of cover plate, reserved allowance 3mm;
S13: stress relief annealing, the temperature of stress relief annealing is: 280 ℃;
S14: finish-milling processing, CNC milling machine is programmed again, complete the finish-milling processing of cover plate.
As shown in Figure 7, the processing technology of described cavity 2 comprises following sub-step:
S21: cutting, cuts into cavity profile according to electric bridge waveguide design by raw material water, reserved allowance 4mm, thickness surplus 4mm;
S22: rough milling, CNC milling machine is programmed, complete the rough milling of cavity die cavity, reserved allowance 3mm;
S23: stress relief annealing, the temperature of stress relief annealing is: 280 ℃;
S24: finish-milling processing, CNC milling machine is programmed again, complete the finish-milling processing of cavity die cavity.
Described cover plate 1 and each end face of cavity 2 surroundings respectively stay 2.5mm allowance.
Described cover plate 1 is provided with boss 4, the embedding thickness of boss 4 deduction weld tabs, the monolateral 0.04mm gap of respectively staying again.
Described cavity 2 is provided with the groove 5 matching with boss 4, the embedding thickness of groove 5 deduction weld tabs, the monolateral 0.04mm gap of respectively staying again.
Claims (6)
1. self-align narrow limit electric bridge waveguide, it is characterized in that: it comprises cover plate (1), cavity (2) and flange (3), flange (3) comprises first half flange and Lower Half flange, and first half flange and cover plate (1) are one-body molded, and Lower Half flange and cavity (2) are one-body molded; The surrounding of cover plate (1) is provided with boss (4), and the surrounding of cavity (2) is provided with the groove (5) matching with boss (4), and cover plate (1), cavity (2) weld together by vacuum brazing.
2. self-align narrow limit electric bridge waveguide vacuum soldering processes, is characterized in that: it comprises the following steps:
S1: the machining that completes cover plate (1), cavity (2) according to design;
S2: the cover plate that machining is completed (1), cavity (2) carry out respectively surface treatment;
S3: make solder, the contact-making surface size combining according to cover plate (1), cavity (2) is made solder, and it is upper that solder is assemblied in to cavity (2), cover plate (1), cavity (2) assemble;
S4: vacuum brazing, the waveguide assembling is fixed on frock clamp, to put into vacuum Aluminum brazing stove and carry out vacuum brazing, the brazing temperature in vacuum Aluminum brazing stove completes vacuum brazing while being 615 ℃, cooling with stove;
S5: the profile of waveguide and flange are done to further digital control processing, hole and ring flange is carried out to fraising;
S6: electrochemical treatments, its concrete steps are:
S61: oil removing: adopt organic solvent to carry out oil removing to electric bridge waveguide;
S62: etch: with the electric bridge waveguide after 8%～10%NaOH aqueous solution etch oil removing;
S63: rinse for the first time: repeatedly rinse the electric bridge waveguide after etch with hot water;
S64: bright pickling: under room temperature with 30%～50%HNO
3solution carries out bright pickling;
S65: rinse for the second time: repeatedly rinse the electric bridge waveguide after bright pickling with cold water;
S66: electric conductive oxidation: electric bridge waveguide is immersed by 0.5%～0.7%CrO
3, 0.05%～0.1%K
3fe(CN)
6in the mixed liquor forming with 0.1%～0.15%NaF, carry out etch;
S67: rinse for the third time: the electric bridge waveguide after electric conductive oxidation is immersed in flowing water and repeatedly rinsed;
S68: dry.
3. self-align narrow limit according to claim 2 electric bridge waveguide vacuum soldering processes, is characterized in that: the processing technology of described cover plate (1) comprises following sub-step:
S11: cutting, cuts into cover plate profile according to electric bridge waveguide design by raw material water, reserved allowance 3～5mm, thickness surplus 3～5mm;
S12: rough milling, CNC milling machine is programmed, complete the rough milling of cover plate, reserved allowance 1～3mm;
S13: stress relief annealing, the temperature of stress relief annealing is: 250 ℃～280 ℃;
S14: finish-milling processing, CNC milling machine is programmed again, complete the finish-milling processing of cover plate.
4. self-align narrow limit according to claim 2 electric bridge waveguide vacuum soldering processes, is characterized in that: the processing technology of described cavity (2) comprises following sub-step:
S21: cutting, cuts into cavity profile according to electric bridge waveguide design by raw material water, reserved allowance 3～5mm, thickness surplus 3～5mm;
S22: rough milling, CNC milling machine is programmed, complete the rough milling of cavity die cavity, reserved allowance 1～3mm;
S23: stress relief annealing, the temperature of stress relief annealing is: 250 ℃～280 ℃;
S24: finish-milling processing, CNC milling machine is programmed again, complete the finish-milling processing of cavity die cavity.
5. self-align narrow limit according to claim 2 electric bridge waveguide vacuum soldering processes, is characterized in that: described cover plate (1) and each end face of cavity (2) surrounding respectively stay 2～3mm allowance.
6. cover plate described in (1) is provided with boss (4); Described cavity (2) is provided with the groove (5) matching with boss (4), the embedding thickness of boss (4) and groove (5) deduction weld tabs, monolateral 0.02～0.04mm gap of respectively staying again.
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| CN104347923A (en) * | 2014-11-22 | 2015-02-11 | 成都锦江电子系统工程有限公司 | Y-shaped power divider manufacturing technology |
| CN107570965A (en) * | 2017-08-17 | 2018-01-12 | 西安电子工程研究所 | A kind of method of U-shaped waveguide bend processing |
| CN107971596A (en) * | 2017-11-30 | 2018-05-01 | 贵州航天电子科技有限公司 | A kind of waveguide assemblies forming method |
| CN112207383A (en) * | 2020-09-17 | 2021-01-12 | 西安空间无线电技术研究所 | Microwave passive device brazing method and device |
| CN114012361A (en) * | 2021-11-05 | 2022-02-08 | 合肥聚能电物理高技术开发有限公司 | High-strength waveguide tube and manufacturing tool and manufacturing process thereof |
| CN114012361B (en) * | 2021-11-05 | 2024-04-30 | 合肥聚能电物理高技术开发有限公司 | High-strength waveguide tube manufacturing tool and manufacturing process |
| CN114406606A (en) * | 2021-12-13 | 2022-04-29 | 上海第一机床厂有限公司 | Method for processing nuclear fuel transfer equipment shell |
| CN114406606B (en) * | 2021-12-13 | 2023-08-29 | 上海第一机床厂有限公司 | Method for processing nuclear fuel transfer equipment shell |
| CN114227175A (en) * | 2021-12-30 | 2022-03-25 | 佛山华智新材料有限公司 | Waveguide device manufacturing method and waveguide device |
| CN115383411A (en) * | 2022-09-21 | 2022-11-25 | 西安艾力特电子实业有限公司 | Method for machining bent waveguide tube and bent waveguide tube structure |
| CN115383411B (en) * | 2022-09-21 | 2024-04-30 | 西安艾力特电子实业有限公司 | Method for processing bent waveguide tube and bent waveguide tube structure |
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