CN103872163A - Black solar cell backplane and manufacturing method thereof - Google Patents
Black solar cell backplane and manufacturing method thereof Download PDFInfo
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- CN103872163A CN103872163A CN201410128998.3A CN201410128998A CN103872163A CN 103872163 A CN103872163 A CN 103872163A CN 201410128998 A CN201410128998 A CN 201410128998A CN 103872163 A CN103872163 A CN 103872163A
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- 238000004519 manufacturing process Methods 0.000 title 1
- 229920005989 resin Polymers 0.000 claims abstract description 138
- 239000011347 resin Substances 0.000 claims abstract description 138
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 35
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 24
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 22
- 239000011737 fluorine Substances 0.000 claims abstract description 22
- 239000006229 carbon black Substances 0.000 claims abstract description 15
- 239000011256 inorganic filler Substances 0.000 claims abstract description 15
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 15
- 239000002904 solvent Substances 0.000 claims abstract description 14
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 12
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 230000004888 barrier function Effects 0.000 claims description 35
- 229920001577 copolymer Polymers 0.000 claims description 15
- 229920001567 vinyl ester resin Polymers 0.000 claims description 15
- 238000002360 preparation method Methods 0.000 claims description 12
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- 229910017083 AlN Inorganic materials 0.000 claims description 5
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 5
- 150000001718 carbodiimides Chemical class 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 5
- 150000002513 isocyanates Chemical class 0.000 claims description 5
- 238000000637 aluminium metallisation Methods 0.000 claims description 4
- 229960005363 aluminium oxide Drugs 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000011342 resin composition Substances 0.000 abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 229940024548 aluminum oxide Drugs 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- FYIBGDKNYYMMAG-UHFFFAOYSA-N ethane-1,2-diol;terephthalic acid Chemical compound OCCO.OC(=O)C1=CC=C(C(O)=O)C=C1 FYIBGDKNYYMMAG-UHFFFAOYSA-N 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000005341 toughened glass Substances 0.000 description 4
- 230000003679 aging effect Effects 0.000 description 3
- 239000005030 aluminium foil Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000003049 inorganic solvent Substances 0.000 description 2
- 229910001867 inorganic solvent Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention provides a black solar cell backplane. The black solar cell backplane comprises a first black heat-conducting weather-proof layer, a substrate, an isolating layer and a second black heat-conducting weather-proof layer, wherein the first black heat-conducting weather-proof layer, the substrate, the isolating layer and the second black heat-conducting weather-proof layer are sequentially stacked. The substrate is filled with a first resin composition. The first black heat-conducting weather-proof layer is made of a second resin composition. The second heat-conducting weather-proof layer is made of a third resin composition. The first resin composition, the second resin composition and the third resin composition respectively comprise, by weight, 100 parts of fluorine-containing resin, 8 to 20 parts of a curing agent, 80 to 200 parts of a solvent, 50 to 100 parts of inorganic filler and one to five parts of carbon black. The insulating layer is made of aluminum or silicon dioxide. Due to the fact that each resin composition is a medium with a high heat conductivity coefficient, each layer of the black solar cell backplane contains the good heat-conducting material, and the black solar cell backplane is high in heat conductivity.
Description
Technical field
The present invention relates to technical field of solar batteries, relate in particular to a kind of black solar cell backboard and preparation method thereof.
Background technology
Solar cell, is again photovoltaic cell, is the device that directly light energy conversion is become to electric energy by photoelectric effect or Photochemical effects.Solar cell is widely used in the departments such as military affairs, space flight, industry, business, agricultural, communication, household electrical appliance and public utility.
Along with the needs attractive in appearance of house class photovoltaic module, black assembly is also progressively developed and comes into operation.In global range, residential building class photovoltaic module is constantly promoted at present, and demand also increases thereupon, and the consumption of black solar energy backboard synchronously increases simultaneously.
