CN103837943B - Optical communication module - Google Patents
Optical communication module Download PDFInfo
- Publication number
- CN103837943B CN103837943B CN201210477850.1A CN201210477850A CN103837943B CN 103837943 B CN103837943 B CN 103837943B CN 201210477850 A CN201210477850 A CN 201210477850A CN 103837943 B CN103837943 B CN 103837943B
- Authority
- CN
- China
- Prior art keywords
- sealing ring
- support plate
- communication module
- substrate
- receive unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Optical Couplings Of Light Guides (AREA)
Abstract
A kind of optical communication module, including support plate, substrate and optical fiber, light Transmit-Receive Unit is provided with the substrate to send and receive optical signal, the smooth Transmit-Receive Unit is towards the support plate, there is reflecting surface on the support plate, the optical signal that the smooth Transmit-Receive Unit is sent is coupled into the optical fiber after the reflective surface, the optical signal of the optical fiber transmission is received after the reflective surface by the smooth Transmit-Receive Unit, there is the first sealing ring on the support plate, there is the second sealing ring on the substrate, first sealing ring and the second sealing ring, which are engaged, is sealed in the smooth Transmit-Receive Unit between the substrate and support plate, the material of first sealing ring and the second sealing ring is metal.
Description
Technical field
The present invention relates to a kind of optical communication module.
Background technology
The lens of current optical communication module are plastic material, and used circuit board is also macromolecule polymeric material, one
As use macromolecule glue material（Such as Epoxy or Acrylic）Lens are combined with circuit board.Because high polymer material is inherently
It is a material for being easy to water suction, so whole water-protected enclosure and bad, easily discharges hydrone at high temperature.For only
Be bare crystalline light emitting diode, photodiode, chip for because the protection without packaging body, whole service life
Influenceed to reduce by aqueous vapor, also the substrate and method therefore using other protections and anti-aqueous vapor are very urgent.
The content of the invention
In view of this, it is necessary to provide a kind of water resistance excellent optical communication module.
Light Transmit-Receive Unit is provided with a kind of optical communication module, including support plate and substrate, the substrate for sending and
Optical signal is received, the smooth Transmit-Receive Unit has reflecting surface and optical fiber towards the support plate on the support plate, the light transmitting-receiving is single
The optical signal that member is sent is coupled into the optical fiber after the reflective surface, and the optical signal of the optical fiber transmission is through the reflection
Received after the reflection of face by the smooth Transmit-Receive Unit, having on the support plate on the first sealing ring, the substrate has the second sealing
Ring, first sealing ring and the second sealing ring, which are engaged, is sealed in the smooth Transmit-Receive Unit between the substrate and support plate,
The material of first sealing ring and the second sealing ring is metal.
Compared to prior art, the optical communication module of the present embodiment uses the first sealing that hydrophobic metal material is made
Ring and the second sealing ring carry out fitted seal light Transmit-Receive Unit, so as to excellent waterproof effect, add optical communication module
Reliability.
Brief description of the drawings
Fig. 1 is the schematic cross-section of optical communication module of the embodiment of the present invention.
Fig. 2 is the schematic cross-sectional exploded view of optical communication module of the embodiment of the present invention.
Main element symbol description
| Optical communication module | 10 |
| Support plate | 11 |
| First surface | 111 |
| Second surface | 112 |
| Groove | 113 |
| Reflecting surface | 114 |
| Accommodating hole | 115 |
| First pin | 116 |
| Stage portion | 117 |
| Substrate | 12 |
| 3rd surface | 121 |
| 4th surface | 122 |
| Second pin | 126 |
| Light Transmit-Receive Unit | 13 |
| Chip | 14 |
| Sealing structure | 15 |
| First sealing ring | 151 |
| Second sealing ring | 152 |
| Optical fiber | 20 |
Following embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Embodiment
Fig. 1 and Fig. 2 is referred to, optical communication module 10 provided in an embodiment of the present invention includes support plate 11, substrate 12, light transmitting-receiving
Unit 13, chip 14, sealing structure 15 and optical fiber 20, optical communication module 10 are used for realizing between optical fiber 20 and light Transmit-Receive Unit 13
The transmission of optical signal.
