CN103881562A - Heat dissipation coating for LED (Light Emitting Diode) lamps and preparation method thereof - Google Patents
Heat dissipation coating for LED (Light Emitting Diode) lamps and preparation method thereof Download PDFInfo
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- CN103881562A CN103881562A CN201410050679.5A CN201410050679A CN103881562A CN 103881562 A CN103881562 A CN 103881562A CN 201410050679 A CN201410050679 A CN 201410050679A CN 103881562 A CN103881562 A CN 103881562A
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Abstract
The invention provides heat dissipation coating for LED (Light Emitting Diode) lamps. The heat dissipation coating is prepared from the following raw materials in parts by weight: 30-35 parts of polyacrylic acid resin, 40-46 parts of polyimide resin, 4-6 parts of polyacrylamide, 8-12 parts of isophorone diamine (IPDA), 20-24 parts of xylene, 6-9 parts of polyethyl silicate, 2-3 parts of silane coupling agent KH550, 2-3 parts of nanometer clay, 8-12 parts of ethyl acetate, 2-4 parts of benzyltrimethylammonium tribromide, 10-12 parts of aluminum nitride, 10-12 parts of beryllium oxide and 4-5 parts of film forming additive. The heat dissipation coating for the LED (Light Emitting Diode) lamps has high-radiation cooling property due to addition of the nanometer clay, the aluminum nitride and the beryllium oxide and is used for reducing the surface temperature of heat dissipation cups, aluminum substrates and lampshades in the LED lamps, so that the service life of the lamps is prolonged; the heat dissipation coating is stable in dispersion, convenient to apply and aging-resistant and has large binding power; and the film forming additive is used for ensuring that the film-forming property of the coating is good, and the coating is easy to apply.
Description
Technical field
The invention belongs to technical field of coatings, particularly a kind of LED lamp heat radiation coating and preparation method thereof.
Background technology
Along with the rapid expansion of LED lamp use range, extend LED lamp and also become urgent problem work-ing life, LED power strengthens, and heat dissipation problem is also just more and more focused on by people.Adopt at present heat-conducting glue to solve LED lamp heat dissipation problem, but there is heatproof and ageing-resistant poor in its material using, little to base material cohesive force, radiating effect is not good and the inconvenient technical problem of constructing, and is difficult to meet the requirement that people are dispelled the heat to LED lamp.
Summary of the invention
The object of this invention is to provide a kind of LED lamp heat radiation coating and preparation method thereof, that coating of the present invention has advantages of is ageing-resistant, cohesiveness good, thermal diffusivity good.
The technical solution adopted in the present invention is:
A kind of LED lamp heat radiation coating, is characterized in that being made up of the raw material of following weight part: polyacrylic acid resin 30-35, polyimide resin 40-46, polyacrylamide 4-6, isophorone diamine IPDA8-12, dimethylbenzene 20-24, ethyl polysilicate 6-9, Silane coupling agent KH550 2-3, nanoclay 2-3, ethyl acetate 8-12, benzyl trimethyl tribromide ammonium 2-4, aluminium nitride 10-12, beryllium oxide 10-12, film coalescence aid 4-5.
Described film coalescence aid is made by the raw material of following weight part: ethylene glycol ether acetate 6-9,2-fluoroacetic acid base fourth are led sour 2-4, vinylformic acid 3-5, polyvinyl butyral acetal 2-4, HMPA 3-5, meraneine 3-5, sec.-propyl three (dioctylphyrophosphoric acid acyloxy) titanic acid ester 0.5-1, hydroxymethyl-propyl cellulose 2-3, nano-chitosan 0.3-0.5, plasticity-starch 1-2, acetyl peroxide 0.2-0.4, propylene glycol methyl ether acetate 15-18; Preparation method is: ethylene glycol ether acetate, HMPA, meraneine, hydroxymethyl-propyl cellulose, nano-chitosan, plasticity-starch, propylene glycol methyl ether acetate are mixed, stir 5-10 minute, be heated to 60-70 ℃, under 4000-6000 rev/min, stir 18-25 minute, add again 2-fluoroacetic acid base fourth to lead acid, vinylformic acid, polyvinyl butyral acetal, sec.-propyl three (dioctylphyrophosphoric acid acyloxy) titanic acid ester, stirring reaction 15-30 minute; Be cooled to 20-25 ℃ again, then add other remaining component, stirring reaction 45-60 minute, to obtain final product.