Solar module is a kind of device that due to photovoltaic effect, solar energy is converted into electric energy, is a kind of novel power supply, has long feature of permanent, spatter property and the large advantage of flexibility three and life-span.Compared with white solar components, after being sunlighted, black solar module cannot major part be reflected and directly be absorbed, and cause the temperature of inside solar energy battery to raise, and the temperature of solar cell affect the efficiency of solar cell.For example, for the solar cell of typical use crystalline silicon, it is about 10～17% that photoelectric conversion efficiency is generally, and when 1 DEG C of the every rising of temperature of solar cell, its power just loses approximately 0.4～0.5%.Therefore,, in order to improve the efficiency of solar cell, it is very important that the temperature that prevents solar cell in use raises.And the radiating efficiency of black solar cell is poor at present, causes the temperature of solar cell to raise, thereby cause power loss.
Summary of the invention
The technical problem that the present invention solves is to provide a kind of heat conductivility good black solar cell backboard, and the application's black solar cell backboard has good weatherability.
The application provides a kind of black solar cell backboard, comprises stack arranges successively the first black heat conduction weathering layer, substrate, barrier layer and the second black heat conduction weathering layer, and described substrate inside is filled with the first resin combination;
Described the first black heat conduction weathering layer is formed by the second resin combination, and described the second black heat conduction weathering layer is formed by the 3rd resin combination, and described the first resin combination, the second resin combination and the 3rd resin combination independently comprise separately:
Fluorine resin 100 weight portions;
Curing agent 8～20 weight portions;
Solvent 80～200 weight portions;
Inorganic filler 50～100 weight portions;
Carbon black 1～5 weight portion;
Described barrier layer is formed by aluminium or silicon dioxide.
Preferably, described fluorine resin is one or more in Kynoar, trifluoro-ethylene-hydroxy alkyl vinyl ether co-polymer, chlorotrifluoroethylene-hydroxy alkyl vinyl ether co-polymer, tetrafluoroethene-hydroxy alkyl vinyl ether co-polymer, trifluoro-ethylene-carboxyalkyl vinyl ester copolymer, chlorotrifluoroethylene-carboxyalkyl vinyl ester copolymer and tetrafluoroethene-carboxyalkyl vinyl ester copolymer.
Preferably, described curing agent is one or more in epoxy curing agent, isocyanate curing agent and carbodiimides curing agent.
Preferably, described solvent is one or more in toluene, ethyl acetate, butyl acetate and cyclohexanone; Described inorganic filler is one or more mixtures in micarex, boron nitride, silica, titanium dioxide, aluminium nitride, calcium carbonate, talcum powder.
The application also provides the preparation method of described black solar cell backboard, comprises the following steps:
To be provided with surface-coated first resin combination of substrate of micropore, after solidifying, apply the second resin combination, after again solidifying, obtain the first black heat conduction weathering layer;
At another surperficial AM aluminum metallization or silicon dioxide of described substrate, obtain barrier layer;
At described barrier layer surface-coated the 3rd resin combination, after solidifying, obtain black solar cell backboard;
Described the first resin combination, the second resin combination and the 3rd resin combination independently comprise separately:
Fluorine resin 100 weight portions;
Curing agent 8～20 weight portions;
Solvent 80～200 weight portions;
Inorganic filler 50～100 weight portions;
Carbon black 1～5 weight portion.
Preferably, the mass ratio of described the first resin combination and described the second resin combination is (60～80): (20～40).
Preferably, the micropore that the surface of described substrate arranges is of a size of 0.5mm～1mm, and described micropore is 10%～30% of the described substrate gross area.
Preferably, the thickness of described substrate is 120 μ m～280 μ m, and the thickness of described barrier layer is 1 μ m～5 μ m, and the thickness of described the first black heat conduction weathering layer is 10 μ m～40 μ m.
