CN103849845A - Magnetron sputtering coating production line - Google Patents
Magnetron sputtering coating production line Download PDFInfo
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- CN103849845A CN103849845A CN201410083043.0A CN201410083043A CN103849845A CN 103849845 A CN103849845 A CN 103849845A CN 201410083043 A CN201410083043 A CN 201410083043A CN 103849845 A CN103849845 A CN 103849845A
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Abstract
The invention discloses a magnetron sputtering coating production line. The magnetron sputtering coating production line comprises a machine base as well as a transmitting device, a loading region, a vacuum processing chamber group, an unloading region and a pass back circuit which are arranged on the machine base, the loading region, the vacuum processing chamber group, the unloading region and the pass back circuit are sequentially connected in rings and a processing loop circuit in continuous circulation operation is formed, and the transmitting device is arranged in the processing loop circuit in a continuous circulation operation manner; the vacuum processing chamber group comprises a feeding chamber, a front transition chamber, a front buffer chamber, a first coating chamber, a second coating chamber, a third coating chamber, a rear buffer chamber, a rear transition chamber and a discharging chamber which are sequentially connected along transmission direction of the transmitting device, target material is respectively arranged in the first coating chamber, the second coating chamber and the third coating chamber, a movable magnet close to corresponding target material and a regulating mechanism used for regulating the magnet are respectively arranged outside the first coating chamber, the second coating chamber and the third coating chamber, each regulating mechanism comprises a magnetism shifting regulating component and a magnetism dividing regulating component, and the magnetism shifting regulating component and the magnetism dividing regulating component are respectively connected with the magnet.
Description
Technical field
The present invention relates to magnetron sputtering plating field, relate in particular to a kind of magnetron sputtering film production line.
Background technology
As everyone knows, magnetron sputtering is in order to carry out high-speed sputtering under subatmospheric, must effectively improve the ionization level of gas.By introducing magnetic field on target cathode surface, utilize magnetic field to improve plasma density to increase the method for sputtering raste to the constraint of charged particle; In diode sputtering, increase a magnetic confining field that is parallel to target material surface, by means of the crossed electric and magnetic field forming on target material surface, secondary electron constraint is strengthened to ionization efficiency in target material surface specific region, increase ion density and energy, thereby realize the process of two-forty sputter.
In existing magnetron sputtering film production line, normally provide magnetic field by a magnet that is tabular rectangular structure, although the technology of magnetron sputtering reaches its maturity, but still there is numerous defects in it, on the one hand, because the Distribution of Magnetic Field of the magnet of tabular rectangular structure itself is inhomogeneous, cause the Distribution of Magnetic Field in target region of living in inhomogeneous, make the unstable and skewness of the motion of the secondary electron in diode sputtering, finally cause plated film skewness and the coating film thickness of glass substrate to be coated inconsistent, thereby coating quality and the qualification rate of glass substrate are had a strong impact on, on the other hand, because magnet is often and is fixedly installed with respect to target, cannot move, for target area during compared with the less situation in magnetic field large and that magnet produces, make utilization ratio and the sputter scope of target be restricted, cannot make full use of target, the target in the action of a magnetic field region is not caused to waste, and very large restriction the working (machining) efficiency of glass substrate plated film, and also can produce certain detrimentally affect to the coating quality of glass substrate and qualification rate, moreover also there is complex structure in existing magnetron sputtering film production line, plated film working (machining) efficiency is low, glass substrate plated film tooling cost is high, technique versatility is poor and cannot meet the shortcoming of large batch of Production requirement.
Therefore, be badly in need of wanting a kind of magnetron sputtering film production line to overcome the problem of above-mentioned existence.
Summary of the invention
The object of the present invention is to provide a kind of magnetron sputtering film production line of simple in structure and technique highly versatile, this magnetron sputtering film production line has advantages of can improve plated film qualification rate, coating quality, target utilization and plated film working (machining) efficiency, and this magnetron sputtering film production line can also reduce substrate coating tooling cost and meet large batch of Production requirement.
For realizing above-mentioned object, the invention provides a kind of magnetron sputtering film production line that is applicable to substrate to carry out plated film processing, comprise support and be located at transmitting device, feeding area, vacuum Processing Room group, discharging area and the passback circuit of described support, the processing loop that described feeding area, vacuum Processing Room group, discharging area and passback circuit are connected and arrange and form continuous circulation operation in turn ringwise, described transmitting device is the described processing loop of being located at of continuous circulation operation, described vacuum Processing Room group comprises the feed chamber that is connected and arranges in turn along the transmission direction of transmitting device, front transition chamber, front surge chamber, a coating chamber, No. two coating chambers, No. three coating chambers, rear surge chamber, rear transition chamber and discharge chamber, a described coating chamber, in No. two coating chambers and No. three coating chambers, be equipped with target, a described coating chamber, No. two coating chambers and No. three coating chambers are equipped with movably and are close to the magnet of corresponding described target outward and for regulating the regulating mechanism of described magnet, described regulating mechanism comprises and moves magnetic adjusting part and equal magnetic adjusting parts, described move magnetic adjusting part and all magnetic adjusting part be all connected with described magnet, order about the relatively described target of described magnet and do translational adjustment operation along the direction that is parallel to described target by the described magnetic adjusting part that moves, order about described magnet bending to regulate the distance of described magnet two ends and described target by described equal magnetic adjusting part, described substrate is loaded into described transmitting device in described feeding area place, described transmitting device carries described substrate and is transmitted in turn described feed chamber, front transition chamber, front surge chamber, a coating chamber, No. two coating chambers, No. three coating chambers, rear surge chamber, rear transition chamber and discharge chambers to complete the plated film processing of substrate, described substrate unloads from described transmitting device in described discharging area place, and described transmitting device is back to described feeding area through described passback circuit.
Preferably, described regulating mechanism also comprises erecting frame, and described erecting frame is located at described support, and described magnet is the mobile described erecting frame of being located at, described in move magnetic adjusting part and all magnetic adjusting part be all located between described magnet and erecting frame.
Preferably, the described magnetic adjusting part that moves comprises driving toothed gear and driven bar shaped tooth, described driving toothed gear is articulated in described erecting frame, and the direction that described driven bar shaped tooth does translational adjustment along described magnet is installed on described magnet, and described driving toothed gear and described driven bar shaped tooth engagement fit, described in each, the two ends of magnet are equipped with described equal magnetic adjusting part, the described middle part of moving magnetic adjusting part and be positioned at corresponding described magnet, described equal magnetic adjusting part comprises Connection Block, push bolt and the bolt of pulling back, described Connection Block is connected in described erecting frame, the described threaded one end that pushes bolt is connected in described Connection Block, the described the other end that pushes bolt contacts at described magnet, the threaded one end of the described bolt of pulling back is connected in described magnet, the other end of the described bolt of pulling back slides and runs through described Connection Block, described Connection Block all described magnet and described in pull back between the nut of bolt, and the nut of the bolt of pulling back described in described Connection Block contacts at, the described magnetic adjusting part that moves is also formed with pushing part, and described pushing part pushes in described magnet towards the direction near described target.
Preferably, described transmitting device comprises frame, moving bearing bracket and driving mechanism, described frame is located at described support, the bottom carrying of described moving bearing bracket is transmitted in described driving mechanism, described frame is provided with the first guide part along the travel direction of described moving bearing bracket, described moving bearing bracket is provided with the second guide part that is running fit with described the first guide part, and the sidepiece that described the first guide part and described the second guide part are faced is mutually magnetic and repels each other and maintain described moving bearing bracket in vertical state.
Preferably, described the first guide part comprises some the first magnets and some the second magnets, described the first magnet is the arrangement in gap and forms the first magnet group along the travel direction of described moving bearing bracket, described the second magnet is the arrangement in gap and forms the second magnet group along the travel direction of described moving bearing bracket, described the first magnet group and the second magnet group are along same level location arrangements, and between described the first magnet group and the second magnet group, form a magnetic guide path, described the second guide part is in the described magnetic guide path of being placed in of gap, described the second guide part comprises some the 3rd magnets and some the 4th magnets, described the 3rd magnet is the arrangement in gap and forms the 3rd magnet group along the travel direction of described moving bearing bracket, described the 4th magnet is the arrangement in gap and forms the 4th magnet group along the travel direction of described moving bearing bracket, described the 3rd magnet group and the 4th magnet group are all positioned at described magnetic guide path, one end of described the 3rd magnet is one end of described the first magnet of regarding to of gap and is magnetic and repels each other, one end of described the 4th magnet is regarding to of gap described and one end of magnet and be magnetic and repel each other.
Preferably, described front transition chamber and described rear transition chamber are equipped with the fast vacuum mechanism for vacuumizing, described fast vacuum mechanism comprises the first valve, the first connecting pipe, the second valve, the second connecting pipe, lobe pump and slide valve pump, described the first valve is communicated between described front transition chamber and described the first connecting pipe or between described rear transition chamber and described the first connecting pipe, described the second valve is communicated in described the first connecting pipe between the second connecting pipe, the inlet end of described slide valve pump is communicated in described the second connecting pipe, the inlet end of described lobe pump is communicated in described the first connecting pipe, the outlet side of described lobe pump is communicated in the second connecting pipe.
Preferably, described transmitting device carries and is the described substrate of two row side by side isolated and in same level position along transmission direction, each is listed as described substrate and forms a substrate row, is equipped with and regards to described in two substrate row and substrate row described in two is carried out to the film-coating mechanism of plated film simultaneously in a described coating chamber, No. two coating chambers and No. three coating chambers.
Preferably, in a described coating chamber, No. two coating chambers and No. three coating chambers, be equipped with the heating arrangements for heating, described heating arrangements comprises primary heater, secondary heater and the 3rd well heater, described in two, substrate ranking is between described primary heater and secondary heater, and described the 3rd well heater is described in two between base screening.
Preferably, described in each, substrate row vertically all has at least two-layer described substrate that is carried on described transmitting device.
Preferably, in a described coating chamber, No. two coating chambers and No. three coating chambers, be equipped with the segmentation gas distribution mechanism for importing rare gas element, described segmentation gas distribution mechanism comprises some gas distributing pipelines, the sidewall of described gas distributing pipeline offers at least two gas ports, described gas port is arranged along the flow direction of rare gas element, and distance between two adjacent described gas ports is diminishing setting along the flow direction of rare gas element.
Compared with prior art, due to the processing loop that the feeding area of magnetron sputtering film production line of the present invention, vacuum Processing Room group, discharging area and passback circuit are connected and arrange and form continuous circulation operation in turn ringwise, what transmitting device was continuous circulation operation is located at processing loop, vacuum Processing Room group comprises the feed chamber that is connected and arranges in turn along the transmission direction of transmitting device, front transition chamber, front surge chamber, a coating chamber, No. two coating chambers, No. three coating chambers, rear surge chamber, rear transition chamber and discharge chamber, a coating chamber, in No. two coating chambers and No. three coating chambers, be equipped with target, a coating chamber, No. two coating chambers and No. three coating chambers are equipped with movably and are close to the magnet of corresponding target outward and for regulating the regulating mechanism of magnet, regulating mechanism comprises and moves magnetic adjusting part and equal magnetic adjusting parts, move magnetic adjusting part and all magnetic adjusting part be all connected with magnet, order about the relative target of magnet and do translational adjustment operation along the direction that is parallel to target by moving magnetic adjusting part, order about magnet bending to regulate the distance of magnet two ends and target by equal magnetic adjusting part, on the one hand, order about the relative target of magnet and do translational adjustment along the direction that is parallel to target by moving magnetic adjusting part, the everywhere that makes target is in turn within the scope of the action of a magnetic field in magnet, thereby utilization ratio and the sputter scope of target are greatly increased, make full use of target, greatly improve the working (machining) efficiency of substrate coating simultaneously, and without the volume that increases magnet, on the other hand, order about magnet bending to regulate the distance of magnet two ends and target by equal magnetic adjusting part, thereby make the Distribution of Magnetic Field in target region of living in more even, make the motion of the secondary electron in diode sputtering more stable and distribute more even, and then the plated film that makes substrate to be coated distributes more even and coating film thickness is more consistent, has finally greatly improved coating quality and the qualification rate of substrate, substrate is loaded into transmitting device in feeding area place, transmitting device carrying substrates is transmitted in front feed chamber in turn, transition chamber, front surge chamber, a coating chamber, No. two coating chambers, No. three coating chambers, rear surge chamber, rear transition chamber and discharge chamber are to complete the plated film processing of substrate, substrate unloads from transmitting device in discharging area place, transmitting device is back to feeding area through passback circuit, thereby make magnetron sputtering film production line of the present invention also have simple in structure, technique highly versatile and can improve plated film qualification rate, coating quality, the advantage of target utilization and plated film working (machining) efficiency, and can also reduce substrate coating tooling cost and meet large batch of Production requirement.
Accompanying drawing explanation
Fig. 1 is the vertical view of magnetron sputtering film production line of the present invention.
