CN103825076B - Sheet type LTCC miniaturized 3dB directional coupler - Google Patents
Sheet type LTCC miniaturized 3dB directional coupler Download PDFInfo
- Publication number
- CN103825076B CN103825076B CN201410015382.5A CN201410015382A CN103825076B CN 103825076 B CN103825076 B CN 103825076B CN 201410015382 A CN201410015382 A CN 201410015382A CN 103825076 B CN103825076 B CN 103825076B
- Authority
- CN
- China
- Prior art keywords
- port
- strip line
- layer substrate
- coupling
- directional coupler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Abstract
The invention discloses a sheet type LTCC miniaturized 3dB directional coupler which is wide in frequency band, small in size, stable in temperature performance, small in insertion loss, balanced in amplitude and good in phase balance characteristics. The sheet type LTCC miniaturized 3dB directional coupler comprises four ports which are printed at the four corners on the bottom surface of a first bottom substrate and are provided with impedance input of 50 ohms, i.e., an input port, a straight-through port, a coupling port and an isolation port. The input port and the straight-through port are connected with a first coupling band-shaped wire on a second substrate through a first asymmetric band-shaped wire and a third asymmetric band-shaped wire which are arranged on the same substrate. The coupling port and the isolation port are connected with a second coupling band-shaped wire on a third substrate through a second asymmetric band-shaped wire and a fourth asymmetric band-shaped wire which are arranged on the other same substrate. The first coupling band-shaped wire and the second band-shaped wire represent rotary-shaped patterns and are coupled in a band-shaped mode at upper wide edges and lower wide edges. According to the invention, the coupling wires represent the rotary-shaped patterns so that quite large coupling wire length can be obtained on a limited substrate area, thus a quite wide frequency scope is obtained. The sheet type LTCC miniaturized 3dB directional coupler has the advantages of simple structure, high yield, good batch consistency and low cost.
Description
Technical field
The present invention relates to a kind of for the microwave device used by radio communication or radar transmit-receive signal, particularly relate to one
Chip LTCC (also known as LTCC Technology) miniature 3dB directional coupler.
Background technology
Microwave directive coupler is in radio frequency, microwave transmission system, for the power of transmission signal is allocated, is closed
Become, power samples and detection, is the weight of the devices such as balance amplifier, analog-and digital-phase shifter, analog-and digital-attenuator
Want parts.The microwave directive coupler of standard is that input signal power is divided in the frequency range set a certain proportion of two
Four port networks of individual output signal, when using this directional coupler inversely to transmit signal, then have the effect of power combing.
Chip LTCC miniature 3dB directional coupler is electronic unit important in microwave system, describes this component capabilities
The key technical indexes have: operating frequency range, input/output voltage standing-wave ratio, insertion loss, isolation, the degree of coupling, amplitude
Balance, phase equilibrium characteristic, temperature stability, volume, weight, reliability etc..Wherein, the degree of coupling characterizes the power of coupling.
Chip LTCC miniature 3dB directional coupler is four port elements, by rationally selecting coupled structure and size permissible
The performance indications making directional coupler reach required requirement.It is input port, straight-through end by the ports-settings of directional coupler
Mouth, coupling port and isolated port, represent with Pi, Pd, Pc and Ps respectively.Technical specification conventional in design and engineering has following
Several:
The degree of coupling: be defined as the ratio of input power Pi of input port and the output Pc of coupling port, be designated as Kc, often
Represent with dB, i.e.
Pc/Pi is referred to as the power coefficient of coup.The numerical value of Kc is the biggest, and the output of coupling port is the least, and the degree of coupling is the most weak,
During 3dB, the signal power of coupling port is the half of input port signal power.The coupling of the directional coupler of different applications
Right size also differs, and its version is the most different.
Directivity: be defined as the ratio of the output Pc of coupling port and the output Ps of isolated port, be designated as Kd, often
Represent with dB, i.e.
Ideally, each port mates the most completely, so the output Ps of isolated port is zero, Kd is infinite
Greatly.But actually due to each side such as design and techniques, isolated port always has certain power to export, in design
Kd is the bigger the better.