Preferably, described fluorine resin is one or more in Kynoar, trifluoro-ethylene-hydroxy alkyl vinyl ether co-polymer, chlorotrifluoroethylene-hydroxy alkyl vinyl ether co-polymer, tetrafluoroethene-hydroxy alkyl vinyl ether co-polymer, trifluoro-ethylene-carboxyalkyl vinyl ester copolymer, chlorotrifluoroethylene-carboxyalkyl vinyl ester copolymer and tetrafluoroethene-carboxyalkyl vinyl ester copolymer.
Preferably, it is characterized in that, described curing agent is one or more in epoxy curing agent, isocyanate curing agent and carbodiimides curing agent.
The application provides a kind of black solar cell backboard, and it comprises stack arranges successively the first black heat conduction weathering layer, substrate, barrier layer and the second black heat conduction weathering layer, and described substrate inside is filled with the first resin combination; Described the first black heat conduction weathering layer and the second black heat conduction weathering layer are formed by the second resin combination and the 3rd resin combination respectively, and described the first resin combination, the second resin combination and the 3rd resin combination comprise respectively fluorine resin, curing agent, inorganic filler, solvent and carbon black.The application is owing to being filled with the first resin combination in substrate inside, and the first black heat conduction weathering layer in backboard and the second black heat conduction weathering layer are formed by the second resin combination and the 3rd resin combination respectively, resin combination is a kind of medium with high thermal conductivity coefficient, therefore every layer of solar cell backboard all includes good Heat Conduction Material, heat successfully come out from inside and reduce the working temperature of backboard, making solar cell backboard there is good thermal conductivity; Because the major ingredient fluorine resin in resin combination has good weatherability, therefore the weatherability of solar cell backboard is also improved simultaneously.In addition, the application is provided with barrier layer in black solar cell backboard, and it can stop seeing through of steam, has improved the ageing properties of solar cell backboard.
Brief description of the drawings
Fig. 1 is the structural representation of black solar cell backboard provided by the invention.
Embodiment
In order further to understand the present invention, below in conjunction with embodiment, the preferred embodiment of the invention is described, but should be appreciated that these are described is for further illustrating the features and advantages of the present invention, instead of limiting to the claimed invention.
The embodiment of the invention discloses a kind of black solar cell backboard, comprise stack arranges successively the first black heat conduction weathering layer, substrate, barrier layer and the second black heat conduction weathering layer, described substrate inside is filled with the first resin combination;
Described the first black heat conduction weathering layer is formed by the first resin combination, and described the second black heat conduction weathering layer is formed by the second resin combination, and described the first resin combination, the second resin combination and the 3rd resin combination independently comprise separately:
Fluorine resin 100 weight portions;
Curing agent 8～20 weight portions;
Solvent 80～200 weight portions;
Inorganic filler 50～100 weight portions;
Carbon black 1～5 weight portion;
Described barrier layer is formed by aluminium or silicon dioxide.
The application provides a kind of black solar cell backboard, as shown in Figure 1, Fig. 1 is the structural representation of black solar cell backboard of the present invention, wherein, 1 is the first black heat conduction weathering layer, and 2 is substrate, and 3 is barrier layer, 4 is the second black heat conduction weathering layer, and 5 for being filled in the resin combination in 2.Described in the application, the thickness of the first black heat conduction weathering layer is preferably 10 μ m～40 μ m, the thickness of described substrate is preferably 120 μ m～280 μ m, the thickness of described barrier layer is preferably 1 μ m～5 μ m, and the thickness of described the second black heat conduction weathering layer is preferably 10 μ m～40 μ m.
Described in the application, the substrate of black solar cell backboard is material well known to those skilled in the art, and the present invention has no particular limits this.Described in the application, substrate inside is filled with the first resin combination, described the first black heat conduction weathering layer is formed by the second resin combination, described the second black heat conduction weathering layer is formed by the 3rd resin combination, and described the first resin combination, the second resin combination and the 3rd resin combination independently comprise separately:
Fluorine resin 100 weight portions;
Curing agent 8～20 weight portions;
Solvent 80～200 weight portions;
Inorganic filler 50～100 weight portions;
Carbon black 1～5 weight portion.
