CN103851370A - LED (light emitting diode) lamp and manufacturing method thereof - Google Patents
LED (light emitting diode) lamp and manufacturing method thereof Download PDFInfo
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- CN103851370A CN103851370A CN201210511038.6A CN201210511038A CN103851370A CN 103851370 A CN103851370 A CN 103851370A CN 201210511038 A CN201210511038 A CN 201210511038A CN 103851370 A CN103851370 A CN 103851370A
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- heat dissipation
- led chip
- light fixture
- dissipation base
- led
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Abstract
The invention discloses an LED (light emitting diode) lamp, which comprises an LED chip, a heat radiating base, a driving circuit and a power source input terminal, wherein the heat radiating base comprises a heat radiating part for radiating heat, the LED chip is electrically connected with the output end of the driving circuit and is supplied with power by the driving circuit, an input terminal of a power source is arranged on the heat radiating base and is electrically connected with the input end of the driving circuit, the heat radiating base also comprises a die bond position, and the LED chip is packaged in the die bond position of the heat radiating base. The LED lamp has the beneficial effects that the structures, such as an LED packaging bracket, a heat conducting medium and a circuit board, are eliminated, so the material cost is reduced; the heat generated by the LED chip directly reaches the heat radiating base to be radiated, so the heat radiating efficiency is improved; the mechanization level is improved in the manufacturing process of the LED lamp, the production efficiency is improved, and the problem of SMT (surface mount technology) lamp wick effect is completely avoided.
Description
Technical field
The present invention relates to field of illuminating lamps, relate in particular to a kind of structure of the LED light fixture with fabulous heat dissipation.
Background technology
LED (Light-Emitting-Diode) Chinese means light emitting diode, it is a kind of semiconductor that can be luminous energy by electric energy conversion, it has changed the luminous principle luminous with electricity-saving lamp tricolor powder of incandescent lamp tungsten filament, and employing electroluminescence, the feature of LED is very obvious, long, the high and low radiation of light efficiency of life-span and low-power consumption.
The LED light fixture production technology of prior art please see the following form:
The technological process of production of the LED light fixture of table 1 prior art
| Chip factory | Encapsulation factory | LED lamp assembled |
| 1. become brilliant, produce LED chip | By LED chip die bond on |
1. coat heat-conducting medium at the LED lamp |
| 2. test | 2.LED chip nation determines routing and draws both positive and |
2. use SMT technology (surface mounting technology) that LED lamp pearl is installed to and on circuit board, becomes |
| 3. |
3. utilize resin material to solidify and cover LED chip, become LED lamp pearl finished |
3. coat heat-conducting medium at the LED lamp plate back side |
| ? | 4. test | 4. LED lamp plate is installed on base shell |
| ? | 5. |
5. Switching Power Supply is installed in base shell |
| ? | ? | 6. mounted lens and lampshade, becomes LED light fixture finished product |
| ? | ? | 7. packing shipment |
In the technological process of production of the LED light fixture of the shown prior art of table 1, coat the flow process of heat-conducting medium has manually smeared by product line worker at the LED lamp pearl back side and the LED lamp plate back side, become the bottleneck of production line, brought production efficiency lowly and the high problem of human cost; And while using SMT technology that LED lamp pearl is set on circuit board, because the high temperature of welding may cause the tin problem of climbing (claiming again SMT wick effect).
The LED light fixture of producing according to the technological process of table 1 conducts in the following order heat in the time of heat radiation: the LED chip---support---heat-conducting medium at the LED lamp pearl back side---circuit board---heat-conducting medium at the LED lamp plate back side---base shell.And the thermal conductivity factor of the heat-conducting medium at the heat-conducting medium at the LED lamp pearl back side and the LED lamp plate back side is lower than the thermal conductivity factor of other heat transfer structure, it is the bottleneck of LED light fixture heat radiation.In addition, the structure such as support, heat-conducting medium, circuit board has also increased material cost.
Summary of the invention
For the deficiencies in the prior art, the invention provides the LED light fixture that a kind of heat dissipation is good, the cost of material is low.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of LED light fixture, comprise LED chip (1), heat dissipation base (2), drive circuit (3) and power input terminal (4), described heat dissipation base (2) comprises the radiating part (22) for dispelling the heat, described LED chip (1) is electrically connected with the output of described drive circuit (3) and is powered by described drive circuit (3), described power input terminal (4) is arranged on heat dissipation base (2) above and is electrically connected with the input of described drive circuit (3), described heat dissipation base (2) also comprises die bond position (21), described LED chip (1) is encapsulated on the die bond position (21) of described heat dissipation base (2).
Described die bond position (21) is also provided with thin film circuit (5), and described LED chip (1) is fixed with described thin film circuit (5) nation, and described thin film circuit (5) is electrically connected with the output of described drive circuit (3).