Isolation: isolation is also called directionality, is defined as the output Pi of input port and the output of isolated port
The ratio of power P s, is designated as Ks, conventional dB and represents, i.e.
Input vswr: be defined as port Pd, Pc, Ps when all connecing matched load, the standing-wave ratio of input port Pi.Due to coupling
Clutch is only mated good, so directional coupler standing wave when off-center frequency can be deteriorated at mid frequency.
Vmax is standing wave voltage amplitude maximum, and Vmin is standing wave voltage amplitude minima.
Insertion loss: be defined as the ratio of input signal power and two-way output sum
Here, insertion loss=coupling loss+loss.Coupling loss is typically sized as 3dB, therefore can be in the hope of transmission
Loss.
Directional coupler of the prior art due to use after traditional air bridges method for designing, first photoetching electroplating technology and
Thick film multilayer matrix technique, thus its there is narrow bandwidth, volume is big, cost is high and is not suitable for the shortcomings such as production in enormous quantities.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of bandwidth, volume is little, temperature performance is stable, insertion loss
Little, isolation is high, amplitude balance and the good chip LTCC miniature 3dB directional coupler of phase equilibrium characteristic.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is:
The chip LTCC miniature 3dB directional coupler of the present invention, including upper earth plate, lower earth plate, between two earth plates
Between multi layer substrate and be attached to the coupling strip line on substrate, the port of described directional coupler is four and prints respectively
Brush corner, bottom substrate bottom surface and have first port of adjacent distributions successively of 50 ohmages inputs, the second port, the
Three ports and the 4th port, the first port and the 3rd port are respectively by being arranged on multi layer substrate conductive channel and the position of correspondence
The first asymmetric strip line and the 3rd asymmetric strip line on the A layer substrate of top connect, and the first asymmetric strip line is through setting
The first conductive through hole in the middle part of A layer substrate and the first coupling in jatharapanvartanasana pattern being arranged under A layer substrate on B layer substrate
The one end closing strip line is connected, and the 3rd asymmetric strip line is through being located at the 3rd conductive through hole and described first of A layer substrate sidepiece
The other end of coupling strip line is connected；If the second port and the 4th port are respectively by being arranged on dried layer substrate the conduction of correspondence
Passage connects with the second asymmetric strip line being positioned at below B layer substrate on D layer substrate and the 4th asymmetric strip line, and the 4th is not
Symmetric band matrices line through be located on D layer substrate the 4th conductive through hole in the middle part of C layer substrate be arranged on C layer substrate in revolution
One end of second coupling strip line of shape pattern is connected, and the second asymmetric strip line is through being located at the second conduction of C layer substrate sidepiece
Through hole is connected with the other end of described second coupling strip line；Described A layer substrate, B layer substrate, C layer substrate and D layer substrate are by upper
It is sequentially stacked under to, the four of described first coupling strip line and the second coupling strip line a length of input signal mid frequency/
One wavelength, the therebetween coupling of broadside banding.
Described first coupling strip line and the second coupling strip line rectangular jatharapanvartanasana pattern.
Described first coupling strip line and the second coupling strip line are in oval jatharapanvartanasana pattern.
Described multi layer substrate is high-frequency low-consumption medium, and its relative dielectric constant is 4.8.
If described conductive channel is the via being arranged on dried layer substrate or multi layer substrate, the silver slurry poured in via
Post connects composition with silver slurry band, and the via on the most upper and lower two layers of substrate below D layer substrate shifts to install in vertical direction
And silver slurry band is set.
This directional coupler bandwidth is at 800MHz-1000MHz.
Vertical dimension between described upper and lower earth plate is 1.25mm, and the thickness × width of described asymmetric strip line is
0.01mm × 0.3mm, the vertical dimension between described first coupling strip line and the second coupling strip line is 0.039mm.
Described mid frequency is 900MHz.
Compared with prior art, the present invention uses high-frequency low-consumption dielectric substrate will connect each with chip LTCC production method
The signal transmssion line being made up of high conductivity material of port and coupling line are divided on different substrates, thus so that this
Bright excellent electrical property, temperature performance are stable and functional reliability is high；Coupling line of the present invention is jatharapanvartanasana pattern, and this makes it permissible
Limited chip area obtains bigger Coupled Line Length of Band, thus, this length is reasonably designed and is achieved with relatively
Wide operating frequency range, less insertion loss and higher isolation；Owing to coupling line uses the coupling of broadside banding, also make
Obtain the degree of coupling of the present invention height, amplitude balance and phase equilibrium characteristic good；Present configuration is simple, yield rate is high, concordance in batches
Well, cost is low earns.
Accompanying drawing explanation
Fig. 1 is the electrical schematic diagram of the present invention.
Fig. 2 is profile and the internal structure schematic diagram of the present invention.
Fig. 3 is the exploded perspective view of Fig. 2.
Fig. 4 is insertion loss and the degree of coupling test curve figure of the present invention.
Reference is as follows:
Multi layer substrate 1, A layer substrate A, B layer substrate B, C layer substrate C, D layer substrate D, conductive channel 2, via 21, silver slurry
Band 22, first conductive through hole the 3, second conductive through hole the 4, the 3rd conductive through hole the 5, the 4th conductive through hole the 6, first port P1, second
Port P2, the 3rd port P3, the 4th port P4, the first asymmetric strip line TL1, the second asymmetric strip line TL2, the 3rd the most right
Claim strip line TL3, the 4th asymmetric strip line TL4, the first coupling strip line CL1, the second coupling strip line CL2.
Detailed description of the invention
Below in conjunction with the accompanying drawings the present invention is described in further detail.
As shown in Figure 1, Figure 2 and Figure 3, if chip LTCC of the present invention miniature 3dB directional coupler is that dried layer is by the low damage of high frequency
The multi layer substrate 1 that lossy dielectric material makes, the asymmetric strip line being printed on setting substrate and coupling strip line and setting
Earth terminal in these directional coupler top and bottom is constituted.
Directional coupler of the present invention is four port devices, is respectively the first port being all printed with 50 ohmage inputs
P1, the second port P2, the 3rd port P3 and the 4th port P4, these four ports are the most sequentially separately positioned on bottom substrate 1 end
Four corners in face.
Described asymmetric strip line is divided into the first asymmetric strip line TL1, the second asymmetric strip line TL2, the 3rd the most right
Strip line TL3 and the 4th asymmetric strip line TL4, the first asymmetric strip line TL1 and the 3rd asymmetric strip line TL3 is claimed to arrange
In same level and be positioned at top A layer substrate A, the first asymmetric strip line TL1 is extended to place substrate center by corner, and
Three asymmetric strip line TL3 are extended to the sidepiece of place substrate by corner；Second asymmetric strip line TL2 and the 4th asymmetric band
Shape line TL4 is arranged at same level and is positioned at the D layer substrate D below A layer substrate A, and the 4th asymmetric strip line TL4 is by corner
Extending to place substrate center, the second asymmetric strip line TL2 is extended to the sidepiece of place substrate by corner.
Described coupling strip line is divided into rectangular jatharapanvartanasana or the first coupling strip line of oval jatharapanvartanasana conductive layer pattern
CL1 and the second coupling strip line CL2, the first coupling strip line CL1 are arranged in the B layer substrate B under A layer substrate A, the second coupling
Close strip line CL2 to be arranged in the C layer substrate C under B layer substrate B.
Described A layer substrate A, B layer substrate B, C layer substrate C and D layer substrate D is from top to bottom sequentially stacked, described first coupling
Coupling for broadside banding between strip line CL1 and the second coupling strip line CL2, its length can be according to input signal mid frequency
Change, usually 1/4th of this signal wavelength.
First port P1 is by the conductive channel 2 being arranged on multi layer substrate 1 and the head end of the first asymmetric strip line TL1
Connecting, the tail end of the first asymmetric strip line TL1 couples with first by being arranged at the first conductive through hole 3 of A layer substrate A central authorities
The top of strip line CL1 connects；3rd port P3 is by the conductive channel 2 being arranged on multi layer substrate 1 and the 3rd asymmetric band
Shape line TL3 tail end connects, and the head end of the 3rd asymmetric strip line TL3 is by being arranged at the 3rd conductive through hole of A layer substrate A side
5 and first coupling strip line CL1 joining distal ends (head and the tail and the whole story with by the first port P1 input signal pass order for join
According to, lower same).
If the second port P2 is by the conductive channel 2 being arranged on dried layer substrate and the tail of the second asymmetric strip line TL2
End connects, and the head end of the second asymmetric strip line TL2 is by being arranged at the second conductive through hole 4 and the second coupling of C layer substrate C side
Close the joining distal ends of strip line CL2；If the 4th port P4 is asymmetric with the 4th by the conductive channel 2 being arranged on dried layer substrate
Strip line TL4 tail end connects, and the head end of the 4th asymmetric strip line TL4 is logical by the 4th conduction being arranged at C layer substrate C central authorities
Hole 6 connects with the head end of the second coupling strip line CL2.
Described conductive channel 2 is to electrically connect and be positioned at several vias 21 above corresponding ports and silver slurry with each port
Band 22 composition, via 21 is arranged on related port to A layer substrate A or D layer substrate D, the most upper and lower the two of D layer below substrate D
Via 21 on layer substrate 1 shifts to install in vertical direction, therebetween by silver slurry band 22 electrical connection.Via 21 irrigates
Silver slurry post.
Described via 21 shifts to install the quality that can be effectively improved conductive layer, it is to avoid when using longer via 21, go out
Existing conductive layer cracking phenomena, thus can ensure that the reliable of its electrical property and stability.
When microwave signal is by the first port P1 input, it is input port that each port is respectively as follows: the first port P1, the 3rd end
Mouth P3 is straight-through port, and the 4th port P4 is coupling port, and the second port P2 is isolated port；When microwave signal is reversely by second
During port P2 input, it is input port that the most each port is respectively as follows: the second port P2, and the 4th port P4 is straight-through port, the 3rd end
Mouth P3 is coupling port, and the first port P1 is isolated port；In like manner, when microwave signal is inputted by different ports, each port
Purposes will make corresponding changes.
The operation principle (with the first port P1 as signal input part) of the present invention:
The broadband microwave signal of input is through the first port P1, the first asymmetric strip line TL1 to first coupling strip line
CL1, here energy couples, and the part in this signal input power reaches by the 3rd asymmetric strip line TL3
Three port P3 outputs；Another part in this signal input power is coupled to the second coupling strip line CL2 asymmetric through the 4th
Strip line TL4 and the second asymmetric strip line TL2 is respectively transmitted to the 4th port P4 and the second port P2 output.
Above-mentioned identical by signal and the first port P1 input signal phase place of the 3rd port P3 output, so the 3rd port P3
There is output, i.e. form straight-through port；In coupled signal, a part arrives the 4th port P4 by the 4th asymmetric strip line TL4,
Carry out homophase addition, i.e. form coupling port；In coupled signal, another part arrives second by the second asymmetric strip line TL2
Port P2, signal is reversely offset, and i.e. constitutes isolated port, the 4th port P4 and the second port P2 phase 90 degree.
Chip LTCC of the present invention miniature 3dB directional coupler, owing to being to use multilamellar LTCC technique to realize, is
Low-temperature co-burning ceramic material and metallic pattern sinter at a temperature of about 900 DEG C and form, thus have extreme high reliability and
Temperature stability, use upper and lower be set with structure Coupling strip lines configuration and outer surface metallic shield to be grounded due to structure and
Encapsulation, so that volume and weight significantly reduces.
The main performance result of chip LTCC of the present invention miniature 3dB directional coupler embodiment sees Fig. 4, figure can see
Going out in 800MHz-1000MHz frequency range, mid frequency is 900MHz, and insertion loss representative value is :-0.21～-
0.28dB, degree of coupling representative value is :-3.5～-2.8dB, and isolation representative value is :-22.9～-13.9dB.Component size is only
For 6.35mm × 5.08mm × 1.5mm, in this frequency range like product, size is the least, little for respective wireless electronic system
Typeization plays a significant role with raising system reliability with effectively alleviating system weight.
As shown in Figure 4, frequency be 800MHz: insertion loss (A..IL) be-0.213dB, the degree of coupling (A..Couple)
For-3.479dB；Frequency be 1.0GHz: insertion loss (A..IL) be-0.282dB, the degree of coupling (A..Couple) is-
2.842dB。
The present invention relates to a kind of chip LTCC miniature 3dB directional coupler, use multilamellar high-frequency low-consumption dielectric stack
LTCC Technology realizes, and it has working band width, size is little, reliability is high, excellent electrical property, and straight-through and coupled end
Mouth wideband phase orthogonality is good, and straight-through little with coupling port amplitude error, temperature stability is good, the letter of perfect heat-dissipating, structure
Single, yield rate high, batch production electrical performance indexes concordance is good, low cost and the advantage such as easy to install, can be widely used for
In the communication of corresponding band and radar and wireless system.
Asymmetric strip line in the present invention mainly plays the effect of 50 ohms impedance match, simultaneously by coupling strip line
Coupled signal reach output port, by by the vertical dimension of LTCC properties of materials and strip line, metal layer thickness, length
After parameter optimization, can preferably mate with 50 ohmages, thus obtain the performances such as preferable Insertion Loss.Chip of the present invention
Four ports of LTCC miniature 3dB directional coupler are all 50 ohmages, and the relative dielectric constant further according to LTCC material is
4.8, the result after optimization be up and down between vertical dimension b be 1.25mm, metal layer thickness t of strip line is
0.01mm, the width w of asymmetric strip line is 0.3mm, and vertical dimension S between coupling strip line is 0.039mm.
Wherein, coupling line strip line closes on configuration in the way of mutual electromagnetic coupling, is respectively provided with the length of 1/4 wavelength
Article two, coupling line conductor.The mid frequency of chip LTCC of the present invention miniature 3dB directional coupler is 900MHz, further according to LTCC material
Material relative dielectric constant be 4.8,1/4 wavelength be 58mm, be the length of coupling strip line.
Asymmetric strip line and coupling line strip line are the cores constituting chip LTCC of the present invention miniature 3dB directional coupler
Part, the feature of its structure makes bonder have following remarkable advantage: (1) work strip wide (2) reliability is high；(3) electrical property
Excellent；(4) perfect heat-dissipating (5) electrical property temperature stability is high；(6) circuit realiration simple in construction；(7) electrical property consistency
Good, can realize producing in enormous quantities；(8) low cost；(9) easy to install and use, can install with full-automatic chip mounter and welding.
Useful the having the technical effect that of the present invention
1. use LTCC height Q high-frequency ceramic material and high conductivity silver slurry, have less dielectric loss and conductor losses, pole
Big reduces product size.
2. using LTCC technique to make, homogeneity of product is high, owing to being the parallel process using printing, can realize simultaneously
Produce in enormous quantities, be greatly improved than home built production efficiency.
3. by regulating upper and lower be set with structure Coupling strip line and the relevant parameter of asymmetric strip line, it is possible to achieve different
The various sizes of bonder of frequency customizes, and designs the most flexible.
Claims (7)
1. a chip LTCC miniature 3dB directional coupler, including upper earth plate, lower earth plate, between two earth plates
Multi layer substrate (1) and be attached to the coupling strip line on substrate, it is characterised in that: the port of described directional coupler is four
Individual be respectively printed at corner, bottom substrate bottom surface and have 50 ohmages input adjacent distributions successively the first port (P1),
Second port (P2), the 3rd port (P3) and the 4th port (P4), the first port (P1) and the 3rd port (P3) are respectively by setting
Put at the upper corresponding conductive channel (2) of multi layer substrate (1) and the first asymmetric strip line being positioned on top A layer substrate (A)
(TL1) connecting with the 3rd asymmetric strip line (TL3), the first asymmetric strip line (TL1) is through being located at A layer substrate (A) middle part
First conductive through hole (3) couples banding with in jatharapanvartanasana pattern first be arranged under A layer substrate (A) on B layer substrate (B)
One end of line (CL1) is connected, and the 3rd asymmetric strip line (TL3) is through being located at the 3rd conductive through hole (5) of A layer substrate (A) sidepiece
It is connected with the other end of described first coupling strip line (CL1)；Second port (P2) and the 4th port (P4) are respectively by arranging
If conductive channel (2) corresponding on dried layer substrate and the second asymmetric band being positioned on B layer substrate (B) lower section D layer substrate (D)
Shape line (TL2) and the 4th asymmetric strip line (TL4) connect, the 4th asymmetric strip line (TL4) through be located at D layer substrate (D) it
4th conductive through hole (6) at upper C layer substrate (C) middle part couples with in jatharapanvartanasana pattern second be arranged on C layer substrate (C)
One end of strip line (CL2) is connected, and the second asymmetric strip line (TL2) is through being located at the second conductive through hole of C layer substrate (C) sidepiece
(4) other end with described second coupling strip line (CL2) is connected；Described A layer substrate (A), B layer substrate (B), C layer substrate (C)
From top to bottom it is sequentially stacked with D layer substrate (D), described first coupling strip line (CL1) and the second coupling strip line (CL2) length
For the quarter-wave of input signal mid frequency, the therebetween coupling of broadside banding；
Described conductive channel (2) is if for the via (21) being arranged on dried layer substrate or multi layer substrate (1), pouring into via
(21) the silver slurry post in connects composition with silver slurry band (22), the via on D layer substrate (D) the most upper and lower two layers of substrate below
(21) shift to install in vertical direction and silver slurry band (22) is set.
Chip LTCC the most according to claim 1 miniature 3dB directional coupler, it is characterised in that: described first strap
Shape line (CL1) and the second coupling strip line (CL2) at right angles jatharapanvartanasana pattern.
Chip LTCC the most according to claim 1 miniature 3dB directional coupler, it is characterised in that: described first strap
Shape line (CL1) and the second coupling strip line (CL2) are in oval jatharapanvartanasana pattern.
Chip LTCC the most according to claim 1 miniature 3dB directional coupler, it is characterised in that: described multi layer substrate (1)
For high-frequency low-consumption medium, its relative dielectric constant is 4.8.
5. according to the chip LTCC miniature 3dB directional coupler according to any one of claim 14, it is characterised in that: this is fixed
To bonder bandwidth at 800MHz-1000MHz.
Chip LTCC the most according to claim 5 miniature 3dB directional coupler, it is characterised in that: described upper and lower earth plate
Between vertical dimension be 1.25mm, the thickness × width of described asymmetric strip line is 0.01mm × 0.3mm, described first coupling
The vertical dimension closed between strip line (CL1) and the second coupling strip line (CL2) is 0.039mm.
Chip LTCC the most according to claim 6 miniature 3dB directional coupler, it is characterised in that: described mid frequency is
900MHz。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410015382.5A CN103825076B (en) | 2014-01-14 | 2014-01-14 | Sheet type LTCC miniaturized 3dB directional coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410015382.5A CN103825076B (en) | 2014-01-14 | 2014-01-14 | Sheet type LTCC miniaturized 3dB directional coupler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103825076A CN103825076A (en) | 2014-05-28 |
| CN103825076B true CN103825076B (en) | 2017-01-11 |
Family
