CN103834351B - There is the high-temperature resistance adhesive of exhaust performance - Google Patents
There is the high-temperature resistance adhesive of exhaust performance Download PDFInfo
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- CN103834351B CN103834351B CN201410066221.9A CN201410066221A CN103834351B CN 103834351 B CN103834351 B CN 103834351B CN 201410066221 A CN201410066221 A CN 201410066221A CN 103834351 B CN103834351 B CN 103834351B
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- adhesive
- temperature resistance
- organic silicon
- resistance adhesive
- polysiloxane
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Abstract
The present invention discloses a kind of high-temperature resistance adhesive with exhaust performance, and described organic silicon adhesive is obtained after reaction by the material of following mass percentage: organic silicon adhesive 35 ~ 45%; Hydroxyl polysiloxane 5 ~ 10%; Silver catalyst 2 ~ 3%; Containing chromium organic complex 15 ~ 20%; Methylparafynol 0.5 ~ 2%; Tackifying resin 20 ~ 50%; N-nitroso compound whipping agent 12 ~ 25%; Described hydroxyl polysiloxane is α, alpha, omega-dihydroxy polysiloxane; Described tackifying resin is MDQ resin.The present invention defines the Micropore-type organic silicone adhesive of microvoid structure, solves the problem that the exhaust of existing organic silicon adhesive is not smooth.
Description
Technical field
The present invention relates to a kind of high-temperature resistance adhesive with exhaust performance, belong to adhesive material technical field.
Background technology
The sizing of organic silicon adhesive is by the siloxanes of one or more line styles, ring-type or branched chain type, under catalyst action, and the line style of the high molecule mass obtained by reactions such as balance, addition or condensations or cross-linking type siloxanes composition.Organic silicon adhesive mainly contains rubber-type and resin type two class.Organic silicon adhesive has the features such as high temperature resistant, clinging power stable, persistence is good, is widely used in the every field such as aviation, navigation, spaceship, rocket-powered missile, nuclear power, electronic apparatus industry.Along with the progressively expansion of the range of application of organic silicon adhesive system adhesive tape, all trades and professions propose new requirement to the quality of organic silicon adhesive system adhesive tape and the application of properties.The adhesive surface of many irregular and different treatment technique, makes the application of organic silicon adhesive system adhesive tape be changed to special use by simple.The preparation technology of general organic silicon adhesive system adhesive tape is surface organic silicon adhesive being coated on adhesive band base (as various film, paper etc.).One large purposes of organic silicon adhesive system adhesive tape makes protective membrane, for the protection of the surface of the material such as glass, sheet metal, plastic plate of transport or use procedure, its surface scratched from contact stain(ing) or polishing scratch.When organic silicon adhesive system adhesive tape protective membrane protection electronic product surface, because these surfaces can apply some water-miscible paints, the chemical substances such as gloss oil, in general technology, there is chemical substance solvent on these surfaces, small molecules etc. remain, with existing organic silicon adhesive system protective membrane be fitted in surface protect time, due to the smooth consolidation of organic silicone adhesive oxidant layer, exhaust-duct is not had between protected surface and organic silicon adhesive, can not discharge when residual small-molecule substance volatilizees, aberration is there will be during long-time use, circle print, the bad phenomenon such as peculiar smell, this is because the super planarization of silica gel, cannot breathe freely and cause.
Summary of the invention
The invention provides a kind of high-temperature resistance adhesive with exhaust performance, in order to prepare organic silicon adhesive protective membrane, object solves the not smooth problem of existing organic silicon adhesive exhaust.
For achieving the above object, the technical solution used in the present invention is: a kind of high-temperature resistance adhesive with exhaust performance, and described high-temperature resistance adhesive is obtained after reaction by the material of following mass percentage:
Organic silicon adhesive 35 ~ 45%;
Hydroxyl polysiloxane 5 ~ 10%;
Silver catalyst 2 ~ 3%;
Containing chromium organic complex 15 ~ 20%;
Methylparafynol 0.5 ~ 2%;
Tackifying resin 20 ~ 50%;
N-nitroso compound whipping agent 12 ~ 25%.
The technical scheme improved further in technique scheme is as follows:
1, in such scheme, described N-nitroso compound whipping agent is selected from N, N '-dinitrosopentamethlyene tetramine or N, N '-dimethyl-N, N '-dinitrosoterephthalamine.
