CN103904493B - A kind of adapter and processing method thereof - Google Patents
A kind of adapter and processing method thereof Download PDFInfo
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- CN103904493B CN103904493B CN201410159228.5A CN201410159228A CN103904493B CN 103904493 B CN103904493 B CN 103904493B CN 201410159228 A CN201410159228 A CN 201410159228A CN 103904493 B CN103904493 B CN 103904493B
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- 238000003672 processing method Methods 0.000 title claims description 10
- 239000003292 glue Substances 0.000 claims abstract description 71
- 238000002347 injection Methods 0.000 claims abstract description 35
- 239000007924 injection Substances 0.000 claims abstract description 35
- 238000009413 insulation Methods 0.000 claims abstract description 31
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 22
- 239000000126 substance Substances 0.000 claims abstract description 20
- 230000001427 coherent effect Effects 0.000 claims abstract description 10
- 238000004891 communication Methods 0.000 claims abstract description 9
- 238000007711 solidification Methods 0.000 claims abstract description 6
- 230000008023 solidification Effects 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims description 17
- 230000000994 depressogenic effect Effects 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 230000009969 flowable effect Effects 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 6
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 238000003786 synthesis reaction Methods 0.000 abstract description 3
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
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Abstract
nullThe present invention relates to a kind of adapter，Including insulation division，Described insulation division is connected to Plug contact portion and side joint contact portion，Described insulation division is built-in with conducting terminal and is electrically connected in described Plug contact portion and side joint contact portion，Described conducting terminal includes ground terminal and high-speed communication terminal，The glue injection channel of coherent described ground terminal is formed in described insulation division，It is molded with conductive materials in described glue injection channel，Can be according to the glue injection channel that ground terminal is attached specifically being configured shape in described insulation division，It is molded again and into conductive materials, described ground terminal is coupled together，Revise the synthesis resonant frequency of ground terminal，Use the liquid conductive substance of easily solidification compared to prior art uses metal bridge frame member，Bigger contact area can be provided，Make connection more stable，And arrange more convenient，Can be at various types of High Speed I/O、The adapters such as High speed rear panel arrange passage on demand and is molded，Flexible and changeable，Range is extensive.
Description
Technical field
The present invention relates to adapter and the processing method thereof of a kind of high-speed communication.
Background technology
High speed connector (High-Speed Connector), back panel connector (Backplane Connector)
It is large-scale communication apparatus, very-high performance server and supercomputer, industrial computer, high-end storage device
A conventional class adapter, its Main Function is connecting single board (daughter card) and backboard, veneer and
90 degree of vertical stratifications, transmission high-speed differential signal (differencial signal) or single-ended is become between backboard
Signal (single end signal) and transmit big electric current.
But being as increasing of signal frequency, the electrical and physical length of adapter becomes the factor more needing to consider,
For Te Bie, the electrical length of the terminal in adapter is probably due to effective electrical length of terminal and signalling
Wavelength contained in effect can occur a resonance condition in becoming close and making adapter.Therefore, even if
It is composed as the connector system of Difference signal pair can be used also to start along with increasing of frequency to come into question.
But, two or more ground based terminals can be coupled by this problem by a bridge joint mode, can revise two
The produced resonant frequency of ground based terminal so that connector system with good performance in higher frequency
Under stable work, such as Chinese invention Publication No. CN102282731A, entitled " resonance revises and connects
Device " in disclose and provide a kind of connector assembly, described connector assembly is suitable for controlling for shielding high-speed
The resonant frequency of the ground terminal of differential pair.Ground terminal can be shared to provide predetermined for ground terminal
Maximum electrical length.The resonant frequency of adapter can be moved on to by the electrical length reducing described ground terminal
Outside signal will be with its frequency range being transmitted.
But this patent uses the bridgeware of metal, because the contact surface of metal structure is little, can easily produce
Life contacts unstable situation, and metal structure is not easy to change shape, and adapter kind is numerous, has
Some connector constructions are special, and the bridgeware of this metal cannot be suitable for.
Summary of the invention
The technical problem to be solved in the present invention is: for overcoming the problems referred to above, it is provided that a kind of employing flowable is led
Adapter that ground terminal is bridged by isoelectric substance flexibly and processing method thereof.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of adapter, including insulation division, described insulation division is connected to Plug contact portion and side joint contact portion,
Described insulation division is built-in with conducting terminal and is electrically connected in described Plug contact portion and side joint contact portion, described conducting end
Attached bag includes ground terminal and high-speed communication terminal, forms coherent described ground terminal in described insulation division
Glue injection channel, is molded with conductive materials in described glue injection channel.