ID=50760012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410015382.5A Active CN103825076B (en) | 2014-01-14 | 2014-01-14 | Sheet type LTCC miniaturized 3dB directional coupler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103825076B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6210029B2 (en) * | 2014-07-23 | 2017-10-11 | 株式会社村田製作所 | Directional coupler |
| CN104681908A (en) * | 2015-03-18 | 2015-06-03 | 深圳市麦捷微电子科技股份有限公司 | Ultra-miniature multilayer chip balun |
| JP6358297B2 (en) * | 2016-08-23 | 2018-07-18 | Tdk株式会社 | Directional coupler and wireless communication apparatus using the same |
| CN107069171A (en) * | 2017-06-07 | 2017-08-18 | 孙超 | A kind of miniature ultra wide band 3dB directional couplers |
| CN113871136B (en) * | 2021-08-24 | 2022-07-26 | 锐石创芯(深圳)科技股份有限公司 | Coupler and radio frequency front end module |
| CN114122664B (en) * | 2021-11-19 | 2022-10-11 | 中国兵器工业集团第二一四研究所苏州研发中心 | Manufacturing method of LTCC-based coupling 3dB bridge |
| CN114497962A (en) * | 2021-12-22 | 2022-05-13 | 中国电子科技集团公司第二十九研究所 | Design method of broadband impedance matching directional coupler |
| WO2023178611A1 (en) * | 2022-03-24 | 2023-09-28 | 清华大学 | Microwave power distribution network and method based on phase-frequency hybrid control |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5841328A (en) * | 1994-05-19 | 1998-11-24 | Tdk Corporation | Directional coupler |
| CN101621150A (en) * | 2009-08-11 | 2010-01-06 | 南京理工大学 | P wave band third octave miniature directional coupler |
| JP2012049696A (en) * | 2010-08-25 | 2012-03-08 | Murata Mfg Co Ltd | Electronic component |
| CN102842425A (en) * | 2007-10-23 | 2012-12-26 | 株式会社村田制作所 | Laminated electronic component and method for manufacturing the same |
-
2014
- 2014-01-14 CN CN201410015382.5A patent/CN103825076B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5841328A (en) * | 1994-05-19 | 1998-11-24 | Tdk Corporation | Directional coupler |
| CN102842425A (en) * | 2007-10-23 | 2012-12-26 | 株式会社村田制作所 | Laminated electronic component and method for manufacturing the same |
| CN101621150A (en) * | 2009-08-11 | 2010-01-06 | 南京理工大学 | P wave band third octave miniature directional coupler |
| JP2012049696A (en) * | 2010-08-25 | 2012-03-08 | Murata Mfg Co Ltd | Electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103825076A (en) | 2014-05-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103825076B (en) | Sheet type LTCC miniaturized 3dB directional coupler | |
| US5742210A (en) | Narrow-band overcoupled directional coupler in multilayer package | |
| TWI376838B (en) | Single-layer metallization and via-less metamaterial structures | |
| TW538556B (en) | Multilayered tapered transmission line, device and method for making the same | |
| CN207559072U (en) | A kind of 2 × 3 wideband butler matrix plates, butler matrix and multibeam antenna | |
| JP6280985B2 (en) | Compact wireless directional coupler for cellular applications | |
| CN108832291A (en) | A kind of substrate integrated waveguide filtering antenna | |
| CN102544675A (en) | Double-frequency unequal power divider | |
| CN103326093A (en) | Novel cross coupling substrate integrated waveguide band-pass filter | |
| CN108598654A (en) | A kind of coupler integrating gap waveguide based on substrate | |
| CN107946752A (en) | A kind of substrate integrates gap waveguide electromagnetic dipole antenna | |
| CN105990630A (en) | High-selectivity Balun band pass filter based on substrate integrated waveguide | |
| CN107230817A (en) | The wide wall micropore couplers of the dB of half module substrate integrated wave guide 3 | |
| CN105789802A (en) | Ultra-wideband Balun based on new interconnection structure | |
| CN109802213A (en) | A kind of 90 degree of tri- port 3dB plane electric bridge | |
| CN108682923A (en) | The faces E wave band H microprobe type waveguide microstrip switching device based on LTCC | |
| CN110247145B (en) | Bandwidth-adjustable broadband filtering balun with in-band good matching and isolation | |
| CN206076497U (en) | Same polarization micro-strip duplexed antenna array | |
| CN107516753A (en) | A kind of wave filter based on the incomplete mould of substrate integration wave-guide | |
| CN206340652U (en) | Radio frequency vertical transition structure comprising ceramic micro-strip | |
| CN109216845A (en) | A kind of substrate integration groove gap waveguide structure | |
| CN208767444U (en) | A kind of three-passband filter based on hybrid substrate integrated wave guide structure | |
| CN104241753A (en) | LTCC filtering balun adopting two inverse filtering circuits | |
| KR102163069B1 (en) | Coupler | |
| CN109524755A (en) | A kind of millimere-wave band microminiature branch line coupler |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |