CN103871935B - A kind of chip gum and sealed in unit - Google Patents
A kind of chip gum and sealed in unit Download PDFInfo
- Publication number
- CN103871935B CN103871935B CN201410103889.6A CN201410103889A CN103871935B CN 103871935 B CN103871935 B CN 103871935B CN 201410103889 A CN201410103889 A CN 201410103889A CN 103871935 B CN103871935 B CN 103871935B
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- Prior art keywords
- chip
- board
- station
- gum
- module
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Abstract
The present invention relates to a kind of chip gum and sealed in unit and its using method, the raw material chip that the present invention is adopted arranges chip for board-like chip, often includes multiple chip templates.Compared with prior art, chip gum of the invention is punched module with the chip of sealed in unit（214）Including multiple cutting heads, multiple chip templates can be processed every time, i.e., punching action can be punched multiple chip modules every time, therefore substantially increase chip package efficiency.And the terminal of the chip gum of the present invention and sealed in unit（218）Including multiple chip transfer mechanisms, when part transfer mechanism therein is for chip seized condition, remaining chip transfer mechanism is in transfer state.Therefore chip Grasping skill is improve, compared with 1 or 2 chip transfer mechanism of prior art, the chip package machine of the present invention（2）Chip Grasping skill significantly improved, thus also improve the speed of chip package on the whole.
Description
Technical field
The present invention relates to field of chip manufacture technology, especially, is related to a kind of chip gum with sealed in unit and its use
Method.
Background technology
The chip gum of prior art and sealed in unit, the raw material chip which adopts are substantially belt, often arrange and only wrap
Two chip modules are included, therefore, when chip punching is carried out, each action is only for the back-gluing machine and chip package machine of prior art
Two chip templates are punched only, therefore, the gum of chip is slower with package speed, there is a problem of that production efficiency is low.
The content of the invention
The technical problem to be solved in the present invention is, for the deficiencies in the prior art, designs a kind of chip gum with envelope
Installing is standby, and the raw material chip for adopting arranges chip for board-like chip, often includes multiple chip templates, chip gum and the envelope of the present invention
The standby chip punching module of installing（214）Including multiple cutting heads, multiple chip templates, i.e. punching action every time can be processed every time
Multiple chip modules can be punched, therefore substantially increase chip package efficiency.And the chip gum of the present invention and sealed in unit
Terminal（218）Including multiple chip transfer mechanisms, when part transfer mechanism therein is for chip seized condition, remaining core
Piece transfer mechanism is in transfer state.Therefore chip Grasping skill is improve, 1 or 2 chip transfer mechanism with prior art
Compare, the chip package machine of the present invention（2）Chip Grasping skill significantly improved, thus also improve on the whole
The speed of chip package.
The technical solution adopted for the present invention to solve the technical problems is：A kind of chip gum and sealed in unit, including the back of the body
Glue machine（1）With chip package machine（2）, it is characterised in that：The raw material chip adopted with sealed in unit by the chip gum is for plate
Formula chip, the board-like chip are made up of multiple rows of chip arranged in parallel in the width direction, often arrange the core included by chip
The quantity of piece module is all higher than 2, the back-gluing machine（1）The structure of the gummed paper for being adopted is adapted with the board-like chip, institute
The width for stating gummed paper is equal with the width of the board-like chip, and the PUR on the top layer of the gummed paper is by back-gluing machine（1）It is cut into
The PUR module corresponding with each chip module, the back-gluing machine（1）Including gummed paper punching die（114）, the gummed paper punching
Punch die（114）Including multiple gummed paper cutting heads of linear array, the quantity of the gummed paper cutting head is existed with the board-like chip
The quantity for often arranging the chip module included by chip on width is identical, the chip package machine（2）The chip being punched
It is through the back-gluing machine（1）Board-like chip after gum process, the chip package machine（2）Module is punched including chip
（214）, the chip punching module（214）Including multiple chip cutting heads of linear array, the quantity of the chip cutting head
It is identical with the board-like chip quantity for often arranging the chip module included by chip in the direction of the width, the chip blanking die
Group（214）Punching action every time is punched the row's chip on the board-like Chip-wide direction.
