CN103835418A - Thermal-insulation and moisture-proof bathroom floor - Google Patents
Thermal-insulation and moisture-proof bathroom floor Download PDFInfo
- Publication number
- CN103835418A CN103835418A CN201210486760.9A CN201210486760A CN103835418A CN 103835418 A CN103835418 A CN 103835418A CN 201210486760 A CN201210486760 A CN 201210486760A CN 103835418 A CN103835418 A CN 103835418A
- Authority
- CN
- China
- Prior art keywords
- thermal
- insulation
- moisture
- heat
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a thermal-insulation and moisture-proof bathroom floor. The thermal-insulation and moisture-proof bathroom floor is composed of floor tiles (1), a cement mortar combined layer (2), a waterproof layer (3), a cement bearing plate (4), hot water coils (5), galvanized thermal conductive plates (6), a thermal-insulation layer (7), foam concrete (8), a concrete plate (9), a macadam layer (10) and packed soil (11). The thermal-insulation and moisture-proof bathroom floor has the advantages that by adopting the structure, the thermal-insulation layer in the heated floor body can resist a heat bridge and play a role in thermal-insulation, the moisture-proof layer plays a role in moisture resistance, construction is simple, and the thermal-insulation and moisture-proof bathroom floor is economical and applicable.
Description
Technical field
The present invention relates to a kind of constructure ground, relate in particular to a kind of heat-holding dampproof accomodation ground.
Background technology
The heat-holding dampproof problem on housing construction one deck ground is related to resident's work and quality of life, is always one of construction quality problem emphasis of complaining.Insulation layer is not established on ground, and thermal resistance is little heat bridge, occurs moisture, furniture, metope mildew bacterium, and air pollution, to people's healthy generation harm.Along with the raising of people's living standard, more and higher to the requirement of living quality, the house of building green, environmental protection, health is the direction of Residential Buildings.
Summary of the invention
The object of the invention is to overcome above-mentioned shortcoming, a kind of heat-holding dampproof accomodation ground is provided.To achieve these goals, technical scheme of the present invention is: a kind of heat-holding dampproof accomodation ground, and take advantage of pressing plate (4), hot-water coil pipe (5), zinc-plated heat-conducting plate (6), insulation layer (7), foam concrete (8), concrete slab (9), macadam (10), rammed earth (11) to form by floor tile (1), cement mortar setting course (2), waterproofing course (3), cement.The invention has the beneficial effects as follows: adopt said structure, the insulation layer heat bridge capable of blocking in underground heat ground, plays function of heat insulation, and damp-proof course plays blocking-up moisture, construction is simple, economic and practical.
Brief description of the drawings
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is structural representation of the present invention.
In figure: 1-floor tile, 2-cement mortar setting course, 3-waterproofing course, 4-cement are taken advantage of pressing plate, 5-hot-water coil pipe, the zinc-plated heat-conducting plate of 6-, 7-insulation layer, 8-foam concrete, 9-concrete slab, 10-macadam, 11-rammed earth.
Detailed description of the invention
As shown in Figure 1, on concrete slab, establish 30 millimeters thick foam concrete leveling layers, lay 40 millimeters thick extruded polystyrene warming plates above, warming plate is along on metope anti-60 millimeters high, extruded polystyrene warming plate density is 32kg/M3, coefficient of thermal conductivity is 0.3W/M.K, on extruded polystyrene warming plate according to the layout perforate of hot-water coil pipe, arrange hot-water coil pipe, on extruded polystyrene warming plate, lay 20 millimeters thick cement and take advantage of pressing plate, cement pressure plate upper berth 1.8 millimeters thick polypropylene fibre composite of water-proof coiled material, the 1:3 cement mortar screeding layer sloping layer thinnest part 30 of holding concurrently is thick, paste 10 millimeters thick floor tiles above, concrete slab is 100 millimeters thick C20 concrete, inside joining diameter is 8 millimeters of reinforcing bars, spacing is 200 millimeters of the Double Faces to Installs, under concrete slab, be 100 millimeters thick macadams, fill with M5 composite mortar, macadam is in rammed earth.
Claims (5)
1. a heat-holding dampproof accomodation ground, take advantage of pressing plate (4), hot-water coil pipe (5), zinc-plated heat-conducting plate (6), insulation layer (7), foam concrete (8), concrete slab (9), macadam (10), rammed earth (11) to form by floor tile (1), cement mortar setting course (2), waterproofing course (3), cement, it is characterized in that: hot-water coil pipe (5) is layered in insulation layer (7).
2. a kind of heat-holding dampproof accomodation ground according to claim 1, is characterized in that: on insulation layer (7), have zinc-plated heat-conducting plate (6).
3. a kind of heat-holding dampproof accomodation ground according to claim 1, is characterized in that: on hot-water coil pipe (5), have 20-30 millimeters thick cement to take advantage of pressing plate (4).
4. a kind of heat-holding dampproof accomodation ground according to claim 1, it is characterized in that: concrete slab is joined steel mesh reinforcement in (9), on concrete slab (9), establish foam concrete (8), concrete slab (9) is macadam (10) below, in rammed earth (11).
5. a kind of heat-holding dampproof accomodation ground according to claim 1, is characterized in that: insulation layer (4) thickness is 40-80 millimeters thick.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210486760.9A CN103835418A (en) | 2012-11-27 | 2012-11-27 | Thermal-insulation and moisture-proof bathroom floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210486760.9A CN103835418A (en) | 2012-11-27 | 2012-11-27 | Thermal-insulation and moisture-proof bathroom floor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103835418A true CN103835418A (en) | 2014-06-04 |
Family
ID=50799281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210486760.9A Pending CN103835418A (en) | 2012-11-27 | 2012-11-27 | Thermal-insulation and moisture-proof bathroom floor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103835418A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108277956A (en) * | 2018-03-30 | 2018-07-13 | 安徽理工大学 | A kind of civil construction floor heating brick |
| CN108755979A (en) * | 2018-06-15 | 2018-11-06 | 湖南宝家云建筑工程管理有限公司 | A kind of toilet moistureproof and waterproof processing method |
-
2012
- 2012-11-27 CN CN201210486760.9A patent/CN103835418A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108277956A (en) * | 2018-03-30 | 2018-07-13 | 安徽理工大学 | A kind of civil construction floor heating brick |
| CN108755979A (en) * | 2018-06-15 | 2018-11-06 | 湖南宝家云建筑工程管理有限公司 | A kind of toilet moistureproof and waterproof processing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101298799B (en) | Dry-type hot water heating floor | |
| CN107313573B (en) | Quick-heating energy-saving wet floor heating structure and construction method thereof | |
| CN103835417A (en) | Heat-preservation and sound-insulation floor | |
| CN205036046U (en) | Warm up energy -saving insulation system | |
| CN202644752U (en) | Thermal insulation wallboard | |
| CN103835418A (en) | Thermal-insulation and moisture-proof bathroom floor | |
| CN203188486U (en) | Waterproof structure for roof | |
| KR101004250B1 (en) | A multi-layer structure for the dampproofing and heat insulation | |
| CN204059629U (en) | Waterproof, fireproof heat insulating low-carbon (LC) module assembly wallboard | |
| CN205476047U (en) | A assembled EPS module with filling heat preservation composite wall panel for steel construction wall body | |
| CN105908894A (en) | Fireproof heat-preservation noise-elimination composite type floor slab | |
| CN103835420A (en) | Thermal-insulation and moisture-proof floor | |
| CN215368007U (en) | Connecting structure for bottom joint of prefabricated exterior wall cladding | |
| CN104074292A (en) | A damp-proof and heat insulating ground system and a construction method thereof | |
| CN211816461U (en) | Waterproof layer structure of passive room heating underground outdoor heat insulation material | |
| CN103835377A (en) | Thermal-insulating fireproof structure of floor slab deformation joint | |
| CN203403549U (en) | Roof deformation joint | |
| CN204098052U (en) | A kind of house slab foundation thermal-insulating waterproof Rotating fields | |
| CN206346325U (en) | A kind of building thermal insulation material | |
| CN206428901U (en) | A kind of compound heat insulation house surface of upside-down waterproof layer | |
| CN203383366U (en) | Composite constant temperature floor board | |
| CN204023855U (en) | Moisture-proof heat-insulation ground system | |
| CN215715460U (en) | Heat insulation structure of heat insulation bridge between high-rise passive house pile cap and waterproof board foundation | |
| CN103835419A (en) | Thermal-insulation and sound-insulation bathroom floor | |
| CN219952352U (en) | Waterproof cast-in-situ wall |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140604 |