Above-mentioned fluorine resin is the major ingredient of resin combination, mainly have the effect that improves weatherability, described fluorine resin is preferably one or more in Kynoar, trifluoro-ethylene-hydroxy alkyl vinyl ether co-polymer, chlorotrifluoroethylene-hydroxy alkyl vinyl ether co-polymer, tetrafluoroethene-hydroxy alkyl vinyl ether co-polymer, trifluoro-ethylene-carboxyalkyl vinyl ester copolymer, chlorotrifluoroethylene-carboxyalkyl vinyl ester copolymer and tetrafluoroethene-carboxyalkyl vinyl ester copolymer.
Described curing agent, for solidifying major ingredient, is preferably one or more in epoxy curing agent, isocyanate curing agent and carbodiimides curing agent.The content of described curing agent is 8～20 weight portions, is preferably 10～15 weight portions.Inorganic filler described in the application is a kind of high thermal conductivity coefficient medium, and can increase the anti-ultraviolet ageing performance of backboard, and carbon black is mainly in order to obtain black backboard.Described inorganic filler is preferably one or more in micarex, boron nitride, silica, titanium dioxide, aluminium nitride, calcium carbonate and talcum powder, more preferably aluminium nitride, silicon nitride or boron nitride; The content of described inorganic filler is 50～100 weight portions, and more preferably 60～85 weight portions most preferably are 65 weight portion～75 weight portions; The content of described carbon black is 1～15 weight portion, is preferably 5～10 weight portions.Described in the application, in resin combination, also comprise solvent, described solvent is by other components dissolved in resin combination.Described solvent is preferably one or more in toluene, ethyl acetate, butyl acetate and cyclohexanone, more preferably butyl acetate.The content of described solvent is 80～200 weight portions, is preferably 100～160 weight portions.
The first resin combination described in the application, the second resin combination can be identical with the 3rd component of resin combination and the content of every kind of component, also can be different, and the application does not do special restriction.As preferred version, the first resin combination described in the application, the second resin combination are identical with the 3rd resin combination.The mass ratio of described the first resin combination and described the second resin combination is preferably (60～80): (20～40).
Barrier layer described in the application is formed by aluminium or silicon dioxide, and described barrier layer can prevent seeing through of steam, improves the ageing properties of solar cell backboard.
The application also provides the preparation method of described black solar cell backboard, comprises the following steps:
To be provided with surface-coated first resin combination of substrate of micropore, after solidifying, apply the second resin combination, after again solidifying, obtain the first black heat conduction weathering layer;
At another surperficial AM aluminum metallization or silicon dioxide of described substrate, obtain barrier layer;
At described barrier layer surface-coated the 3rd resin combination, after solidifying, obtain black solar cell backboard;
Described the first resin combination, the second resin combination and the 3rd resin combination independently comprise separately:
Fluorine resin 100 weight portions;
Curing agent 8～20 weight portions;
Solvent 80～200 weight portions;
Inorganic filler 50～100 weight portions;
Preparing in the process of black solar cell backboard, first the application is being provided with surface-coated first resin combination of substrate of micropore, the wherein said preferably preparation by the following method of substrate that is provided with micropore:
Adopt mechanical method evenly to punch out micropore at substrate layer.
Micropore of the present invention is preferably dimensioned to be 0.5mm～1mm.The gross area of described micropore is preferably 10%～30% of the described substrate gross area, and more preferably 15%～25%.