2, in such scheme, described hydroxyl polysiloxane is α, alpha, omega-dihydroxy polysiloxane.
3, in such scheme, described tackifying resin is MDQ resin.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
The present invention has the high-temperature resistance adhesive of exhaust performance, achieve and general organic silicon adhesive is transformed into the Micropore-type organic silicone adhesive with microvoid structure, make organic silicon adhesive have venting quality, adsorptivity, micropore is hollow simultaneously, has the micromolecular function of absorption.The microvoid structure size of organic silicon adhesive can regulate, micropore arranged evenly can tightly can pine, according to final requirement, the structure of micropore and the size of viscosity can be decided.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of high-temperature resistance adhesive with exhaust performance, described high-temperature resistance adhesive is obtained after reaction by the material of following mass percentage:
Organic silicon adhesive 35%;
Hydroxyl polysiloxane 5%;
Silver catalyst 3%;
Containing chromium organic complex 15%;
Methylparafynol 2%;
Tackifying resin 15%;
N, N '-dimethyl-N, N '-dinitrosoterephthalamine 25%.
Above-mentioned hydroxyl polysiloxane is α, alpha, omega-dihydroxy polysiloxane.
Above-mentioned tackifying resin is MDQ resin.
Preparation method:
The first step, chooses a kind of organic silicon adhesive, adds other auxiliary agent as hydroxyl polysiloxane 5%; Silver catalyst 3%; Containing chromium organic complex 15%; Methylparafynol 2%; Thickening tree 15%; N, N '-dimethyl-N, N '-dinitrosoterephthalamine 25% etc., add one by one in order, stir.
Second step, according to the kind of whipping agent, select suitable temperature, the solidification value >100 degree of general silica gel, select the whipping agent of foaming within 100 degree, oven temperature arranges as follows: 50,80,100,120,140,140,70, is first solvent flashing between 50-80 degree, foam between 85 degree and 100 degree, between 120-180, carry out the solidification of silica gel.The type of foaming can obtain perforate according to the difference of whipping agent, also can be the Micropore-type organic silicone adhesive of closed pore.Thus make Micropore-type organic silicone adhesive have good permeability.
Through measuring: the pore diameter range of micropore is distributed as 1nm ~ 5cm, pore density is Midst density, is namely less than 45kg/m
3, and be greater than 18kg/m
3.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to spirit of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (3)
1. there is a high-temperature resistance adhesive for exhaust performance, it is characterized in that: described high-temperature resistance adhesive is obtained after reaction by the material of following mass percentage:
Organic silicon adhesive 35 ~ 45%;
Hydroxyl polysiloxane 5 ~ 10%;
Silver catalyst 2 ~ 3%;
Containing chromium organic complex 15 ~ 20%;
Methylparafynol 0.5 ~ 2%;
Tackifying resin 20 ~ 50%;
N-nitroso compound whipping agent 12 ~ 25%;
Described N-nitroso compound whipping agent is selected from N, N '-dinitrosopentamethlyene tetramine or N, N '-dimethyl-N, N '-dinitrosoterephthalamine;
In described composition, each component concentration percentage ratio sum equals 100%.
2. high-temperature resistance adhesive according to claim 1, is characterized in that: described hydroxyl polysiloxane is α, alpha, omega-dihydroxy polysiloxane.
