CN103834342A - High temperature resistant halogen-free antiflaming adhesive for flexible printed circuit board - Google Patents
High temperature resistant halogen-free antiflaming adhesive for flexible printed circuit board Download PDFInfo
- Publication number
- CN103834342A CN103834342A CN201410108214.0A CN201410108214A CN103834342A CN 103834342 A CN103834342 A CN 103834342A CN 201410108214 A CN201410108214 A CN 201410108214A CN 103834342 A CN103834342 A CN 103834342A
- Authority
- CN
- China
- Prior art keywords
- resin
- adhesive
- printed circuit
- circuit board
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention relates to a high temperature resistant halogen-free antiflaming adhesive for a flexible printed circuit board and preparation thereof. The antiflaming adhesive mainly comprises bismaleimide resin, benzoxazine resin, butadiene-acrylonitrile rubber, phenolic resin, antiflaming epoxy resin, a curing accelerator, an inorganic filler and a solvent. The adhesive is prepared by a chemical reaction method or a physical mixing method through steps of mixing the bismaleimide resin with benzoxazine resin, adding the antiflaming epoxy resin, dissolving with organic solvent, and then adding the butadiene-acrylonitrile rubber, curing accelerator, phenolic resin and inorganic filler. The adhesive is used for bonding a copper foil with a polyimide film, and the prepared flexible printed circuit board has good antiflaming performance, and also has excellent heat resistance and very high peel strength.
Description
Technical field
The present invention relates to a kind of flame retardant adhesive without halogen and preparation in field of fine chemical, refer more particularly to a kind of tackiness agent that is applied to bonding Copper Foil and Kapton in flexible printed circuit board base material.
Background technology
Flexible printed circuit board (FPC) has become indispensable important component part in electronic product, and it has adapted to the needs of electronic product to miniaturization, high-density, high reliability development.The gordian technique that flexible printed circuit board is produced is to select suitable tackiness agent, and can tackiness agent fire-retardant, the heat-resisting performance that directly determines flexible printed circuit board.
In the production process of flexible printed circuit board, develop the burning-resistant type adhesive such as acrylic ester adhesive and butadiene-acrylonitrile rubber stick, they are taking brominated epoxy resin as fire retardant.Although these tackiness agent have obtained good flame retardant effect, be all to use the brominated fire retardant of addition type.Addition type brominated flame-retardant easily by organic solvent dissolution, can exert an influence to the soldering resistance of circuit card in the course of processing in the course of processing.And brominated fire retardant is in the time of burning, can emit the hydrogen halide that toxicity is large, contaminate environment.Therefore, exploitation flexible printed circuit board becomes a new developing direction with flame retardant adhesive without halogen.
Chinese patent (CN1916101A) discloses a kind of flexible printed circuit non-halogen flame-proof acrylic ester gum stick, and this tackiness agent is mainly made up of multicomponent methacrylate monomer, phosphorous filler and mineral filler etc.Although this tackiness agent has obtained good stripping strength and flame retardant effect, there is the not good enough shortcoming of thermotolerance.Chinese patent (CN 1178237A), disclose a kind of flame-retarding adhesive of bimaleimide resin modified butadiene acrylonitrile rubber, but it is to reach flame retardant effect by adding brominated fire retardant.And Chinese patent CN 101323773B, the name of innovation and creation is called a kind of high temperature resistant halogen-free flame-retardant adhesive for flexible copper clad foil substrate and preparation method thereof, this patent is in toluene, to obtain performed polymer by the prepolymerized method of solution with aromatic amine and bismaleimides, then introduce phosphorous epoxy resin after chemical reaction or physics fusion obtains flexible PCB high temperature resistant halogen-free flame-retardant adhesive, but still there is the not good enough shortcoming of stripping strength in this flame-retarding adhesive.
Summary of the invention
Object of the present invention will overcome the deficiencies in the prior art exactly, the high temperature resistant halogen-free flame-retardant adhesive and the method for making thereof that provide a kind of flexible printed circuit board to use.This tackiness agent is bonding for Copper Foil and Kapton, and the flexible printed circuit board base material making has excellent flame retardant resistance, thermotolerance, resistance to tin-welding, chemical proofing, also has good stripping strength simultaneously, and industrial implementation is convenient.