Preferably, the chip package machine（2）Including：PLC control system, frame（211）, pan feeding for throwing in card
Cassette station（212）, chip pan feeding group for throwing in board-like chip（213）, for be punched board-like chip chip be punched module
（214）, for transporting the board-like chip, the servosystem of the chip module after the card and punching（215）, for knowing
The module identification group of other chip module quality（216）, bad chip disposable box for collecting bad chip（217）, in chip
The terminal for turning（218）, for chip conveyance chip transport mechanism（219）, for detecting double sheet inspection that whether card overlap
Survey station（220）, angle detecting station for detecting card placement direction（221）, on card be implanted into chip implant station
（222）, prewelding station for prewelding is carried out to chip（223）, for heat weldable hot weld station is carried out to chip（224）, for right
Chip carries out the cold welding station of cold welding（225）, for card weld quality inspection sampling observation and useless card gathering station（226）, for chip
Carry out the ATR measuring stations of ATR detections（227）, for collecting the receipts card station of card that encapsulation is finished（228）；The PLC controls system
System is installed in the frame（211）Inside, the pan feeding group（213）, chip punching module（214）, module identification group（216）、
Useless chip disposable box（217）, terminal（218）, chip transport mechanism（219）It is respectively positioned on frame（211）The top on surface, and according to
Secondary arrangement, the pan feeding cassette station（212）, double sheet measuring station（220）, angle detecting station（221）, implant station（222）, prewelding station
（223）, hot weld station（224）, cold welding station（225）, sampling observation and useless card gathering station（226）, ATR measuring stations（227）, receive card station
（228）Each erect-position be respectively positioned on frame（211）The bottom on surface, and be arranged in order.
Preferably, the hot weld station（224）Including a card twin-core hot weld station, for the encapsulation of a card twin-core, the hot weld
Stand（224）Also including a four core hot weld stations of card, for the encapsulation of four cores of card.
Preferably, the module identification group（216）Including multiple inductive probes, the inductive probe is used to recognize surface band
There is the bad chip module in hole, the quantity of the inductive probe is identical with the quantity of the chip cutting head, each inductive probe
Sensing action every time recognizes the chip module being equal to the row's core number on the board-like Chip-wide direction.
Preferably, the terminal（218）Including chip transfer mechanism（M）, chip transfer mechanism（N）, chip transfer machine
Structure（O）, chip transfer mechanism（P）, when the chip module on the chip transfer mechanism of part is in implant station（222）Crawl
During position, the chip module on other chip transfer mechanisms is located at implant station（222）Non-gripping position, in transfer state.
Preferably, the chip package machine（2）Implant station（222）Including the first implant station（2221）With the second implant station
（2222）, first implant station（2221）Point is transported including chip（E）, chip conveyance point（C）, the chip transfer mechanism
（M）, chip transfer mechanism（N）It is used to grab chips conveyance point（E）, chip conveyance point（C）The chip at place；Second implantation
Stand（2222）Point is transported including chip（D）, chip conveyance point（B）, the chip transfer mechanism（O）, chip transfer mechanism（P）
It is used to grab chips conveyance point（D）, chip conveyance point（B）The chip at place.
Preferably, the back-gluing machine（1）Including：Board（111）, install in the board（111）Internal PLC controls system
System, in the board（111）On the material strip buffer gear that is arranged in order（112）, discharge mechanism（113）, gummed paper punching die
（114）, PUR segmentation cutting mechanism（115）, board-like chip transport mechanism（116）, spot-welding mechanism（117）, gum mould
（118）, punishment in advance erect-position（119）, gum chip transport mechanism（120）, rewinding erect-position（121）, receiving mechanism（122）, board-like core
Piece rewinding box（123）, chip protection film rewinding box（124）；The board（111）For carrying the back-gluing machine（1）Other
Part, the material strip buffer gear（112）For buffering the tension force of masking tape to protect masking tape, the discharge mechanism（113）
For throwing in masking tape, the gummed paper punching die（114）For circular hole, the PUR segmentation are punched on the masking tape
Cutting mechanism（115）PUR for cutting masking tape top layer is the multiple moulds being adapted with the structure of the board-like chip
Block, the board-like chip transport mechanism（116）For throwing in board-like chip into the back-gluing machine（1）In, the spot-welding mechanism
（117）For spot welding, the gum mould are carried out to the board-like chip（118）For PUR described in Jing is segmented cutting machine
Structure（115）Melt viscosity after cutting is attached on the board-like chip, the punishment in advance erect-position（119）Transport with the gum chip
Mechanism（120）For transporting gum mould described in Jing（118）Board-like chip after gum, the rewinding erect-position（121）With rewinding
Mechanism（122）The board-like chip rewinding box is transported to for the board-like chip after by the gum（123）In, the board-like core
Piece rewinding box（123）For collecting gum mould described in storage Jing（118）Described board-like chip after being disposed, the chip
Protecting film rewinding box（124）For collecting the remaining masking tape Jing after throwing off top layer PUR and process.