Support plate 11 is used for bearing substrate 12, light Transmit-Receive Unit 13, chip 14, sealing structure 15 and optical fiber 20, and light transmitting-receiving is single
Member 13 and chip 14 are arranged on substrate 12, and light Transmit-Receive Unit 13 includes light emitting diode and photelectric receiver to send and receive
Optical signal, chip 14 is used for handling the signal that light Transmit-Receive Unit 13 sends and received, and sealing structure 15 is used for sealing light transmitting-receiving list
Member 13 and chip 14.
Support plate 11 includes relative first surface 111 and second surface 112, and first surface 111 is recessed to second surface 112
Groove 113 is formed, a side of groove 113 has reflecting surface 114, and the side relative with reflecting surface 114 has stage portion
117, with 45 degree of angle between reflecting surface 114 and second surface 112.
The plural accommodating hole 115 of parallel second surface 112, accommodating hole 115 are provided with the stage portion 117 of groove 113
In stage portion 117 close to the position of second surface 112, accommodating hole 115 is used for housing fixed optical fiber 20, from the light of the outgoing of optical fiber 20
Incide on reflecting surface 114 and be reflected off to enter light Transmit-Receive Unit 13, equally, the light that light Transmit-Receive Unit 13 is sent is incided
On reflecting surface 114 and be reflected off and into optical fiber 20.
The stage portion 117 of groove 113 is towards being provided with the plural sealing ring of first pin 116 and first on the position of substrate 12
151, the first sealing ring 151 is cyclic structure, and the first pin 116 is located in the first sealing ring 151.The material of first sealing ring 151
Expect for the mixture of hydrophobic metal, such as two kinds of nickel, copper, titanium or wherein at least.
First sealing ring 151 and the second sealing ring 152 can be arranged on support plate 11 and substrate 12 by sputtering way.
Substrate 12 can be circuit board, with the 3rd relative surface 121 and the 4th surface 122, the direction of the 3rd surface 121
Support plate 11, light Transmit-Receive Unit 13 and chip 14 are arranged on the 3rd surface 121, so that light Transmit-Receive Unit 13 is towards groove 113.
The first pin 116 of correspondence and the first sealing ring 151 have the second pin 126 and the second sealing ring respectively on 3rd surface 121
152, the first pin 116 is in contact with the second pin 126, and the second sealing ring 152 is located at the edge of substrate 12 to be arranged at base
The glazing Transmit-Receive Unit 13 of plate 12 and chip 14 are surrounded, and the material of the second sealing ring 152 is identical with the material of the first sealing ring 151.
Second sealing ring 152 and the first sealing ring 151 use transition liquid-phase（Transient Liquid Phase）Or electricity
The technologies such as plating Au-Sn are combined to form sealing structure 15, and light Transmit-Receive Unit 13 and chip 14 are sealed in load by sealing structure 15
Between plate 11 and substrate 12.
If the second pin 126 need not be electrically connected with support plate 11, the first pin 116 on support plate 11 can be omitted.
Sealing structure 15 that this optical communication module 10 is made of hydrophobic metal material seals light Transmit-Receive Unit 13
With chip 14, so as to excellent waterproof effect, add the reliability of optical communication module 10.
It is understood that those skilled in the art can also do other changes in spirit of the invention, without departing from
The technique effect of the present invention.These changes done according to present invention spirit, should all be included in the present invention claimed
Within the scope of.