The preparation method of described LED lamp heat radiation coating, it is characterized in that comprising the following steps: ethyl polysilicate, nanoclay, aluminium nitride, beryllium oxide are mixed, at 1100-1300 rev/min of lower stirring reaction 10-20 minute, add ethyl acetate, dimethylbenzene, then be warming up to 40-50 ℃, add polyacrylic acid resin, polyimide resin, polyacrylamide, benzyl trimethyl tribromide ammonium, continue to stir 20-30 minute, add again other remaining component, continue stirring reaction 30-40 minute, grinding obtains slurry, to obtain final product.
Beneficial effect of the present invention
The heat radiation coating of LED lamp of the present invention has added nanoclay, aluminium nitride, beryllium oxide, has high radiation cooling, is used for reducing the surface temperature of heat radiating cup in LED lamp, aluminium base, lampshade etc., has extended the duration of service of light fixture; And stably dispersing, application is convenient, and cohesive force is large, ageing-resistant; Film coalescence aid of the present invention, makes coating good film-forming property, is easy to application.
Embodiment
A kind of LED lamp heat radiation coating, by following weight part (kilogram) raw material make: polyacrylic acid resin 33, polyimide resin 43, polyacrylamide 5, isophorone diamine IPDA 10, dimethylbenzene 22, ethyl polysilicate 7, Silane coupling agent KH550 2.5, nanoclay 2.5, ethyl acetate 10, benzyl trimethyl tribromide ammonium 3, aluminium nitride 11, beryllium oxide 11, film coalescence aid 4.5.
Described film coalescence aid by following weight part (kilogram) raw material make: ethylene glycol ether acetate 8,2-fluoroacetic acid base fourth are led acid 3, vinylformic acid 4, polyvinyl butyral acetal 3, HMPA 4, meraneine 4, sec.-propyl three (dioctylphyrophosphoric acid acyloxy) titanic acid ester 0.7, hydroxymethyl-propyl cellulose 2.5, nano-chitosan 0.4, plasticity-starch 1.5, acetyl peroxide 0.3, propylene glycol methyl ether acetate 17; Preparation method is: ethylene glycol ether acetate, HMPA, meraneine, hydroxymethyl-propyl cellulose, nano-chitosan, plasticity-starch, propylene glycol methyl ether acetate are mixed, stir 8 minutes, be heated to 65 ℃, under 5000 revs/min, stir 20 minutes, add again 2-fluoroacetic acid base fourth to lead acid, vinylformic acid, polyvinyl butyral acetal, sec.-propyl three (dioctylphyrophosphoric acid acyloxy) titanic acid ester, stirring reaction 26 minutes; Be cooled to 24 ℃ again, then add other remaining component, stirring reaction 50 minutes, to obtain final product.
The preparation method of described LED lamp heat radiation coating, comprise the following steps: ethyl polysilicate, nanoclay, aluminium nitride, beryllium oxide are mixed, 1200 revs/min of lower stirring reactions 15 minutes, add ethyl acetate, dimethylbenzene, be then warming up to 45 ℃, add polyacrylic acid resin, polyimide resin, polyacrylamide, benzyl trimethyl tribromide ammonium, continue to stir 25 minutes, then add other remaining component, continue stirring reaction 35 minutes, grinding obtains slurry, to obtain final product.
Coating of the present invention is applied on LED housing to artificial accelerated aging test under 80 ℃ and 300W ultraviolet light irradiation condition, 4800 hours ageing-resistant time, 280 ℃ of heatproof high temperature, bonding shearing force 15MPa., thermal conductivity 279 W/ (m ℃).
Claims (2)
1. a LED lamp heat radiation coating, is characterized in that being made up of the raw material of following weight part: polyacrylic acid resin 30-35, polyimide resin 40-46, polyacrylamide 4-6, isophorone diamine IPDA8-12, dimethylbenzene 20-24, ethyl polysilicate 6-9, Silane coupling agent KH550 2-3, nanoclay 2-3, ethyl acetate 8-12, benzyl trimethyl tribromide ammonium 2-4, aluminium nitride 10-12, beryllium oxide 10-12, film coalescence aid 4-5;
Described film coalescence aid is made by the raw material of following weight part: ethylene glycol ether acetate 6-9,2-fluoroacetic acid base fourth are led sour 2-4, vinylformic acid 3-5, polyvinyl butyral acetal 2-4, HMPA 3-5, meraneine 3-5, sec.-propyl three (dioctylphyrophosphoric acid acyloxy) titanic acid ester 0.5-1, hydroxymethyl-propyl cellulose 2-3, nano-chitosan 0.3-0.5, plasticity-starch 1-2, acetyl peroxide 0.2-0.4, propylene glycol methyl ether acetate 15-18; Preparation method is: ethylene glycol ether acetate, HMPA, meraneine, hydroxymethyl-propyl cellulose, nano-chitosan, plasticity-starch, propylene glycol methyl ether acetate are mixed, stir 5-10 minute, be heated to 60-70 ℃, under 4000-6000 rev/min, stir 18-25 minute, add again 2-fluoroacetic acid base fourth to lead acid, vinylformic acid, polyvinyl butyral acetal, sec.-propyl three (dioctylphyrophosphoric acid acyloxy) titanic acid ester, stirring reaction 15-30 minute; Be cooled to 20-25 ℃ again, then add other remaining component, stirring reaction 45-60 minute, to obtain final product.
2. the preparation method of LED lamp heat radiation coating according to claim 1, it is characterized in that comprising the following steps: ethyl polysilicate, nanoclay, aluminium nitride, beryllium oxide are mixed, at 1100-1300 rev/min of lower stirring reaction 10-20 minute, add ethyl acetate, dimethylbenzene, then be warming up to 40-50 ℃, add polyacrylic acid resin, polyimide resin, polyacrylamide, benzyl trimethyl tribromide ammonium, continue to stir 20-30 minute, add again other remaining component, continue stirring reaction 30-40 minute, grinding obtains slurry, to obtain final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410050679.5A CN103881562A (en) | 2014-02-14 | 2014-02-14 | Heat dissipation coating for LED (Light Emitting Diode) lamps and preparation method thereof |
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| CN201410050679.5A CN103881562A (en) | 2014-02-14 | 2014-02-14 | Heat dissipation coating for LED (Light Emitting Diode) lamps and preparation method thereof |
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| CN103881562A true CN103881562A (en) | 2014-06-25 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104711467A (en) * | 2015-03-16 | 2015-06-17 | 合肥瑞华电子科技有限责任公司 | Rare-earth yttrium-doped aluminum-based composite heat dissipation material for LED |
| CN104861939A (en) * | 2015-06-12 | 2015-08-26 | 固态照明张家口有限公司 | Heat radiation material and LED soft strip lamp flexible circuit board based on material |
| CN108129957A (en) * | 2018-02-06 | 2018-06-08 | 合肥东恒锐电子科技有限公司 | A kind of power device heat radiation coating and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103351743A (en) * | 2013-06-19 | 2013-10-16 | 天长市驰程电子科技有限公司 | Thermal-conductive and heat-dissipation coating and preparation method thereof |
-
2014
- 2014-02-14 CN CN201410050679.5A patent/CN103881562A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103351743A (en) * | 2013-06-19 | 2013-10-16 | 天长市驰程电子科技有限公司 | Thermal-conductive and heat-dissipation coating and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104711467A (en) * | 2015-03-16 | 2015-06-17 | 合肥瑞华电子科技有限责任公司 | Rare-earth yttrium-doped aluminum-based composite heat dissipation material for LED |
| CN104861939A (en) * | 2015-06-12 | 2015-08-26 | 固态照明张家口有限公司 | Heat radiation material and LED soft strip lamp flexible circuit board based on material |
| CN104861939B (en) * | 2015-06-12 | 2018-02-13 | 矽照光电（厦门）有限公司 | A kind of heat sink material and the soft bar lamp FPCs of LED based on the material |
| CN108129957A (en) * | 2018-02-06 | 2018-06-08 | 合肥东恒锐电子科技有限公司 | A kind of power device heat radiation coating and preparation method thereof |
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Application publication date: 20140625 |