Preferably, the chip package machine（2）Pan feeding group include receive protecting film magazine（K）, board-like chip enter magazine
（J）, feed box（I）；The back-gluing machine（1）Board-like chip rewinding box（123）With the chip package machine（2）Board-like chip
Enter magazine（J）Model it is identical, and the board-like chip rewinding box（123）Enter magazine with board-like chip（J）It is detachable.
A kind of chip gum and the using method of sealed in unit, comprise the following steps：
S1：Open the back-gluing machine（1）, back-gluing machine（1）Board-like chip after gum is finished enters the board-like chip receipts
Magazine（118）, treat the board-like chip rewinding box（118）After filling the board-like chip that gum is finished, board-like core is filled by described
The board-like chip rewinding box of piece（118）Remove；
S2：By the board-like chip rewinding box for filling board-like chip（118）It is installed to the chip package machine（2）On；
S3：Open the chip package machine（2）, by the board-like chip rewinding box for filling board-like chip（118）As
The chip package machine（2）Board-like chip enter magazine（J）Put into operation.
For board-like chip, often row's chip includes multiple the raw material chip adopted with sealed in unit by the chip gum of the present invention
Chip template, and the chip of prior art is non-board-like, often arranging chip only includes two templates.Compared with prior art, originally
The chip gum of invention includes multiple cutting heads with the chip punching module 214 of sealed in unit, can process multiple chip dies every time
Plate, i.e., punching action can be punched multiple chip modules every time, therefore substantially increase chip package efficiency.And the chip of the present invention
Gum includes multiple chip transfer mechanisms with the terminal 218 of sealed in unit, when part transfer mechanism therein is grabbed for chip
When taking state, remaining chip transfer mechanism is in transfer state.Therefore chip Grasping skill is improve, 1 or 2 with prior art
Individual chip transfer mechanism is compared, and the chip Grasping skill of the present invention is significantly improved, thus also improves core on the whole
The speed of piece encapsulation.
Description of the drawings
Fig. 1 is the front view of the chip gum with the back-gluing machine 1 of sealed in unit of present pre-ferred embodiments；
Fig. 2 is the top view of the chip gum with the back-gluing machine 1 of sealed in unit of present pre-ferred embodiments；
Fig. 3 is the front view of the chip gum with the chip package machine 2 of sealed in unit of present pre-ferred embodiments；
Fig. 4 is the top view of the chip gum with the chip package machine 2 of sealed in unit of present pre-ferred embodiments；
Fig. 5 is the structure schematic diagram of the chip gum with the chip package machine 2 of sealed in unit of present pre-ferred embodiments.
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment the invention will be further described：
As shown in figure 1, the front view of the back-gluing machine 1 for the chip gum and sealed in unit of present pre-ferred embodiments；Such as
Shown in Fig. 2, it is the top view of the chip gum with the back-gluing machine 1 of sealed in unit of present pre-ferred embodiments；
The chip gum of present pre-ferred embodiments is included with the back-gluing machine 1 of sealed in unit：Board 111, install in described
PLC control system, the material strip buffer gear 112 being arranged in order on board 111 inside board 111, discharge mechanism 113, glue
Paper punching die 114, PUR segmentation cutting mechanism 115, board-like chip transport mechanism 116, spot-welding mechanism 117, gum mould
118th, punishment in advance erect-position 119, gum chip transport mechanism 120, rewinding erect-position 121, receiving mechanism 122, board-like chip rewinding box
123, chip protection film rewinding box 124；Board 111 is used for the miscellaneous part for carrying the back-gluing machine 1, material strip buffer gear 112
For buffering the tension force of masking tape to protect masking tape, discharge mechanism 113 to be used to throw in masking tape, gummed paper punching die 114 is used
In being punched circular hole on masking tape, PUR segmentation cutting mechanism 115 be used to cutting the PUR on masking tape top layer be with it is board-like
Multiple modules that the structure of chip is adapted, board-like chip transport mechanism 116 are used to throw in board-like chip in back-gluing machine 1,
Spot-welding mechanism 117 for spot welding is carried out to board-like chip, cut for Jing PURs are segmented cutting mechanism 115 by gum mould 118
Melt viscosity after cutting is attached on board-like chip, and punishment in advance erect-position 119 is used to transport Jing gum moulds with gum chip transport mechanism 120
Has a board-like chip after 118 gums, rewinding erect-position 121 and receiving mechanism 122 are transported to plate for the board-like chip after by gum
In formula chip rewinding box 123, it is board-like Jing after gum mould 118 is disposed that board-like chip rewinding box 123 is used for collection storage
Chip, chip protection film rewinding box 124 are used to collect the remaining masking tape Jing after throwing off top layer PUR and process.
The raw material chip adopted with the back-gluing machine 1 of sealed in unit by the chip gum of present pre-ferred embodiments is for board-like core
Piece, is made up of multiple rows of chip arranged in parallel in the width direction, and the quantity of the chip module included by each row's chip is big
In 2；Preferably, the quantity of the chip template included by each row's chip can be 6.And prior art is adopted
Raw material chip be belt chip, often arrange only include two chip templates.Compared with prior art, the core of the embodiment of the present invention
Piece gum can process 6 chip templates every time with sealed in unit, substantially increase chip gum and packaging efficiency.
Preferably, the gummed paper punching die 114 of back-gluing machine 1 includes multiple gummed paper punchings of linear array
Head, the quantity phase of often arranging chip module that chip included of the quantity of gummed paper cutting head with board-like chip in the direction of the width
Together, as preferred embodiment, the quantity of gummed paper cutting head is also 6, gummed paper cutting head every time punching action in gummed paper bandwidth
It is to make board-like chip in the follow-up back of the body with the board-like number of chips identical through hole of every row, the purpose of the operation at punching on degree direction
The PUR pasted in glue step reserves an aperture in the centre of each chip template, so that it is guaranteed that aperture position is that do not have
There is glue, so as to the metal position of exposed chip.
The structure of the gummed paper adopted by back-gluing machine 1 is adapted with board-like chip, the width of the width of gummed paper and board-like chip
It is equal, the PUR on gummed paper top layer in back-gluing machine 1 Jing after PUR segmentation cutting mechanism 115 cuts, the hot melt on gummed paper top layer
Glue is cut into the PUR module corresponding with each chip module, and used as preferred embodiment, the PUR after cutting is in width
Often arrange on direction, so as to match with board-like chip, so as to accurate gum is realized in gum mould 118,
Pay each PUR module viscous on chip module.
As shown in figure 3, the main view of the chip package machine 2 for the chip gum and sealed in unit of present pre-ferred embodiments
Figure；As shown in figure 4, the top view of the chip package machine 2 for the chip gum and sealed in unit of present pre-ferred embodiments.
The chip gum of present pre-ferred embodiments is included with the chip package machine 2 of sealed in unit：PLC control system, machine
Frame 211, pan feeding cassette station 212, chip pan feeding group 213, chip punching module 214, servosystem 215, module identification group 216,
Bad chip disposable box 217, terminal 218, chip transport mechanism 219, double sheet measuring station 220, angle detecting station 221, implant station
222nd, prewelding station 223, hot weld station 224, cold welding station 225, sampling observation and useless card gathering station 226, ATR measuring stations 227, receipts card station 228.
Wherein, pan feeding cassette station 212 is used to throw in card, and chip pan feeding group 213 is used to throw in board-like chip, chip punching
Module 214 is used to be punched board-like chip, servosystem 215 be used to transport board-like chip, card and punching after chip module,
Module identification group 216 is used for that identification chip module to be fine or not, bad chip disposable box 217 is used to collecting bad chip, terminal 218 and is used for
Chip transfer, chip transport mechanism 219 are used for chip conveyance, double sheet measuring station 220 to be used to detect whether card overlaps, direction inspection
Survey station 221 is used to detect card placement direction, implant station 222 for chip, prewelding station 223 are implanted on card for chip
Carry out prewelding, hot weld station 224 to receive for carrying out chip on cold welding, sampling observation and useless card for carrying out chip at hot weld, cold welding station 225
Collection station 226 is used for card welding quality inspection, ATR measuring stations 227 to be used to collect envelope for carrying out chip ATR detections, receiving card station 228
Install complete card.
PLC control system is installed inside frame 211, pan feeding group 213, chip punching module 214, module identification group 216,
Useless chip disposable box 217, terminal 218, chip transport mechanism 219 are respectively positioned on the top on 211 surface of frame, and are arranged in order,
Pan feeding cassette station 212, double sheet measuring station 220, angle detecting station 221, implant station 222, prewelding station 223, hot weld station 224, cold welding
225, sampling observation of standing is respectively positioned under 211 surface of frame with each erect-position at useless card gathering station 226, ATR measuring stations 227, receipts card station 228
Portion, and be arranged in order.
Preferably, the chip is punched by chip package machine 2 be board-like chip, chip punching module 214 wrap
Include multiple chip cutting heads of linear array, often row chip institute of the quantity of chip cutting head with board-like chip in the direction of the width
Comprising chip module quantity it is identical, chip punching 214 each punching action of module be punched the board-like Chip-wide side
Row's chip upwards.Preferably, the quantity of the chip template included by each row's chip can be 6.And it is existing
The raw material chip adopted by technology is often arranged for belt chip.Compared with prior art, the present invention
The chip gum of embodiment can process 6 chip templates, i.e. chip punching module 214 every time with sealed in unit includes 6 punchings
Head, each punching action can be punched 6 chip modules, therefore substantially increase chip package efficiency.
Used as preferred embodiment, terminal 218 includes multigroup chip transfer mechanism；As preferred embodiment, in Fig. 4 in
Turning station 218 includes 4 groups of chip transfer mechanisms：Chip transfer mechanism（M）, chip transfer mechanism（N）, chip transfer mechanism（O）, core
Piece transfer mechanism（P）, preferably, this four groups of chip transfer mechanisms are entered using the accurate transmission cylinder with slide block
Row transmission, when the chip module on segment chip transfer mechanism is in the crawl position of implant station 222, other chip transfer machines
Chip module on structure is located at the non-gripping position of implant station 222, in transfer state.For specifically operating for terminal
Journey, refer to the follow-up narration to Fig. 5, will not be described here.
Used as preferred embodiment, module identification group 216 includes multiple inductive probes, for recognizing bad core of the surface with hole
Piece module, the quantity of inductive probe are identical with the quantity of the chip cutting head that chip is punched module 214.As preferred embodiment,
The quantity of inductive probe can be 6.Sensing action is recognized and the row on board-like Chip-wide direction each inductive probe every time
The chip module of core number equivalent, if certain inductive probe detects the chip template surface at this and has hole, that is, bad core
Piece template（Chip production manufacturer can punch in bad chip template labelling when chip is produced）；Then inductive probe is by the letter at this
PLC control system number is given, PLC control system controls servosystem 215 and bad chip template is sent into useless chip disposable box 217
In, so as to the operation such as hot weld, cold welding is not carried out to the evil idea.
Used as preferred embodiment, hot weld station 224 includes a card twin-core hot weld station, for the encapsulation of a card twin-core, i.e., per
Two chip templates are encapsulated on card, further, the card twin-core hot weld station may include 2 substations, i.e. 1 station of hot weld, hot weld 2
Stand, the corresponding welding arm in each substation includes 2 soldering tips, hot weld station 224 also including a four core hot weld stations of card, blocks four for one
The encapsulation of core, i.e., encapsulate four chip templates on every card, the card twin-core hot weld station may include 2 substations, i.e. hot weld 3
Stand, 4 station of hot weld, the corresponding welding arm in each substation include 4 soldering tips.
As shown in figure 5, the chip gum and the structure of the chip package machine 2 of sealed in unit for present pre-ferred embodiments shows
Meaning sketch.
Wherein, A：Machine erect-position, B：The conveyance point of second implant station 2222, C：The conveyance point of second implant station 2222, D：First
The conveyance point of implant station 2221, E：First implant station 2221 conveyance point, 214：Chip punching module, 217：Useless chip disposable box, K：
Receive protecting film magazine, J：Board-like chip enters magazine, I：Self-feeding box, H：Chip dies plate conveying arm, L：Carrying arm, M：In chip
Rotation mechanism, N：Chip transfer mechanism, O：Chip transfer mechanism, P：Chip transfer mechanism.