Fig. 2 is the regulating mechanism combination schematic perspective view of magnetron sputtering film production line of the present invention.
Fig. 3 is the two dimensional structure schematic diagram of Fig. 2.
Fig. 4 is the sectional view along A-A line in Fig. 3.
Fig. 5 is the combination schematic perspective view that moves magnetic adjusting part of magnetron sputtering film production line of the present invention.
Fig. 6 is the combination schematic perspective view of the equal magnetic adjusting part of magnetron sputtering film production line of the present invention.
The combination schematic perspective view of the transmitting device of Fig. 7 magnetron sputtering film production line of the present invention.
The two dimensional structure schematic diagram of Fig. 8 Fig. 7.
Fig. 9 is the enlarged view of B part in Fig. 8.
Figure 10 is the sectional drawing along C-C line in Fig. 9.
Figure 11 is the structural representation of the fast vacuum mechanism of magnetron sputtering film production line of the present invention.
Figure 12 is the heating arrangements of magnetron sputtering film production line of the present invention and substrate row's two dimensional structure schematic diagram.
Figure 13 is the full sectional view of the segmentation gas distribution mechanism of magnetron sputtering film production line of the present invention.
Embodiment
In order to describe technology contents of the present invention, structural attitude in detail, below in conjunction with embodiment and coordinate accompanying drawing to be described further.
Refer to Fig. 1 to Fig. 8, magnetron sputtering film production line 100 of the present invention comprises support 101 and is located at the transmitting device 102 of support 101, feeding area 103, vacuum Processing Room group 104, discharging area 105 and passback circuit 106, feeding area 103, vacuum Processing Room group 104, discharging area 105 and the passback circuit 106 processing loop 100a that connected setting and formation continuous circulation move in turn ringwise, transmitting device 102 is being located at of continuous circulation operation and processes loop 100a, vacuum Processing Room group 104 comprises feed chamber 80a, the front transition chamber 80b, front surge chamber 80c, coating chamber 90a, No. two coating chamber 90b, No. three coating chamber 90c, rear surge chamber 80d, rear transition chamber 80e and the discharge chamber 80f that are connected and arrange in turn along the transmission direction of transmitting device 102, wherein, the concrete structure of front surge chamber 80c and rear surge chamber 80d is well known for ordinary skill in the art, and does not repeat them here, a coating chamber 90a, in No. two coating chamber 90b and No. three coating chamber 90c, be equipped with target 911, a coating chamber 90a, No. two coating chamber 90b and No. three coating chamber 90c are equipped with movably and are close to the magnet 912 of corresponding target 911 outward and for regulating the regulating mechanism 108 of magnet 912, magnet 912 is platy structure, regulating mechanism 108 comprises and moves magnetic adjusting part 50 and equal magnetic adjusting parts 60, move magnetic adjusting part 50 and all magnetic adjusting part 60 be all connected with magnet 912, order about the relative target of magnet 912 911 and do translational adjustment operation along the direction that is parallel to target 911 by moving magnetic adjusting part 50, order about magnet 912 bendings to regulate the distance of magnet 912 two ends and target 911 by equal magnetic adjusting part 60, on the one hand, order about the relative target of magnet 912 911 and do translational adjustment along the direction that is parallel to target 911 by moving magnetic adjusting part 50, the everywhere that makes target 911 is in turn within the scope of the action of a magnetic field in magnet 912, thereby utilization ratio and the sputter scope of target 911 are greatly increased, make full use of target 911, greatly improve the working (machining) efficiency of substrate 201 plated films simultaneously, and without the volume that increases magnet 912, on the other hand, order about magnet 912 bendings to regulate the distance of magnet 912 two ends and target 911 by equal magnetic adjusting part 60, thereby make the Distribution of Magnetic Field in target 911 regions of living in more even, make the motion of the secondary electron in diode sputtering more stable and distribute more even, and then the plated film that makes substrate to be coated 201 distributes more even and coating film thickness is more consistent, has finally greatly improved coating quality and the qualification rate of substrate 201, substrate 201 is loaded into transmitting device 102 in 103 places, feeding area, transmitting device 102 carrying substrates 201 are transmitted in feed chamber 80a in turn, front transition chamber 80b, front surge chamber 80c, a coating chamber 90a, No. two coating chamber 90b, No. three coating chamber 90c, rear surge chamber 80d, rear transition chamber 80e and discharge chamber 80f are to complete the plated film processing of substrate 201, substrate 201 unloads from transmitting device 102 in 105 places, discharging area, transmitting device 102 is back to feeding area 103 through passback circuit 106, thereby can being realized, magnetron sputtering film production line 100 of the present invention improves substrate 201 plated film working (machining) efficiencies, meet large batch of Production requirement and reduce substrate 201 plated film tooling costs.Particularly, as follows:
Refer to Fig. 2 to Fig. 6, regulating mechanism 108 also comprises erecting frame 70, and erecting frame 70 is located at support 101, and magnet 912 is the mobile erecting frame 70 of being located at, move magnetic adjusting part 50 and all magnetic adjusting part 60 be all located between magnet 912 and erecting frame 70, the more reasonable compactness of structure.Particularly, move magnetic adjusting part 50 and comprise driving toothed gear 51 and driven bar shaped tooth 52, driving toothed gear 51 is articulated in erecting frame 70, the direction that driven bar shaped tooth 52 does translational adjustment along magnet 912 is installed on magnet 912, and driving toothed gear 51 and driven bar shaped tooth 52 engagement fit, thereby order about that driven bar shaped tooth 52 moves to drive magnet 912 to move and position adjustments that magnet 912 is carried out to translation by pivotable driving toothed gear 51, to improve the utilising efficiency of target 911, structure is more reasonable compact.More excellent, in the present embodiment, target 911 and magnet 912 all vertically arrange, and the direction that magnet 912 does translational adjustment arranges in horizontal direction, and structure is more reasonable compact, but, not as limit.More excellently be, in the present embodiment, move magnetic adjusting part 50 and also comprise the first pivotal axis 53 and operating parts 54, the first pivotal axis 53 is articulated in erecting frame 70, driving toothed gear 51 is installed on the first pivotal axis 53 one end near magnet 912, operating parts 54 is installed on the first pivotal axis 53 one end away from magnet 912, makes the pin-jointed structure of driving toothed gear 51 more reasonable compact, and can the more convenient driving toothed gear of pivotable effortlessly 51 by operating parts 54.Specifically, in the present embodiment, erecting frame 70 is provided with pin joint seat 55, the first pivotal axis 53 and is articulated in pin joint seat 55, and structure is more reasonable compact.
