CN103862512A - Electronic material processing locating method and applications thereof - Google Patents
Electronic material processing locating method and applications thereof Download PDFInfo
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- CN103862512A CN103862512A CN201210524174.9A CN201210524174A CN103862512A CN 103862512 A CN103862512 A CN 103862512A CN 201210524174 A CN201210524174 A CN 201210524174A CN 103862512 A CN103862512 A CN 103862512A
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- electronic material
- locating
- material processing
- machine
- punched
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- Details Of Cutting Devices (AREA)
Abstract
The invention relates to the technical field of electronic material processing locating and particularly relates to an electronic material processing locating method and applications thereof. The method comprises performing punching on an electronic material, wherein locating holes are punched on the two sides of the electronic material through a hob machine, and every two locating holes are symmetrical; putting the locating holes of one end of the punched electronic material in a locating device with a locating gear and putting the other end of the electronic material in a locating device with a locating gear similarly; starting the locating device, wherein the electronic material can move in the two locating devices without deviation. The method can be applied to hob machines, die-cutting machines, punches and printing machines. According to the method, the usage is light and quick, the efficiency is high, compared with a traditional printing machine, the work efficiency of a printing machine implementing the method is improved by at least 40%, the delivery cycle is greatly shortened, and the enterprise production cost is greatly reduced.
Description
Technical field
The present invention relates to electronic material processing field of locating technology, specifically a kind of electronic material processing positioning method and application thereof.
Background technology
In processing, be to cut by various device at electronic material; be completed for printing; because the thickness of material to be processed is variant; just easily cause material to fluctuate to cause moving left and right up and down in the process of operation and easily cause deviation; and then cause the material of processing to occur that defective products easily appears in deviation; and need operating personnel to shut down midway to adjust the running orbit of material to guard against deviations; so just cause the time of processing also not have the time of tuningout many, caused operating efficiency very low.
Therefore, design and treat rapidoprint and position for overcoming the deficiency of above-mentioned technology, can ensure that material to be processed is not subjected to displacement deviation in the equipment of various processing to reduce material defective products rate and a kind of electronic material processing positioning method of the operating efficiency of raising processing, inventor's problem to be solved just.
Summary of the invention
For the deficiencies in the prior art, the object of this invention is to provide a kind of electronic material processing positioning method, its device is simple, easy to operate, can reduce material defective products rate and improve the operating efficiency of processing, has extraordinary practical value.
The technical solution adopted for the present invention to solve the technical problems is: a kind of electronic material processing positioning method, and method comprises following steps:
A. electronic material is punched, make locating hole on the both sides of material with hobboing cutter machine, what do not have two locating holes is symmetrical;
B. the locating hole of one end of the electronic material of accomplishing fluently locating hole is positioned in the positioner with Positioning Gear, the other end of electronic material is positioned in the positioner with Positioning Gear equally;
C. opening locating device, electronic material just can move in two positioners, is not offset.
An application for electronic material processing positioning method, the range of application of described the method is hobboing cutter machine, die-cutting machine, punch press, printing machine.
The invention has the beneficial effects as follows:
1, by material being processed to locating hole design, can ensure that material keeps rectilinear motion in the process of processing, be not offset, reduce the generation of defective products, defective products rate reduces to 2% by 10%, has reduced enterprise's production cost;
2, when increasing work efficiency, corresponding is lower by energy consumption, meets the policy of government's energy-saving and emission-reduction;
3, compact conformation, adopts light and handy portable design, and very easy to use, men and women employee all can operate through simple training.
4, light quick use, efficiency is high, improves at least closely 40% than conventional presses operating efficiency, has shortened greatly the delivery cycle, significantly reduces the production cost of enterprise.
Detailed description of the invention
Below in conjunction with specific embodiment, further set forth the present invention, should be understood that these embodiment are only not used in and limit the scope of the invention for the present invention is described.In addition should be understood that those skilled in the art can make various changes or modifications the present invention after having read the content of the present invention's instruction, these equivalent form of values drop on application appended claims limited range equally.
A kind of electronic material processing positioning method, method comprises following steps: electronic material is punched, make locating hole on the both sides of material with hobboing cutter machine, what do not have two locating holes is symmetrical; The locating hole of one end of the electronic material of accomplishing fluently locating hole is positioned in the positioner with Positioning Gear, the other end of electronic material is positioned in the positioner with Positioning Gear equally; Opening locating device, electronic material just can move in two positioners, is not offset, and the range of application of described the method is hobboing cutter machine, die-cutting machine, punch press, printing machine.
Claims (2)
1. an electronic material processing positioning method, is characterized in that, method comprises following steps:
A. electronic material is punched, make locating hole on the both sides of material with hobboing cutter machine, what do not have two locating holes is symmetrical;
B. the locating hole of one end of the electronic material of accomplishing fluently locating hole is positioned in the positioner with Positioning Gear, the other end of electronic material is positioned in the positioner with Positioning Gear equally;
C. opening locating device, electronic material just can move in two positioners, is not offset.
2. an application for electronic material processing positioning method, is characterized in that: the range of application of described the method is hobboing cutter machine, die-cutting machine, punch press, printing machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210524174.9A CN103862512A (en) | 2012-12-10 | 2012-12-10 | Electronic material processing locating method and applications thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210524174.9A CN103862512A (en) | 2012-12-10 | 2012-12-10 | Electronic material processing locating method and applications thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103862512A true CN103862512A (en) | 2014-06-18 |
Family
ID=50901829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210524174.9A Pending CN103862512A (en) | 2012-12-10 | 2012-12-10 | Electronic material processing locating method and applications thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103862512A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104464508A (en) * | 2014-12-06 | 2015-03-25 | 苏州市华扬电子有限公司 | Fabrication process of two-dimensional code labels |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01288557A (en) * | 1988-05-16 | 1989-11-20 | Rohm Co Ltd | Intermittently transporting device for long lead frame |
| JPH1121005A (en) * | 1997-07-04 | 1999-01-26 | Sansei Mach Kk | Sheet conveying device |
| JP2002326745A (en) * | 2001-05-02 | 2002-11-12 | Spc:Kk | Method for transferring carrier tape by sprocket and sprocket therefor |
| CN1750987A (en) * | 2003-02-20 | 2006-03-22 | 三井金属矿业株式会社 | Device and method for transporting film carrier tape for mounting electronic components |
-
2012
- 2012-12-10 CN CN201210524174.9A patent/CN103862512A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01288557A (en) * | 1988-05-16 | 1989-11-20 | Rohm Co Ltd | Intermittently transporting device for long lead frame |
| JPH1121005A (en) * | 1997-07-04 | 1999-01-26 | Sansei Mach Kk | Sheet conveying device |
| JP2002326745A (en) * | 2001-05-02 | 2002-11-12 | Spc:Kk | Method for transferring carrier tape by sprocket and sprocket therefor |
| CN1750987A (en) * | 2003-02-20 | 2006-03-22 | 三井金属矿业株式会社 | Device and method for transporting film carrier tape for mounting electronic components |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104464508A (en) * | 2014-12-06 | 2015-03-25 | 苏州市华扬电子有限公司 | Fabrication process of two-dimensional code labels |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140618 |