3. high-temperature resistance adhesive according to claim 1, is characterized in that: described tackifying resin is MDQ resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410066221.9A CN103834351B (en) | 2012-07-09 | 2012-07-09 | There is the high-temperature resistance adhesive of exhaust performance |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210234767.1A CN102757757B (en) | 2012-07-09 | 2012-07-09 | Micropore-type organic silicone adhesive |
| CN201410066221.9A CN103834351B (en) | 2012-07-09 | 2012-07-09 | There is the high-temperature resistance adhesive of exhaust performance |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210234767.1A Division CN102757757B (en) | 2012-07-09 | 2012-07-09 | Micropore-type organic silicone adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103834351A CN103834351A (en) | 2014-06-04 |
| CN103834351B true CN103834351B (en) | 2016-01-13 |
Family
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Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410065939.6A Active CN103805126B (en) | 2012-07-09 | 2012-07-09 | For the protection of the organic silicon adhesive of film |
| CN201210234767.1A Active CN102757757B (en) | 2012-07-09 | 2012-07-09 | Micropore-type organic silicone adhesive |
| CN201410066107.6A Active CN103834349B (en) | 2012-07-09 | 2012-07-09 | Discharge type organic silicon adhesive |
| CN201410066221.9A Active CN103834351B (en) | 2012-07-09 | 2012-07-09 | There is the high-temperature resistance adhesive of exhaust performance |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410065939.6A Active CN103805126B (en) | 2012-07-09 | 2012-07-09 | For the protection of the organic silicon adhesive of film |
| CN201210234767.1A Active CN102757757B (en) | 2012-07-09 | 2012-07-09 | Micropore-type organic silicone adhesive |
| CN201410066107.6A Active CN103834349B (en) | 2012-07-09 | 2012-07-09 | Discharge type organic silicon adhesive |
Country Status (1)
| Country | Link |
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| CN (4) | CN103805126B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104387961A (en) * | 2014-12-08 | 2015-03-04 | 江苏诺飞新材料科技有限公司 | Organic silicon pressure-sensitive surface coating |
| CN106633119B (en) * | 2016-09-30 | 2018-11-30 | 涌奇材料技术（上海）有限公司 | A kind of pore type organosilicon micron ball and its preparation method and application |
| CN106589434B (en) * | 2016-11-15 | 2019-02-26 | 烟台德邦科技有限公司 | Double glass photovoltaic modulies lamination edge sealing adhesive bands of a kind of solar energy and preparation method thereof |
| CN107793944A (en) * | 2017-11-06 | 2018-03-13 | 张永宏 | A kind of organic silica gel static-free glue band |
| CN108085664A (en) * | 2017-12-28 | 2018-05-29 | 金华市鸿新新材料科技有限公司 | Environment-friendly type macromolecule modified silane vitrification liquid and preparation method thereof |
| CN112280523A (en) * | 2020-09-21 | 2021-01-29 | 湖北平安电工材料有限公司 | Process for prolonging gelling time of hard mica plate adhesive and adhesive |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110020640A1 (en) * | 2008-01-11 | 2011-01-27 | Sherman Audrey A | Stretch releasing optically clear pressure sensitive adhesive |
| CN102516929A (en) * | 2011-11-25 | 2012-06-27 | 上海锐朗光电材料有限公司 | Low-hardness glue-dispensing shaping shielding conductive adhesive as well as preparation method and application thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101586018A (en) * | 2008-12-23 | 2009-11-25 | 海龙艾默生（镇江）能源科技有限公司 | Expanded silicone fireproof seal gum and method of preparing the same |
| CN101942201B (en) * | 2010-08-30 | 2012-05-23 | 北京天山新材料技术股份有限公司 | Room-temperature vulcanized antiflaming single-component dealcoholization-type silicone rubber sealant and preparation method thereof |
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2012
- 2012-07-09 CN CN201410065939.6A patent/CN103805126B/en active Active
- 2012-07-09 CN CN201210234767.1A patent/CN102757757B/en active Active
- 2012-07-09 CN CN201410066107.6A patent/CN103834349B/en active Active
- 2012-07-09 CN CN201410066221.9A patent/CN103834351B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110020640A1 (en) * | 2008-01-11 | 2011-01-27 | Sherman Audrey A | Stretch releasing optically clear pressure sensitive adhesive |
| CN102516929A (en) * | 2011-11-25 | 2012-06-27 | 上海锐朗光电材料有限公司 | Low-hardness glue-dispensing shaping shielding conductive adhesive as well as preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103834351A (en) | 2014-06-04 |
| CN103834349B (en) | 2016-04-27 |
| CN102757757B (en) | 2014-03-26 |
| CN103805126A (en) | 2014-05-21 |
| CN102757757A (en) | 2012-10-31 |
| CN103834349A (en) | 2014-06-04 |
| CN103805126B (en) | 2015-09-23 |
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Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee after: Jiangsu Stick new materials Polytron Technologies Inc Address before: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No. Patentee before: Suzhou Sidike New Material Science & Technology Co., Ltd. |
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Effective date of registration: 20170706 Address after: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No. Patentee after: Taicang Stick new Mstar Technology Ltd Address before: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee before: Jiangsu Stick new materials Polytron Technologies Inc |