After the preparatory process of substrate is completed, the application is being provided with surface-coated first resin combination of substrate of micropore, the first resin combination is filled up described micropore, the first resin combination applies the second resin combination after solidifying, and after again solidifying, obtains the first black heat conduction weathering layer.Described in the application, the curing process of the first resin combination and the second resin combination, is the process that the base material of coating resin combination is toasted; Described curing temperature is preferably 100 DEG C～150 DEG C, and the curing time is preferably 1～5min; Described curing temperature is again preferably 100 DEG C～150 DEG C, and the curing time is preferably 1min～5min again.In the process of coating the second resin combination, the application preferably applies the second resin combination in the time that the curing degree of the first resin combination reaches 70%～90%.The application has carried out twice coating at described substrate surface, in the micropore that can ensure to make the first resin combination be filled in described substrate, also can avoid the appearance of pin hole simultaneously.In order to make solar cell backboard have good thermal conductivity, the mass ratio of described the first resin combination and described the second resin combination is preferably (60～80): (20～40).
Described in the application, the material of substrate is material well known to those skilled in the art, does not do special restriction herein.The thickness of described substrate is preferably 120 μ m～280 μ m, too thin its support performance that can affect of described substrate.The thickness of described the first black heat conduction weathering layer is preferably 10 μ m～40 μ m, and described first black heat conduction weathering layer is too thin cannot reach good weatherability.
According to the present invention, described the first black heat conduction weathering layer, at another surperficial AM aluminum metallization or silicon dioxide of described substrate, obtains barrier layer after having prepared.The thickness of described barrier layer is preferably 1 μ m～5 μ m, if described barrier layer is too thin, can affect the too large bad realization of aqueous vapor barrier and coating difficulty.After prepared by described barrier layer, at surface-coated the 3rd resin combination of described barrier layer, after solidifying, obtain the second black heat conduction weathering layer, also obtained black solar cell backboard simultaneously, it comprises above-mentioned the first black heat conduction weathering layer setting gradually, and inside is filled with substrate, barrier layer and the second black heat conduction weathering layer of resin combination.
The invention provides a kind of black solar cell backboard, it comprises stack arranges successively the first black heat conduction weathering layer, substrate, barrier layer and the second black heat conduction weathering layer, and described substrate inside is filled with the first resin combination; Described the first black heat conduction weathering layer is formed by the second resin combination, described the second black heat conduction weathering layer is formed by the 3rd resin combination, and described the first resin combination, the second resin combination and the 3rd resin combination comprise respectively fluorine resin, curing agent, inorganic filler, solvent and carbon black.The application is owing to being filled with the first resin combination in substrate inside, and the first black heat conduction weathering layer in backboard and the second black heat conduction weathering layer are formed by the second resin combination and the 3rd resin combination respectively, resin combination is a kind of medium with high thermal conductivity coefficient, therefore every layer of solar cell backboard all includes good Heat Conduction Material, heat successfully come out from inside and reduce the working temperature of backboard, making solar cell backboard there is good thermal conductivity; Because the major ingredient fluorine resin in resin combination has good weatherability, therefore the weatherability of solar cell backboard is also improved simultaneously.In addition, the application is provided with barrier layer in black solar cell backboard, and it can stop seeing through of steam, has improved the ageing properties of solar cell backboard.
In order further to understand the present invention, below in conjunction with embodiment, black solar cell backboard provided by the invention and preparation method thereof is elaborated, protection scope of the present invention is not limited by the following examples.
In the present embodiment, resin composition formula is as follows, in mass fraction:
Fluorine resin (LF200, Asahi Glass Co., Ltd manufactures) 100;
Curing agent N3300(Bayer Bitterfeld GmbH is manufactured) 15;
Boron nitride 50;
Butyl acetate 160;
Carbon black 8.
At substrate P ET(ethylene glycol terephthalate) in mechanical uniform punch out 0.5mm size micropore, micropore accounts for the gross area 20%.By the surface mixing, account for resin combination total amount 60wt% the first resin combination scraper coating device of 40 μ m and be coated on substrate P ET, micropore is filled up simultaneously, at the temperature of 120 DEG C, toast 1min, now the first resin combination presents semi-cured state.Subsequently, the second resin combination that accounts for resin combination 40wt% is coated on the first resin combination of semi-cured state and dries 2min at 120 DEG C, obtaining total build is the first black heat conduction weathering layer of 23 μ m～30 μ m.Normal temperature left standstill after 30 hours, carried out second coating.Adopt the method for vacuum evaporation at another surperficial evaporation aluminium foil of substrate P ET, form barrier layer, thickness is 2 μ m.Adopt in the same way at barrier layer surface-coated resin combination, slaking 24 hours, obtains heat conduction black solar energy backboard 1 at 60 DEG C.
In the present embodiment, resin composition formula is as follows, in mass fraction:
Fluorine resin (GK570, great Jin coating is manufactured) 100;
Curing agent TKA-100(Asahi Chemical Industry manufactures) 15;
Aluminium nitride 100;
Butyl acetate 150;
Carbon black 6.
At substrate P ET(ethylene glycol terephthalate) in mechanical uniform punch out 0.5mm size micropore, micropore accounts for the gross area 25%.By the surface mixing, account for total amount 70wt% the first resin combination scraper coating device of 40 μ m and be coated on substrate P ET, micropore is filled up simultaneously, at the temperature of 120 DEG C, toast 1.5min, now the first resin combination presents semi-cured state.Subsequently, the second resin combination that accounts for total amount 30wt% is coated on the first resin combination of semi-cured state and dries 2.5min at 120 DEG C, obtaining total build is the first black heat conduction weathering layer of 23 μ m～30 μ m.Normal temperature left standstill after 30 hours, carried out second coating.Adopt the method for vacuum evaporation at another surperficial evaporation aluminium foil of substrate P ET, form barrier layer, thickness is 3 μ m.Adopt the surface-coated resin combination at barrier layer in the same way, slaking 24 hours, obtains heat conduction black solar energy backboard 2 at 60 DEG C.
In the present embodiment, resin composition formula is as follows, in mass fraction:
Fluorine resin (LF600X, Asahi Glass Co., Ltd manufactures) 100;
Curing agent TKA-100(Mitsui Chemicals is manufactured) 15;
Carborundum 75;
Butyl acetate 140;
At substrate P ET(ethylene glycol terephthalate) in mechanical uniform punch out 0.5mm size micropore, micropore accounts for the gross area 15%.By mix, account for resin combination total amount 60wt% the first resin combination scraper coating device of 40 μ m and be coated on pet sheet face, micropore is filled up simultaneously, at the temperature of 120 DEG C, toast 1min, now the first resin combination presents semi-cured state.Subsequently, the second resin combination that accounts for resin combination 35wt% is coated on the first resin combination of semi-cured state and dries 2.5min at 120 DEG C, obtaining total build is the first black heat conduction weathering layer of 23 μ m～30 μ m.Normal temperature left standstill after 30 hours, carried out second coating.Adopt the method for vacuum evaporation at another surperficial evaporation aluminium foil of substrate P ET, form barrier layer, thickness is 2 μ m.Adopt the surface at barrier layer in the same way and carry out coating, slaking 24 hours, obtains heat conduction black solar energy backboard 3 at 60 DEG C.
By stacked in accordance with regulations to toughened glass, EVA film, solar cell circuit, EVA film, heat conduction black solar energy backboard 1, then obtain solar cell 1 through laminating machine pressing heat-sealing.
By stacked in accordance with regulations to toughened glass, EVA film, solar cell circuit, EVA film, heat conduction black solar energy backboard 2, then obtain solar cell 2 through laminating machine pressing heat-sealing.
Embodiment 6
By stacked in accordance with regulations to toughened glass, EVA film, solar cell circuit, EVA film, heat conduction black solar energy backboard 3, then obtain solar cell 3 through laminating machine pressing heat-sealing.
Comparative example 1
In this comparative example, resin composition formula is as follows, in mass fraction:
Fluorine resin (GK570, great Jin coating is manufactured) 100;
Curing agent N3300(Bayer Bitterfeld GmbH is manufactured) 15;
Titanium dioxide 75;
Butyl acetate 140.
The resin combination mixing is coated on to substrate P ET(ethylene glycol terephthalate with the scraper coating device of 60 μ m) surface, 120 DEG C of baking 4min, normal temperature left standstill after 30 hours, adopted the another side coating resin combination at substrate P ET in the same way.At 60 DEG C, slaking 24 hours, obtains solar energy backboard 4.
Comparative example 2
By stacked in accordance with regulations to toughened glass, EVA film, solar cell circuit, EVA film, heat conduction solar energy backboard 4, then obtain solar cell 4 through laminating machine pressing heat-sealing.
The performance of solar cell backboard prepared by detection embodiment 1～3 and comparative example 1, as shown in table 1.Wherein, the outward appearance of solar cell backboard obtains by range estimation; The test of UV is with reference to the method for IEC6121515-10.10; The test of wet-heat resisting is with reference to the method for IEC6121515-10.13; The test of moisture-vapor transmission is with reference to the method for ASTM F-1249; The mensuration of conductive coefficient is with reference to the method for ASTM D-5470.Embodiment 4～6 and comparative example 2 be comprise prepared by embodiment 1～3 and comparative example 1 the solar cell of solar cell backboard, detect the generating efficiency of embodiment 4～6 and the solar cell of comparative example 2, as shown in table 2.
The performance structure number of solar cell backboard prepared by table 1 embodiment 1～3 and comparative example 1
According to table
The performance data table of the solar cell of table 2 embodiment 4～6 and comparative example 2
| ? | |
|
Embodiment 6 | Comparative example 2 |
| Generating efficiency/% | 17.3 | 17.0 | 16.8 | 16.1 |
From properties test result, heat conduction black solar energy backboard weather resistance excellence of the present invention, moisture-vapor transmission are low, and conductive coefficient is high.Adopt the solar cell power generation efficiency of solar energy backboard of the present invention high simultaneously.
The explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof.It should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also carry out some improvement and modification to the present invention, these improvement and modification also fall in the protection range of the claims in the present invention.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiment, General Principle as defined herein can, in the situation that not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. a black solar cell backboard, comprises stack arranges successively the first black heat conduction weathering layer, substrate, barrier layer and the second black heat conduction weathering layer, and described substrate inside is filled with the first resin combination;
Described the first black heat conduction weathering layer is formed by the second resin combination, and described the second black heat conduction weathering layer is formed by the 3rd resin combination, and described the first resin combination, the second resin combination and the 3rd resin combination independently comprise separately:
Fluorine resin 100 weight portions;
Curing agent 8～20 weight portions;
Solvent 80～200 weight portions;
Inorganic filler 50～100 weight portions;
Carbon black 1～5 weight portion;
Described barrier layer is formed by aluminium or silicon dioxide.
2. black solar cell backboard according to claim 1, it is characterized in that, described fluorine resin is one or more in Kynoar, trifluoro-ethylene-hydroxy alkyl vinyl ether co-polymer, chlorotrifluoroethylene-hydroxy alkyl vinyl ether co-polymer, tetrafluoroethene-hydroxy alkyl vinyl ether co-polymer, trifluoro-ethylene-carboxyalkyl vinyl ester copolymer, chlorotrifluoroethylene-carboxyalkyl vinyl ester copolymer and tetrafluoroethene-carboxyalkyl vinyl ester copolymer.
3. black solar cell backboard according to claim 1, is characterized in that, described curing agent is one or more in epoxy curing agent, isocyanate curing agent and carbodiimides curing agent.
4. black solar cell backboard according to claim 1, is characterized in that, described solvent is one or more in toluene, ethyl acetate, butyl acetate and cyclohexanone; Described inorganic filler is one or more mixtures in micarex, boron nitride, silica, titanium dioxide, aluminium nitride, calcium carbonate, talcum powder.
5. the preparation method of the black solar cell backboard described in claim 1～4 any one, comprises the following steps:
To be provided with surface-coated first resin combination of substrate of micropore, after solidifying, apply the second resin combination, after again solidifying, obtain the first black heat conduction weathering layer;
At another surperficial AM aluminum metallization or silicon dioxide of described substrate, obtain barrier layer;
At described barrier layer surface-coated the 3rd resin combination, after solidifying, obtain black solar cell backboard;
Described the first resin combination, the second resin combination and the 3rd resin combination independently comprise separately:
Fluorine resin 100 weight portions;
Curing agent 8～20 weight portions;
Solvent 80～200 weight portions;
Inorganic filler 50～100 weight portions;
Carbon black 1～5 weight portion.
6. preparation method according to claim 5, is characterized in that, the mass ratio of described the first resin combination and described the second resin combination is (60～80): (20～40).
7. preparation method according to claim 5, is characterized in that, the micropore that the surface of described substrate arranges is of a size of 0.5mm～1mm, and described micropore is 10%～30% of the described substrate gross area.
8. preparation method according to claim 5, is characterized in that, the thickness of described substrate is 120 μ m～280 μ m, and the thickness of described barrier layer is 1 μ m～5 μ m, described the first black heat conduction weathering layer and thickness be 10 μ m～40 μ m.
9. preparation method according to claim 5, it is characterized in that, described fluorine resin is one or more in Kynoar, trifluoro-ethylene-hydroxy alkyl vinyl ether co-polymer, chlorotrifluoroethylene-hydroxy alkyl vinyl ether co-polymer, tetrafluoroethene-hydroxy alkyl vinyl ether co-polymer, trifluoro-ethylene-carboxyalkyl vinyl ester copolymer, chlorotrifluoroethylene-carboxyalkyl vinyl ester copolymer and tetrafluoroethene-carboxyalkyl vinyl ester copolymer.
10. preparation method according to claim 5, is characterized in that, described curing agent is one or more in epoxy curing agent, isocyanate curing agent and carbodiimides curing agent.
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| CN104409549A (en) * | 2014-11-18 | 2015-03-11 | 苏州福斯特新材料有限公司 | High-efficiency black solar cell backplane and preparation method thereof |
| WO2017193583A1 (en) * | 2016-05-11 | 2017-11-16 | 明冠新材料股份有限公司 | Black aluminum-plastic film and polymer lithium battery |
| CN107611208A (en) * | 2017-10-12 | 2018-01-19 | 绍兴文理学院 | A kind of preparation method of heat radiating type solar cell backboard |
| CN112670362A (en) * | 2020-12-30 | 2021-04-16 | 苏州度辰新材料有限公司 | Anti ultraviolet heat conduction solar backplane |
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| CN104409549A (en) * | 2014-11-18 | 2015-03-11 | 苏州福斯特新材料有限公司 | High-efficiency black solar cell backplane and preparation method thereof |
| WO2017193583A1 (en) * | 2016-05-11 | 2017-11-16 | 明冠新材料股份有限公司 | Black aluminum-plastic film and polymer lithium battery |
| CN107611208A (en) * | 2017-10-12 | 2018-01-19 | 绍兴文理学院 | A kind of preparation method of heat radiating type solar cell backboard |
| CN112670362A (en) * | 2020-12-30 | 2021-04-16 | 苏州度辰新材料有限公司 | Anti ultraviolet heat conduction solar backplane |
| CN112670362B (en) * | 2020-12-30 | 2023-12-29 | 苏州度辰新材料有限公司 | Anti-ultraviolet heat-conducting solar backboard |
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Application publication date: 20140618 |