CN103928317B - Improve the method that technique sheet becomes film uniformity - Google Patents
Improve the method that technique sheet becomes film uniformity Download PDFInfo
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- CN103928317B CN103928317B CN201410174514.9A CN201410174514A CN103928317B CN 103928317 B CN103928317 B CN 103928317B CN 201410174514 A CN201410174514 A CN 201410174514A CN 103928317 B CN103928317 B CN 103928317B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
Abstract
The invention discloses and a kind of improve the method that technique sheet becomes film uniformity, it is passed through nitrogen in including the oxidation furnace boiler tube of thermotropism；Rotating technics sheet supporting boat, and rise boat from home position to primary importance；Keep rotating technics sheet supporting boat, technique sheet is carried out main oxidation technology；After main oxidation technology completes, keep rotating technics sheet supporting boat, from technique travel position fall boat to home position.The present invention is by keeping low speed rotation technique sheet supporting boat during a liter boat, fall boat and main oxidation technology, reduce temperature field, airflow field skewness and technique sheet is become the impact of film uniformity, thus optimize the one-tenth film uniformity of technique sheet in quasiconductor vertical furnace equipment, reduce production cost simultaneously.
Description
Technical field
The present invention relates to ic manufacturing technology field, improve technique sheet in quasiconductor vertical furnace equipment particularly to one and become
The method of film uniformity.
Background technology
At present, the electronics and information industry with integrated circuit as core has been over the biography with automobile, oil, iron and steel as representative
System industry becomes the largest industrial sector, becomes transformation and pulls conventional industries to march toward the powerful engine of digital Age and rich foundation stone.
In terms of integrated circuit processing and manufacturing, characteristic size constantly reduces, and the integrated level making chip is more and more higher, has caused a series of
Technology obstacle and technological problems.Integrated circuit processing and manufacturing is one and the closely-related technology of special equipment, is commonly called as " one
For equipment, generation technique, generation product ".Wherein, thin film generation technique is the skill of most critical in ic manufacturing technology
One of art, therefore has higher requirement to equipment.As a example by vertical oxidation, as thermal processing equipment, in order to
Ensure the performance of handicraft product, and to film thickness uniformity, Grain size controlling, Control for Oxygen Content, temperature rate, stability etc.
Technical specification is had higher requirement.
In existing technique sheet oxidation technology, the main cause that technique sheet can be made to become film uniformity poor is temperature field and air-flow
, and affect temperature field, airflow field factor predominantly: the 1. factor of plant machinery structure, as body of heater when equipment assembles,
Whether boat, heat-preserving container be on concentric line；2. the impact of heat-preserving container；3. the impact of little oxygen it is connected with during lifting boat.
Wherein, the impact that front two factors are brought can be improved by the adjustment of plant equipment.For Section 3 factor, one
As the oxidation technology of technique sheet be that technique sheet is placed in cassette, by the elevating mechanism in oxidation furnace, cassette is risen to
Object height, carries out main oxidation technology.During cassette rises boat or fall boat, little oxygen (a small amount of oxygen in oxidation furnace, can be passed through
Gas), uneven temperature field and airflow field can be formed in oxidation furnace, the cassette in rising or falling will be affected,
Cause film forming lack of homogeneity.Therefore, how to avoid aoxidizing temperature field in furnace and the impact of airflow field, thus improve technique sheet
Become film uniformity, be one of those skilled in the art's technical problem urgently to be resolved hurrily.
Summary of the invention
The present invention is to solve above-mentioned technical problem, and provide a kind of and improve the method that technique sheet becomes film uniformity, in order to reduce
Temperature field, airflow field skewness become the impact of film uniformity to technique sheet.
The method that the raising technique sheet that the present invention provides becomes film uniformity, comprising:
Step S01, is passed through nitrogen in the oxidation furnace boiler tube of thermotropism；
Step S02, rotates the technique sheet supporting boat in boiler tube, and rises boat from home position to technique travel position；
Step S03, keeps rotating technics sheet supporting boat, technique sheet is carried out main oxidation technology；
Step S04, after main oxidation technology completes, keeps rotating technics sheet supporting boat, from technique travel position fall boat to original
Position.
Further, step S02 includes step S021 rotating technics sheet supporting boat, simultaneously with First Speed from home position
Rise boat and keep rotating technics sheet supporting boat to primary importance, step S022, rise boat to technique stroke position with second speed simultaneously
Putting, wherein, this second speed is less than First Speed；After step S04 includes that the main oxidation technology of step S041 completes, keep
Rotating technics sheet supporting boat, keeps rotating technics sheet supporting boat with third speed fall boat to the second position, step S042 simultaneously,
Simultaneously with fourth speed fall boat to the 3rd position, step S043 is stopped the rotation technique sheet supporting boat, and drops with this third speed
Boat is to this home position, and wherein, this third speed is less than fourth speed.
Further, in the method, the speed of rotation of rotating technics sheet supporting boat is 1-5rpm (turning every point), and in each step
For rotating Vortex.
Further, this First Speed and fourth speed scope are 100-150mm/min (millimeter is per minute), this second speed
Degree and third speed scope are 20-50mm/min.
Further, this primary importance and the second position are above home position between 1550-1600mm.
Further, the 3rd position is above home position between 10-20mm.
Further, during step S02, it is passed through a small amount of oxygen, during step S04, is not passed through oxygen.
Further, this small amount of oxygen is 100-500SCCM (sccm)；Main oxidation in step S03
It is 1000-10000SCCM that technique is passed through the amount of oxygen.
Further, first rotating technics sheet supporting boat 10-60s before rising boat in step S02, the speed of rotation is 1-5rpm.
Further, before step S01, also include step S00, stablize temperature in oxidation furnace boiler tube, and open blower fan with shape
Become steady air flow.
Further, in stablizing oxidation furnace boiler tube in step S00, temperature is in 600-800 DEG C, opens blower fan wind speed and is
0.3-0.5m/s。
Further, be passed through in step S01 is high pure nitrogen, and its flow is 500-1000SLM.
Further, main oxidation technology described in step S03 includes temperature stabilization, intensification, oxidation technology, fall mild temperature
Stable.
Further, in first stablizing oxidation furnace boiler tube before dropping boat in step S04, temperature is in 600-800 DEG C.
Further, step S042 drops boat after the 3rd position, continues rotating technics sheet supporting boat 10-60s, rotate speed
Rate is 1-5rpm.
Further, this method also includes step S05, closes fire door, is passed through nitrogen, to cool down technique sheet.
The method that the raising technique sheet that the present invention provides becomes film uniformity, during a liter boat, fall boat and main oxidation technology
Keep low speed rotation technique sheet supporting boat, reduce temperature field, airflow field skewness and technique sheet is become the shadow of film uniformity
Ring, thus optimize the one-tenth film uniformity of technique sheet in quasiconductor vertical furnace equipment, reduce production cost simultaneously.
Accompanying drawing explanation
For becoming apparent from understanding the purpose of the present invention, feature and advantage, below with reference to accompanying drawing to presently preferred embodiments of the present invention
It is described in detail, wherein:
Fig. 1 is that the present invention improves technique sheet and becomes the first embodiment flow chart of film uniformity method.
Detailed description of the invention
The present invention improves the method that technique sheet becomes film uniformity, comprising:
Step S01, is passed through nitrogen in the oxidation furnace boiler tube of thermotropism, purges boiler tube inside with nitrogen, manufacturing environment；
Step S02, with the technique sheet supporting boat in low speed rotation boiler tube, and rises boat to technique travel position from home position；
Step S03, keeps rotating technics sheet supporting boat, technique sheet is carried out main oxidation technology；
Step S04, after main oxidation technology completes, keeps rotating technics sheet supporting boat, from technique travel position fall boat to original
Position.
The technique sheet supporting boat of the present invention is placed on heat-preserving container, and heat-preserving container is located on quartz disk, and rotating shaft is through at the bottom of oxidation furnace
The art and craft door magnetic fluid in portion is connected with quartz disk, drives the heat-preserving container on quartz disk and technique sheet by external motor drive shaft
Supporting boat realizes rotating.By step S02 to S04, rise boat, main oxidation technology and the process of fall boat at technique sheet supporting boat
Middle holding low speed rotation, reduces temperature field, airflow field skewness and technique sheet becomes the impact of film uniformity.Below with this
The preferred embodiment of invention illustrates each step of the present invention.
