CN103852203B - Identification method of ultrasonic bonding pressure - Google Patents
Identification method of ultrasonic bonding pressure Download PDFInfo
- Publication number
- CN103852203B CN103852203B CN201410053685.6A CN201410053685A CN103852203B CN 103852203 B CN103852203 B CN 103852203B CN 201410053685 A CN201410053685 A CN 201410053685A CN 103852203 B CN103852203 B CN 103852203B
- Authority
- CN
- China
- Prior art keywords
- ultrasonic
- pressure
- bonding
- bonding pressure
- experiment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000002474 experimental method Methods 0.000 claims abstract description 18
- 238000012935 Averaging Methods 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000011156 evaluation Methods 0.000 abstract 1
- 206010044565 Tremor Diseases 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention provides an identification method of ultrasonic bonding pressure, and belongs to the technical field of ultrasonic bonding. When the bonding pressure is increased, the ultrasonic voltage envelope amplitude is increased gradually, the current envelope amplitude is decreased gradually, and the bonding pressure is evaluated by building an equation according to mutual changes; the bonding pressure is sequentially increased from 0.2 N to 0.7 N, and each interval is 0.1 N. Six groups of experiments are arranged in total; as for other three technological parameters which are fixed, bonding time is 15 ms, ultrasonic power is 25 mW, and loading temperature is 200 DEG C. In the equation (please see the specification for the expression of the equation), F represents a bonding pressure evaluation value; n represents the data length; xi represents an ultrasonic voltage signal, and yi represents a current signal, wherein i=1, 2, ..., n; lambda F represents an adjustment coefficient. During experimenting, each experiment corresponds to a pressure point, ten samples are measured in each experiment, the average value lambda F is obtained by calculating and averaging multiple groups of data, and finally, the value of the calculation equation of the ultrasonic bonding pressure can be obtained.
Description
Technical field
The present invention relates to a kind of recognition methodss of ultrasonic bond pressure, belong to Ultrasonic bonding techniques field.
Background technology
Bonding process technological parameter be affect bonding quality most critical factor, engineering in practice, typically all by adjust
Whole technological parameter is guaranteeing bonding quality.However, bonding technology parameter may be with external environment condition or the shakiness of bonding system
It is qualitative that drift occurs.The fluctuation of such as external power source influences whether the change of ultrasonic power, and the bonding force control system failure causes
Bonding force changes etc..Therefore, to carry out monitor in real time significant for para-linkage process parameter.
General bonding system, the regulation of technological parameter are all completing, therefore by outer by the switching of fixed gear
Portion affects big, general error rate 15% or so, for the ultrasonic bond system involved by this patent, bonding time and ultrasonic work(
Rate can be divided into 30 gears, change successively from small to large, and bonding pressure can be divided into 6 gears, load the change of temperature from 0-400
Consecutive variations between DEG C.It is existing research it has been proved that bonding process ultrasound the signal of telecommunication can reflect bonding process quality information,
There is substantial connection between bonding technology parameter, therefore, in theory for can be recognized by the ultrasonic signal of telecommunication and be bonded
The pressure parameter of journey.How to set up is currently a urgent problem.
The content of the invention
It is an object of the invention to provide a kind of recognition methodss of ultrasonic bond pressure.
The present invention is to solve existing fixed gear adjusts the inaccurate deficiency of pressure.
A kind of recognition methodss of ultrasonic bond pressure, the increase of bonding pressure, ultrasonic voltage envelope amplitude are incrementally increased, and
Current envelops amplitude progressively reduces, and is mutually changed according to which and sets up formula assessment bonding pressure；The change of bonding pressure is from 0.2N
Increase to 0.7N successively, at intervals of 0.1N.6 groups of experiments are scheduled that altogether, other 3 technological parameters are fixed as：Bonding time：
15ms, ultrasonic power：25mW, loads temperature：200℃.
In formula：
F --- bonding pressure assessed value；
N --- data length；
xi, yi--- ultrasonic voltage signal and current signal, i=1,2 ..., n；
λF--- regulation coefficient.
Per group of experiment one pressure spot of correspondence during experiment, per group of experiment measures 10 samples respectively, by multi-group data
Calculate, take its meansigma methods, obtain average λF, finally can be obtained by calculating the computing formula value of ultrasonic bond pressure.
Advantages of the present invention：The computing formula of ultrasonic pressure is established by experiment, can be by formula direct derivation excess of export
Acoustic pressure power, and accuracy is high, should have the wide market space.
Description of the drawings
Fig. 1 is a kind of voltage and current signal figure of the recognition methodss of ultrasonic bond pressure of the invention；
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment the present invention is further illustrated.
A kind of recognition methodss of ultrasonic bond pressure, the increase of bonding pressure, ultrasonic voltage envelope amplitude are incrementally increased, and
Current envelops amplitude progressively reduces, and is mutually changed according to which and sets up formula assessment bonding pressure；The change of bonding pressure is from 0.2N
Increase to 0.7N successively, at intervals of 0.1N.6 groups of experiments are scheduled that altogether, other 3 technological parameters are fixed as：Bonding time：
15ms, ultrasonic power：25mW, loads temperature：200℃.
In formula：
F --- bonding pressure assessed value；
N --- data length；
xi, yi--- ultrasonic voltage signal and current signal, i=1,2 ..., n；
λF--- regulation coefficient.