Preferably, described conductive materials is the liquid conductive substance of easily solidification.
Preferably, described conductive materials is conducting resinl.
Preferably, described conductive materials is conductive plastic or conductive heat melten gel.
Preferably, described insulation division includes multilayer insulation sheet, is provided with described conduction in every layer of described insulating trip
Terminal, every layer of described insulating trip forms the injecting glue through hole described glue injection channel of coherent formation, described in two-layer absolutely
Between embolium, injecting glue through hole edge is provided with sealing structure.
Preferably, described sealing structure is the sealing of the injecting glue through hole edge setting described in two-layer between insulating trip
Lobe and sealing depressed part.
Preferably, described ground terminal is being equipped with contact through hole, described contact with described injecting glue through hole
The diameter of through hole is less than described injecting glue through hole.
Preferably, described injecting glue through hole is circular, oval or polygon, and described contact through hole is shaped as circle
Shape, ellipse or polygon.
Preferably, described insulation division outer wrap has shell.
A kind of processing method using above-described adapter, comprises the following steps:
(1) injecting glue through hole will be processed on described insulating trip, and insulating trip described in multilamellar is compound to together；
(2) the described liquid conductive substance described injecting glue through hole of injection is linked up in the glue injection channel formed；
(3) described multilayer insulation sheet is toasted, make described liquid conductive substance be solidified as solid-state.
A kind of processing method using above-described adapter, comprises the following steps:
(1) injecting glue through hole will be processed on described insulating trip, and insulating trip described in multilamellar is compound to together；
(2) described conductive plastic or conductive heat melten gel are heated make it melt as flowable state, and inject
Described injecting glue through hole links up in the glue injection channel formed；
(3) rear post forming it is allowed to cool in described glue injection channel.
The invention has the beneficial effects as follows: present configuration is simple, can be according to specifically carrying out in described insulation division
The glue injection channel being attached by ground terminal of shape is set, then is molded described earth terminal into conductive materials
Son is coupled together, and revises the synthesis resonant frequency of ground terminal, uses the liquid conductive substance of easily solidification
Compared to prior art uses metal bridge frame member, it is provided that bigger contact area, make connection more stable,
And arrange more convenient, can be according to ground terminal in various types of High Speed I/adapter such as O, High speed rear panel
Being configured passage in described insulation division and be molded, flexible and changeable, range is extensive.
Accompanying drawing explanation
The present invention is further described with embodiment below in conjunction with the accompanying drawings.
Fig. 1 is the axonometric chart of the first embodiment of the present invention；
Fig. 2 is the side sectional view of the first embodiment of the present invention；
Fig. 2 A is the enlarged drawing of part A in Fig. 2；
Fig. 2 B is the enlarged drawing of part B in Fig. 2；
Fig. 3 is another side sectional view of the first embodiment of the present invention；
Fig. 4 is the axonometric chart of the second embodiment of the present invention；
Fig. 5 is the sectional view of the second embodiment of the present invention；
Fig. 6 is the sectional view of the third embodiment of the present invention；
Fig. 7 is the sectional view of an alternative embodiment of the invention；
Fig. 8 is the front view of an alternative embodiment of the invention；
Fig. 9 is the front view of an alternative embodiment of the invention；
Figure 10 is the front view of an alternative embodiment of the invention.
Labelling in figure: 1-insulating trip, 2-conductive materials, 11-insulation division, 12-Plug contact portion, 13-side joint
Contact portion, 14-ground terminal, 15-glue injection channel, 16-blind hole, 111-injecting glue through hole, 112-sealing lobe,
113-seals depressed part, 141-contact through hole, 17-megohmite insulant.
Detailed description of the invention
In conjunction with the accompanying drawings, the present invention is further detailed explanation.These accompanying drawings are the schematic diagram of simplification,
The basic structure of the present invention is described the most in a schematic way, and therefore it only shows the composition relevant with the present invention.
The first embodiment of of the present invention a kind of adapter as depicted in figs. 1 and 2, a kind of adapter,
Including insulation division 11, described insulation division 11 uses insulant, preferably plastic cement, described insulation division 11
Being connected to Plug contact portion 12 and side joint contact portion 13, described Plug contact portion 12 and side joint contact portion 13 are adopted
With conductive metallic material, described Plug contact portion 12 is connected with the plug of backboard, in the present embodiment, described
Plug contact portion 12 includes organizing Plug contact more, and described Plug contact includes the contact head coordinated up and down,
And be communicatively coupled by lobe contact plug, described side joint contact portion 13 is connected with veneer, described side joint
Contact portion 13 is the side plug of multiple oval hollow in the present embodiment, as the embodiment that can convert,
Described Plug contact portion 12 and side joint contact portion 13 are specifically at different High Speed I/connector type such as O, High speed rear panel
Can be set to different shapes in number, it is achieved with backboard and the connection of veneer, such as Fig. 1, Fig. 5 and Tu
Two kinds of different settings in 6.
Described insulation division 11 is built-in with conducting terminal and is electrically connected in described Plug contact portion 12 and side joint contact portion 13,
Described conducting terminal includes ground terminal 14 and high-speed communication terminal, and described conducting terminal is in actual applications also
Including the terminal of other functions, such as but not limited to function terminal or bias terminal, described high-speed communication terminal
Carry out different settings according to different models, be respectively used to transmit different Difference signal pairs, owing to being formed
During high-speed-differential pair, terminals of adjacent is electrically coupled together to form the pattern that can be described as first mode.This mould
Formula is for transmitting signal along the terminal constituting differential pair.But, if other signal terminal is also close to this
Difference signal pair, (or two) terminal in differential pair can also be electrically coupled to one or more other
Terminal (therefore forms additional modes, be sometimes referred to as non-artificial pattern).Owing to these additional modes are relative to
One pattern can introduce the cross-talk serving as noise, and therefore, in order to prevent or reduce this cross-talk, it will be poor for needing
Divide and open with other signal shielding.Accordingly, because the above-mentioned trend that terminal position is the most close, difference
Signal is to being generally grounded terminal 14 separately.Ground-signal-signal-ground pattern can be used, and work as
When this pattern is arranged in a row, this makes Difference signal pair be grounded terminal 14 cincture in every side.Because shielding connects
Ground terminal 14 and a problem occurring is to be caused the coupling between terminal by ground terminal 14 and signal
Another pattern.It addition, when transient signal is by adapter, the electricity between two different ground terminals 14
Pressure reduction also can make ground terminal 14 be coupled together.These various couplings define additional modes (and close
Become electromagnetic field) and introduce noise, if communication system works effectively, the most described noise must be with first
Mode Areas is separately；So needing to lead to two or more ground terminals 14 with predetermined maximum electrical length
Cross bridgeware to be coupled together, in order to other desired communication means for some.
Therefore, the present invention forms the glue injection channel of coherent described ground terminal 14 in described insulation division 11
15, it is molded with conductive materials 2 in described glue injection channel 15, described conductive materials 2 can be liquid conductive substance
Or other can be molded into the conductive materials 2 in described glue injection channel 15, will by the conductive materials 2 injected
Described ground terminal 14 couples, and revises the synthesis resonant frequency of ground terminal 14, so that connecting
Device system is with the most stable work of good performance, and the glue injection channel of the present invention can be all
Such as High Speed I/O adapter (SFP, SFP+, zSFP+, QSFP+, zQSFP+, MINI SAS HD, CXP) and
Back panel connector is suitable for, but is not limited to this, it is also possible to be applicable to other accommodable adapters, such as Fig. 8
With the adapter in Fig. 9, Fig. 9 first covers on terminals megohmite insulant 17, uses the most again and lead
Isoelectric substance 2 covers megohmite insulant 17 and connects ground terminal 14, is coupled by ground terminal 14, and rises
Effect to shielding.
In a preferred embodiment, described conductive materials 2 is the liquid conductive substance 2 of easily solidification, described liquid
Conductive materials 2 includes the conductive materials 2 of liquid and semi liquid state, and the benefit using liquid conductive substance 2 is to allow note
Glue passage 15 can be flexible and changeable setting, can be that linear type can also be for shaped form or coherent is logical
Road, such as the second embodiment in Fig. 4 and Fig. 5, also the coherent glue injection channel 15 in Fig. 7, therein
Glue injection channel 15 is through passage, and in passage, ground terminal 14 directly runs through in the past, liquid conductive substance 2
Being to be attached by ground terminal 14 parcel in a second embodiment, liquid conductive substance 2 is above various
Passage can well be molded into, and is filled up by passage, and big with the contact area of ground terminal 14,
Contact is stable, and coupling effect is good, described liquid conductive substance 2 preferably conducting resinl, but is not limited to conduction
Glue, it is also possible to for the liquid conductive substance 2 of other easy solidifications of good performance.
In a preferred embodiment, described conductive materials 2 is conductive plastic or conductive heat melten gel, because conduction is moulded
Glue and conductive heat colloidal sol are solid-state at normal temperatures, need first to be heated before described glue injection channel 15 being molded
Melt.
Described insulation division 11 includes multilayer insulation sheet 1, is provided with described conducting end in every layer of described insulating trip 1
Son, in an embodiment, every layer of described insulating trip 1 is respectively arranged with one or more groups Plug contact and side
Plug, arranges group number different model and specifically arranges, the one or more conducting end arranged in described insulating trip 1
The most corresponding being electrically connected with side plug by Plug contact of son, every layer of described insulating trip 1 forms injecting glue
Through hole 111 is coherent forms described glue injection channel 15, in a preferred embodiment, in first embodiment, institute
Stating glue injection channel 15 is linear type, is provided with close at injecting glue through hole 111 edge described in two-layer between insulating trip 1
Seal structure, described sealing structure is can to seal between the injecting glue through hole 111 of two insulating trips 1,
Making the structure that described glue injection channel 15 is not connected with the gap between two insulating trips 1, described sealing structure can
To play good sealing function in linear glue injection channel 15, prevent the conductive materials 2 injected from entering
Between gap between described insulating trip 1.
In a preferred embodiment, described sealing structure is the injecting glue through hole 111 described in two-layer between insulating trip 1
The sealing lobe 112 that edge is arranged and sealing depressed part 113, in the present embodiment, described sealing lobe
112 is circular protrusions, but is not limited to circular protrusions, it is also possible to for rectangular preiection or other feasible shapes, institute
State sealing depressed part 113 to be correspondingly arranged with described sealing lobe 112, when described glue injection channel 15 is single-pass
Rather than connection passage time, i.e. as the glue injection channel 15 in Fig. 2, then at the bottommost of passage, the most logical
Need to arrange a blind hole 16, as shown in Figure 2 A on last insulating trip 1 that road arrives.
Described ground terminal 14 is being equipped with contact through hole 141 with described injecting glue through hole 111, described in connect
The diameter of tactile through hole 141 is less than described injecting glue through hole 111, as shown in Figure 2 B, in the first embodiment,
Contact through hole 141 makes after liquid conductive substance 2 injects less than injecting glue through hole 111, ground terminal 14
Bigger, as it is shown on figure 3, make contact more stable with the contact area of liquid conductive substance 2.
Described injecting glue through hole 111 is circular, oval or polygon, and described contact through hole 141 is shaped as circle
Shape, ellipse or polygon, the shape of described injecting glue through hole 111 can be identical with contact through hole 141 shape,
Can also differ, the shape of described injecting glue through hole 111 and contact through hole 141 can also be other shapes,
It is not limited to circle, ellipse and polygon.
In preferred embodiment, described insulation division 11 outer wrap has shell.Described shell be conventional can
The material being suitable for, depending on specifically seeing needs.
A kind of processing method using above-described adapter, comprises the following steps:
(1) injecting glue through hole 111 will be processed on described insulating trip 1, and insulating trip described in multilamellar 1 is combined
To together；
(2) described liquid conductive substance 2 is injected the described coherent glue injection channel 15 formed of injecting glue through hole 111
In；
(3) described multilayer insulation sheet 1 is carried out short time low-temperature bake, make described liquid conductive substance 2 coagulate
Admittedly be solid-state.
A kind of processing method using above-described adapter, comprises the following steps:
(1) injecting glue through hole 111 will be processed on described insulating trip 1, and insulating trip described in multilamellar 1 is combined
To together；
(2) described conductive plastic or conductive heat melten gel are heated make it melt as flowable state, and inject
In the described coherent glue injection channel 15 formed of injecting glue through hole 111；
(3) rear post forming it is allowed to cool in described glue injection channel 15.
With the above-mentioned desirable embodiment according to the present invention for enlightenment, by above-mentioned description, related work
Personnel can carry out various change and amendment completely in the range of without departing from this invention technological thought.
The content that the technical scope of this invention is not limited in description, it is necessary to according to right
Determine its technical scope.
Claims (10)
1. an adapter, it is characterised in that include that insulation division, described insulation division are connected to plug and connect
Contact portion and side joint contact portion, described insulation division is built-in with conducting terminal by described Plug contact portion and side joint contact portion electricity
Connecting, described conducting terminal includes ground terminal and high-speed communication terminal, the company of forming in described insulation division
Pass through the glue injection channel of described ground terminal, in described glue injection channel, be molded with conductive materials.
2. adapter as claimed in claim 1, it is characterised in that described conductive materials is the liquid of easily solidification
State conductive materials.
3. adapter as claimed in claim 2, it is characterised in that described conductive materials is conducting resinl.
4. adapter as claimed in claim 1, it is characterised in that described conductive materials be conductive plastic or
Conductive heat melten gel.
5. the adapter as described in any one of claim 1-4, it is characterised in that described insulation division includes many
Layer insulating trip, is provided with described conducting terminal, every layer of described insulating trip forms in every layer of described insulating trip
Injecting glue through hole is coherent forms described glue injection channel, is provided with at injecting glue through hole edge described in two-layer between insulating trip
Seal structure.
6. adapter as claimed in claim 5, it is characterised in that described sealing structure is exhausted described in two-layer
The sealing lobe that injecting glue through hole edge between embolium is arranged and sealing depressed part.
7. adapter as claimed in claim 6, it is characterised in that described ground terminal with described injecting glue
Through hole is equipped with contact through hole, and the diameter of described contact through hole is less than described injecting glue through hole.
8. adapter as claimed in claim 7, it is characterised in that described injecting glue through hole is circular, oval
Shape or polygon, described contact through hole is generally circular in shape, oval or polygon.
9. the processing method of the adapter processed described in claim 2, it is characterised in that include following
Step:
(1) injecting glue through hole will be processed on described insulating trip, and insulating trip described in multilamellar is compound to together；
(2) the described liquid conductive substance described injecting glue through hole of injection is linked up in the glue injection channel formed；
(3) described multilayer insulation sheet is toasted, make described liquid conductive substance be solidified as solid-state.
10. the processing method of the adapter processed described in claim 4, it is characterised in that include with
Lower step:
(1) injecting glue through hole will be processed on described insulating trip, and insulating trip described in multilamellar is compound to together；
(2) described conductive plastic or conductive heat melten gel are heated make it melt as flowable state, and inject
Described injecting glue through hole links up in the glue injection channel formed；
(3) rear post forming it is allowed to cool in described glue injection channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410159228.5A CN103904493B (en) | 2014-04-18 | 2014-04-18 | A kind of adapter and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410159228.5A CN103904493B (en) | 2014-04-18 | 2014-04-18 | A kind of adapter and processing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103904493A CN103904493A (en) | 2014-07-02 |
| CN103904493B true CN103904493B (en) | 2016-09-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410159228.5A Active CN103904493B (en) | 2014-04-18 | 2014-04-18 | A kind of adapter and processing method thereof |
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| Country | Link |
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| CN (1) | CN103904493B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6641438B1 (en) * | 2002-06-07 | 2003-11-04 | Hon Hai Precision Ind. Co., Ltd. | High speed, high density backplane connector |
| CN201699248U (en) * | 2008-12-12 | 2011-01-05 | 莫列斯公司 | Connector with improved resonance |
| CN103594871A (en) * | 2012-08-18 | 2014-02-19 | 温州意华通讯接插件有限公司 | Electric connector |
| CN203813128U (en) * | 2014-04-18 | 2014-09-03 | 苏州雷鸿电子科技有限公司 | Connector |
-
2014
- 2014-04-18 CN CN201410159228.5A patent/CN103904493B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6641438B1 (en) * | 2002-06-07 | 2003-11-04 | Hon Hai Precision Ind. Co., Ltd. | High speed, high density backplane connector |
| CN201699248U (en) * | 2008-12-12 | 2011-01-05 | 莫列斯公司 | Connector with improved resonance |
| CN103594871A (en) * | 2012-08-18 | 2014-02-19 | 温州意华通讯接插件有限公司 | Electric connector |
| CN203813128U (en) * | 2014-04-18 | 2014-09-03 | 苏州雷鸿电子科技有限公司 | Connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103904493A (en) | 2014-07-02 |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215024 Building D, No. 18, Baihe street, Suzhou area, China (Jiangsu) pilot Free Trade Zone, Suzhou, Jiangsu Patentee after: Suzhou Weidazhi Technology Co.,Ltd. Address before: 215000 unit g1-305, artificial intelligence Industrial Park, 88 Jinjihu Avenue, Suzhou Industrial Park, Suzhou area, China (Jiangsu) pilot Free Trade Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU WEIDAZHI ELECTRONIC TECHNOLOGY Co.,Ltd. |