Claims (7)
1. light Transmit-Receive Unit is provided with a kind of optical communication module, including support plate and substrate, the substrate to send and connect
Optical signal is received, the smooth Transmit-Receive Unit has reflecting surface and optical fiber, the smooth Transmit-Receive Unit towards the support plate on the support plate
The optical signal sent is coupled into the optical fiber after the reflective surface, and the optical signal of the optical fiber transmission is through the reflecting surface
Received after reflection by the smooth Transmit-Receive Unit, there is groove on the support plate, the substrate portion is contained in the groove, institute
State to have in groove and there is the second sealing ring, first sealing ring and the second sealing ring phase on the first sealing ring, the substrate
The smooth Transmit-Receive Unit is sealed between the substrate and support plate by cooperation, the material of first sealing ring and the second sealing ring
For metal.
2. optical communication module as claimed in claim 1, it is characterised in that first sealing ring and the second sealing ring pass through mistake
Cross liquid phase or plating Au-Sn integrally combines.
3. optical communication module as claimed in claim 1, it is characterised in that the groove has stage portion, first sealing
Ring is located in the stage portion.
4. optical communication module as claimed in claim 1, it is characterised in that the support plate has relative first surface and second
Surface, the groove is recessed from the first surface to the second surface, and the reflecting surface is located in the groove, described anti-
Penetrating between face and the second surface has 45 degree of angle.
5. optical communication module as claimed in claim 3, it is characterised in that having in the groove stage portion is used to accommodate optical fiber
Accommodating hole.
6. optical communication module as claimed in claim 1, it is characterised in that the metal be copper, nickel, titanium or at least two it
Mixture.
7. optical communication module as claimed in claim 1, it is characterised in that first sealing ring and the second sealing ring are by splashing
Plating mode is formed on the support plate and substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210477850.1A CN103837943B (en) | 2012-11-22 | 2012-11-22 | Optical communication module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210477850.1A CN103837943B (en) | 2012-11-22 | 2012-11-22 | Optical communication module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103837943A CN103837943A (en) | 2014-06-04 |
| CN103837943B true CN103837943B (en) | 2017-08-15 |
Family
ID=50801636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210477850.1A Expired - Fee Related CN103837943B (en) | 2012-11-22 | 2012-11-22 | Optical communication module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103837943B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5479540A (en) * | 1994-06-30 | 1995-12-26 | The Whitaker Corporation | Passively aligned bi-directional optoelectronic transceiver module assembly |
| CN1595741A (en) * | 2003-09-19 | 2005-03-16 | 安捷伦科技有限公司 | Integrated photoelectronic device |
| CN1638115A (en) * | 2003-10-24 | 2005-07-13 | 米拉迪亚公司 | Method and system for hermetically sealing packages for optics |
| CN102162885A (en) * | 2011-05-03 | 2011-08-24 | 苏州旭创科技有限公司 | Parallel optical transceiving component for high-speed transmission |
| CN102692684A (en) * | 2011-03-24 | 2012-09-26 | 源杰科技股份有限公司 | Photoelectric module |
-
2012
- 2012-11-22 CN CN201210477850.1A patent/CN103837943B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5479540A (en) * | 1994-06-30 | 1995-12-26 | The Whitaker Corporation | Passively aligned bi-directional optoelectronic transceiver module assembly |
| CN1595741A (en) * | 2003-09-19 | 2005-03-16 | 安捷伦科技有限公司 | Integrated photoelectronic device |
| CN1638115A (en) * | 2003-10-24 | 2005-07-13 | 米拉迪亚公司 | Method and system for hermetically sealing packages for optics |
| CN102692684A (en) * | 2011-03-24 | 2012-09-26 | 源杰科技股份有限公司 | Photoelectric module |
| CN102162885A (en) * | 2011-05-03 | 2011-08-24 | 苏州旭创科技有限公司 | Parallel optical transceiving component for high-speed transmission |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103837943A (en) | 2014-06-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170711 Address after: Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Applicant before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Applicant before: Hon Hai Precision Industry Co., Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170815 Termination date: 20171122 |