Per group of experiment one pressure spot of correspondence during experiment, per group of experiment measure 10 samples respectively, arrange 6 groups of experiments altogether,
The voltage signal envelope and current signal envelope of experiment in fig. 1, by the calculating of multi-group data, takes its meansigma methods, obtains
To average λF=0.6452, by λFSubstitute in formula, obtain the result shown in table 1.Its error can be seen | Fc| it is very little, calculate
As a result mean accuracy reaches 95.2%, and accuracy of identification is very high, substantially conforms to actually used requirement.
1 bonding pressure recognition result of table
Claims (1)
1. a kind of recognition methodss of ultrasonic bond pressure, it is characterised in that：
The increase of bonding pressure, ultrasonic voltage envelope amplitude are incrementally increased, and current envelops amplitude progressively reduces, mutual according to which
Formula assessment bonding pressure is set up in change；The change of bonding pressure increases from 0.2N to 0.7N successively, at intervals of 0.1N, Yi Gongan
6 groups of experiments are arranged, other 3 technological parameters are fixed as：Bonding time：15ms, ultrasonic power：25mW, loads temperature：200℃；
In formula：
F --- bonding pressure assessed value；
n --- data length；
x i ,y i --- ultrasonic voltage signal and current signal,；
--- regulation coefficient；
Per group of experiment one pressure spot of correspondence during experiment, per group of experiment measures 10 samples respectively, by the calculating of multi-group data,
Its meansigma methods is taken, average γ is obtained, finally can be obtained by calculating the computing formula value of ultrasonic bond pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410053685.6A CN103852203B (en) | 2014-02-17 | 2014-02-17 | Identification method of ultrasonic bonding pressure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410053685.6A CN103852203B (en) | 2014-02-17 | 2014-02-17 | Identification method of ultrasonic bonding pressure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103852203A CN103852203A (en) | 2014-06-11 |
| CN103852203B true CN103852203B (en) | 2017-05-10 |
Family
ID=50860125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410053685.6A Active CN103852203B (en) | 2014-02-17 | 2014-02-17 | Identification method of ultrasonic bonding pressure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103852203B (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691133B2 (en) * | 1985-02-14 | 1994-11-14 | 株式会社東芝 | Ultrasonic wire bonding method |
| CH680576A5 (en) * | 1990-05-31 | 1992-09-30 | Kistler Instrumente Ag | |
| DE10218596A1 (en) * | 2002-04-25 | 2003-11-06 | Pfister Waagen Gmbh | Mating force measurement device for use in documenting the jointing of waste water or sewage pipes, comprises a force measurement cell linked to a handheld computer so that measurements can be digitally recorded |
| CN201364886Y (en) * | 2009-02-19 | 2009-12-16 | 中国电子科技集团公司第四十五研究所 | Binding force monitoring and detecting device |
| CN201522345U (en) * | 2009-08-07 | 2010-07-07 | 南通华达微电子集团有限公司 | Pressure measurement device of electronic aluminum wire bonder welding head |
| CN102183787B (en) * | 2011-03-07 | 2013-05-29 | 中国海洋石油总公司 | Method for improving seismic data resolution based on seismographic record varitron wave model |
| CN202855719U (en) * | 2012-08-10 | 2013-04-03 | 西华大学 | Ultrasonic lead bonding instrument chopper pressure on-line device |
-
2014
- 2014-02-17 CN CN201410053685.6A patent/CN103852203B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103852203A (en) | 2014-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20170284375A1 (en) | Method and arrangement for continuous calibration of a wind direction measurement | |
| CN101846572B (en) | Method for decreasing basic error of pressure sensor | |
| CN104646774B (en) | A kind of export license real-time compensation method based on spark discharge rate | |
| CN105508148B (en) | Method and system for capturing maximum wind energy based on wind energy distribution | |
| CN104023891B (en) | Wire discharge processing apparatus and control device | |
| CN104120456B (en) | Aluminium electroloysis fuzzy control method | |
| CN103852203B (en) | Identification method of ultrasonic bonding pressure | |
| CN103760498B (en) | A kind of power module automatic calibrating method | |
| CN104535257A (en) | Silicon-piezoresistive temperature compensation assessment method | |
| CN203298728U (en) | Hydraulic cylinder displacement sensor precision calibrating device | |
| CN203241176U (en) | Non-linear compensating circuit of pressure sensor | |
| CN104896961B (en) | The power coordination control device of multiple electric furnace operations | |
| CN108169013A (en) | A kind of fatigue life calibration method suitable for Multi-fasteners joint test specimen | |
| TW201517191A (en) | Maximum power point tracking method for solar cell | |
| CN107544455B (en) | Asymmetric online convergence correction method applied to quality control soft instrument | |
| CN204100960U (en) | Air preheater fanning strip actuating mechanism displacement detector | |
| Liu | Design of flow control system based on expert PID | |
| CN102944688A (en) | Temperature compensation and time drift correction device and method for acceleration sensor | |
| CN204203782U (en) | The control system rolling thickness of electrodes of lithium-ion batteries | |
| CN204740177U (en) | Tensile testing machine is expected with cable in laboratory | |
| CN103970175B (en) | A kind of Stabilizing Circuits for Inertial Platform closed loop test method | |
| CN106681139A (en) | Method for automatically controlling analog and designation of frequencies of frequency converter | |
| CN108279568B (en) | Interface control method for variable concentration tank | |
| CN201673418U (en) | Controller capable of accurately setting the constant temperature point of constant temperature tank of constant temperature crystal oscillator from outside | |
| CN201748963U (en) | Electric belt scale monitored by computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |