CN103822817A - Pure nickel chemical polishing etching solution and application method - Google Patents
Pure nickel chemical polishing etching solution and application method Download PDFInfo
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- CN103822817A CN103822817A CN201410071591.1A CN201410071591A CN103822817A CN 103822817 A CN103822817 A CN 103822817A CN 201410071591 A CN201410071591 A CN 201410071591A CN 103822817 A CN103822817 A CN 103822817A
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Abstract
A pure nickel chemical polishing etching solution is disclosed. The formula of the etching solution comprises, by volume, 50-90 parts of nitric acid, 10-40 parts of hydrochloric acid, 5-30 parts of phosphoric acid and 5-40 parts of acetic acid. In comparison with an etching solution in the prior art, the pure nickel chemical polishing etching solution provided by the invention can be used to make crystalline phase of pure nickel easier to distinguish, and it is more beneficial to evaluate quality of a pure nickel product. In addition, by the use of the polishing etching solution, a pollution layer will not be formed on the surface of a sample, and the sample will not be over-etched. Thus, insufficient etching and over-etching are both avoided. Meanwhile, an application method of the polishing etching solution is simple and has high operability. The raw materials of the pure nickel chemical polishing etching solution are simple and easily available. The pure nickel chemical polishing etching solution has a simple operation method, has low degree of dependence on equipment and facilities, has obvious application efficacy, and has a certain generalization performance.
Description
technical field
The present invention relates to metal metallographic technical field of measurement and test, be specifically related to a kind of chemical polishing etching solution of pure nickel metallographic specimen polishing use and the using method of this chemical polishing etching solution thereof.
background technology
Metal metallographic is the important content of metallography research, is also important reference parameter in producing, and metal metallographic mainly comprises tissue topography, the grain size level etc. of microcosmic, organizes grain size size to affect organization mechanics performance and plasticity, and grain size is less, plasticity preference; There is the defects such as slag inclusion in organization internal, metallicity is bad.So often need to propose metallographic testing requirement to pure nickel in producing.
The ununified standard of pure nickel brilliant polish at present, conventional etching solution composition: HNO
3+ HCl+H
2sO
4+ copper sulphate saturated solution, sample is after mechanical buffing, with the cotton balls wiping specimen surface that is moistened with etching solution.First adopt this polish attack liquid to form and to pollute at sample surfaces, simultaneously this corrosive liquid is acid strong, corrosive effect is difficult for grasping, often there is corroding not in place and excessive corrosion situation generation, and when operation, there is certain technical difficulty, cause pure nickel chemical polishing etch to be difficult to there is generalization.
summary of the invention
Technical matters to be solved by this invention is to provide a kind of chemical polishing etching solution for the polishing of pure nickel metallographic specimen for shortcoming of the prior art.
Another technical matters that the present invention solves is to provide the using method of above-mentioned chemical polishing etching solution.
Adopt following technical scheme for solving technical matters of the present invention:
A kind of pure nickel chemical polishing etching solution, etching solution formula parts by volume is: nitric acid 50-90 part, hydrochloric acid 10-40 part, phosphoric acid 5-30 part, acetic acid 5-40 part, the massfraction of nitric acid used is 65-70%, the massfraction of hydrochloric acid is 36-38%, the massfraction of phosphoric acid is 85-90%, and the massfraction of acetic acid is 36-37%.
A kind of pure nickel chemical polishing etching solution, etching solution formula parts by volume is: 55 parts, nitric acid, 20 parts of hydrochloric acid, 20 parts of phosphoric acid, 5 parts of acetic acid, and the massfraction of nitric acid used is 65-70%, the massfraction of hydrochloric acid is 36-38%, the massfraction of phosphoric acid is 85-90%, and the massfraction of acetic acid is 36-37%.
A using method for pure nickel chemical polishing etching solution, the steps include:
(1) adopt machining apparatus removal surface black oxide skin and obvious rough road to produce a certain size smooth pure nickel sample;
(2) with sand papering pure nickel sample surfaces, make pure nickel sample surfaces smooth;
(3) get above-mentioned etching solution and carry out polish attack, can obtain chemical polishing etch sample, can be used for microscopic examination, wherein the polish attack time is: 5-20min, etch temperature is: 20-60 ℃.
In described step (2), press order number dry grinding successively from small to large with 100,300,500,800,1200 order waterproof abrasive papers successively, using 1200 order waterproof abrasive papers as final polishing.
Pure nickel chemical polishing etching solution provided by the present invention is compared with etching solution in prior art, can make the crystalline phase of pure nickel more easily distinguish, more be conducive to evaluate the quality of pure nickel product, and adopt this polish attack liquid can not form and pollute at sample surfaces, can excessive corrosion sample, avoided occurring corroding not in place and excessive corrosion situation generation, the using method of this polish attack liquid is simple simultaneously, and operability is more intense.Raw material of the present invention is simple and easy to get, and method of operating is easy, and low to the dependency degree of installations and facilities, result of use is obvious, has certain generalization.
Accompanying drawing explanation
Fig. 1 is pure nickel sample metallograph after embodiment 1 chemical polishing etching solution etch;
Fig. 2 is pure nickel sample metallograph after embodiment 2 chemical polishing etching solution etches;
Fig. 3 is pure nickel sample metallograph after embodiment 3 chemical polishing etching solution etches;
Fig. 4 is pure nickel sample metallograph after embodiment 4 chemical polishing etching solution etches;
Fig. 5 is pure nickel sample metallograph after embodiment 5 chemical polishing etching solution etches.
embodiment
embodiment 1
A kind of pure nickel chemical polishing etching solution, the hydrochloric acid that the nitric acid that is 65% by 90ml massfraction, 10ml massfraction are 38%, the phosphoric acid that 20ml massfraction is 90%, the acetic acid that 20ml massfraction is 36% form.
A using method for pure nickel chemical polishing etching solution, the steps include:
(1) adopt machining apparatus removal surface black oxide skin and obvious rough road to produce a certain size smooth pure nickel sample;
(2) press order number dry grinding successively from small to large with 100,300,500,800,1200 order waterproof abrasive papers successively, using 1200 order waterproof abrasive papers as final polishing pure nickel sample surfaces, make pure nickel sample surfaces smooth;
(3) get above-mentioned etching solution and carry out polish attack, can obtain chemical polishing etch sample, can be used for microscopic examination, wherein the polish attack time is: 10min, and etch temperature is: 50 ℃;
(4) after the etch of the present embodiment chemical polishing etching solution pure nickel sample metallographic result as shown in Figure 1, crystal grain is high-visible, there is no obvious cut.
embodiment 2
A kind of pure nickel chemical polishing etching solution, the hydrochloric acid that the nitric acid that is 65% by 90ml massfraction, 30ml massfraction are 38%, the phosphoric acid that 10ml massfraction is 85%, the acetic acid that 30ml massfraction is 36% form.
A using method for pure nickel chemical polishing etching solution, the steps include:
(1) adopt machining apparatus removal surface black oxide skin and obvious rough road to produce a certain size smooth pure nickel sample;
(2) press order number dry grinding successively from small to large with 100,300,500,800,1200 order waterproof abrasive papers successively, using 1200 order waterproof abrasive papers as final polishing pure nickel sample surfaces, make pure nickel sample surfaces smooth;
(3) get above-mentioned etching solution and carry out polish attack, can obtain chemical polishing etch sample, can be used for microscopic examination, wherein the polish attack time is: 20min, and etch temperature is: 30 ℃;
(4) after the etch of the present embodiment chemical polishing etching solution pure nickel sample metallographic result as shown in Figure 2, crystal grain is high-visible, there is no obvious cut.
embodiment 3
A kind of pure nickel chemical polishing etching solution, the hydrochloric acid that the nitric acid that is 70% by 50ml massfraction, 30ml massfraction are 36%, the phosphoric acid that 5ml massfraction is 87%, the acetic acid that 20ml massfraction is 37% form.
A using method for pure nickel chemical polishing etching solution, the steps include:
(1) adopt machining apparatus removal surface black oxide skin and obvious rough road to produce a certain size smooth pure nickel sample;
(2) press order number dry grinding successively from small to large with 100,300,500,800,1200 order waterproof abrasive papers successively, using 1200 order waterproof abrasive papers as final polishing pure nickel sample surfaces, make pure nickel sample surfaces smooth;
(3) get above-mentioned etching solution and carry out polish attack, can obtain chemical polishing etch sample, can be used for microscopic examination, wherein the polish attack time is: 5min, and etch temperature is: 20 ℃;
(4) after the etch of the present embodiment chemical polishing etching solution pure nickel sample metallographic result as shown in Figure 3, crystal grain is high-visible, there is no obvious cut.
embodiment 4
A kind of pure nickel chemical polishing etching solution, the hydrochloric acid that the nitric acid that is 67% by 90ml massfraction, 40ml massfraction are 38%, the phosphoric acid that 30ml massfraction is 90%, the acetic acid that 40ml massfraction is 36% form.
A using method for pure nickel chemical polishing etching solution, the steps include:
(1) adopt machining apparatus removal surface black oxide skin and obvious rough road to produce a certain size smooth pure nickel sample;
(2) press order number dry grinding successively from small to large with 100,300,500,800,1200 order waterproof abrasive papers successively, using 1200 order waterproof abrasive papers as final polishing pure nickel sample surfaces, make pure nickel sample surfaces smooth;
(3) get above-mentioned etching solution and carry out polish attack, can obtain chemical polishing etch sample, can be used for microscopic examination, wherein the polish attack time is: 15min, and etch temperature is: 60 ℃;
(4) after the etch of the present embodiment chemical polishing etching solution pure nickel sample metallographic result as shown in Figure 4, crystal grain is high-visible, there is no obvious cut.
embodiment 5
A kind of pure nickel chemical polishing etching solution, the hydrochloric acid that the nitric acid that is 67% by 55ml massfraction, 20ml massfraction are 38%, the phosphoric acid that 20ml massfraction is 90%, the acetic acid that 5ml massfraction is 36% form.
A using method for pure nickel chemical polishing etching solution, the steps include:
(1) adopt machining apparatus removal surface black oxide skin and obvious rough road to produce a certain size smooth pure nickel sample;
(2) press order number dry grinding successively from small to large with 100,300,500,800,1200 order waterproof abrasive papers successively, using 1200 order waterproof abrasive papers as final polishing pure nickel sample surfaces, make pure nickel sample surfaces smooth;
(3) get above-mentioned etching solution and carry out polish attack, can obtain chemical polishing etch sample, can be used for microscopic examination, wherein the polish attack time is: 15min, and etch temperature is: 60 ℃;
(4) after the etch of the present embodiment chemical polishing etching solution pure nickel sample metallographic result as shown in Figure 4, crystal grain is high-visible, there is no obvious cut.
The present invention open and a kind of pure nickel chemical polishing etching solution and the using method thereof that propose, those skilled in the art can be by using for reference content herein, and the links such as appropriate change technique realize.Product of the present invention and method are described by preferred embodiment, person skilled obviously can, not departing from content of the present invention, spirit and scope method as herein described and product is changed or suitably change combination, realize the technology of the present invention.Special needs to be pointed out is, all similar replacements and change apparent to those skilled in the artly, they are deemed to be included in spirit of the present invention, scope and content.
Claims (4)
1. a pure nickel chemical polishing etching solution, is characterized in that described etching solution formula parts by volume is: nitric acid 50-90 part, hydrochloric acid 10-40 part, phosphoric acid 5-30 part, acetic acid 5-40 part.
2. a kind of pure nickel chemical polishing etching solution according to claim 1, is characterized in that described etching solution formula parts by volume is: 55 parts, nitric acid, 20 parts of hydrochloric acid, 20 parts of phosphoric acid, 5 parts of acetic acid.
3. the using method of a kind of pure nickel chemical polishing etching solution according to claim 1 and 2, is characterized in that step is:
(1) adopt machining apparatus removal surface black oxide skin and obvious rough road to produce a certain size smooth pure nickel sample;
(2) with sand papering pure nickel sample surfaces, make pure nickel sample surfaces smooth;
(3) get above-mentioned etching solution and carry out polish attack, can obtain chemical polishing etch sample, can be used for microscopic examination, wherein the polish attack time is: 5-20min, etch temperature is: 20-60 ℃.
4. the using method of a kind of pure nickel chemical polishing etching solution according to claim 3, it is characterized in that: in described step (2), dry grind successively from small to large by order number with 100,300,500,800,1200 order waterproof abrasive papers successively, using 1200 order waterproof abrasive papers as final polishing.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104593775A (en) * | 2015-02-10 | 2015-05-06 | 中国华能集团公司 | Metallographical corrosive for observing delta-Ni3Nb phase in ferronickel-based superalloy structure and using method of metallographical corrosive |
| CN113295503A (en) * | 2021-05-28 | 2021-08-24 | 金川镍钴研究设计院有限责任公司 | Chemical polishing etching solution for MBA-2 copper alloy |
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| US2145518A (en) * | 1935-04-06 | 1939-01-31 | Elektrokemiska Ab | Method of brightening nickel surfaces |
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2014
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| US2145518A (en) * | 1935-04-06 | 1939-01-31 | Elektrokemiska Ab | Method of brightening nickel surfaces |
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| CN101532928A (en) * | 2009-03-17 | 2009-09-16 | 北京科技大学 | Method for preparing electroformed nickel metallographic sample and displaying constitution |
| CN101597760A (en) * | 2009-06-26 | 2009-12-09 | 上海工程技术大学 | A kind of etching reagent with Ni-based braze material as solder |
| CN101655426A (en) * | 2009-09-16 | 2010-02-24 | 北京科技大学 | Electrochemical metallographic etching method universal for nickel-based alloys |
| CN102042985A (en) * | 2010-10-22 | 2011-05-04 | 西部金属材料股份有限公司 | Observation method of Ti-Ni alloy metallographic structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104593775A (en) * | 2015-02-10 | 2015-05-06 | 中国华能集团公司 | Metallographical corrosive for observing delta-Ni3Nb phase in ferronickel-based superalloy structure and using method of metallographical corrosive |
| CN113295503A (en) * | 2021-05-28 | 2021-08-24 | 金川镍钴研究设计院有限责任公司 | Chemical polishing etching solution for MBA-2 copper alloy |
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