Refer to Fig. 1, the method that the raising technique sheet of the present embodiment becomes film uniformity, comprising:
Step S00, in stablizing oxidation furnace boiler tube, temperature is between 600-800 DEG C, opens blower fan and makes blast velocity control exist
Between 0.3-0.5m/s, to form metastable air-flow.
Step S01, is passed through high pure nitrogen in boiler tube, and flow-control is between 500-1000SLM.
Step S021, rotates the technique sheet supporting boat being loaded with silicon chip, simultaneously with the liter of 100mm/min with the speed of 2rpm
Boat speed is by technique sheet supporting boat from the height and position of home position liter boat to 1550mm, and this step improves temperature by rotation
Field, the relatively uniform distribution of airflow field；
Step S022, with the speed rotating technics sheet supporting boat of 2rpm, simultaneously with the liter boat speed of 50mm/min by technique
Sheet supporting boat continues to rise boat and improves temperature field, airflow field to technique travel position, the most main process station, this step by rotation
Relatively uniform distribution.
Wherein, rise boat process and be divided into above two steps to carry out, and the boat speed that rises of second step is less than the liter boat speed of the first step,
Purpose is to give certain buffering, will arrive the height of technique travel position, reduces and rises boat speed, can avoid
Because of excessive velocities at technique travel position all standing, cause rotating shaft to the impact of parts at art and craft door, prevent art and craft door parts such as
The damage of sealing ring etc..
Wherein, it is passed through a small amount of oxygen (250SCCM), to produce oxidation environment during rising boat.
Step S03, carries out main oxidation technology to technique sheet, including temperature stabilization, heats up, aoxidizes main technique, cooling and temperature
Degree stabilizing step, those steps are step commonly used in the art, therefore repeat no more.
Wherein, the amount of oxygen that main oxidation technology is passed through can be between 500-1000SLM.
Step S041, main oxidation technology stablize oxidation furnace boiler tube after completing in temperature in 600-800 DEG C, subsequently, with 2rpm
Speed rotating technics sheet supporting boat, simultaneously with the fall boat speed of 50mm/min by technique sheet supporting boat fall boat to 1550mm
Height and position, this step improves the relatively uniform distribution of temperature field, airflow field by rotation；
Step S042, with the speed rotating technics sheet supporting boat of 2rpm, simultaneously with the fall boat speed of 100mm/min by work
Skill sheet supporting boat fall boat, to the height of distance home position 10mm, subsequently, continues to hold with the speed rotating technics sheet of 2rpm
Stopping the rotation after carrying boat 30s, this step improves the relatively uniform distribution of temperature field, airflow field by rotation；
Step S043, after technique of stopping the rotation sheet supporting boat, drops technique sheet supporting boat with the fall boat speed of 20mm/min
Boat is to home position.
Wherein, fall boat process is divided into above three to carry out step by step, and the fall boat speed of the first step is less than the fall boat speed of second step,
Purpose is to give certain buffering, moves down from the height of technique travel position, is gradually increased fall boat speed, permissible
Avoid excessive velocities and avoiding at home position all standing at the very start, and cause rotating shaft to the impact of parts at art and craft door, anti-
The only damage of art and craft door parts such as sealing ring etc..
Wherein, after technique sheet supporting boat fall boat to the height of distance home position 10mm, low speed rotation technique sheet is continued
Supporting boat 30s, also for buffering.Wherein it is possible to rise first low speed rotation 10-60s before boat at technique sheet supporting boat,
Also for buffering.
Step S05, closes fire door, is passed through nitrogen, to cool down technique sheet.
Wherein, all risings of technique sheet supporting boat in this method, decline, spinning movement are all to have certain acceleration, and
It is made to slowly reach above-mentioned each kinematic parameter.
In the present embodiment, the speed of rotation of technique sheet supporting boat remains at the lower-speed state of 2rpm, improve temperature field,
While airflow field is evenly distributed, it is ensured that the stability of technique sheet supporting boat.In other embodiments, the speed of rotation is permissible
Between 1-5rpm.
In the present embodiment, technique sheet supporting boat carries 125-150 blade technolgy sheet, and supporting boat bottom has heat-preserving container, insulation
The total height of bucket and supporting boat is 1440-1500mm.
In the present embodiment, blower fan is held open during whole technique, and wind speed is the lowest can not reach fast cooling effect,
The highest easy generation noise of wind speed, therefore wind speed setting value to control at 0.3-0.5m/s, forms metastable air-flow.
In the present embodiment, be passed through in boiler tube is high pure nitrogen, makes technique sheet be in nitrogen atmosphere in lifting process all the time,
Both ensure that the thickness of technique sheet, and also prevent the impurity particle in air and enter into boiler tube causes sources of particles；At blower fan
Under effect, nitrogen is cycle purge in boiler tube, has both controlled the oxygen content in boiler tube, can promote that again heat scatters and disappears.
In the present embodiment, step S05 is for closing fire door, under the purging of high pure nitrogen, makes technique sheet cool down 20-60min
(concrete cool time visual technology type depending on), reducing the temperature of technique sheet, the warpage making high temperature cause technique sheet becomes
Shape is restored, it is to avoid mechanical hand rubs with technique sheet, causes sources of particles；Treat that technique sheet temperature is reduced to 20-30 DEG C
Afterwards, the most desirable.
Claims (10)
1. one kind is improved the method that technique sheet becomes film uniformity, it is characterised in that comprising:
Step S01, is passed through nitrogen in the oxidation furnace boiler tube of thermotropism；
Step S02, rotating technics sheet supporting boat, described technique sheet supporting boat is risen boat simultaneously to technique stroke from home position
Position；
Step S03, keeps rotating described technique sheet supporting boat, technique sheet is carried out main oxidation technology simultaneously；
Step S04, after main oxidation technology completes, by described technique sheet supporting boat from described technique travel position fall boat to described
Home position, wherein at described technique sheet supporting boat while described technique travel position drops to above described home position
Keep rotating described technique sheet supporting boat.
The method that raising technique sheet the most according to claim 1 becomes film uniformity, it is characterised in that: step S02
Including step S021 rotating technics sheet supporting boat, rise boat to primary importance, step S022 with First Speed from home position simultaneously
Keeping rotating technics sheet supporting boat, simultaneously rise boat to technique travel position with second speed, wherein, this second speed is less than the
One speed；After step S04 includes that the main oxidation technology of step S041 completes, keep rotating technics sheet supporting boat, simultaneously with the
Three speed fall boats keep rotating technics sheet supporting boat to the second position, step S042, simultaneously with fourth speed fall boat to the 3rd
Position, step S043 stops the rotation technique sheet supporting boat, and with this third speed fall boat to this home position, wherein, should
Third speed is less than fourth speed.
The method that raising technique sheet the most according to claim 2 becomes film uniformity, it is characterised in that: the method is revolved
The speed of rotation of skill of changing a job sheet supporting boat is to be rotating Vortex in 1-5rpm, and each step.
The method that raising technique sheet the most according to claim 2 becomes film uniformity, it is characterised in that: this First Speed
Being 100-150mm/min with fourth speed scope, this second speed and third speed scope are 20-50mm/min.
The method that raising technique sheet the most according to claim 2 becomes film uniformity, it is characterised in that: this primary importance
With the second position is above home position between 1550-1600mm, the 3rd position above home position 10-20mm it
Between.
The method that raising technique sheet the most according to claim 2 becomes film uniformity, it is characterised in that: step S02
First rotating technics sheet supporting boat 10-60s before middle liter of boat, the speed of rotation is 1-5rpm, drops boat to the 3rd in step S042
Putting continuation rotating technics sheet supporting boat 10-60s afterwards, the speed of rotation is 1-5rpm.
The method that raising technique sheet the most according to claim 2 becomes film uniformity, it is characterised in that: step S01
The most also include step S00, stablize temperature in oxidation furnace boiler tube, and open blower fan to form steady air flow, in step S04
Temperature in oxidation furnace boiler tube is first stablized before fall boat.
The method that raising technique sheet the most according to claim 7 becomes film uniformity, it is characterised in that: step S00
In stablize oxidation furnace boiler tube in temperature in 600-800 DEG C, opening blower fan wind speed is 0.3-0.5m/s, stable oxidation in step S04
In stove boiler tube, temperature is in 600-800 DEG C, and be passed through in step S01 is high pure nitrogen, and its flow is 500-1000SLM.
The method that raising technique sheet the most according to claim 2 becomes film uniformity, it is characterised in that: step S02
During be passed through a small amount of oxygen, be not passed through oxygen during step S04, described in step S03, main oxidation technology includes temperature
Stably, intensification, oxidation technology, cooling and temperature stabilization.
The method that raising technique sheet the most according to claim 1 becomes film uniformity, it is characterised in that: this method is also wrapped
Include step S05, close fire door, be passed through nitrogen, to cool down technique sheet.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410174514.9A CN103928317B (en) | 2014-04-28 | 2014-04-28 | Improve the method that technique sheet becomes film uniformity |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410174514.9A CN103928317B (en) | 2014-04-28 | 2014-04-28 | Improve the method that technique sheet becomes film uniformity |
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| CN103928317A CN103928317A (en) | 2014-07-16 |
| CN103928317B true CN103928317B (en) | 2016-10-26 |
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| CN106257625B (en) * | 2016-08-19 | 2019-02-05 | 横店集团东磁股份有限公司 | A kind of stack high-temperature annealing process |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223432A (en) * | 1998-11-26 | 2000-08-11 | Tokyo Electron Ltd | Thermal treatment apparatus |
| US6435865B1 (en) * | 2001-07-30 | 2002-08-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for positioning gas injectors in a vertical furnace |
| US6464825B1 (en) * | 1999-06-15 | 2002-10-15 | Ebara Corporation | Substrate processing apparatus including a magnetically levitated and rotated substrate holder |
| CN1428824A (en) * | 2001-12-28 | 2003-07-09 | 旺宏电子股份有限公司 | Thermal-oxidative production process of semiconductor wafer |
| CN101207010A (en) * | 2006-12-14 | 2008-06-25 | 应用材料股份有限公司 | A substrate processing apparatus |
| CN101896995A (en) * | 2007-12-20 | 2010-11-24 | 应用材料股份有限公司 | Thermal reactor with air-flow distribution of improvement |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1013984C2 (en) * | 1999-12-29 | 2001-07-02 | Asm Int | Method and device for treating substrates. |
| JP2010239115A (en) * | 2009-03-10 | 2010-10-21 | Hitachi Kokusai Electric Inc | Substrate processing apparatus |
-
2014
- 2014-04-28 CN CN201410174514.9A patent/CN103928317B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223432A (en) * | 1998-11-26 | 2000-08-11 | Tokyo Electron Ltd | Thermal treatment apparatus |
| US6464825B1 (en) * | 1999-06-15 | 2002-10-15 | Ebara Corporation | Substrate processing apparatus including a magnetically levitated and rotated substrate holder |
| US6435865B1 (en) * | 2001-07-30 | 2002-08-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for positioning gas injectors in a vertical furnace |
| CN1428824A (en) * | 2001-12-28 | 2003-07-09 | 旺宏电子股份有限公司 | Thermal-oxidative production process of semiconductor wafer |
| CN101207010A (en) * | 2006-12-14 | 2008-06-25 | 应用材料股份有限公司 | A substrate processing apparatus |
| CN101896995A (en) * | 2007-12-20 | 2010-11-24 | 应用材料股份有限公司 | Thermal reactor with air-flow distribution of improvement |
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Address after: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee after: North China Science and technology group Limited by Share Ltd. Address before: 100016 Jiuxianqiao East Road, Beijing, No. 1, No. Patentee before: BEIJING SEVENSTAR ELECTRONIC Co.,Ltd. |
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Effective date of registration: 20180123 Address after: 100176 No. 8, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: North China Science and technology group Limited by Share Ltd. |