Realizing technical scheme of the present invention is with polymaleimide resin and benzoxazine mixed with resin, add fire retarding epoxide resin, with after organic solvent dissolution, then add paracril, curing catalyst, resol, mineral filler chemical reaction method or physical mixed legal system to obtain the heat-resistant fireproof adhesive that flexible printed circuit board is used.
The high temperature resistant halogen-free flame-retardant adhesive that flexible printed circuit board is used, the formulation weight ratio of tackiness agent is:
Described fire retarding epoxide resin is phosphorous epoxy resin, and its phosphorus content is 2～5wt%,
Described paracril is liquid acrylonitrile butadiene rubber or carboxyl end of the liquid acrylonitrile-butadiene rubber,
Described resol is phenol type or double A type resol, and the polymerization degree is 2～5,
Described mineral filler is one or more in magnesium hydroxide, aluminium hydroxide, silicon-dioxide, zinc borate, Dawsonite Kompensan, and its particle diameter is less than 1 micron,
Described curing catalyst is the one in 2-ethyl imidazol(e), 2-ethyl-4-methylimidazole, 2-phenylimidazole or glyoxal ethyline,
Described solvent is one or more in dimethylbenzene, toluene, acetone, espeleton, methylethylketone, butylacetate, ethyl acetate.
The structural formula of described polymaleimide resin is:
Wherein R
1for-SO
2,-CH
2,-O-,
R
2, R
3for-CH
3,-H ,-C
2h
5;
The structural formula of described benzoxazine resin is:
Wherein R
1, R
2for-CH
3,-H;
R
3, R
4for-CH
3,-H ,-C
2h
5.
Be directly to add a proportion container by above-mentioned weight composition for the preparation method 1 of the heat-resistant fireproof adhesive of flexible printed circuit board, stir, obtain heat-resistant fireproof adhesive.
A kind of preparation method 2 of the heat-resistant fireproof adhesive for flexible printed circuit board adds fire retarding epoxide resin to polymaleimide resin, keep refluxing toluene temperature to continue reaction 20～60 minutes, after cooling, add benzoxazine resin, resol, paracril, curing catalyst, solvent and mineral filler, stir, obtain heat-resistant fireproof adhesive.
Adopt the prepared flame-retarding adhesive of above-mentioned composition and method for bonding Copper Foil and Kapton, through hot-press solidifying technique, make flexible printed circuit board base material, have the following advantages:
(1) stripping strength of prepared flexible printed circuit board base material is high, is greater than 2 kilograms per centimeter;
(2) do not adopt addition type organic fire-retardant, make the solvent resistance that flexible printed circuit board base material has had;
(3) flame retardant rating UL94V-0 grade;
(4) utilize benzoxazine resin and the polymaleimide resin of good heat resistance, improved the soldering resistance of flexible printed circuit board base material, not stratified after 300 DEG C, 60 seconds, non-foaming in tin bath;
(5) benzoxazine resin and the polymaleimide resin of employing good heat resistance, can improve high thermal resistance and resistance to tin-welding, can improve again cementability simultaneously.
Embodiments of the invention:
Embodiment 1. gets 17 grams of polymaleimide resins, 50 grams of 5.1 grams of aniline and toluene, in 500 milliliters of there-necked flasks with agitator (the industrial reactor that is amplified to 100 liters is produced), at refluxing toluene temperature, react 50 minutes, cooling rear discharging, with 16 grams of benzoxazine resins, 90 grams of phosphorous epoxy resins (phosphorus content is 2.6%), 20 grams of phenol type resol (polymerization degree is 2), 30 grams of liquid nbr carboxyl terminals, 0.3 gram of glyoxal ethyline, 30 grams of magnesium hydroxides, 300 grams of ethyl acetate are uniformly mixed, after filtration, make the heat-resistant fireproof adhesive for flexible printed circuit board.
This tackiness agent is evenly coated on the Kapton that 50 μ m are thick, superimposed with the alligatoring electrolytic copper foil that 35 μ m are thick, through 165 DEG C, 60 minutes, 30kg/cm
2hot-press solidifying technique after, make flexible printed circuit board base material.Make circuitous pattern by the testing standard of IPC-TM-650 and survey its stripping strength, resistance to tin-welding, electrical property and flame retardant resistance etc., the results are shown in Table 1.