Simultaneously, the two ends of each magnet 912 are equipped with equal magnetic adjusting part 60, move the middle part that magnetic adjusting part 50 is positioned at corresponding magnet 912, all magnetic adjusting part 60 comprises Connection Block 61, push bolt 62 and the bolt 63 of pulling back, Connection Block 61 is connected in erecting frame 70, the threaded one end that pushes bolt 62 is connected in Connection Block 61, the other end that pushes bolt 62 contacts at magnet 912, the threaded one end of bolt 63 of pulling back is connected in magnet 912, the other end of bolt 63 of pulling back slides and runs through Connection Block 61, Connection Block 61 is all between magnet 912 and the nut of the bolt 63 of pulling back, and Connection Block 61 contacts at the nut of the bolt 63 of pulling back, by push bolt 62 and the bolt 63 1 of pulling back push away one draw cooperatively interact for the distance of positioning magnet 912 two ends and target 911, in the time need to regulating the distance of magnet 912 two ends and target 911, only need pivotable to push bolt 62 and the bolt 63 of pulling back operates, very convenient, and simple and compact for structure, more excellently be, in the present embodiment, all magnetic adjusting part 60 comprises that two pull back bolt 63 and one push bolt 62, two bolts 63 of pulling back are distributed in and push the both sides of bolt 62 and be symmetrical layout about pushing bolt 62, structure is more reasonable compact, certainly, push bolt 62 and the concrete quantity of the bolt 63 of pulling back and arrangement not as limit, in other embodiments, can also be according to actual user demand and Choice and design flexibly, move magnetic adjusting part 50 and be also formed with pushing part 511, pushing part 511 pushes in magnet 912 towards the direction near target 911, the more excellent end that is close to magnet 912 for being formed at driving toothed gear 51 of pushing part 511, and pushing part 511 is between the equal magnetic adjusting part 60 at the two ends of magnet 912, thereby push in the middle part of magnet 912 by pushing part 511, and by being positioned at the adjustment operation of equal magnetic adjusting part 60 at magnet 912 two ends, finally order about magnet 912 bendings to regulate the distance of magnet 912 two ends and target 911, thereby make the Distribution of Magnetic Field in target 911 regions of living in more even.More excellent, in the present embodiment, all magnetic adjusting part 60 also comprises guide 65, the direction that guide 65 does translational adjustment along magnet 912 is located at erecting frame 70, Connection Block 61 is and is slidably connected to guide 65, thereby the translational adjustment of the magnet making 912 is more smooth and easy stable, and structure is more reasonable.More excellently be, in the present embodiment, erecting frame 70 offers storage tank 71, move magnetic adjusting part 50 and all magnetic adjusting part 60 be all positioned at storage tank 71, make to move magnetic adjusting part 50 and all magnetic adjusting part 60 arrangement spaces are more reasonable, reduce taking up room of entirety, the more reasonable compactness of structure, but, and as limit.
Refer to Fig. 7 to Figure 10, transmitting device 102 comprises frame 10, moving bearing bracket 20 and driving mechanism 30, frame 10 is located at support 101, the bottom carrying of moving bearing bracket 20 is transmitted in driving mechanism 30, frame 10 is provided with the first guide part 11 along the travel direction of moving bearing bracket 20, moving bearing bracket 20 is provided with the second guide part 21 that is running fit with the first guide part 11, the sidepiece that the first guide part 11 and the second guide part 21 are faced is mutually magnetic and repels each other and maintain moving bearing bracket 20 in vertical state, thereby prevent that moving bearing bracket 20 from occurring tilting, and realize the guiding without frictional fit of the first guide part 11 and the second guide part 21, make transmitting device 102 can maintain transmitted substrate 201 in vertical state and avoid producing dust, and then the coating quality of raising substrate 201.More excellently be, the first guide part 11 is located at the top of frame 10, the second guide part 21 is located at the top of moving bearing bracket 20, structure is more reasonable compact, the concrete setting position of certain the first guide part 11 and the second guide part 21, not as limit, can also be selected flexibly according to actual user demand.More excellent, moving bearing bracket 20 is provided with the supporting part 23 for carrying substrates 201, and to facilitate the carrying of substrate 201, and supporting part 23 can be according to actual user demand with regard to concrete structure and flexible design.Particularly, the first guide part 11 comprises some the first magnet 111a and some the second magnet 112a, the first magnet 111a is the arrangement in gap and forms the first magnet group 111 along the travel direction of moving bearing bracket 20, the second magnet 112a is the arrangement in gap and forms the second magnet group 112 along the travel direction of moving bearing bracket 20, the first magnet group 111 and the second magnet group 112 are along same level location arrangements, and between the first magnet group 111 and the second magnet group 112, form magnetic guide path 113, the second guide parts 21 and be being placed in magnetic guide path 113 of gap, the second guide part 21 comprises some the 3rd magnet 211a and some the 4th magnet 212a, the 3rd magnet 211a is the arrangement in gap and forms the 3rd magnet group 211 along the travel direction of moving bearing bracket 20, the 4th magnet 212a is the arrangement in gap and forms the 4th magnet group 212 along the travel direction of moving bearing bracket 20, the 3rd magnet group 211 and the 4th magnet group 212 are all positioned at magnetic guide path 113, one end of the 3rd magnet 211a is the one end that regards to the first magnet 111a in gap and is magnetic and repels each other, what one end of the 4th magnet 212a was gap regards to and one end of magnet 912 and be magnetic and repel each other, thereby maintain the second guide part 21 in the interior movement of magnetic guide path 113, and the second guide part 21 not can with the first guide part 11 contact frictions, and maintain moving bearing bracket 20 in vertical state.And, in the present embodiment, the first magnet 111a, the second magnet 112a, the 3rd magnet 211a and the 4th magnet 212a are all gap along the travel direction of moving bearing bracket 20 and arrange uniformly, make the magnetic action of the first magnet group 111 and the 3rd magnet group 211 and the more equalization stable of magnetic action of the second magnet group 112 and the 4th magnet group 212, make the movement of moving bearing bracket 20 more stable, and the present invention is not to the first magnet 111a, the second magnet 112a, the concrete magnitude setting of the 3rd magnet 211a and the 4th magnet 212a is construed as limiting, in different embodiment, can select flexibly according to actual user demand.More excellently be, in the present embodiment, on moving bearing bracket 20, be provided with side by side two the second guide parts 21, corresponding, in frame 10, be also provided with two with each second guide part 21 the first guide part 11 of corresponding matching one by one, make the transmission of moving bearing bracket 20 more stable, therefore the processing of accepting each operation that the transmission of the substrate 201 carrying on moving bearing bracket 20 also can be more stable, thereby greatly improve the coating quality of substrate 201, structure is more reasonable compact, certainly, the first guide part 11 and the concrete magnitude setting of the second guide part 21 be not as limit, can also select flexibly according to actual user demand.More excellent, in the present embodiment, the first magnet 111a, the second magnet 112a, the 3rd magnet 211a and the 4th magnet 212a are all preferably resistant to elevated temperatures magnet and make, to adapt to the plated film of substrate 201 in high temperature chamber.Specifically, in the present embodiment, the first guide part 11 also comprises the first mount pad 114 and the second mount pad 115, that the first mount pad 114 and the second mount pad 115 are gap and be all located at frame 10 along the travel direction of moving bearing bracket 20, built-in first mount pad 114 that is fixed on of the first magnet group 111, built-in second mount pad 115 that is fixed on of the second magnet group 112, that is, magnetic guide path 113 is also formed between the first mount pad 114 and the second mount pad 115, the second guide part 21 also comprises the 3rd mount pad 213, the 3rd mount pad 213 is located at moving bearing bracket 20 along the travel direction of moving bearing bracket 20, the 3rd mount pad 213 is being placed in magnetic guide path 113 of gap, the 3rd magnet group 211 and the 4th magnet group 212 be built-in the 3rd mount pad 213 that is fixed on all, finally realize the first magnet group 111, the second magnet group 112, the installation of the 3rd magnet group 211 and the 4th magnet group 212 is fixed, structure is more reasonable compact, certainly, the first magnet group 111, the second magnet group 112, the 3rd magnet group 211 and the concrete mount fixing structure of the 4th magnet group 212 are not limited to this, also can be according to actual user demand and flexible design.The person of meriting attention, in other embodiments, the 3rd magnet 211a and the 4th magnet 212a can also be one-body molded, the 3rd magnet 211a and the 4th magnet 212a two ends after can also be one-body molded are all magnetic with faced one end of the first magnet 111a and one end of the second magnet 112a and repel each other, the same can realization maintains the second guide part 21 in the interior movement of magnetic guide path 113, and the second guide part 21 not can with the first guide part 11 contact frictions, and maintain moving bearing bracket 20 in vertical state.Specifically, in the present embodiment, driving mechanism 30 comprises driving mechanism 31 and at least two power wheels 32, and in the present embodiment, driving mechanism 31 is preferably motor, certainly not as limit; Driving mechanism 31 is installed on frame 10, power wheel 32 be along the travel direction of moving bearing bracket 20 gap arrangement be articulated in frame 10, more excellently be, power wheel 32 is gap and arranges uniformly, and the present invention does not limit the magnitude setting of power wheel 32, in different embodiment, can select flexibly according to actual user demand; Power wheel 32 is all connected in the output terminal of driving mechanism 31, and the bottom carrying of moving bearing bracket 20 is transmitted on power wheel 32, orders about power wheel 32 by driving mechanism 31 and rotates, and then drive the moving bearing bracket 20 carrying on power wheel 32 to move.Power wheel 32 is articulated in the bottom of frame 10 by one second pivotal axis 33, the second pivotal axis 33 is all connected in the output terminal of driving mechanism 31, specifically, in the present embodiment, between all the second pivotal axis 33, all interconnect by transmission belt 34, be connected in again the output terminal of driving mechanism 31 by transmission belt 34 by one of them second pivotal axis 33, structure is more reasonable compact, certainly, concrete drive mechanism between power wheel 32 and between power wheel 32 and driving mechanism 31 is as limit, can also be according to actual user demand and flexible design.The bottom of moving bearing bracket 20 is provided with the first carrying engagement part 22, and the outer rim of power wheel 32 is provided with the second carrying engagement part 321 cooperatively interacting with the first carrying engagement part 22.More specifically, the first carrying engagement part 22 is cord tissue, and the second carrying engagement part 321 is the groove structure cooperatively interacting with cord tissue, makes the carrying transmission of moving bearing bracket 20 more stable.
The person of meriting attention, as shown in Fig. 1 and Fig. 7 to Figure 10, in the present embodiment, feed chamber 80a, front transition chamber 80b, front surge chamber 80c, a coating chamber 90a, No. two coating chamber 90b, No. three coating chamber 90c, rear surge chamber 80d, rear transition chamber 80e and discharge chamber 80f interconnect formed vacuum Processing Room group 104 and linearly arrange, and passback circuit 106 is also linearly arranged, and vacuum Processing Room group 104 is parallel to each other with passback circuit 106, feeding area 103 is between the passback end of circuit 106 and the initiating terminal of feed chamber 80a, discharging area 105 is between the end of discharge chamber 80f and the initiating terminal of passback circuit 106, be that above-mentioned processing loop 100a is rectangular, accordingly, in the present embodiment, the frame 10 that is arranged in vacuum Processing Room group 104 and passback circuit 106 of transmitting device 102 is also linearly arranged, structure is more reasonable compact, greatly improve plated film efficiency, more excellently be, in the present embodiment, transmitting device 102 also comprises the translation transport sector 40 that is positioned at feeding area 103 and discharging area 105, this translation transport sector 40 comprises translation support body 41, guide rail 42 and cylinder (not shown), guide rail 42 and cylinder are all located on support 101, the output terminal that is connected in cylinder of translation support body 41, translation support body 41 is slided and is located on guide rail 42 by a sliding part (not shown), and the rectilinear direction that the arranged direction of guide rail 42 is arranged with frame 10 is mutually vertical, the setting party of translation support body 41 is parallel to each other to the rectilinear direction of arranging with frame 10, and in the time that cylinder orders about translation support body 41 and moves to the end of guide rail 42, translation support body 41 docks with adjacent frame 10 respectively, and, in the present embodiment, translation support body 41 is except the sliding part being mutually slidably matched with guide rail 42 and the structure being connected with cylinder, all the other structures are all identical with the structure of frame 10, and translation support body 41 is also provided with above-mentioned driving mechanism 30, do not repeat them here.
Refer to Fig. 1 and Figure 11, front transition chamber 80b and rear transition chamber 80e are equipped with the fast vacuum mechanism 81 for vacuumizing, in the present embodiment, front transition chamber 80b and the equal correspondence of rear transition chamber 80e are provided with a fast vacuum mechanism 81, fast vacuum mechanism 81 comprises the first valve 811, the first connecting pipe 812, the second valve 813, the second connecting pipe 814, lobe pump 815 and slide valve pump 816, the first valve 811 is communicated between front transition chamber 80b and the first connecting pipe 812 or between rear transition chamber 80e and the first connecting pipe 812, the second valve 813 is communicated in the first connecting pipe 812 between the second connecting pipe 814, the inlet end 816a of slide valve pump 816 is communicated in the second connecting pipe 814, the inlet end 815a of lobe pump 815 is communicated in the first connecting pipe 812, the outlet side 815b of lobe pump 815 is communicated in the second connecting pipe 814, it should be noted that, the outlet side of lobe pump of the prior art is to be provided with drain tap, and in the present invention, lobe pump 815 is improved, the outlet side 815b that is lobe pump 815 does not arrange drain tap, be that the outlet side 815b of lobe pump 815 is in normally open, to reduce the quantity of valve and total switching number of times of valve of required control, structure is more reasonable compact, start is faster, to meet the work requirements of front transition chamber 80b and rear transition chamber 80e fast vacuum, , in the time that needs carry out vacuum operating to front transition chamber 80b or rear transition chamber 80e, first open the first valve 811 and the second valve 813, start slide valve pump 816 (now without starting lobe pump 815), when by slide valve pump 816 vacuum during to default pressure, restart lobe pump 815, and close the second valve 813 simultaneously, carry out vacuum operating by slide valve pump 816 and lobe pump 815 operations simultaneously, thereby realize the operation of front transition chamber 80b and rear transition chamber 80e fast vacuum.More excellent, in the present embodiment, the second valve 813 is an air cylinder driven valve, but, not as limit.The concrete structure of lobe pump 815 and slide valve pump 816 is well known for ordinary skill in the art, and does not repeat them here.
Refer to Fig. 1 and Figure 12, on the moving bearing bracket 20 of transmitting device 102, carry and be two row substrates 201 side by side isolated and in same level position along transmission direction, each row substrate 201 forms a substrate row 200, be that moving bearing bracket 20 is provided with substrate and arranges 200 corresponding supporting parts 23, a coating chamber 90a, in No. two coating chamber 90b and No. three coating chamber 90c, be equipped with and regard to two substrate rows 200 and two substrate rows 200 are carried out to the film-coating mechanism 91 of plated film simultaneously, thereby improve the efficiency of the plated film processing of magnetron sputtering film production line 100 of the present invention, and then reduce production costs.The concrete structure of film-coating mechanism 91 is well known for ordinary skill in the art, and in the present embodiment, each film-coating mechanism 91 is the corresponding above-mentioned regulating mechanism 108 that is provided with all, above-mentioned magnet 912 and target 911 are also located in film-coating mechanism 91, do not repeat them here.More excellently be, in the present embodiment, in coating chamber 90a, No. two coating chamber 90b and No. three coating chamber 90c, be equipped with the heating arrangements 92 for heating, heating arrangements 92 comprises primary heater 921, secondary heater 922 and the 3rd well heater 923, two substrate rows 200 are between primary heater 921 and secondary heater 922, the 3rd well heater 923 is between two base screenings, thereby make the substrate 201 can be by homogeneous heating, avoid the difference of Heating temperature, thereby the quality that has improved substrate 201 plated film processing, structure is more reasonable compact; Concrete structure that it should be noted that primary heater 921, secondary heater 922 and the 3rd well heater 923 is well known for ordinary skill in the art, and does not repeat them here.More excellently be, in the present embodiment, each substrate row 200 vertically all has at least two-layer substrate 201 that is carried on transmitting device 102, makes magnetron sputtering film production line 100 of the present invention within the identical time period, the substrate 201 that can process more quantity, efficiency is higher.
Refer to Fig. 1 and Figure 13, a coating chamber 90a, in No. two coating chamber 90b and No. three coating chamber 90c, be equipped with the segmentation gas distribution mechanism 93 for importing rare gas element, segmentation gas distribution mechanism 93 comprises some gas distributing pipelines 931, the sidewall of gas distributing pipeline 931 offers at least two gas port 931a, gas port 931a arranges along the flow direction (direction of arrow D indication in Figure 13) of rare gas element, and the distance between two adjacent gas port 931a is diminishing setting along the flow direction (direction of arrow D indication in Figure 13) of rare gas element, thereby make rare gas element in a coating chamber 90a, in No. two coating chamber 90b and No. three coating chamber 90c, can be distributed as more quickly evenly, to ensure the homogeneity of substrate 201 coating film thicknesses, and in the present embodiment, gas distribution mechanism is also provided with under meter (not shown), the inlet end of gas distributing pipeline 931 is communicated under meter, observe and control air input and air inlet speed to facilitate, structure is more reasonable, work more convenient.
By reference to the accompanying drawings, principle of work to magnetron sputtering film production line 100 of the present invention elaborates, substrate 201 is loaded into moving bearing bracket 20 in 103 places, feeding area, driving mechanism 30 orders about moving bearing bracket 20 and is entered by the movable support body of feeding area 103 initiating terminal of front Transition Room, and be transmitted in turn feed chamber 80a, front transition chamber 80b, front surge chamber 80c, a coating chamber 90a, No. two coating chamber 90b, No. three coating chamber 90c, rear surge chamber 80d, rear transition chamber 80e and discharge chamber 80f are to complete the plated film processing of substrate 201, complete after plated film manufacturing procedure, arrive discharging area 105, moving bearing bracket 20 moves into the translation support body 41 that is positioned at discharging area 105, this translation support body 41 is moved to the initiating terminal of passback circuit 106 under the ordering about of cylinder by the end of discharge chamber 80f, afterwards, moving bearing bracket 20 is ordered about and is shifted out translation carrier by driving mechanism 30, and enter passback circuit 106, ordered about to be back to by driving mechanism 30 and enter the translation support body 41 that is positioned at feeding area 103, this translation support body 41 is moved to the initiating terminal of feed chamber 80a under the ordering about of cylinder by the end of passback circuit 106, and complete the upper operation of substrate 201 simultaneously, to enter the plated film processing of substrate 201 of next batch.
And, in the plated film course of processing, can regulate magnet 912 by regulating mechanism 108, in the time relative magnet 912 target 911 need to being done to translational adjustment operation along the direction that is parallel to target 911, only need to rotate to drive the first pivotal axis 53 to order about driving toothed gear 51 by pivot action part 54, thereby by pivotable driving toothed gear 51 order about that driven bar shaped tooth 52 moves to drive magnet 912 to move and the position adjustments of magnet 912 being carried out to translation in different positions, and then improve the utilising efficiency of target 911.In the time need to regulating the distance of magnet 912 two ends and target 911, only need the equal magnetic adjusting part 60 at the two ends by being positioned at magnet 912 to regulate, by push bolt 62 and the bolt 63 1 of pulling back push away one draw cooperatively interact for the distance of positioning magnet 912 two ends and target 911, push bolt 62 by pivotable and the bolt 63 of pulling back carries out adjustment operation, and under the pushing tow of pushing part 511, make the middle part of magnet 912 towards the direction bending near target 911, and the two ends that this takes turns are towards the direction bending away from target 911, so that the distance of magnet 912 two ends and target 911 is adjusted, thereby make the Distribution of Magnetic Field in target 911 regions of living in more even, make the motion of the secondary electron in diode sputtering more stable and distribute more even, and then the plated film that makes substrate to be coated 201 distributes more even and coating film thickness is more consistent.
Compared with prior art, due to feeding area 103, vacuum Processing Room group 104, discharging area 105 and the passback circuit 106 processing loop 100a that connected setting and formation continuous circulation move in turn ringwise of magnetron sputtering film production line 100 of the present invention, transmitting device 102 is being located at of continuous circulation operation and processes loop 100a, vacuum Processing Room group 104 comprises the feed chamber 80a that is connected and arranges in turn along the transmission direction of transmitting device 102, front transition chamber 80b, front surge chamber 80c, a coating chamber 90a, No. two coating chamber 90b, No. three coating chamber 90c, rear surge chamber 80d, rear transition chamber 80e and discharge chamber 80f, a coating chamber 90a, in No. two coating chamber 90b and No. three coating chamber 90c, be equipped with target 911, a coating chamber 90a, No. two coating chamber 90b and No. three coating chamber 90c are equipped with movably and are close to the magnet 912 of corresponding target 911 outward and for regulating the regulating mechanism 108 of magnet 912, regulating mechanism 108 comprises and moves magnetic adjusting part 50 and equal magnetic adjusting parts 60, move magnetic adjusting part 50 and all magnetic adjusting part 60 be all connected with magnet 912, order about the relative target of magnet 912 911 and do translational adjustment operation along the direction that is parallel to target 911 by moving magnetic adjusting part 50, order about magnet 912 bendings to regulate the distance of magnet 912 two ends and target 911 by equal magnetic adjusting part 60, on the one hand, order about the relative target of magnet 912 911 and do translational adjustment along the direction that is parallel to target 911 by moving magnetic adjusting part 50, the everywhere that makes target 911 is in turn within the scope of the action of a magnetic field in magnet 912, thereby utilization ratio and the sputter scope of target 911 are greatly increased, make full use of target 911, greatly improve the working (machining) efficiency of substrate 201 plated films simultaneously, and without the volume that increases magnet 912, on the other hand, order about magnet 912 bendings to regulate the distance of magnet 912 two ends and target 911 by equal magnetic adjusting part 60, thereby make the Distribution of Magnetic Field in target 911 regions of living in more even, make the motion of the secondary electron in diode sputtering more stable and distribute more even, and then the plated film that makes substrate to be coated 201 distributes more even and coating film thickness is more consistent, has finally greatly improved coating quality and the qualification rate of substrate 201, substrate 201 is loaded into transmitting device 102 in 103 places, feeding area, transmitting device 102 carrying substrates 201 are transmitted in front feed chamber 80a in turn, transition chamber, front surge chamber 80c, a coating chamber 90a, No. two coating chamber 90b, No. three coating chamber 90c, rear surge chamber 80d, rear transition chamber 80e and discharge chamber 80f are to complete the plated film processing of substrate 201, substrate 201 unloads from transmitting device 102 in 105 places, discharging area, transmitting device 102 is back to feeding area 103 through passback circuit 106, thereby make magnetron sputtering film production line 100 of the present invention also have simple in structure, technique highly versatile and can improve plated film qualification rate, coating quality, the advantage of target 911 utilization ratios and plated film working (machining) efficiency, and can also reduce substrate 201 plated film tooling costs and meet large batch of Production requirement.
Above disclosed is only preferred embodiment of the present invention, the interest field that certainly can not limit the present invention with this, and the equivalent variations of therefore doing according to the claims in the present invention, still belongs to the scope that the present invention is contained.
Claims (10)
1. a magnetron sputtering film production line, be applicable to substrate to carry out plated film processing, it is characterized in that, comprise support and be located at transmitting device, feeding area, vacuum Processing Room group, discharging area and the passback circuit of described support, the processing loop that described feeding area, vacuum Processing Room group, discharging area and passback circuit are connected and arrange and form continuous circulation operation in turn ringwise, described transmitting device is the described processing loop of being located at of continuous circulation operation, described vacuum Processing Room group comprises the feed chamber that is connected and arranges in turn along the transmission direction of transmitting device, front transition chamber, front surge chamber, a coating chamber, No. two coating chambers, No. three coating chambers, rear surge chamber, rear transition chamber and discharge chamber, a described coating chamber, in No. two coating chambers and No. three coating chambers, be equipped with target, a described coating chamber, No. two coating chambers and No. three coating chambers are equipped with movably and are close to the magnet of corresponding described target outward and for regulating the regulating mechanism of described magnet, described regulating mechanism comprises and moves magnetic adjusting part and equal magnetic adjusting parts, described move magnetic adjusting part and all magnetic adjusting part be all connected with described magnet, order about the relatively described target of described magnet and do translational adjustment operation along the direction that is parallel to described target by the described magnetic adjusting part that moves, order about described magnet bending to regulate the distance of described magnet two ends and described target by described equal magnetic adjusting part, described substrate is loaded into described transmitting device in described feeding area place, described transmitting device carries described substrate and is transmitted in turn described feed chamber, front transition chamber, front surge chamber, a coating chamber, No. two coating chambers, No. three coating chambers, rear surge chamber, rear transition chamber and discharge chambers to complete the plated film processing of substrate, described substrate unloads from described transmitting device in described discharging area place, and described transmitting device is back to described feeding area through described passback circuit.
2. magnetron sputtering film production line as claimed in claim 1, it is characterized in that, described regulating mechanism also comprises erecting frame, described erecting frame is located at described support, described magnet is the mobile described erecting frame of being located at, described in move magnetic adjusting part and all magnetic adjusting part be all located between described magnet and erecting frame.
3. magnetron sputtering film production line as claimed in claim 2, it is characterized in that, the described magnetic adjusting part that moves comprises driving toothed gear and driven bar shaped tooth, described driving toothed gear is articulated in described erecting frame, the direction that described driven bar shaped tooth does translational adjustment along described magnet is installed on described magnet, and described driving toothed gear and described driven bar shaped tooth engagement fit, described in each, the two ends of magnet are equipped with described equal magnetic adjusting part, the described middle part of moving magnetic adjusting part and be positioned at corresponding described magnet, described equal magnetic adjusting part comprises Connection Block, push bolt and the bolt of pulling back, described Connection Block is connected in described erecting frame, the described threaded one end that pushes bolt is connected in described Connection Block, the described the other end that pushes bolt contacts at described magnet, the threaded one end of the described bolt of pulling back is connected in described magnet, the other end of the described bolt of pulling back slides and runs through described Connection Block, described Connection Block all described magnet and described in pull back between the nut of bolt, and the nut of the bolt of pulling back described in described Connection Block contacts at, the described magnetic adjusting part that moves is also formed with pushing part, and described pushing part pushes in described magnet towards the direction near described target.
4. magnetron sputtering film production line as claimed in claim 1, it is characterized in that, described transmitting device comprises frame, moving bearing bracket and driving mechanism, described frame is located at described support, the bottom carrying of described moving bearing bracket is transmitted in described driving mechanism, described frame is provided with the first guide part along the travel direction of described moving bearing bracket, described moving bearing bracket is provided with the second guide part that is running fit with described the first guide part, the sidepiece that described the first guide part and described the second guide part are faced is mutually magnetic and repels each other and maintain described moving bearing bracket in vertical state.
5. magnetron sputtering film production line as claimed in claim 4, it is characterized in that, described the first guide part comprises some the first magnets and some the second magnets, described the first magnet is the arrangement in gap and forms the first magnet group along the travel direction of described moving bearing bracket, described the second magnet is the arrangement in gap and forms the second magnet group along the travel direction of described moving bearing bracket, described the first magnet group and the second magnet group are along same level location arrangements, and form a magnetic guide path between described the first magnet group and the second magnet group, described the second guide part is in the described magnetic guide path of being placed in of gap, described the second guide part comprises some the 3rd magnets and some the 4th magnets, described the 3rd magnet is the arrangement in gap and forms the 3rd magnet group along the travel direction of described moving bearing bracket, described the 4th magnet is the arrangement in gap and forms the 4th magnet group along the travel direction of described moving bearing bracket, described the 3rd magnet group and the 4th magnet group are all positioned at described magnetic guide path, one end of described the 3rd magnet is one end of described the first magnet of regarding to of gap and is magnetic and repels each other, one end of described the 4th magnet is regarding to of gap described and one end of magnet and be magnetic and repel each other.
6. magnetron sputtering film production line as claimed in claim 1, it is characterized in that, described front transition chamber and described rear transition chamber are equipped with the fast vacuum mechanism for vacuumizing, described fast vacuum mechanism comprises the first valve, the first connecting pipe, the second valve, the second connecting pipe, lobe pump and slide valve pump, described the first valve is communicated between described front transition chamber and described the first connecting pipe or between described rear transition chamber and described the first connecting pipe, described the second valve is communicated in described the first connecting pipe between the second connecting pipe, the inlet end of described slide valve pump is communicated in described the second connecting pipe, the inlet end of described lobe pump is communicated in described the first connecting pipe, the outlet side of described lobe pump is communicated in the second connecting pipe.
7. magnetron sputtering film production line as claimed in claim 1, it is characterized in that, described transmitting device carries and is the described substrate of two row side by side isolated and in same level position along transmission direction, each is listed as described substrate and forms a substrate row, is equipped with and regards to described in two substrate row and substrate row described in two is carried out to the film-coating mechanism of plated film simultaneously in a described coating chamber, No. two coating chambers and No. three coating chambers.
8. magnetron sputtering film production line as claimed in claim 7, it is characterized in that, in a described coating chamber, No. two coating chambers and No. three coating chambers, be equipped with the heating arrangements for heating, described heating arrangements comprises primary heater, secondary heater and the 3rd well heater, described in two, substrate ranking is between described primary heater and secondary heater, and described the 3rd well heater is described in two between base screening.
9. magnetron sputtering film production line as claimed in claim 8, is characterized in that, described in each, substrate row vertically all has at least two-layer described substrate that is carried on described transmitting device.
10. magnetron sputtering film production line as claimed in claim 1, it is characterized in that, in a described coating chamber, No. two coating chambers and No. three coating chambers, be equipped with the segmentation gas distribution mechanism for importing rare gas element, described segmentation gas distribution mechanism comprises some gas distributing pipelines, the sidewall of described gas distributing pipeline offers at least two gas ports, described gas port is arranged along the flow direction of rare gas element, and distance between two adjacent described gas ports is diminishing setting along the flow direction of rare gas element.
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| CN201410083043.0A CN103849845B (en) | 2014-03-07 | 2014-03-07 | Magnetron sputtering film production line |
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| CN104513965A (en) * | 2014-12-22 | 2015-04-15 | 深圳市拓日新能源科技股份有限公司 | Magnetron sputtering and coating equipment for silicon nitride deposition and coating method |
| CN106282948A (en) * | 2016-07-28 | 2017-01-04 | 北京中科三环高技术股份有限公司 | A kind of film plating process and coating system and the preparation method of rare-earth magnet |
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| CN106637112A (en) * | 2016-11-16 | 2017-05-10 | 上海交通大学 | Horizontal type magnetron sputtering system used for fuel cell metal bipolar plates and coating process |
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| CN109252138A (en) * | 2018-11-29 | 2019-01-22 | 东莞市粒米薄膜科技有限公司 | Vacuum coating equipment |
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| CN109778134A (en) * | 2019-03-28 | 2019-05-21 | 张家港市铭斯特光电科技有限公司 | A kind of back plastic cover plated film production line |
| CN112853305A (en) * | 2020-12-31 | 2021-05-28 | 深圳市嘉德真空光电有限公司 | Multifunctional vacuum nano film coating ring type production line |
| CN112899635A (en) * | 2021-01-14 | 2021-06-04 | 东莞市一粒米薄膜科技有限公司 | Horizontal optical continuous magnetron sputtering coating equipment |
| CN117467969A (en) * | 2023-12-28 | 2024-01-30 | 湖南振添光学玻璃科技有限公司 | ITO coating equipment for optical glass lens and use method |
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Denomination of invention: Magnetron sputtering coating production line for capacitive touch screens Effective date of registration: 20161117 Granted publication date: 20160127 Pledgee: Bank of Dongguan Limited by Share Ltd Humen branch Pledgor: Dongguan Xintai Glass Technology Co., Ltd. Registration number: 2016440000027 |
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