Described die bond position (21) is the outer surface at described heat dissipation base (2) top.
Described heat dissipation base (2) is rotation body structure, and described radiating part (22) is for being arranged in vertically multiple heat radiation thin slices (221) of described heat dissipation base (2) surfaces of revolution, and described heat radiation thin slice (221) radially outward stretches out along described heat dissipation base (2).
Described heat dissipation base (2) also comprises base intracavity (23), described base intracavity opening (231) is positioned at described heat dissipation base (2) bottom, described drive circuit (3) is arranged on drive circuit board (31), described drive circuit board (31) is arranged in base intracavity (23), and described power input terminal (4) is arranged on the bottom of described heat dissipation base (2) and seals described base intracavity opening (231).
Described drive circuit (3) is for being integrated in the module in described thin film circuit (5).
Described thin film circuit (5) top is provided with the insulation cover plate that covers described thin film circuit (5).
Described thin film circuit (5) comprises the insulating barrier for preventing electric leakage.
Described die bond position (21) is provided with the groove (211) for described LED chip (1) die bond.
Described die bond position (21) is plane.
Described heat dissipation base (2) top is also provided with the lampshade (6) that covers described LED chip (1) completely.
Described LED chip (1) top is also provided with optical texture.
The present invention also comprises a kind of method of manufacturing above-mentioned LED light fixture, comprises the following steps:
I. by LED chip (1) die bond on the die bond position (21) of heat dissipation base (2);
II. LED chip (1) nation determines routing and draws both positive and negative polarity;
III. utilize resin material to solidify and cover LED chip;
IV., drive circuit (3) and other assembly are installed.
LED light fixture of the present invention has following useful technique effect: saved the structures such as LED package support, heat-conducting medium, circuit board, material cost is reduced; The heat that LED chip produces directly arrives radiator heat-dissipation, has strengthened heat dissipation.And in the manufacture process of producing LED light fixture of the present invention, saved the program of smearing heat-conducting medium that manpower completes that relies on, and make production process mechanization degree higher, also make production efficiency be improved; Save and used SMT technology that LED lamp pearl is set to the program on circuit board, avoided climbing tin problem (claiming again SMT wick effect) completely.
Accompanying drawing explanation
Fig. 1 is the exploded view of LED light fixture of the present invention;
Fig. 2 is the structural representation of LED light fixture of the present invention;
Fig. 3 is the die bond position top view of LED light fixture of the present invention.
The specific embodiment
Rotary body definition a: plane curve rotates around a boning out in the plane at its place the curved surface forming and is called the surfaces of revolution; This boning out is called the axle of rotary body; The solid that the surfaces of revolution of sealing surrounds is called rotary body.
Below in conjunction with the drawings and specific embodiments, the present invention will be further described.
LED light fixture of the present invention as shown in Figure 1, comprises LED chip 1, heat dissipation base 2, drive circuit 3, power input terminal 4 and the lampshade 6 of powering for LED wick 1.
Refer to Fig. 1, described heat dissipation base 2 selects aluminium to make, and this heat dissipation base 2 is rotation body structure, comprises the die bond position 21 and the radiating part 22 that encapsulate for LED chip 1.In the present embodiment, described die bond position 21 is described heat dissipation base 2 top surfaces; Described radiating part 22 is for being arranged in vertically multiple heat radiation thin slices 221 of described heat dissipation base 2 surfacess of revolution, and described heat radiation thin slice 221 radially outward stretches out along described heat dissipation base 2.Described heat dissipation base 2 tops are also provided with the lampshade 6 that covers described LED chip 1 completely.Understandable, described heat dissipation base 2 also can be selected the material of other good heat conductivity, can be also other shape, only needs to realize supporting LED chip 1 and is LED chip 1 two functions of dispelling the heat; Die bond position 21 can be arranged on any one position of heat dissipation base 2, only needs to encapsulate thereon for LED chip 1; Described radiating part 22 can also be the cooling system of other structure in prior art, and only needing can be heat dissipation base 2 heat radiations; Lampshade 6 has optical effect and plays a protective role, if do not have lampshade 6 LED light fixture of the present invention normally to use.
As shown in Figures 2 and 3, die bond position 21 is provided with the groove 211 for described LED chip 1 die bond to the structure of the die bond position 21 of the present embodiment, and LED chip 1 adopts the die-bonding method die bond of prior art in the groove 211 of described die bond position 21.On die bond position 21, be also provided with thin film circuit 5, fixed with described thin film circuit 5 nations after described LED chip 1 die bond, and utilize the curing LED chip 1 that covers of resin material to complete encapsulation.In the present embodiment, due to the metal material of heat dissipation base 2 for conducting electricity, therefore thin film circuit 5 comprises the insulating barrier for preventing electric leakage.The die-bonding method of LED chip 1, the concrete Wiring method of thin film circuit 5, LED chip 1 are determined method with the nation of thin film circuit 5 and are utilized the method that resin material solidifies covering LED chip 1 to be prior art, do not repeat them here.Understandable, for the LED chip of vertical stratification, die bond position 21 also can not be provided with groove 211 to facilitate LED chip bottom to be connected with the lead frame in thin film circuit 5; If heat dissipation base 2 adopts insulating materials, thin film circuit 5 also can comprise insulating barrier so; Thin film circuit 5 tops can also be provided with the insulation cover plate that covers described thin film circuit 5, needn't worry electric leakage to continue safe handling LED light fixture of the present invention in the situation that lampshade 6 damages.
Refer to Fig. 2, described heat dissipation base 2 also comprises base intracavity 23, and described base intracavity opening 231 is positioned at described heat dissipation base 2 bottoms.Described drive circuit 3 is arranged on drive circuit board 31, and described drive circuit board 31 is arranged in base intracavity 23, and described power input terminal 4 is arranged on the bottom of described heat dissipation base 2 and seals described base intracavity opening 231.Described thin film circuit 5 is electrically connected with the output of described drive circuit 3 by wire 7, and power input terminal 4 passes through wire 7 and is electrically connected with the input of described drive circuit 3.Understandable, described drive circuit 3 also can, for being integrated in the module in described thin film circuit 5, so can save base intracavity 23 structures.
Described LED chip 1 top can also arrange the light that optical texture sends to change LED chip 1 according to actual operation requirements, and described optical texture includes but not limited to lens, fluorescence coating etc.
LED light fixture of the present invention has following useful technique effect: saved the structures such as support, heat-conducting medium, circuit board, material cost is reduced; The heat that LED chip produces directly arrives radiator heat-dissipation, has strengthened heat dissipation.
The manufacture method of LED light fixture of the present invention comprises the following steps:
I. 1 one-tenth of LED chip is brilliant;
II. test LED chip 1;
III. manufactured heat dissipation base 2;
IV. on the die bond position 21 of heat dissipation base 2, thin film circuit 5 is set;
V. by LED chip 1 die bond on the die bond position 21 of heat dissipation base 2;
VI. LED chip 1 is fixed with the thin film circuit nation on die bond position 21;
VII. utilize resin material to solidify and cover LED chip;
VIII., drive circuit 3, power input terminal 4, lampshade 6 are installed;
IX. test LED light fixture;
X. pack shipment.
The manufacture method of producing LED light fixture of the present invention has following useful technique effect: saved and relied on the program of smearing heat-conducting medium that manpower completes, made production process mechanization degree higher, also made production efficiency be improved; Save and used SMT technology that LED lamp pearl is set to the program on circuit board, avoided climbing tin problem (claiming again SMT wick effect) completely.
Above-described embodiment is the preferred embodiment for the present invention, and all its principles are identical with the present embodiment or approximate with basic structure, all within protection domain of the present invention.
Claims (13)
1. a LED light fixture, comprise LED chip (1), heat dissipation base (2), drive circuit (3) and power input terminal (4), described heat dissipation base (2) comprises the radiating part (22) for dispelling the heat, described LED chip (1) is electrically connected with the output of described drive circuit (3) and is powered by described drive circuit (3), described power input terminal (4) is arranged on heat dissipation base (2) above and is electrically connected with the input of described drive circuit (3), it is characterized in that: described heat dissipation base (2) also comprises die bond position (21), described LED chip (1) is encapsulated on the die bond position (21) of described heat dissipation base (2).
2. LED light fixture according to claim 1, it is characterized in that: described die bond position (21) is also provided with thin film circuit (5), described LED chip (1) is fixed with described thin film circuit (5) nation, and described thin film circuit (5) is electrically connected with the output of described drive circuit (3).
3. LED light fixture according to claim 2, is characterized in that: the outer surface that described die bond position (21) is described heat dissipation base (2) top.
4. LED light fixture according to claim 3, it is characterized in that: described heat dissipation base (2) is rotation body structure, described radiating part (22) is for being arranged in vertically multiple heat radiation thin slices (221) of described heat dissipation base (2) surfaces of revolution, and described heat radiation thin slice (221) radially outward stretches out along described heat dissipation base (2).
5. LED light fixture according to claim 3, it is characterized in that: described heat dissipation base (2) also comprises base intracavity (23), described base intracavity opening (231) is positioned at described heat dissipation base (2) bottom, described drive circuit (3) is arranged on drive circuit board (31), described drive circuit board (31) is arranged in base intracavity (23), and described power input terminal (4) is arranged on the bottom of described heat dissipation base (2) and seals described base intracavity opening (231).