Embodiment 2. gets 1 kilogram of polymaleimide resin, 2 kilograms of 250 grams of aniline and toluene, in 5000 milliliters of there-necked flasks with agitator, at refluxing toluene temperature, react 30 minutes, cooling rear discharging, with 1 kilogram of benzoxazine resin, 5 kilograms of phosphorous epoxy resins (phosphorus content is 3.5%), 0.3 kilogram of bisphenol A-type resol (polymerization degree is 3), 2 kilograms of liquid nbr carboxyl terminals, 2 kg of hydrogen magnesium oxide and 0.5 kilogram of silicon-dioxide, 5 grams of 2-ethyl-4-methylimidazoles, after 20 kilograms of espeletons and 20 kilograms of methylethylketones, be uniformly mixed, after filtration, make the heat-resistant fireproof adhesive for flexible printed circuit board.
This tackiness agent is evenly coated on the Kapton that 25 μ m are thick, superimposed with the alligatoring electrolytic copper foil that 50 μ m are thick, through 170 DEG C, 70 minutes, 40kg/cm
2hot-press solidifying technique after, make FPC base material.Standard testing sample method for making, with embodiment 1, the results are shown in Table 1.
Embodiment 3. gets 1.5 kilograms of polymaleimide resins, 2.5 kilograms of 360 grams of aniline and toluene, in 10000 milliliters of there-necked flasks with agitator, be heated to transparent after, at refluxing toluene temperature, react 40 minutes, cooling rear discharging, with 1.5 kilograms of benzoxazine resins, 8 kilograms of phosphorous epoxy resins (phosphorus content is 4.1%), 0.5 kilogram of cresols type resol (polymerization degree is 5), 3 kilograms of liquid nbr carboxyl terminals, 3 kg of hydrogen magnesium oxide and 1.5 kilograms of Dawsonite Kompensans, 1 gram of 2-phenylimidazole, after 30 kilograms of espeletons and 10 kilograms of dimethylbenzene, be uniformly mixed, after filtration, make the heat-resistant fireproof adhesive for flexible printed circuit board.
This tackiness agent is evenly coated on the Kapton that 75 μ m are thick, superimposed with the alligatoring electrolytic copper foil that 18 μ m are thick, through 170 DEG C, 50 minutes, 40kg/cm
2hot-press solidifying technique after, make FPC base material.Standard testing sample method for making, with embodiment 1, the results are shown in Table 1.
Embodiment 4. gets 2.5 kilograms of polymaleimide resins, 3.5 kilograms of 700 grams of aniline and toluene, in 50 liters of reactors with agitator, be heated to transparent after, in refluxing toluene thermotonus after 45 minutes, add 12 kilograms of phosphorous epoxy resins (phosphorus content is 2.6%), at refluxing toluene temperature, continue reaction 25 minutes, cooling rear discharging, with 2.5 kilograms of benzoxazine resins, 5 kilograms of phenol type resol (polymerization degree is 4), 3.5 kilograms of liquid acrylonitrile butadiene rubber, 3.5 kg of hydrogen magnesium oxide, 3 kilograms of zinc borates, 5 grams of 2-ethyl-4-methylimidazoles mix, add again 25 kilograms of butylacetates, 60 kilograms of acetone, after 30 kilograms of espeletons, be uniformly mixed, after filtration, make the heat-resistant fireproof adhesive for flexible printed circuit board.
This tackiness agent is evenly coated on the Kapton that 40 μ m are thick, superimposed with the rolled copper foil that 35 μ m are thick, through 170 DEG C, 45 minutes, 40kg/cm
2hot-press solidifying technique after, make FPC base material.Standard testing sample method for making, with embodiment 1, the results are shown in Table I.
Embodiment 5. gets 500 grams of polymaleimide resins, 650 grams of 100 grams of aniline and toluene, in 10 liters of three-necked bottles with agitator, be heated to transparent after, in refluxing toluene thermotonus after 35 minutes, add 7 kilograms of phosphorous epoxy resins (phosphorus content is 3.5%), at refluxing toluene temperature, continue reaction 20 minutes, cooling rear discharging, with 500 grams of benzoxazine resins, 2.5 kilograms of bisphenol A-type resol (polymerization degree is 4), 1.5 kilograms of carboxyl end of the liquid acrylonitrile-butadiene rubber, 2 kg of hydrogen magnesium oxide, 1.5 kg of hydrogen aluminum oxide, 3 grams of glyoxal ethylines mix, add again 8 kilograms of toluene, after 20 kilograms of acetone, mix, after filtration, make the heat-resistant fireproof adhesive for flexible printed circuit board.
