CN103915366A - Improved quartz tube cap used for sealing quartz tube - Google Patents
Improved quartz tube cap used for sealing quartz tube Download PDFInfo
- Publication number
- CN103915366A CN103915366A CN201410099823.4A CN201410099823A CN103915366A CN 103915366 A CN103915366 A CN 103915366A CN 201410099823 A CN201410099823 A CN 201410099823A CN 103915366 A CN103915366 A CN 103915366A
- Authority
- CN
- China
- Prior art keywords
- quartz tube
- pipe cap
- quartz
- cap body
- quartzy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 106
- 239000010453 quartz Substances 0.000 title claims abstract description 78
- 238000007789 sealing Methods 0.000 title abstract description 7
- 239000003708 ampul Substances 0.000 claims description 25
- 239000000377 silicon dioxide Substances 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 4
- UEZVMMHDMIWARA-UHFFFAOYSA-N Metaphosphoric acid Chemical compound OP(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Closures For Containers (AREA)
Abstract
The invention discloses an improved quartz tube cap used for sealing a quartz tube. The improved quartz tube cap comprises a quartz tube cap body (1), wherein a quartz handle (2) is arranged on the outer surface of the quartz tube cap body (1). The improved quartz tube cap is characterized in that the inner surface of the quartz tube cap body (1) is in a plane state so that the inner surface of the quartz tube cap body (1) can make full contact with the tube opening plane of the quartz tube (4), and the quartz handle (2) is provided with a hold-down spring (5) which enables the inner surface of the quartz tube cap body (1) to be attached to the tube opening plane of the quartz tube (4). The contact mode of the quartz tube cap and the quartz tube is changed to a plane contact mode, the hold-down spring is adopted to press the quartz tube cap on the end face of the quartz tube so that the quartz tube can be sealed, and the quartz tube cap can be separated from the quartz tube more easily; the quartz tube cap has the advantages of being simple in structure, convenient to operate and good in sealing performance, improves work efficiency and is suitable for being popularized and used in semiconductor silicon wafer production.
Description
Technical field
The present invention relates to the diffusion facilities of silicon chip in semiconductor technology, specifically a kind of simple in structure, easy to operate and good airproof performance is for the modified model quartz pipe cap of sealed silica envelope.
Background technology
In existing technique, the general quartzy cap sealed silica envelope that has ground that adopts, structural representation when quartzy pipe cap of the prior art and sealed silica envelope as shown in Figure 1, this quartz pipe cap comprises quartzy pipe cap body 1, quartzy handgrip 2 and venthole 3, together with quartz pipe cap body 1 is intermeshing by the ground on himself inwall and ground on the outer wall of the end of quartz ampoule 4, realize the sealing of quartz ampoule 4 and fixing of quartzy pipe cap body 1, the quartzy pipe cap body 1 that the dorsal part of quartzy pipe cap body 1 is provided with quartzy handgrip 2 and quartzy handgrip 2 sides is provided with venthole 3.In use, in the time using on the diffusion quartz tube that generates metaphosphoric acid, the metaphosphoric acid of generation is bonded together quartz ampoule and quartzy pipe cap to this quartz pipe cap, and pipe cap is got to be got off; And separating also of quartzy pipe cap and quartz ampoule 4 bothers relatively at ordinary times.
Summary of the invention
The object of the invention is the defect existing for existing quartzy pipe cap, the modified model quartz pipe cap of a kind of simple in structure, easy to operate and good airproof performance for sealed silica envelope is provided.
The object of the invention is to solve by the following technical programs:
A kind of quartz of the modified model for sealed silica envelope pipe cap, comprise quartzy pipe cap body, outer surface on quartz pipe cap body is provided with quartzy handgrip, and the inner surface that it is characterized in that described quartzy pipe cap body is flat state the inner surface of quartzy pipe cap body and the orifice plane of quartz ampoule are contacted entirely; Described quartzy handgrip is provided with holddown spring, this holddown spring make the inner surface of quartzy pipe cap body and the orifice plane of quartz ampoule bonded to each other.
Described quartzy pipe cap body is " Contraband " font, and the facade in the quartzy pipe cap body of " Contraband " font and the orifice plane of quartz ampoule are bonded to each other.
Described quartzy pipe cap body is provided with venthole.
Described venthole is positioned on the facade of quartzy pipe cap body.
Described quartzy pipe cap body and quartzy handgrip adopt pure quartz to make.
The present invention has the following advantages compared to existing technology:
The present invention is by changing the way of contact of quartzy pipe cap and quartz ampoule into plane contact, and adopt holddown spring quartzy pipe cap to be pressed on the end face of quartz ampoule to play sealing function, quartz pipe cap without ground, smooth without leaking gas and contacting completely, makes quartzy pipe cap easier with separating of quartz ampoule with quartz ampoule contact position; This quartz pipe cap has the feature of simple in structure, easy to operate and good airproof performance, has improved operating efficiency, suitable semi-conductor silicon chip produce in promote the use of.
Brief description of the drawings
Cross section structure schematic diagram when accompanying drawing 1 is quartzy pipe cap of the prior art and sealed silica envelope;
Cross section structure schematic diagram when accompanying drawing 2 is quartzy pipe cap of the present invention and sealed silica envelope.
Wherein: 1-quartzy pipe cap body; 2-quartzy handgrip; 3-venthole; 4-quartz ampoule; 5-holddown spring.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the present invention is further illustrated.
As shown in Figure 2: a kind of quartz of the modified model for sealed silica envelope pipe cap, comprise quartzy pipe cap body 1, outer surface on quartz pipe cap body 1 is provided with quartzy handgrip 2, quartz pipe cap body 1 and quartzy handgrip 2 adopt pure quartz to make, the inner surface of this quartz pipe cap body 1 is flat state the inner surface of quartzy pipe cap body 1 is contacted entirely with the orifice plane of quartz ampoule 4, quartz handgrip 2 be provided with holddown spring 5, this holddown spring 5 make the inner surface of quartzy pipe cap body 1 and the orifice plane of quartz ampoule 4 bonded to each other; Specifically quartzy pipe cap body 1 is " Contraband " font, and the facade in the quartzy pipe cap body 1 of " Contraband " font and the orifice plane of quartz ampoule 4 are bonded to each other.On quartzy pipe cap body 1, be provided with venthole 3 in addition, this venthole 3 is positioned on the facade of quartzy pipe cap body 1.
When modified model quartz pipe cap of the present invention uses, by bonded to each other the orifice plane of the facade of quartzy pipe cap body 1 and quartz ampoule 4, then positioning compression spring 5, fits tightly in the orifice plane of quartz ampoule 4 inner surface of quartzy pipe cap body 1, plays sealing function; In the time that this modified model quartz pipe cap does not use, the location of removing holddown spring 5, can take off this modified model quartz pipe cap from the mouth of pipe of quartz ampoule 4.
The present invention is by changing the way of contact of quartzy pipe cap and quartz ampoule 4 into plane contact, and adopt holddown spring quartzy pipe cap to be pressed on the end face of quartz ampoule 4 to play sealing function, quartz pipe cap without ground, smooth without leaking gas and contacting completely, makes quartzy pipe cap easier with separating of quartz ampoule 4 with quartz ampoule 4 contact positions; This quartz pipe cap has the feature of simple in structure, easy to operate and good airproof performance, has improved operating efficiency, suitable semi-conductor silicon chip produce in promote the use of.
Above embodiment only, for explanation technological thought of the present invention, can not limit protection scope of the present invention with this, every technological thought proposing according to the present invention, and any change of doing on technical scheme basis, within all falling into protection range of the present invention; The technology that the present invention does not relate to all can be realized by prior art.
Claims (5)
1. the quartz of the modified model for a sealed silica envelope pipe cap, comprise quartzy pipe cap body (1), outer surface on quartz pipe cap body (1) is provided with quartzy handgrip (2), and the inner surface that it is characterized in that described quartzy pipe cap body (1) is flat state the inner surface of quartzy pipe cap body (1) is contacted entirely with the orifice plane of quartz ampoule (4); Described quartzy handgrip (2) is provided with holddown spring (5), this holddown spring (5) make the inner surface of quartzy pipe cap body (1) and the orifice plane of quartz ampoule (4) bonded to each other.
2. the quartz of the modified model for sealed silica envelope pipe cap according to claim 1, it is characterized in that described quartzy pipe cap body (1) is " Contraband " font, the facade in the quartzy pipe cap body (1) of " Contraband " font and the orifice plane of quartz ampoule (4) are bonded to each other.
3. the quartz of the modified model for sealed silica envelope pipe cap according to claim 1 and 2, is characterized in that described quartzy pipe cap body (1) is provided with venthole (3).
4. the quartz of the modified model for sealed silica envelope pipe cap according to claim 3, is characterized in that described venthole (3) is positioned on the facade of quartzy pipe cap body (1).
5. the quartz of the modified model for sealed silica envelope pipe cap according to claim 1, is characterized in that described quartzy pipe cap body (1) and quartzy handgrip (2) adopt pure quartz to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410099823.4A CN103915366A (en) | 2014-03-18 | 2014-03-18 | Improved quartz tube cap used for sealing quartz tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410099823.4A CN103915366A (en) | 2014-03-18 | 2014-03-18 | Improved quartz tube cap used for sealing quartz tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103915366A true CN103915366A (en) | 2014-07-09 |
Family
ID=51040960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410099823.4A Pending CN103915366A (en) | 2014-03-18 | 2014-03-18 | Improved quartz tube cap used for sealing quartz tube |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103915366A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105508744A (en) * | 2016-01-07 | 2016-04-20 | 湖州奥博石英科技有限公司 | Inclined ground quartz tube structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050034973A1 (en) * | 2001-11-15 | 2005-02-17 | Timothy Kelley | Discharge reactor fuse link |
| CN1901763A (en) * | 2006-06-01 | 2007-01-24 | 胡坤旺 | Detachable guartz heating tube |
| CN201096818Y (en) * | 2007-11-15 | 2008-08-06 | 上海康阔光通信技术有限公司 | Sensing optical fiber ring |
| CN202849232U (en) * | 2012-08-27 | 2013-04-03 | 浙江富通光纤技术有限公司 | Graphite furnace for sintering glass loose mass |
| CN202853939U (en) * | 2012-10-29 | 2013-04-03 | 宁波电业局 | Oil sampling device |
| CN203839354U (en) * | 2014-03-18 | 2014-09-17 | 宜兴市环洲微电子有限公司 | An improved quartz tube cap used for sealing a quartz tube |
-
2014
- 2014-03-18 CN CN201410099823.4A patent/CN103915366A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050034973A1 (en) * | 2001-11-15 | 2005-02-17 | Timothy Kelley | Discharge reactor fuse link |
| CN1901763A (en) * | 2006-06-01 | 2007-01-24 | 胡坤旺 | Detachable guartz heating tube |
| CN201096818Y (en) * | 2007-11-15 | 2008-08-06 | 上海康阔光通信技术有限公司 | Sensing optical fiber ring |
| CN202849232U (en) * | 2012-08-27 | 2013-04-03 | 浙江富通光纤技术有限公司 | Graphite furnace for sintering glass loose mass |
| CN202853939U (en) * | 2012-10-29 | 2013-04-03 | 宁波电业局 | Oil sampling device |
| CN203839354U (en) * | 2014-03-18 | 2014-09-17 | 宜兴市环洲微电子有限公司 | An improved quartz tube cap used for sealing a quartz tube |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105508744A (en) * | 2016-01-07 | 2016-04-20 | 湖州奥博石英科技有限公司 | Inclined ground quartz tube structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140709 |