CN103909685A - Adhesive-free supporting insulation part hot press molding process - Google Patents
Adhesive-free supporting insulation part hot press molding process Download PDFInfo
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- CN103909685A CN103909685A CN201210597168.6A CN201210597168A CN103909685A CN 103909685 A CN103909685 A CN 103909685A CN 201210597168 A CN201210597168 A CN 201210597168A CN 103909685 A CN103909685 A CN 103909685A
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Abstract
The invention relates to an adhesive-free supporting insulation part hot press molding process. Appropriate water filter nets are arranged above and under qualified wet ground paper, then formed ground paper is fed into a temperature regulated hot press mold in a temperature regulated press machine to be pressed, the heating temperature of the hot press mold is 50-130 DEG C, the pressure of the hot press mold is 0.19-0.26MPa, and moisture of a pressed blank is 3-6%. The heating temperature of the hot press mold includes three stages, the starting heating temperature is 70 DEG C, the starting pressure is 0.20+/-0.01MPa, the middle-stage heating temperature is 120-130 DEG C, the later-stage cooling temperature is 50 DEG C, the pressure is 0.25+/-0.01MPa, and the heating and pressurizing time depends on the thickness of the ground paper. Products produced by the adhesive-free supporting insulation part hot press molding process are good in electrical insulation performance and high in technical content, and the safety guarantee coefficient of a transformer is improved compared with laminated paper boards.
Description
Technical field
The present invention relates to adhesion without adhesiver L-type support insulators hot press forming technology, belong to transformer and use insulating materials field.
Background technology
Compacting adhesion without adhesiver L-type support insulators is mainly to replace laminated cardboard L-type support insulators to do insulation fabric part for transformer key position.Transformer is all with paperboard bonding, dry processing for making the L-type support insulators of insulation fabric part at present, this processing method is because wherein containing adhesive, and product exists hole and water channel, and thickness is irregular, density unevenness, the uniformity of its insulating properties and uniformity can not guarantee.And adhesive in laminated paperboard affects the performance of oil in transformer, directly affect the withstand voltage properties of transformer, simultaneously, because the polarity of adhesive is much larger than pure insulation paper pulp, polarity effect in high voltage electric field and interfacial effect are the main causes that causes nonuniformity insulating materials electrical strength to be lost, especially direct current ± 600 with exchange 1000kv more than transformer in, it is very serious that the harmful effect of adhesive seems.
Summary of the invention
The object of the invention is to produce the hot press forming technology of adhesion without adhesiver L-type support insulators.
Technical scheme of the present invention is achieved in that pure sulfate insulation pulps through pretreatment, carry out pulping, be concentrated into stock tank, paper pulp is delivered to fiberizer with stock pump, wears into and meet 38 ± 3 ° of SR of beating degree of technological requirement, the slurries of weight in wet base 11 ± 2g, the slurry of milled is made into 0.6 ± 0.1% concentration slurry, remove after impurity through low dense high-efficiency taper desander, carry out fiber screening by pressurized screen again, then by multi-pipeline nozzle, qualified paper pulp is sent into net type l Water Paper former.In the time that qualified paper pulp is sent into l Water Paper former, open vavuum pump simultaneously and dewater, paper pulp is full of to l Water Paper former, after l Water Paper dehydration, require moisture 65-80%, reach after requirement, l Water Paper base is taken out from l Water Paper former.At l Water Paper base upper and lower, suitable water strainer is set, then moulding ground paper is sent in the temp .-regulating type hot pressing die in pressure-adjusting type press and suppressed; The heating-up temperature of hot pressing die is 50-130 ℃, and pressure is 0.19-0.26MPa, and after compacting, the moisture of blank is 3-6%.The heating-up temperature of hot pressing die is preferably divided into three phases: initial heating-up temperature is 70 ℃, and mid-term, heating-up temperature was 120-130 ℃, and later stage chilling temperature is below 50 ℃; The initial pressure of Workpiece carrier is 0.20 ± 0.01MPa, and final bearing pressure is 0.25 ± 0.01MPa, heats the thickness of pressing time depending on ground paper, generally the moisture of blank after compacting is controlled to about 3-6%.Desirable adhesion without adhesiver L-type support insulators, moisture is 5%, density is 1.10-1.2g/cm
3.And then adhesion without adhesiver L-type support insulators having in the high speed cutting of table top under insulation protection and baffle plate, be cut into the applicable size of user in suitable process speed incision; Remove cutting dirt and burrs on edges, also put in storage with plastic bag vacuum packaging.
Advantage of the present invention is: 1, adhesion without adhesiver L-type support insulators is compared with laminated cardboard L-type support insulators (multiple insulating board gummeds form): owing to there is no gluing thing, the fiber fineness of manufactured goods is high, with the soak process of transformer oil in, intermiscibility is better, in process of osmosis, penetration power is stronger, show oil absorbency much larger than laminated cardboard (up to 1.8 times), and the parallel insulaion resistance of having avoided glue-line and cardboard to form, thereby greatly improve electrical insulation properties, the commutator transformer that is particularly useful for extreme high voltage AC transformer and each electric pressure is used as outlet insulating component, 2, adhesion without adhesiver L-type support insulators, due to fiber high purity, less than laminated cardboard dielectric loss, can improve the use voltage of transformer, increase the service life of transformer, improve transformer quality safety assurance coefficient.3, adhesion without adhesiver L-type support insulators technology difficulty is large, with high content of technology, has good economic benefit.
Accompanying drawing explanation
Fig. 1 is the hot press forming technology flow chart of adhesion without adhesiver L-type support insulators.
The specific embodiment
As shown in Figure 1, wood pulp (1) process is purified to pretreatment (2) again through pulping (3), concentrated (4) to the concentration 4.0 ± 0.5% of slurry after size degradation enters brown stock chest (5), by stock pump (6), slurry is delivered to fiberizer (7), the slurry of milled is sent machine chest (8) to, send into efficient low dense scummer (10) by stock pump (9) again, after slagging-off, send into l Water Paper base former (12) by stock pump (11) again, vavuum pump (12a) auxiliary suction water simultaneously, carry out after 30-45 minute, estimate that moisture content reaches 73% left and right, take out l Water Paper base and divide sanction (13), send into hot pressing die (14) squeezing dry, the initial heating-up temperature of hot pressing stage by stage (15) mould is 70 ℃, mid-term, heating-up temperature was 120-130 ℃, later stage chilling temperature is below 50 ℃, the initial pressure of Workpiece carrier is 0.020 ± 0.01MPa, final bearing pressure is 0.25 ± 0.01MPa, drying time is depending on paper thinkness, being dried to moisture in adhesion without adhesiver L-type support insulators blank is 4-6%, release enters semi-finished product chamber balance (16) and processes 3-5 days, carry out again cutting edge and machining (17), qualified through check (18), vacuum packaging (19) warehouse-in (20).
Claims (2)
1. an adhesion without adhesiver support insulators hot press forming technology, it is, at qualified l Water Paper base upper and lower, suitable water strainer is set, then moulding ground paper is sent in the temp .-regulating type hot pressing die in pressure-adjusting type press and suppressed, the heating-up temperature of hot pressing die is 50-130 ℃, pressure is 0.19-0.26MPa, and after compacting, the moisture of blank is 3-6%.
2. hot press forming technology according to claim 1, it is characterized in that: the heating-up temperature of hot pressing die is divided into three phases, initial heating-up temperature is 70 ℃, initial pressure 0.20 ± 0.01MPa, mid-term heating-up temperature 120-130 ℃, later stage chilling temperature is 50 ℃, and pressure is 0.25 ± 0.01MPa, heats the thickness of pressing time depending on ground paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210597168.6A CN103909685A (en) | 2012-12-31 | 2012-12-31 | Adhesive-free supporting insulation part hot press molding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210597168.6A CN103909685A (en) | 2012-12-31 | 2012-12-31 | Adhesive-free supporting insulation part hot press molding process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103909685A true CN103909685A (en) | 2014-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210597168.6A Pending CN103909685A (en) | 2012-12-31 | 2012-12-31 | Adhesive-free supporting insulation part hot press molding process |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1156080A (en) * | 1996-08-09 | 1997-08-06 | 昆明市木器厂 | High strength electrical laminated wood and its preparing method |
| US5906713A (en) * | 1993-12-27 | 1999-05-25 | Taiwan Suger Corporation | Method of preparing biodegradable, water-resistant, and molded paper board |
| JP2004300591A (en) * | 2003-03-28 | 2004-10-28 | Mitsubishi Heavy Ind Ltd | Method for making paper and paper machine |
| CN101783238A (en) * | 2009-09-21 | 2010-07-21 | 湖南广信电工科技股份有限公司 | Process for producing insulating press boards of transformers |
| CN101781869A (en) * | 2009-09-21 | 2010-07-21 | 湖南广信电工科技股份有限公司 | Drying process of super thick insulated pressboard |
| CN101783241A (en) * | 2009-09-21 | 2010-07-21 | 湖南广信电工科技股份有限公司 | Process for producing transposed oxhorn cushion block of insulated coil of transformer |
-
2012
- 2012-12-31 CN CN201210597168.6A patent/CN103909685A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5906713A (en) * | 1993-12-27 | 1999-05-25 | Taiwan Suger Corporation | Method of preparing biodegradable, water-resistant, and molded paper board |
| CN1156080A (en) * | 1996-08-09 | 1997-08-06 | 昆明市木器厂 | High strength electrical laminated wood and its preparing method |
| JP2004300591A (en) * | 2003-03-28 | 2004-10-28 | Mitsubishi Heavy Ind Ltd | Method for making paper and paper machine |
| CN101783238A (en) * | 2009-09-21 | 2010-07-21 | 湖南广信电工科技股份有限公司 | Process for producing insulating press boards of transformers |
| CN101781869A (en) * | 2009-09-21 | 2010-07-21 | 湖南广信电工科技股份有限公司 | Drying process of super thick insulated pressboard |
| CN101783241A (en) * | 2009-09-21 | 2010-07-21 | 湖南广信电工科技股份有限公司 | Process for producing transposed oxhorn cushion block of insulated coil of transformer |
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Application publication date: 20140709 |