This tackiness agent is evenly coated on the Kapton that 35 μ m are thick, superimposed with the alligatoring electrolytic copper foil that 18 μ m are thick, through 165 DEG C, 60 minutes, 30kg/cm
2hot-press solidifying technique after, make FPC base material.Standard testing sample method for making is with embodiment 1, and test result is in table 1.
Embodiment 6. gets 6 kilograms of polymaleimide resins, 35 kilograms of 1.5 kilograms of aniline and toluene, in 100 liters of reactors with agitator, be heated to transparent after, in refluxing toluene thermotonus after 35 minutes, add 27 kilograms of phosphorous epoxy resins (phosphorus content is 3%), at refluxing toluene temperature, continue reaction 30 minutes, cooling rear discharging, with 6 kilograms of benzoxazine resins, 3 kilograms of phenol type resol (polymerization degree is 4), add 7 kilograms of liquid acrylonitrile butadiene rubber, 3 kilograms of silicon-dioxide, 6 kg of hydrogen magnesium oxide, 300 grams of 2-ethyl-4-methylimidazoles, after adding again 50 kilograms of ethyl acetate and 55 kilograms of espeletons, mix, after filtration, make the heat-resistant fireproof adhesive for flexible printed circuit board.
This tackiness agent is evenly coated on the Kapton that 25 μ m are thick, superimposed with the rolled copper foil that 50 μ m are thick, through 175 DEG C, 50 minutes, 40kg/cm
2hot-press solidifying technique after, make FPC base material.Standard testing sample method for making, with embodiment 1, the results are shown in Table 1.
Embodiment 7. gets 1.5 kilograms of polymaleimide resins, 2.5 kilograms of 450 grams of aniline and toluene, in 10 liters of three-necked bottles with agitator, be heated to transparent after, in refluxing toluene thermotonus after 60 minutes, cooling rear discharging, with 1.5 kilograms of benzoxazine resins, 17 kilograms of phosphorous epoxy resins (phosphorus content is 3.7%), 2 kilograms of liquid nbr carboxyl terminals, 4 kilograms of cresols type resol (polymerization degree is 3), 2.5 kg of hydrogen aluminum oxide, 2 kg of hydrogen magnesium oxide, 0.5 kilogram of 2-ethyl imidazol(e), add again 55 kilograms of dimethylbenzene, after 50 kilograms of ethyl acetate, mix, after filtration, make the heat-resistant fireproof adhesive for flexible printed circuit board.
This tackiness agent is evenly coated on the Kapton that 35 μ m are thick, superimposed with the alligatoring electrolytic copper foil that 18 μ m are thick, through 165 DEG C, 60 minutes, 30kg/cm
2hot-press solidifying technique after, make FPC base material.Standard testing sample method for making, with embodiment 1, the results are shown in Table 1.
Comparative example 1. is got 5 kilograms of phosphorous epoxy resins (phosphorus content is 3.5%), 0.3 kilogram of bisphenol A-type resol (polymerization degree is 3), 2 kilograms of liquid nbr carboxyl terminals, 2 kg of hydrogen magnesium oxide and 0.5 kilogram of silicon-dioxide, 5 grams of 2-ethyl-4-methylimidazoles, after 20 kilograms of espeletons and 20 kilograms of methylethylketones, be uniformly mixed, after filtration, make the heat-resistant fireproof adhesive for flexible printed circuit board.
This tackiness agent is evenly coated on the Kapton that 25 μ m are thick, superimposed with the alligatoring electrolytic copper foil that 50 μ m are thick, through 170 DEG C, 70 minutes, 40kg/cm
2hot-press solidifying technique after, make FPC base material.Standard testing sample method for making, with embodiment 1, the results are shown in Table 1.
The result of table 1 shows, tackiness agent is bonding for FPC base material Copper Foil and Kapton, and the FPC base material of making has excellent flame retardant resistance, thermotolerance, and high stripping strength and good solvent resistance.
