CN103887046A - Thin induction coil structure - Google Patents
Thin induction coil structure Download PDFInfo
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- CN103887046A CN103887046A CN201410091933.6A CN201410091933A CN103887046A CN 103887046 A CN103887046 A CN 103887046A CN 201410091933 A CN201410091933 A CN 201410091933A CN 103887046 A CN103887046 A CN 103887046A
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- cladding
- coil
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- inductance coil
- thin inductance
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Abstract
The invention discloses a thin induction coil structure which comprises at least one coil, a first coating body, a second coating body and two electrodes. The coil is provided with two electrical terminals. The first coating body is provided with resin and iron powder and used for forming and coating the coil. The second coating body is provided with resin and iron powder, used for forming and coating the bottom edge of the coil, and formed by being combined with the first coating body. The two electrodes are arranged outside the first coating body and the second coating body, and are electrically connected to the two electrical terminals of the coil respectively. The first coating body and the second coating body are combined and formed and coat the coil integrally, the two electrodes are arranged outside the first coating body and the second coating body, and are electrically connected to the two electrical terminals of the coil respectively through the structural design, when the thin induction coil is manufactured, the product manufacturing process can be simplified, the product yield is improved and increased, production cost can be effectively lowered, and waste is avoided.
Description
Technical field
The present invention relates to inductance coil art, refer in particular to a kind of structure of thin inductance coil.
Background technology
Along with industrial and scientific and technological development, electronic product system is used in modern's life widely; Wherein, inductance coil is more being played the part of indispensable part in electronic product.
Referring to Fig. 1 to Fig. 5, is the processing procedure schematic diagram of a kind of thin inductance coil of commonly using; And please refer to Fig. 6, be the manufacture method flow chart of thin inductance coil.Manufacturer's genealogy of law of the thin inductance coil of commonly using as shown in the figure, comprises the steps:
First, system execution step S01 ', by one first conductive plate 110a ' and one second conductive plate 110b ' respectively punching press form and include one of one first lead piece 125a ' First Line ring layer 120a ' and include one of one second lead piece 125b ' the second coil layer 120b '; Then, the execution step S02 ' of system, with welding manner coincide this First Line ring layer 120a ' and this second coil layer 120b ', two guiding wiring 130 ' are bonded together simultaneously, make this First Line ring layer 120a ' and this second coil layer 120b ' form an inductance coil 120 '.
After completing abovementioned steps, the party's genealogy of law then performs step S03 ', and with coated this inductance coil 120 ' of a lid 140 ', wherein, this lid 140 ' is formed by said magnetic powder material; Finally, be execution step S04 ', by this first lead piece 125 a ' with this second lead piece 125b ' cutting and be welded and fixed into two electrodes.
But manufacturer's genealogy of law of the thin inductance coil of commonly using is produced in a large number by the mode of material strip 200 ', and through cutting, a plurality of inductance coil 120 ' finished products are taken off on this 200 ' material strip, the material strip 200 ' that then just will remain directly abandons; So, not only cause the manufacturing cost of inductance coil 120 ' to increase, cause the waste of material strip 200 ' more simultaneously.In addition, in this step (S02 '), be the mode that sees through welding coincide First Line ring layer 120a ' with the second coil layer 120b ' to form an inductance coil 120 ', which has further increased the manufacture difficulty of this inductance coil 120 '.
Via above-mentioned, can learn that the manufacture method cording of the thin inductance coil of commonly using has shortcoming with not enough; In view of this, invention is done one's utmost to be studied by the inventor system of this case, has has finally researched and developed the structure of the present invention's a kind of thin inductance coil.
Summary of the invention
In view of this, the present invention is directed to the disappearance of prior art existence, its main purpose is to provide a kind of structure of thin inductance coil, and it can effectively solve the existing problem that thin inductance coil manufacture difficulty is large, cost is high.
For achieving the above object, the present invention adopts following technical scheme:
A kind of structure of thin inductance coil, includes:
One coil, this coil array has two electric terminals; And
One first cladding, it has resin and iron powder, is this coil is done to a forming covered; And
One second cladding, it has resin and iron powder, be this coil root edge is done to a forming covered, and with this first cladding connecting shaping; And
Two electrodes, are to be arranged at this first cladding and this second cladding outside, and are electrically connected at respectively two electric terminals of this coil.
As a kind of preferred version, the cross section system of described two electric terminals is exposed to outside this first cladding and this second cladding, to be electrically connected respectively this two electrodes.
As a kind of preferred version, described coil array by a metal wire be coated on one of the outer insulating barrier of this metal wire and formed.
As a kind of preferred version, described coil array by a copper cash be coated on one of the outer insulating barrier of this copper cash and formed.
As a kind of preferred version, described two electrodes are to be formed on the first cladding and the second cladding by the mode of vacuum splashing and plating.
As a kind of preferred version, described two electrodes include nickel dam and tin layer, and this nickel dam plating is located on the first cladding and the second cladding and is positioned at the surrounding and electric terminal electrically connect of electric terminal.
As a kind of preferred version, described two electrodes are by being directly stained with or silver-plated mode is formed on the first cladding and the second cladding.
As a kind of preferred version, described two electrodes are two metal electrode boards, and these two metal electrode boards are fixedly welded on respectively this two electric terminals.
A kind of structure of thin inductance coil, more includes:
Two coils, and each coil array has two electric terminals; And
One first cladding, it has resin and iron powder, is a forming covered is done in this coil top; And
One second cladding, it has resin and iron powder, be this coil root edge is done to a forming covered, and with this first cladding connecting shaping; And
Two electrodes, are to be arranged at this first cladding and this second cladding outside, and are electrically connected at respectively this two electric terminals.
As a kind of preferred version, described these two coil arrays are arranged at respectively among this first cladding and this second cladding in mirror mode, and, wherein two of two coils electric terminal systems are electric connection, and the cross section of this electric terminal system is exposed to these cladding outsides, and be electrically connected respectively this two electrodes.
The present invention compared with prior art has obvious advantage and beneficial effect, particularly, and as shown from the above technical solution:
One, by utilizing the be bonded to each other moulding coil one is enveloped of the first cladding and the second cladding, coordinate and utilize two electrodes be arranged at the first cladding and the second cladding outside and be electrically connected at respectively two electric terminals, so the present invention can a lot of individual coil arrangement in the time producing be positioned to encapsulate in an one of substrate surface basic unit production, so just can reach the object that increases output, the mode of production with material strip of tradition just cannot reach the object that increases output relatively, because material strip take up space is all larger with volume, so cannot once reach the object of producing a lot of coils, the present invention need to can not produce thin inductance coil by the mode of material strip, be convenient to simplify product processing procedure, to enhance product yield, and can effectively reduce production costs, and avoid waste.
Two, by utilizing structural design of the present invention, also can make coil in by the process of the first cladding and the encapsulation of the second cladding, utilize the pressure that extruding produced doped with the while of plastics iron powder downwards, make the outstanding longer electric terminal of coil former two, can be cut off into the expection length outside suitable outstanding the first cladding and the second cladding, and do not need to carry out again other severing procedure, and then simplified procedure for processing, reduce manufacturing cost.
Three, by adopting the mode of vacuum splashing and plating or being directly stained with or silver-plated mode forms two electrodes, be to avoid the mode that sees through welding in conjunction with inductance coil and outer electrode, further reduce the difficulty that product is manufactured.
For more clearly setting forth architectural feature of the present invention and effect, below in conjunction with accompanying drawing and specific embodiment, the present invention is described in detail.
Brief description of the drawings
Fig. 1 is the first view of the thin inductance coil manufacture process commonly used;
Fig. 2 is the second view of the thin inductance coil manufacture process commonly used;
Fig. 3 is the third state schematic diagram of the thin inductance coil manufacture process commonly used;
Fig. 4 is the 4th view of the thin inductance coil manufacture process commonly used;
Fig. 5 is the 5th view of the thin inductance coil manufacture process commonly used;
Fig. 6 is the flow chart of the manufacture method of the thin inductance coil commonly used;
Fig. 7 is the first pass figure of the manufacture method of the present invention's thin inductance coil;
Fig. 8 is the second flow chart of the manufacture method of the present invention's thin inductance coil;
Fig. 9 is the first schematic diagram of the present invention's manufacture method;
Figure 10 is the second schematic diagram of the present invention's manufacture method;
Figure 11 is the 3rd schematic diagram of the present invention's manufacture method;
Figure 12 is the 4th schematic diagram of the present invention's manufacture method;
Figure 13 is the 5th schematic diagram of the present invention's manufacture method;
Figure 14 is the first cutaway view of the side of the present invention's manufacture method;
Figure 15 is the second cutaway view of the side of the present invention's manufacture method;
Figure 16 is the 3rd cutaway view of the side of the present invention's manufacture method;
Figure 17 is the 4th cutaway view of the side of the present invention's manufacture method;
Figure 18 is the 5th cutaway view of the side of the present invention's manufacture method;
Figure 19 is the semi-finished product stereogram of the present invention's thin inductance coil;
Figure 20 is the finished product stereogram of the present invention's thin inductance coil;
Figure 21 is another embodiment stereogram of the present invention's thin inductance coil;
Figure 22 is the another embodiment profile of the present invention's thin inductance coil;
Figure 23 is the stereogram of Figure 22.
Accompanying drawing identifier declaration:
110a ', the first conductive plate 110b ', the second conductive plate
120a ', First Line ring layer 120b ', the second coil layer
125a ', the first lead piece 125b ', the second lead piece
130 ', guiding wiring 140 ', lid
200 ', material strip S01 '~S04 ', method step
1, thin inductance coil 2, substrate
3, mould 4, supporting bracket
5, jack unit 11, coil
13, the first cladding 14, the second cladding
15, electrode 21, basic unit
31, the first containing hole 41, the second containing hole
51, top compression leg 112, electric terminal
S01, method step S021~S023, method step
S03, method step S041~S044, method step
S05~S07, method step S08, S081b, S082b, method step.
Embodiment
In order more clearly to describe the structure of a kind of thin inductance coil proposed by the invention, below will coordinate graphicly, elaborate the present invention's preferred embodiment.
Referring to Fig. 7 and Fig. 8, is the flow chart of the manufacture method of the present invention's a kind of thin inductance coil.As shown in the figure, the structure of the present invention's thin inductance coil is to be reached by following manufacture method and step:
As shown in the processing procedure schematic diagram of Fig. 9, first the party's genealogy of law performs step S01, a plurality of coils 11 are positioned in one of substrate 2 surfaces basic unit 21, and will be formed with one of a plurality of the second containing holes 41 supporting bracket 4 and be arranged at this substrate 2 belows, wherein, this coil 11 is to include two electric terminals 112.
As shown in the processing procedure profile of the processing procedure schematic diagram of Figure 10 and Figure 14, the party's genealogy of law then performs step S021, to have one of a plurality of the first containing holes 31 mould 3 covers on these a plurality of coils 11, make these a plurality of first containing holes 31 correspond respectively to this plurality of the second containing holes 41, and accommodating these a plurality of coils 11 of difference, and then perform step S022 and step S023, seeing through the molded journey of filling pours among these a plurality of first containing holes 31 doped with the iron powder of plastics one, and, head into respectively among these a plurality of first containing holes 31 by a plurality of tops compression leg 51 of a jack unit 5, make this iron powder doped with plastics form a plurality of the first claddings 13 to be coated respectively these a plurality of coils 11, the pressure that can utilize downward extruding to produce doped with the while of plastics iron powder simultaneously, make the outstanding longer electric terminal 112 of coil 11 former two, can be cut off into the expection length outside suitable outstanding the first cladding 13 and the second cladding 14, and do not need to carry out again other severing procedure, and then simplified procedure for processing, reduce manufacturing cost.As shown in the processing procedure profile of the processing procedure schematic diagram of Figure 11 to Figure 12 and Figure 15 to Figure 17, the present invention's manufacture method is then to perform step S03, step S041 after completing steps S023, remove this substrate 2 and this basic unit 21, and by this mould 3 in the mode of being inverted and be arranged in this supporting bracket 4, and press down respectively these a plurality of first claddings 13 to produce a filling modular space by this plurality of tops compression leg 51.
Then, be execution step S042 and step S043, remove this jack unit 5, and through filling with molded journey, this iron powder doped with plastics is poured among these a plurality of first containing holes 31 again; And, after execution of step S043, be execution step S044, be squeezed into respectively among these a plurality of first containing holes 31 and this second containing hole 41 by this plurality of tops compression leg 51, make this iron powder doped with plastics form a plurality of the second claddings 14 that correspond to these a plurality of the first claddings 13, to be coated respectively these a plurality of coils 11, and make these a plurality of first claddings 13, these a plurality of second claddings 14 form a plurality of thin inductance coils 1 with these a plurality of coils 11; Wherein, two of this coil 11 electric terminals 112 are to be exposed to outside this first cladding 13 and this second cladding 14.
As shown in the processing procedure profile of the processing procedure schematic diagram of Figure 13 and Figure 18, after completing steps S044, be then to perform step S05 and step S06, remove this supporting bracket 4, and push respectively these a plurality of thin inductance coils 1 in these a plurality of first containing holes 31 by a plurality of tops compression leg 51 of this jack unit 5, and then take out this plurality of thin inductance coils 1.
Please continue to refer to Fig. 7 and Fig. 8, and please refer to Figure 19 and Figure 20, be semi-finished product stereogram and the finished product stereogram of the present invention's thin inductance coil; The present invention's manufacture method is the semi-finished product that can obtain thin inductance coil 1 as shown in figure 19 after execution of step S06; As shown in figure 20, finally, the execution step S07 of system, carries out an electrode to the semi-finished product of these a plurality of thin inductance coils 1 and forms processing procedure, uses formation two electrodes 15 and is exposed to two electric terminals 112 outside this first cladding 13 and the second cladding 14 to connect respectively this coil 11.
Wherein, the predetermined block that the step S08 of this electrode formation can be around the electric terminal 112 of this thin inductance coil 1 dual-side carries out vacuum splashing coating process, then on the region of this vacuum splashing and plating, carry out nickel plating (Ni), finally be carried out on this nickel dam and carry out zinc-plated (Sn), use and form these two electrodes 15; Also or on the region of this vacuum splashing and plating, be directly stained with or silver-plated (Ag), use and form these two electrodes 15.
Hold above-mentionedly, what this electrode formed also can, in this vacuum splashing and plating region, be fixedly welded on respectively this two electric terminals 112 by two metal electrode boards, uses and forms two electrodes 15.
Refer to Figure 21, it is another embodiment stereogram of the thin inductance coil of this creation, as shown in figure 21, this step S08 more can see through following step and complete: S081b carries out a vacuum splashing coating process to these a plurality of thin inductance coils 1, then, execution step S082b, is fixedly welded on respectively this two electric terminals 112 by two metal electrode boards, uses and forms these two electrodes 15.
Via above-mentioned, the manufacture method of a kind of thin inductance coil 1 of the present invention is so complete that to be illustrated, and then, will see through the structure of a kind of thin inductance coil 1 that illustrates the present invention; Referring again to Figure 19 and Figure 20, as shown in Figure 19 and Figure 20, a kind of thin inductance coil 1 of the present invention is to include: a coil 11, one first cladding 13, one second cladding 14 and two electrodes 15.
Wherein, these coil 11 cordings have two electric terminals 112, are to be exposed to this first cladding 13 and these the second cladding 14 outsides, to be electrically connected respectively this two electrodes 15; And these the first cladding 13 cordings have resin and iron powder, and this coil 11 is done to a forming covered, on the other hand, these the second cladding 14 cordings have resin and iron powder, and these coil 11 root edges are done to a forming covered, and with these the first cladding 13 connecting shapings.
Further, this coil 11 be by a metal wire be coated on one of the outer insulating barrier of this metal wire and formed, in addition, this coil 11 also can by a copper cash be coated on this copper cash one of outward insulating barrier formed.
Refer to Figure 22 and Figure 23, be another embodiment profile and the stereogram of the present invention's thin inductance coil 1, as shown in Figure 22 and Figure 23, another embodiment system of a kind of thin inductance coil 1 of the present invention includes: two coils 11, one first cladding 13, one second cladding 14 and two electrodes 15.
Wherein, these two coils 11 be mirror be arranged at respectively among this first cladding 13 and this second cladding 14, and two electric terminals 112 of a coil 11 are two electric terminals 112 that are electrically connected at another coil 11, and be electrically connected respectively this two electrodes 15.
Design focal point of the present invention is: first, by utilizing the be bonded to each other moulding coil one is enveloped of the first cladding and the second cladding, coordinate and utilize two electrodes be arranged at the first cladding and the second cladding outside and be electrically connected at respectively two electric terminals, so the present invention can a lot of individual coil arrangement in the time producing be positioned to encapsulate in an one of substrate surface basic unit production, so just can reach the object that increases output, the mode of production with material strip of tradition just cannot reach the object that increases output relatively, because material strip take up space is all larger with volume, so cannot once reach the object of producing a lot of coils, the present invention need to can not produce thin inductance coil by the mode of material strip, be convenient to simplify product processing procedure, to enhance product yield, and can effectively reduce production costs, and avoid waste.Secondly, by adopting the mode of vacuum splashing and plating or being directly stained with or silver-plated mode forms two electrodes, be to avoid the mode that sees through welding in conjunction with inductance coil and outer electrode, further reduce the difficulty that product is manufactured.Moreover, in view of the present invention's structure design feature, can make the beginning to take shape of two electric terminals of coil, can be in encapsulation extruding doped with plastics iron powder when the processing procedure on coil, utilize the pressure that extruding produced doped with the while of plastics iron powder downwards, make the outstanding longer electric terminal of coil former two, can be cut off into the expection length outside suitable outstanding the first cladding and the second cladding, and do not need to carry out again other severing procedure, and then simplified procedure for processing, reduce manufacturing cost, although adopt and have in general known packaged type the structure manufacture that whole coil is coated with plastics forming, but in their processing procedure, there is the processing procedure that has more that a palpus grinds off plastics coated coil two ends, just can make coil two electric terminals manifest protrudes from outside plastics, inevitable compared with work consuming like this, consuming time and make manufacturing cost increase, also be the additional act processing procedure that will carry out coil two electric terminal bendings even if be with the general material strip mode of production, processing procedure is loaded down with trivial details.
The above, it is only preferred embodiment of the present invention, not technical scope of the present invention is imposed any restrictions, therefore any trickle amendment, equivalent variations and modification that every foundation technical spirit of the present invention is done above embodiment all still belong in the scope of technical solution of the present invention.
Claims (10)
1. a structure for thin inductance coil, is characterized in that: include:
One coil, this coil array has two electric terminals; And
One first cladding, it has resin and iron powder, is this coil is done to a forming covered; And
One second cladding, it has resin and iron powder, be this coil root edge is done to a forming covered, and with this first cladding connecting shaping; And
Two electrodes, are to be arranged at this first cladding and this second cladding outside, and are electrically connected at respectively two electric terminals of this coil.
2. the structure of a kind of thin inductance coil according to claim 1, is characterized in that: the cross section system of described two electric terminals is exposed to outside this first cladding and this second cladding, to be electrically connected respectively this two electrodes.
3. the structure of a kind of thin inductance coil according to claim 1, is characterized in that: described coil array by a metal wire be coated on one of the outer insulating barrier of this metal wire and formed.
4. the structure of a kind of thin inductance coil according to claim 1, is characterized in that: described coil array by a copper cash be coated on one of the outer insulating barrier of this copper cash and formed.
5. the structure of a kind of thin inductance coil according to claim 1, is characterized in that: described two electrodes are to be formed on the first cladding and the second cladding by the mode of vacuum splashing and plating.
6. the structure of a kind of thin inductance coil according to claim 5, it is characterized in that: described two electrodes include nickel dam and tin layer, this nickel dam plating is located on the first cladding and the second cladding and is positioned at the surrounding and electric terminal electrically connect of electric terminal.
7. the structure of a kind of thin inductance coil according to claim 1, is characterized in that: described two electrodes are by being directly stained with or silver-plated mode is formed on the first cladding and the second cladding.
8. the structure of a kind of thin inductance coil according to claim 1, is characterized in that: described two electrodes are two metal electrode boards, and these two metal electrode boards are fixedly welded on respectively this two electric terminals.
9. a structure for thin inductance coil, is characterized in that: more include:
Two coils, and each coil array has two electric terminals; And
One first cladding, it has resin and iron powder, is a forming covered is done in this coil top; And
One second cladding, it has resin and iron powder, be this coil root edge is done to a forming covered, and with this first cladding connecting shaping; And
Two electrodes, are to be arranged at this first cladding and this second cladding outside, and are electrically connected at respectively this two electric terminals.
10. the structure of a kind of thin inductance coil according to claim 9, it is characterized in that: described these two coil arrays are arranged at respectively among this first cladding and this second cladding in mirror mode, and, wherein two of two coils electric terminal systems are electric connection, and the cross section of this electric terminal system is exposed to these cladding outsides, and be electrically connected respectively this two electrodes.
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CN201410091933.6A CN103887046A (en) | 2014-03-13 | 2014-03-13 | Thin induction coil structure |
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CN201410091933.6A CN103887046A (en) | 2014-03-13 | 2014-03-13 | Thin induction coil structure |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105448468A (en) * | 2015-12-11 | 2016-03-30 | 东莞建冠塑胶电子有限公司 | Thin inductor structure and manufacturing method thereof |
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JP2013045928A (en) * | 2011-08-25 | 2013-03-04 | Taiyo Yuden Co Ltd | Wound inductor and manufacturing method therefor |
CN103050224A (en) * | 2012-12-26 | 2013-04-17 | 王向群 | Power inductor and manufacturing method thereof |
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JPH11329845A (en) * | 1998-05-19 | 1999-11-30 | Tdk Corp | Electronic component and manufacture thereof |
CN2710117Y (en) * | 2004-03-19 | 2005-07-13 | 郑长茂 | Inductor |
JP2006173163A (en) * | 2004-12-13 | 2006-06-29 | Matsushita Electric Ind Co Ltd | Chip coil |
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Application publication date: 20140625 |