Preferably, the chip pan feeding group 213 of chip package machine 2 includes receiving protecting film magazine K, board-like chip
Enter magazine J, self-feeding box I；Chip transport mechanism 219 includes：Chip dies plate conveying arm H, carrying arm L；Receive protecting film magazine K
For collecting the protecting film that cushioning effect is played between chip and chip, board-like chip enters magazine J for storing board-like chip raw material
And pan feeding, self-feeding box I is for automatically by board-like chip feeding to chip punching module 214；Chip dies plate conveying arm H is used
In the fritter chip template that conveyance has been punched, carrying arm L is used to transport board-like chip and collects protecting film.
The implant station 222 of chip package machine 2 includes the first implant station 2221 and the second implant station 2222, the first implant station
2221 include chip conveyance point E, chip conveyance point D；Chip conveyance point E, chip transport point D correspond to respectively it is as shown in Figure 4 in
Turn chip transfer mechanism M, the chip transfer mechanism N at station 218；Chip transfer mechanism M, N are used to grab chips conveyance point E, core
Chip at piece conveyance point D；Second implant station 2222 includes chip conveyance point C, chip conveyance point B, chip conveyance point C, chip
Conveyance point B corresponds to the chip transfer mechanism O of terminal 218 as shown in Figure 4, chip transfer mechanism P, chip transfer mechanism respectively
O, P are used to the chip at grab chips conveyance point C, chip conveyance point B.
The chip module on conveyance point E, chip conveyance point D when the first implant station 2221 is in chip transfer mechanism M, core
Chip module position during the crawl position of piece transfer mechanism N, on chip conveyance point C, the chip conveyance point B of the second implant station 2222
In chip transfer mechanism O, the non-gripping position of chip transfer mechanism P, in transfer state；When the chip of the second implant station 2222
When chip module on conveyance point C, chip conveyance point B is in chip transfer mechanism O, the crawl position of chip transfer mechanism P, the
Chip module on chip conveyance point E, the chip conveyance point D of one implant station 2221 is located at chip transfer mechanism M, chip transfer machine
The non-gripping position of structure N, in transfer state.Namely first implant station 2221 always have one to be in the second implant station 2222
Chip seized condition, and another is in transfer state.
As preferred embodiment, the using method of the chip gum and sealed in unit of the present invention, including step：
S1：Back-gluing machine 1 is opened, the board-like chip after 1 gum of back-gluing machine is finished enters board-like chip rewinding box 118, treats plate
After formula chip rewinding box 118 fills the board-like chip that gum is finished, the board-like chip rewinding box 118 for filling board-like chip is taken
Under；
S2：The board-like chip rewinding box 118 for filling board-like chip is installed on chip package machine 2；
S3：Opening chip packaging machine 2, will fill the board-like chip rewinding box 118 of board-like chip as chip package machine 2
Board-like chip enters magazine J and puts into operation.
The raw material chip adopted with sealed in unit by the chip gum of present pre-ferred embodiments often arranges core for board-like chip
Piece includes multiple chip templates, and the chip of prior art is non-board-like, and often arranging chip only includes two templates.With existing skill
Art is compared, and the chip gum of the embodiment of the present invention includes multiple cutting heads with the chip punching module 214 of sealed in unit, every time may be used
Multiple chip templates are processed, i.e., punching action can be punched multiple chip modules every time, therefore substantially increase chip package efficiency.
And the chip gum of present pre-ferred embodiments includes 4 chip transfer mechanisms with the terminal 218 of sealed in unit, when wherein
Two transfer mechanisms for chip seized condition when, other two chip transfer mechanism be in transfer state.Therefore improve
Chip Grasping skill, compared with 1 or 2 chip transfer mechanism of prior art, the chip crawl of the chip package machine 2 of the present invention
Ability is significantly improved, thus also improves the speed of chip package on the whole.
Presently preferred embodiments of the present invention is the foregoing is only, those skilled in the art know, without departing from the present invention
Spirit and scope in the case of, various changes or equivalent can be carried out to these features and embodiment.In addition, at this
Under bright teaching, these features and embodiment can be modified to adapt to particular situation and material without departing from this
Bright spirit and scope.Therefore, the present invention is not limited to the particular embodiment disclosed, the power of fallen with the application
Embodiment in sharp claimed range belongs to protection scope of the present invention.
Claims (6)
1. a kind of chip gum and sealed in unit, including back-gluing machine（1）With chip package machine（2）, it is characterised in that：The chip
, for board-like chip, the board-like chip is by arranged in parallel in the width direction for the raw material chip adopted with sealed in unit by gum
Multiple rows of chip composition, the quantity for often arranging the chip module included by chip is all higher than 2, the back-gluing machine（1）Adopted
The structure of gummed paper is adapted with the board-like chip, and the width of the gummed paper is equal with the width of the board-like chip, the glue
The PUR on the top layer of paper is by back-gluing machine（1）It is cut into the PUR module corresponding with each chip module, the back-gluing machine（1）
Including gummed paper punching die（114）, the gummed paper punching die（114）It is including multiple gummed paper cutting heads of linear array, described
The quantity phase of often arranging chip module that chip included of the quantity of gummed paper cutting head with the board-like chip in the direction of the width
Together, the chip package machine（2）The chip being punched is through the back-gluing machine（1）Board-like chip after gum process, it is described
Chip package machine（2）Module is punched including chip（214）, the chip punching module（214）Including multiple cores of linear array
Piece cutting head, the chip included by often row chip of the quantity of the chip cutting head with the board-like chip in the direction of the width
The quantity of module is identical, and the chip is punched module（214）Punching action every time is punched on the board-like Chip-wide direction
Row's chip.
2. chip gum according to claim 1 and sealed in unit, it is characterised in that：The chip package machine（2）Including：
PLC control system, frame（211）, pan feeding cassette station for throwing in card（212）, the chip for throwing in board-like chip enters
Material group（213）, for be punched board-like chip chip be punched module（214）, for transporting the board-like chip, the card with
And the servosystem of the chip module after punching（215）, for the module identification group of identification chip module quality（216）, be used for
Collect the bad chip disposable box of bad chip（217）, for the terminal of chip transfer（218）, for chip conveyance chip remove
Send mechanism（219）, for detecting double sheet measuring station that whether card overlaps（220）, direction for detecting card placement direction
Measuring station（221）, on card be implanted into chip implant station（222）, prewelding station for prewelding is carried out to chip
（223）, for heat weldable hot weld station is carried out to chip（224）, cold welding station for cold welding is carried out to chip（225）, for card
The sampling observation of piece welding quality inspection and useless card gathering station（226）, ATR measuring stations for ATR detections are carried out to chip（227）, be used for
Collect the receipts card station of the card that encapsulation is finished（228）；The PLC control system is installed in the frame（211）Inside, it is described enter
Material group（213）, chip punching module（214）, module identification group（216）, useless chip disposable box（217）, terminal（218）, core
Piece transport mechanism（219）It is respectively positioned on frame（211）The top on surface, and be arranged in order, the pan feeding cassette station（212）, double sheet
Measuring station（220）, angle detecting station（221）, implant station（222）, prewelding station（223）, hot weld station（224）, cold welding station（225）、
Sampling observation and useless card gathering station（226）, ATR measuring stations（227）, receive card station（228）Each erect-position be respectively positioned on frame（211）Surface
Bottom, and be arranged in order.
3. chip gum according to claim 2 and sealed in unit, it is characterised in that：The hot weld station（224）Including one
Card twin-core hot weld station, for the encapsulation of a card twin-core, the hot weld station（224）Also including a four core hot weld stations of card, for a card
The encapsulation of four cores.
4. chip gum according to claim 2 and sealed in unit, it is characterised in that：The module identification group（216）Bag
Multiple inductive probes are included, the inductive probe is used to recognize bad chip module of the surface with hole, the quantity of the inductive probe
Identical with the quantity of the chip cutting head, sensing action is recognized and the board-like Chip-wide each inductive probe every time
The chip module of the row's core number equivalent on direction.
5. chip gum according to claim 1 and sealed in unit, it is characterised in that：The back-gluing machine（1）Including：Board
（111）, install in the board（111）Internal PLC control system, in the board（111）On the material strip that is arranged in order delay
Punch mechanism（112）, discharge mechanism（113）, gummed paper punching die（114）, PUR segmentation cutting mechanism（115）, board-like chip
Transport mechanism（116）, spot-welding mechanism（117）, gum mould（118）, punishment in advance erect-position（119）, gum chip transport mechanism
（120）, rewinding erect-position（121）, receiving mechanism（122）, board-like chip rewinding box（123）, chip protection film rewinding box（124）；
The board（111）For carrying the back-gluing machine（1）Miscellaneous part, the material strip buffer gear（112）For buffering adhesive
The tension force of paper tape is protecting masking tape, the discharge mechanism（113）For throwing in masking tape, the gummed paper punching die（114）
For circular hole is punched on the masking tape, the PUR is segmented cutting mechanism（115）For cutting the heat on masking tape top layer
Melten gel is the multiple modules being adapted with the structure of the board-like chip, the board-like chip transport mechanism（116）For throwing in
Board-like chip enters the back-gluing machine（1）In, the spot-welding mechanism（117）It is for carrying out spot welding to the board-like chip, described
Gum mould（118）For PUR described in Jing is segmented cutting mechanism（115）Melt viscosity after cutting is attached to described board-like
On chip, the punishment in advance erect-position（119）With the gum chip transport mechanism（120）For transporting gum mould described in Jing
（118）Board-like chip after gum, the rewinding erect-position（121）With receiving mechanism（122）For board-like after by the gum
Chip is transported to the board-like chip rewinding box（123）In, the board-like chip rewinding box（123）For collecting described in storage Jing
Gum mould（118）Described board-like chip after being disposed, the chip protection film rewinding box（124）Throw off for collecting Jing
Remaining masking tape after the PUR process of top layer.
6. chip gum according to claim 1 and sealed in unit, it is characterised in that：The chip package machine（2）Enter
Material group includes receiving protecting film magazine（K）, board-like chip enter magazine（J）, feed box（I）；The back-gluing machine（1）Board-like chip receive
Magazine（123）With the chip package machine（2）Board-like chip enter magazine（J）Model it is identical, and the board-like chip rewinding
Box（123）Enter magazine with board-like chip（J）It is detachable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410103889.6A CN103871935B (en) | 2014-03-19 | 2014-03-19 | A kind of chip gum and sealed in unit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410103889.6A CN103871935B (en) | 2014-03-19 | 2014-03-19 | A kind of chip gum and sealed in unit |
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| CN103871935A CN103871935A (en) | 2014-06-18 |
| CN103871935B true CN103871935B (en) | 2017-04-05 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104102931B (en) * | 2014-07-16 | 2017-01-25 | 上海华铭智能终端设备股份有限公司 | Sliding plate mechanism of automatic IC card selling and recycling device |
| CN104441050B (en) * | 2014-12-06 | 2016-08-24 | 苏州市华扬电子股份有限公司 | A kind of method removing gum waste material |
| CN106042047A (en) * | 2016-06-11 | 2016-10-26 | 杨树平 | Positioning circle shearing machine-60 |
| CN109358281A (en) * | 2018-10-11 | 2019-02-19 | 颜建芳 | Burning chip test equipment and its test or burning program method for chip |
| CN109256352B (en) * | 2018-10-15 | 2021-10-08 | 深圳成为控股有限公司 | Chip hot melting, welding packaging machine |
| CN109509719B (en) * | 2018-12-27 | 2023-11-10 | 东莞市锐祥智能卡科技有限公司 | Card slot back glue machine |
| CN110497577A (en) * | 2019-08-21 | 2019-11-26 | 苏州旭芯翔智能设备有限公司 | A kind of semiconductor components and devices encapsulation automation adapted to injection system and its working method |
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| CN102289699A (en) * | 2011-07-20 | 2011-12-21 | 上海浦江智能卡系统有限公司 | Double-chip SIM (Subscriber Identity Module) card |
| CN103065183A (en) * | 2011-10-20 | 2013-04-24 | 上海飞乐音响股份有限公司 | Manufacturing method for touch type intelligent card |
| CN103093271A (en) * | 2013-01-08 | 2013-05-08 | 上海浦江智能卡系统有限公司 | Double-interface intelligent card manufacture process and double-interface intelligent card |
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| JP4959457B2 (en) * | 2007-07-26 | 2012-06-20 | 東京エレクトロン株式会社 | Substrate transport module and substrate processing system |
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|---|---|---|---|---|
| CN102289699A (en) * | 2011-07-20 | 2011-12-21 | 上海浦江智能卡系统有限公司 | Double-chip SIM (Subscriber Identity Module) card |
| CN103065183A (en) * | 2011-10-20 | 2013-04-24 | 上海飞乐音响股份有限公司 | Manufacturing method for touch type intelligent card |
| CN103093271A (en) * | 2013-01-08 | 2013-05-08 | 上海浦江智能卡系统有限公司 | Double-interface intelligent card manufacture process and double-interface intelligent card |
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