Comparative example 1 is compared with embodiment 2, phosphorous epoxy resin used in their formula, bisphenol A-type resol (polymerization degree is 3), paracril, mineral filler, solvent and curing catalyst are identical, benzoxazine resin and polymaleimide resin in embodiment 2, are introduced, and in comparative example 1, there is no benzoxazine resin and polymaleimide resin, the electrical property of prepared tackiness agent, flame retardant resistance and chemical proofing are more or less the same, but thermotolerance and stripping strength differ larger, embodiment 2 can test by the soldering resistance of 300 DEG C/60 seconds, bubbling and demixing phenomenon appears in 1 of comparative example in test process, fail by this testing standard.
Table 1
Claims (3)
1. for a high temperature resistant halogen-free flame-retardant adhesive for flexible printed circuit board, it is characterized in that: the component of tackiness agent is by weight:
Described fire retarding epoxide resin is phosphorous epoxy resin, and its phosphorus content is 2～5wt%,
Described paracril is liquid acrylonitrile butadiene rubber or carboxyl end of the liquid acrylonitrile-butadiene rubber,
Described resol is phenol type or double A type resol, and the polymerization degree is 2～5,
Described mineral filler is one or more in magnesium hydroxide, aluminium hydroxide, silicon-dioxide, zinc borate, Dawsonite Kompensan, and its particle diameter is less than 1 micron,
Described curing catalyst is the one in 2-ethyl imidazol(e), 2-ethyl-4-methylimidazole, 2-phenylimidazole or glyoxal ethyline,
Described Ji agent is one or more in dimethylbenzene, toluene, acetone, espeleton, methylethylketone, butylacetate, ethyl acetate,
The structural formula of described polymaleimide resin is:
Wherein R
1for-SO
2,-CH
2,-O-,
R
2, R
3for-CH
3,-H ,-C
2h
5;
The structural formula of described benzoxazine resin is:
Wherein R
1, R
2for CH
3, H;
R
3, R
4for-CH
3,-H ,-C
2h
5.
2. tackiness agent as claimed in claim 1, is characterized in that preparation method directly adds in proportion container by above-mentioned weight composition, stirs, and obtains heat-resistant fireproof adhesive.
3. tackiness agent as claimed in claim 1, it is characterized in that preparation method adds fire retarding epoxide resin by above-mentioned weight composition in polymaleimide resin, keep refluxing toluene temperature to continue reaction 20～60 minutes, after cooling, add benzoxazine resin, resol, paracril, curing catalyst, solvent and mineral filler, stir, obtain heat-resistant fireproof adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410108214.0A CN103834342B (en) | 2014-03-19 | 2014-03-19 | A kind of high temperature resistant halogen-free flame-retardant adhesive for flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410108214.0A CN103834342B (en) | 2014-03-19 | 2014-03-19 | A kind of high temperature resistant halogen-free flame-retardant adhesive for flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103834342A true CN103834342A (en) | 2014-06-04 |
| CN103834342B CN103834342B (en) | 2016-02-10 |
Family
ID=50798245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410108214.0A Active CN103834342B (en) | 2014-03-19 | 2014-03-19 | A kind of high temperature resistant halogen-free flame-retardant adhesive for flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103834342B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104263287A (en) * | 2014-09-19 | 2015-01-07 | 华烁科技股份有限公司 | High heat-resistant low-fluidity adhesive for rigid-flexible printed circuit board, adhesive film and preparation method of high heat-resistant low-fluidity adhesive |
| CN107722896A (en) * | 2017-10-25 | 2018-02-23 | 深圳市宝康电子材料有限公司 | A kind of modified epoxide resin adhesive |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1667073A (en) * | 2005-03-23 | 2005-09-14 | 中山大学 | Halogen-free flame resistant adhesive for preparing laminated sheet |
| CN101323773A (en) * | 2008-07-29 | 2008-12-17 | 武汉科技学院 | High temperature resistant halogen-free flame-retardant adhesive for flexible copper clad foil substrate and preparation thereof |
| WO2011068157A1 (en) * | 2009-12-02 | 2011-06-09 | 三井金属鉱業株式会社 | Resin composition for use in formation of bonding layer in multilayer flexible printed circuit board, resin varnish, resin-coated copper foil, manufacturing method for resin-coated copper foil for use in manufacturing of multilayer flexible printed circuit board, and multilayer flexible printed circuit board |
-
2014
- 2014-03-19 CN CN201410108214.0A patent/CN103834342B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1667073A (en) * | 2005-03-23 | 2005-09-14 | 中山大学 | Halogen-free flame resistant adhesive for preparing laminated sheet |
| CN101323773A (en) * | 2008-07-29 | 2008-12-17 | 武汉科技学院 | High temperature resistant halogen-free flame-retardant adhesive for flexible copper clad foil substrate and preparation thereof |
| WO2011068157A1 (en) * | 2009-12-02 | 2011-06-09 | 三井金属鉱業株式会社 | Resin composition for use in formation of bonding layer in multilayer flexible printed circuit board, resin varnish, resin-coated copper foil, manufacturing method for resin-coated copper foil for use in manufacturing of multilayer flexible printed circuit board, and multilayer flexible printed circuit board |
Non-Patent Citations (2)
| Title |
|---|
| 山东化工学院橡胶工艺教研组: "《丁腈橡胶加工和应用》", 31 July 1978, 石油化学工业出版社, article "丁腈橡胶加工和应用", pages: 113 * |
| 王青松等: ""双酚A型苯并二噁嗪树脂粘接性能研究"", 《中国胶粘剂》, vol. 20, no. 10, 31 October 2011 (2011-10-31), pages 10 - 13 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104263287A (en) * | 2014-09-19 | 2015-01-07 | 华烁科技股份有限公司 | High heat-resistant low-fluidity adhesive for rigid-flexible printed circuit board, adhesive film and preparation method of high heat-resistant low-fluidity adhesive |
| CN104263287B (en) * | 2014-09-19 | 2016-08-24 | 华烁科技股份有限公司 | A kind of rigid/flexible combined printed circuit board high heat-resisting low fluidity adhesive, glued membrane and preparation method thereof |
| CN107722896A (en) * | 2017-10-25 | 2018-02-23 | 深圳市宝康电子材料有限公司 | A kind of modified epoxide resin adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103834342B (en) | 2016-02-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101323773B (en) | High temperature resistant halogen-free flame-retardant adhesive for flexible copper clad foil substrate and preparation thereof | |
| TWI638001B (en) | Thermosetting resin composition and use thereof | |
| CN102226033B (en) | Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same | |
| CN102127290B (en) | Epoxy resin composition and flexible copper-clad plate prepared from same | |
| CN102585440B (en) | High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate | |
| CN102732029B (en) | Halogen-free resin composition, bonding sheet and copper-clad laminate | |
| TWI299352B (en) | ||
| CN103045143A (en) | Halogen-free epoxy adhesive and cover film prepared by using halogen-free epoxy adhesive | |
| CN104341766A (en) | Low-dielectric resin composition, as well as copper foil substrate and printed circuit board applying same | |
| WO2016049981A1 (en) | High-cti halogen-free epoxy resin composition for copper-clad plate and uses thereof | |
| TWI466891B (en) | A vinylated phosphazene compound, a resin composition includes the same, and a circuit board to which the resin composition is used | |
| TW201206977A (en) | Epoxy resin composition, and prepreg and printed wiring board using the same | |
| CN101165076A (en) | Anti-flaming phosphorus-containing epoxy resin, preparation method thereof and composition containing the same | |
| CN103074019A (en) | Halogen-free epoxy adhesive and flexible copper-clad plate prepared from same | |
| CN101831144B (en) | Halogen-free epoxy resin composition and high-flexibility flexible copper clad laminate prepared from same | |
| CN103435973A (en) | Halogen-free epoxy resin composition as well as prepreg and laminate made from same | |
| CN106661311A (en) | Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board | |
| CN103834342B (en) | A kind of high temperature resistant halogen-free flame-retardant adhesive for flexible printed circuit board | |
| JP4503239B2 (en) | Flame-retardant adhesive composition, flexible copper-clad laminate, coverlay and adhesive film | |
| JP2001348420A (en) | Epoxy resin composition, prepreg, and multilayer printed wiring board | |
| JP2002060720A (en) | Flame-retarded adhesive composition, flexible copper- clad laminate, cover lay and adhesive film | |
| CN102020828A (en) | Phosphorus-nitrogen compound intumescence active flame retardant modified epoxy resin and preparation method and application thereof | |
| JP2009527632A (en) | Halogen-free phosphorus / epoxy resin composition | |
| TWI382055B (en) | Thermosetting resin composition | |
| JPH1135795A (en) | Epoxy resin composition, epoxy resin prepreg and epoxy resin laminate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |