CN103886361A - RFID (Radio Frequency Identification) anti-metallic tag and manufacturing method thereof - Google Patents

RFID (Radio Frequency Identification) anti-metallic tag and manufacturing method thereof Download PDF

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Publication number
CN103886361A
CN103886361A CN201210564523.XA CN201210564523A CN103886361A CN 103886361 A CN103886361 A CN 103886361A CN 201210564523 A CN201210564523 A CN 201210564523A CN 103886361 A CN103886361 A CN 103886361A
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metal
paster
rectangular metal
short
dielectric film
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张志勇
张钊锋
庄健敏
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Shanghai Advanced Research Institute of CAS
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Shanghai Advanced Research Institute of CAS
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Abstract

The invention discloses a RFID (Radio Frequency Identification) anti-metallic tag, which comprises a tag antenna, a tag chip, an insulated dielectric substrate and an insulated film. The tag antenna and the tag chip are attached to the upper surface of the insulated film; the lower surface of the insulated film is attached in a covering mode on the insulated dielectric substrate; the tag antenna can comprises two rectangular metal patches and a plurality of short circuit lines; the two rectangular metal patches are located at two sides of the tag chip; a circular gap is formed on each rectangular metal patch; one part of the short circuit lines is in short circuit connection with one rectangular metal patch at one end; and the other part of the short circuit lines is in short circuit connection with the other rectangular metal patch at one end. The invention also discloses a manufacturing method of the RFID anti-metallic tag. The RFID anti-metallic tag antenna is thin in thickness, the manufacturing cost is low, the precision is high, and mass production is facilitated.

Description

RFID anti-metal tag and manufacture method thereof
Technical field
The present invention relates to REID (Radio Frequency Identification, abbreviation RFID), is particularly a kind of RFID anti-metal tag and manufacture method thereof.
Background technology
REID (Radio Frequency Identification, abbreviation RFID) is one and utilizes radiofrequency signal to pass through Space Coupling (alternating magnetic field or electromagnetic field) to realize contactless information transmission and pass through transmitted information the technology that reaches identifying purpose.Compared with conventional identification techniques (Quick Response Code, bar code etc.), RFID technology have unique, the information capacity of sign large, read the feature that efficient and convenient, many labels read, can carry out data encryption.The fields such as item tracking, aviation luggage sorting, factory's assembling line, automobile burglar, electronic bill, the care of animal, commodity counterfeit prevention are widely used in through years development.
RFID, due to carrier wave frequency range difference, can be divided into low frequency (30 ~ 300kHz), intermediate frequency (300kHz ~ 3MHz), high frequency (3 ~ 30MHz) and ultrahigh frequency (300MHz ~ 3GHz).Wherein, the EFFECTIVE RANGE maximum of ultrahigh frequency (UHF) frequency range, can reach 8 ~ 20m, can be widely used in business logistics and traffic and transport field.The agreement of ultrahigh-frequency radio-frequency identification system has a variety of at present, mainly can be divided into two large agreement maker: the one, ISO (ISO (International Standards Organization)); The 2nd, EPC Global.ISO organizes at present and has formulated radio-frequency (RF) identification agreement ISO18000-6 for uhf band, and EPC Global organizes the standard EPC C1G2UHF RFID having formulated for product electronic code ultrahigh-frequency radio-frequency identification system.
Rfid system comprises read write line, label, and complete RFID label comprises label antenna and label chip and by the external resin of their moldings, RFID label chip has transmission and reception unit, control part and storer.In storer, store intrinsic cognizance code (unique ID), the unique ID of read write line to RFID label reads, undertaken by radio communication (wireless messages exchange) with antenna by RFID label, this wireless messages exchange has wave mode and way of electromagnetic induction.
Generally, RFID label sticking is on metal time, and larger variation will appear in characteristic.If the RFID label of way of electromagnetic induction, in the time that entering in metal, magnetic flux will flow through eddy current, it produces the effect of offsetting magnetic flux, and object information exchange distance (message exchange region) significantly shortens, and in worst situation, can not carry out message exchange.If the RFID label of wave mode, electric wave reflects and produces multipath phenomenon at metal covering, and the information of RFID label reads and becomes unstable, due to the impact of metal covering, the power conversion efficiency variation of the antenna of RFID label, identical with way of electromagnetic induction, produce the deterioration of upgrading distance.Industry is improved the read situation of electronic tag under metal environment at present, popular following two kinds of ways:
(1) relative height of raising antenna and metal surface.Along with the increase of relative height, synthetic field signal vector will strengthen gradually, and while reaching the l/4 of wavelength to relative height, synthetic field signal vector reaches maximum, can obtain optimum gain value.But people are more and more thinner to the thickness requirement of electronic tag now, heavy abundant design proposal does not obviously meet user's aesthetic trend, and along with the increase of electronic tag thickness, also improve the production cost of label accordingly, be unfavorable for the large-scale promotion of industry.
(2) meet the performance requirement of system with active label, but the life-span of active label is limited, volume is large, cost is high and be not suitable for working under rugged surroundings.
Existing a kind of RFID label that is applicable to metal as shown in Figure 1, is made up of sheet metal portion 40, the RFID label portion 10 that is located in this sheet metal portion 40.RFID label portion 10 has label chip, label antenna and for regulating the impedance adjustment portion of tuned frequency of this label antenna.RFID label portion lO can monomer sticks on the article outside metal and uses.In the time that RFID label portion 10 monomers are used for to non-metal article, preferably omit impedance adjustment portion.This is to imagine in advance to stick on metal and manufacture because of RFID label portion 10, so if having impedance adjustment portion, tuning performance reduces.
Sheet metal portion 40 is by for preventing that interval parts and sheet metal portion that RFID label portion 10 is subject to metal impact form.In the time that the RFID label sticking that is applicable to metal is used on metal 90, the RFID label that is applicable to metal sticks on metal 90 by the back side of sheet metal portion 40.
As shown in Figure 2, the label chip 21 of RFID label portion 10, label antenna 22 and impedance adjustment portion 23 are formed on substrate, and substrate 12 utilizes PET(polyethylene terephthalate) formation such as material or paper.Label chip 21 is formed at the surperficial substantial middle of substrate 12, label antenna 22 is dipole antennas, be formed at the both sides of label chip 21, label antenna 22 is by implementing the formation such as etching and Solder-Paste Printing on the surface at substrate 12, impedance adjustment portion 23 is conductors, for the impedance operator that regulates label antenna 22 arranges.Impedance adjustment portion 23 also can not be located at the surface of baseplate material portion 12, and is located at the inside of substrate 12.
At the RFID label 1 that is applicable to metal, during corresponding to high-frequency electric waves such as UHF frequency bands, its impedance composition can utilize ring-shaped conductor to form, and therefore impedance adjustment portion 23 is connected with the label antenna 22 of left and right, is formed as
Figure BDA00002636248700021
shape.
The RFID label that is applicable to metal of said structure, manufacturing process complexity, cost are high.
Summary of the invention
The technical problem to be solved in the present invention is the thinner thickness that makes RFID anti-metal tag antenna, and low cost of manufacture, degree of accuracy high, be easy to volume production.
For solving the problems of the technologies described above, RFID anti-metal tag provided by the invention, comprises label antenna, label chip, insulating medium substrate, dielectric film;
Described label antenna, label chip are attached to the upper surface of described dielectric film;
The lower surface of described dielectric film is wrapped up in and is affixed on described insulating medium substrate.
Preferably, described label antenna is dipole element antenna;
Described label antenna comprises two rectangular metal pasters, many short-circuit lines;
Two rectangular metal pasters are positioned at the both sides of described label chip;
On each rectangular metal paster, be formed with a ring gap;
One end same rectangular metal paster short circuit of part short-circuit line, one end of another part short-circuit line is with another rectangular metal paster short circuit.
Preferably, on each rectangular metal paster, be formed with a ring gap, one or more rectangular aperture.
Preferably, the upper end of each rectangular metal paster, left end, right-hand member short circuit one short-circuit line respectively;
Described short-circuit line, wraps up in the side and the back side that are affixed on described insulating medium substrate by described dielectric film.
Preferably, described RFID anti-metal tag is ultrahigh frequency RFID anti-metal tag;
Described dielectric film is polyethylene terephthalate film or polyimide film;
Described rectangular metal paster is aluminium paster or copper paster;
Described label chip welds together with mode and the described rectangular metal paster of back-off.
Preferably, the thickness of described dielectric film is 10~200 μ m;
Described rectangular metal paster thickness is 0.01~0.1mm.
For solving the problems of the technologies described above, the manufacture method of RFID anti-metal tag provided by the invention, comprises the following steps:
One. the upper surface at soft dielectric film forms metal patch;
Two. metal patch described in etching, forms label antenna at the upper surface of dielectric film;
Three. label chip and described label antenna are welded together;
Four. the lower surface of described dielectric film is wrapped up in and is affixed on insulating medium substrate, form RFID anti-metal tag.
Preferably, described label antenna comprises two rectangular metal pasters, many short-circuit lines;
Two rectangular metal pasters are positioned at the both sides of described label chip;
On each rectangular metal paster, be formed with a ring gap;
One end same rectangular metal paster short circuit of part short-circuit line, one end of another part short-circuit line is with another rectangular metal paster short circuit;
Described label chip welds together with mode and the rectangular metal paster of back-off.
Preferably, on each rectangular metal paster, be formed with a ring gap, one or more rectangular aperture;
The upper end of each rectangular metal paster, left end, right-hand member short circuit one short-circuit line respectively;
In step 4, after described dielectric film is wrapped up in and is affixed on insulating medium substrate, described short-circuit line is wrapped up in the side and the back side that are affixed on insulating medium substrate, forms RFID anti-metal tag.
Preferably, described dielectric film is polyethylene terephthalate film or polyimide film, and thickness is 10~200 μ m;
Described rectangular metal paster is aluminium paster or copper paster, and thickness is 0.01~0.1mm.
RFID anti-metal tag of the present invention and manufacture method thereof, label antenna, label chip are formed on soft dielectric film, the soft label that formation processes, the soft label processing is wrapped up in to be bonded at and on insulating medium substrate, form RFID anti-metal tag, by the width of position, internal diameter size and annular slot of the annular slot that forms respectively on the rectangular metal paster at label antenna, can regulate the impedance operator of this label antenna, label thinner thickness, and low cost of manufacture, degree of accuracy high, be easy to volume production.
Brief description of the drawings
In order to be illustrated more clearly in technical scheme of the present invention, below the accompanying drawing that will use required for the present invention is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is existing a kind of RFID label schematic diagram that is applicable to metal;
Fig. 2 is the RFID label portion schematic diagram of existing a kind of RFID label that is applicable to metal;
Fig. 3 is RFID anti-metal tag antenna schematic diagram of the present invention;
Fig. 4 is the manufacture method schematic diagram of RFID anti-metal tag antenna of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the technical scheme in the present invention is carried out to clear, complete description, obviously, described embodiment is a part of embodiment of the present invention, instead of whole embodiment.Based on the embodiment in the present invention, all other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, belong to the scope of protection of the invention.
Embodiment mono-
RFID anti-metal tag as shown in Figure 3, comprises label antenna 2, label chip 3, insulating medium substrate, dielectric film 1;
Described label antenna 2, label chip 3 are attached to the upper surface of described dielectric film 1;
The lower surface of described dielectric film 1 is wrapped up in and is affixed on described insulating medium substrate.
Embodiment bis-
Based on embodiment mono-, label antenna 2 is dipole element antenna;
Label antenna 2 comprises two rectangular metal pasters, many short-circuit lines 4;
Two rectangular metal pasters are positioned at the both sides of described label chip 3;
Described short-circuit line 4 is by described two rectangular metal paster short circuits;
On each rectangular metal paster, be formed with a ring gap 21, the width of position, internal diameter size and ring gap 21 by ring gap 21, regulates the impedance operator of this label antenna;
One end same rectangular metal paster short circuit of part short-circuit line, one end of another part short-circuit line is with another rectangular metal paster short circuit.
Embodiment tri-
Based on embodiment bis-, on each rectangular metal paster, be formed with a ring gap 21, one or more rectangular aperture 22, by regulating the position of the ring gap 21 on rectangular metal paster, the position of rectangular aperture 22, and the internal diameter size of ring gap 21, the width size of ring gap 21, the width size of rectangular aperture 22, or regulate width and the position of described short-circuit line 4, all can change impedance operator and the gain performance of this label antenna.
Embodiment tetra-
Based on embodiment tri-, the upper end of each rectangular metal paster, left end, right-hand member short circuit one short-circuit line 4 respectively;
Described short-circuit line 4, wraps up in the side and the back side that are affixed on described insulating medium substrate by described dielectric film.
Embodiment five
Based on embodiment tetra-, described RFID anti-metal tag is ultrahigh frequency (UHF) RFID anti-metal tag;
Described dielectric film 1 is PET(polyethylene terephthalate) film or PI(polyimide) film;
Described rectangular metal paster is aluminium paster or copper paster;
Described label chip welds together with mode and the described rectangular metal paster of back-off.
Preferably, described dielectric film 1 thickness is 10~200 μ m, and rectangular metal paster thickness is 0.01~0.1mm, and insulating medium substrate is of a size of 108mm × 20mm × 1mm.
Embodiment six
The manufacture method of RFID anti-metal tag, as shown in Figure 4, comprises the following steps:
One. the upper surface at soft described dielectric film 1 forms metal patch;
Preferably, described dielectric film 1 is PET(polyethylene terephthalate) or PI(polyimide) film, thickness is 10~200 μ m;
Preferably, described metal patch is aluminium paster or copper paster, and thickness is 0.01~0.1mm;
Two. metal patch described in etching, forms label antenna 2 at the upper surface of described dielectric film 1;
Three. label chip 3 and described rectangular metal paster are welded together, form the soft label processing;
Four. described dielectric film 1(is attached with to label antenna 2, label chip 3) lower surface wrap up in and be affixed on insulating medium substrate, form RFID anti-metal tag.
Embodiment seven
Based on embodiment six, described label antenna 2 comprises two rectangular metal pasters, many short-circuit lines 4;
Two rectangular metal pasters are positioned at the both sides of described label chip 3;
On each rectangular metal paster, be formed with a ring gap 21;
Described short-circuit line 4 one end are with rectangular metal paster short circuit;
Described label chip 3 welds together with mode and the rectangular metal paster of back-off.
Embodiment eight
Based on embodiment seven, on each rectangular metal paster, be formed with a ring gap 21, one or more rectangular aperture 22;
On each rectangular metal paster, be formed with a ring gap 21, one or more rectangular aperture 22;
The upper end of each rectangular metal paster, left end, right-hand member short circuit one short-circuit line 4 respectively;
In step 4, after described dielectric film 1 is wrapped up in and is affixed on insulating medium substrate, described short-circuit line 4 is wrapped up in the side that is affixed on insulating medium substrate, forms RFID anti-metal tag.
RFID anti-metal tag of the present invention and manufacture method thereof, label antenna, label chip are formed on soft dielectric film, the soft label that formation processes, the soft label processing is wrapped up in to be bonded at and on insulating medium substrate, form RFID anti-metal tag, by the width of position, internal diameter size and annular slot of the annular slot that forms respectively on the rectangular metal paster at label antenna, can regulate the impedance operator of this label antenna, label thinner thickness, and low cost of manufacture, degree of accuracy high, be easy to volume production.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any amendment of making, be equal to replacement, improvement etc., within all should being included in the scope of protection of the invention.

Claims (10)

1. a RFID anti-metal tag, comprises label antenna, label chip, insulating medium substrate, it is characterized in that, RFID anti-metal tag also comprises dielectric film;
Described label antenna, label chip are attached to the upper surface of described dielectric film;
The lower surface of described dielectric film is wrapped up in and is affixed on described insulating medium substrate.
2. RFID anti-metal tag according to claim 1, is characterized in that,
Described label antenna is dipole element antenna;
Described label antenna comprises two rectangular metal pasters, many short-circuit lines;
Two rectangular metal pasters are positioned at the both sides of described label chip;
On each rectangular metal paster, be formed with a ring gap;
One end same rectangular metal paster short circuit of part short-circuit line, one end of another part short-circuit line is with another rectangular metal paster short circuit.
3. RFID anti-metal tag according to claim 2, is characterized in that,
On each rectangular metal paster, be formed with a ring gap, one or more rectangular aperture.
4. RFID anti-metal tag according to claim 2, is characterized in that,
The upper end of each rectangular metal paster, left end, right-hand member short circuit one short-circuit line respectively;
Described short-circuit line, wraps up in the side and the back side that are affixed on described insulating medium substrate by described dielectric film.
5. RFID anti-metal tag according to claim 2, is characterized in that,
Described RFID anti-metal tag is ultrahigh frequency RFID anti-metal tag;
Described dielectric film is polyethylene terephthalate film or polyimide film;
Described rectangular metal paster is aluminium paster or copper paster;
Described label chip welds together with mode and the described rectangular metal paster of back-off.
6. RFID anti-metal tag according to claim 5, is characterized in that,
The thickness of described dielectric film is 10~200 μ m;
Described rectangular metal paster thickness is 0.01~0.1mm.
7. a manufacture method for RFID anti-metal tag, is characterized in that, comprises the following steps:
One. the upper surface at soft dielectric film forms metal patch;
Two. metal patch described in etching, forms label antenna at the upper surface of dielectric film;
Three. label chip and described label antenna are welded together;
Four. the lower surface of described dielectric film is wrapped up in and is affixed on insulating medium substrate, form RFID anti-metal tag.
8. the manufacture method of RFID anti-metal tag according to claim 7, is characterized in that,
Described label antenna comprises two rectangular metal pasters, many short-circuit lines;
Two rectangular metal pasters are positioned at the both sides of described label chip;
On each rectangular metal paster, be formed with a ring gap;
One end same rectangular metal paster short circuit of part short-circuit line, one end of another part short-circuit line is with another rectangular metal paster short circuit;
Described label chip welds together with mode and the rectangular metal paster of back-off.
9. the manufacture method of RFID anti-metal tag according to claim 8, is characterized in that,
On each rectangular metal paster, be formed with a ring gap, one or more rectangular aperture;
The upper end of each rectangular metal paster, left end, right-hand member short circuit one short-circuit line respectively;
In step 4, after described dielectric film is wrapped up in and is affixed on insulating medium substrate, described short-circuit line is wrapped up in the side and the back side that are affixed on insulating medium substrate, forms RFID anti-metal tag.
10. the manufacture method of RFID anti-metal tag according to claim 9, is characterized in that,
Described dielectric film is polyethylene terephthalate film or polyimide film, and thickness is 10~200 μ m;
Described rectangular metal paster is aluminium paster or copper paster, and thickness is 0.01~0.1mm.
CN201210564523.XA 2012-12-24 2012-12-24 RFID (Radio Frequency Identification) anti-metallic tag and manufacturing method thereof Pending CN103886361A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105260766A (en) * 2015-11-10 2016-01-20 中国科学院上海高等研究院 A long distance ultrahigh frequency RFID anti-metal label and a manufacturing method thereof
CN109448609A (en) * 2018-12-11 2019-03-08 深圳市联智物联网科技有限公司 A kind of electronic luggage board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020175873A1 (en) * 2000-07-18 2002-11-28 King Patrick F. Grounded antenna for a wireless communication device and method
CN1941505A (en) * 2005-09-30 2007-04-04 西北工业大学 Microband antenna C-band left-hand material and its array
CN201149716Y (en) * 2007-12-25 2008-11-12 上海埃塞电子有限公司 Radio frequency flexible label with well shield effect
CN101740862A (en) * 2008-11-20 2010-06-16 东莞市启汉电子科技有限公司 Dipole antenna of RF chip
CN102110871A (en) * 2011-03-10 2011-06-29 江苏拓元科技发展有限公司 Radio frequency identification tag antenna suitable for metal surface

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020175873A1 (en) * 2000-07-18 2002-11-28 King Patrick F. Grounded antenna for a wireless communication device and method
CN1941505A (en) * 2005-09-30 2007-04-04 西北工业大学 Microband antenna C-band left-hand material and its array
CN201149716Y (en) * 2007-12-25 2008-11-12 上海埃塞电子有限公司 Radio frequency flexible label with well shield effect
CN101740862A (en) * 2008-11-20 2010-06-16 东莞市启汉电子科技有限公司 Dipole antenna of RF chip
CN102110871A (en) * 2011-03-10 2011-06-29 江苏拓元科技发展有限公司 Radio frequency identification tag antenna suitable for metal surface

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105260766A (en) * 2015-11-10 2016-01-20 中国科学院上海高等研究院 A long distance ultrahigh frequency RFID anti-metal label and a manufacturing method thereof
CN109448609A (en) * 2018-12-11 2019-03-08 深圳市联智物联网科技有限公司 A kind of electronic luggage board

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