6. according to the LED light fixture described in claim 2 to 4 any one, it is characterized in that: described drive circuit (3) is for being integrated in the module in described thin film circuit (5).
7. according to the LED light fixture described in claim 2 to 5 any one, it is characterized in that: described thin film circuit (5) top is provided with the insulation cover plate that covers described thin film circuit (5).
8. according to the LED light fixture described in claim 2 to 5 any one, it is characterized in that: described thin film circuit (5) comprises the insulating barrier for preventing electric leakage.
9. according to the LED light fixture described in claim 1 to 5 any one, it is characterized in that: described die bond position (21) is provided with the groove (211) for described LED chip (1) die bond.
10. according to the LED light fixture described in claim 1 to 5 any one, it is characterized in that: described die bond position (21) is plane.
11. according to the LED light fixture described in claim 3 to 5 any one, it is characterized in that: described heat dissipation base (2) top is also provided with the lampshade (6) that covers described LED chip (1) completely.
12. according to the LED light fixture described in claim 1 to 5 any one, it is characterized in that: described LED chip (1) top is also provided with optical texture.
Manufacture the method for the LED light fixture described in claim 1 to 12 any one for 13. 1 kinds, it is characterized in that, comprise the following steps:
I. by LED chip (1) die bond on the die bond position (21) of heat dissipation base (2);
II. LED chip (1) nation determines routing and draws both positive and negative polarity;
III. utilize resin material to solidify and cover LED chip;
IV., drive circuit (3) and other assembly are installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210511038.6A CN103851370A (en) | 2012-12-04 | 2012-12-04 | LED (light emitting diode) lamp and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210511038.6A CN103851370A (en) | 2012-12-04 | 2012-12-04 | LED (light emitting diode) lamp and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103851370A true CN103851370A (en) | 2014-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210511038.6A Pending CN103851370A (en) | 2012-12-04 | 2012-12-04 | LED (light emitting diode) lamp and manufacturing method thereof |
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| Country | Link |
|---|---|
| CN (1) | CN103851370A (en) |
Citations (7)
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|---|---|---|---|---|
| US20070081342A1 (en) * | 2005-10-07 | 2007-04-12 | Oliver Szeto | System and method for mounting a light emitting diode to a printed circuit board |
| CN201964176U (en) * | 2010-12-20 | 2011-09-07 | 刘远贵 | Indoor LED (light-emitting diode) bulb |
| CN201992444U (en) * | 2011-04-15 | 2011-09-28 | 鹤壁博大电子科技有限责任公司 | Magnesium alloy radial heat-dissipating high-power LED (light-emitting diode) bulb |
| CN202281076U (en) * | 2011-09-30 | 2012-06-20 | 顾文俊 | Wide-angle bulb lamp |
| CN102537718A (en) * | 2011-11-11 | 2012-07-04 | 深圳市瑞丰光电子股份有限公司 | Lamp with light source integrated with radiator and manufacturing method of lamp |
| CN202473920U (en) * | 2012-03-15 | 2012-10-03 | 游文贤 | Integrated packaging structure for high-voltage LED (light-emitting diode) chip and driving power supply chip |
| CN202927583U (en) * | 2012-12-04 | 2013-05-08 | 雅士电子有限公司 | LED (Light-Emitting Diode) lamp |
-
2012
- 2012-12-04 CN CN201210511038.6A patent/CN103851370A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070081342A1 (en) * | 2005-10-07 | 2007-04-12 | Oliver Szeto | System and method for mounting a light emitting diode to a printed circuit board |
| CN201964176U (en) * | 2010-12-20 | 2011-09-07 | 刘远贵 | Indoor LED (light-emitting diode) bulb |
| CN201992444U (en) * | 2011-04-15 | 2011-09-28 | 鹤壁博大电子科技有限责任公司 | Magnesium alloy radial heat-dissipating high-power LED (light-emitting diode) bulb |
| CN202281076U (en) * | 2011-09-30 | 2012-06-20 | 顾文俊 | Wide-angle bulb lamp |
| CN102537718A (en) * | 2011-11-11 | 2012-07-04 | 深圳市瑞丰光电子股份有限公司 | Lamp with light source integrated with radiator and manufacturing method of lamp |
| CN202473920U (en) * | 2012-03-15 | 2012-10-03 | 游文贤 | Integrated packaging structure for high-voltage LED (light-emitting diode) chip and driving power supply chip |
| CN202927583U (en) * | 2012-12-04 | 2013-05-08 | 雅士电子有限公司 | LED (Light-Emitting Diode) lamp |
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Application publication date: 20140611 |