CN103814436B - For the method manufacturing the composite construction separated by stripping - Google Patents
For the method manufacturing the composite construction separated by stripping Download PDFInfo
- Publication number
- CN103814436B CN103814436B CN201280045877.1A CN201280045877A CN103814436B CN 103814436 B CN103814436 B CN 103814436B CN 201280045877 A CN201280045877 A CN 201280045877A CN 103814436 B CN103814436 B CN 103814436B
- Authority
- CN
- China
- Prior art keywords
- layer
- supporting substrates
- stratum disjunctum
- reflecting layer
- interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 78
- 238000010276 construction Methods 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 169
- 210000000433 stratum disjunctum Anatomy 0.000 claims abstract description 97
- 230000003287 optical Effects 0.000 claims abstract description 47
- 230000000694 effects Effects 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 13
- 230000000875 corresponding Effects 0.000 claims abstract description 11
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 9
- 238000005755 formation reaction Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000003475 lamination Methods 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- 239000000377 silicon dioxide Substances 0.000 claims description 11
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 10
- 235000012239 silicon dioxide Nutrition 0.000 claims description 8
- 238000005286 illumination Methods 0.000 claims description 4
- 229910020160 SiON Inorganic materials 0.000 claims description 3
- 229910020230 SIOx Inorganic materials 0.000 claims description 2
- 238000003486 chemical etching Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 description 18
- 238000000926 separation method Methods 0.000 description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 10
- 230000001678 irradiating Effects 0.000 description 9
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 229910002601 GaN Inorganic materials 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000002835 absorbance Methods 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 3
- 229910052593 corundum Inorganic materials 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 229910052904 quartz Inorganic materials 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 description 3
- 230000001066 destructive Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 210000000887 Face Anatomy 0.000 description 1
- 210000002381 Plasma Anatomy 0.000 description 1
- 229910020019 S1 Can Inorganic materials 0.000 description 1
- 229910017436 S2 Can Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N Silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 241000960387 Torque teno virus Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical compound [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atoms Chemical group 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 210000004027 cells Anatomy 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000010192 crystallographic characterization Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable Effects 0.000 description 1
- 230000000149 penetrating Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000576 supplementary Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing Effects 0.000 description 1
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Substances [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- HADKRTWCOYPCPH-UHFFFAOYSA-M trimethylphenylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C1=CC=CC=C1 HADKRTWCOYPCPH-UHFFFAOYSA-M 0.000 description 1
Abstract
The present invention relates to a kind of for manufacturing the method for the composite construction (225) of layer (215) including being separated by irradiation, described method includes the formation of the lamination comprising the following: the supporting substrates (205) formed by the material being transparent at least in part under the wavelength determined；Layer (215) to be separated；And the stratum disjunctum (210) being clipped between described supporting substrates and described layer to be separated, described stratum disjunctum be suitable for have with determined by the corresponding wavelength of wavelength radiation (222a) effect under separated by peeling off, described method also includes: during the step for forming composite steps, changes the optical reflection attribute at interface (206) place between described supporting substrates and described stratum disjunctum or the process step of the optical reflection attribute on the upper surface (205a) of described supporting substrates.
Description
Technical field
The present invention relates to be combined the manufacture field of (or multilamellar) semiconductor structure, and relate more specifically to such as inciting somebody to action
Layer in the range of initial support is transferred to finally to support by stripping make it possible to separate one of composite construction or
The separation method of more layers.
Background technology
In the manufacture field of composite construction, it is possible to assemble and/or separate film or layer (such as semiconductor layer or insulating barrier)
May often be such that useful.Such separation is especially necessary so that layer is transferred to final substrate from initial substrate.These
Transfer is such as performed during the enforcement of three-D elements technology, and described three-D elements technology is included in the two of same layer
Face forms electronic component, photovoltaic element and/or photoelectric cell (3D is integrated) on (" front " and " back side ").
Layer shifts carry circuit during the manufacture being also performed to illuminate overleaf imager.The transfer of layer is for changing on it
The substrate being formed with one or more layer is also useful, so that new substrate is specifically in cost, physical characteristic
Aspects such as (battery sizes, heat stability ...) meets requirement.
The method such as describing thin film transfer in patent documentation EP 0 858 110.The method provide in particular
By means of the separation of the film peeling off the technology separated, this technology specifically needs to irradiate through transparency carrier
Composite construction.
Describe the method (step S1 and S2) for manufacturing composite construction now with reference to Fig. 1 and divide by peeling off
From the illustrative embodiments of method (step S3 and S4).
First, so-called stratum disjunctum 10 (or optical absorbing layer) is assembled in the one of supporting substrates 5 by engaging
On individual face (step S1).As in further detail below instruction as, supporting substrates 5 predetermined wavelength down to
It is partially transparent.
Layer 15 (being also known as " layer to be separated ") by joint and by be assemblied in subsequently layer 10 with and supporting substrates
On the face of the face opposite side that 5 contact, to obtain composite construction 25 (step S2).
It should be noted that, the assembling that layer 5,10 and 15 is during step S1 and S2 can be by means of any suitable
The mounting technology closed performs, and described any applicable mounting technology e.g. molecular adhesion is bonded or comprises middle bonding
The technology of layer.
Additionally, layer 10 and 15 not necessarily assembles to form composite construction 25 by joint.As variant, layer
At least one in 10 and 15 can be formed by means of suitable deposition technique.Such as can pass through PECVD
(" plasma enhanced chemical vapor deposition ") or LPCVD (" low pressure chemical vapor deposition ") deposition forms stratum disjunctum 10.
The most define composite construction 25, it is possible to performed the separation of stratum disjunctum 10 by stripping.The method makes
Obtaining to make layer 15 separate with supporting substrates 5.
For this purpose it is proposed, stratum disjunctum 10 is by means of the electromagnetic radiation 20 through supporting substrates 5 illuminated (step S3).
It is under transparent wavelength at least in part that radiation 20 is in supporting substrates 5.Here, " the most transparent " is intended to
Represent such substrate, i.e. this substrate absorbance under the wavelength discussed is at least 10% and is preferably more than
Or equal to 50%.As indicated by below, the grade of required transparency will be received according to stratum disjunctum 10
The energy of electromagnetic beam 20 and change.
During this irradiating step S3, stratum disjunctum 10 absorbs the boundary being passed through between supporting substrates 5 and stratum disjunctum 10
The incident illumination in face 8.This irradiation causes the adhesive force between the atom in the material of stratum disjunctum 10 or molecule reduce or disappear
Remove.This is because, under the effect of radiation 20, the material experience constituting stratum disjunctum 10 causes atomic link or strand
Destroyed photochemical excitation and/or thermal excitation.These destroy and therefore cause stratum disjunctum 10 to be separated by peeling off, or
Person is (so-called " internal " peels off) on the actual (real) thickness of layer 10, or the boundary between layer 10 and supporting substrates 5
At face 8, or at the interface 12 between layer 10 and layer 15 to be separated (" outside " peels off).This stripping
The one or more of gas that the material by stratum disjunctum 10 is discharged under the effect of radiation 20 can also be comprised from phenomenon
Body.
It should be noted that not necessarily caused in stratum disjunctum 10 (or at interface by the separation that caused of radiation 20
8 with in 12) separate or reality separates, but the abatement of the material of stratum disjunctum 10 can be only resulted in.
In the latter cases, need to apply additional energy (such as, with the form of mechanical force), to obtain supporting substrates 5
With the actual separation (in the case of wishing such separation actually) between layer 15.
Once substrate 5 and layer 15 are completely separated from (step S4), it is possible in order to form new composite construction
Recycle supporting substrates 5.
Usually, it is generally of the one in following synthetic according to composite construction produced by the layout of Fig. 1:
-GaN/Al2O3, it is corresponding to the stratum disjunctum 10 being made up of GaN and the supporting base being made up of sapphire
Plate 5；
-Si3N4/Al2O3, it is corresponding to by Si3N4The stratum disjunctum 10 constituted and the supporting base being made up of sapphire
Plate 5.
About these synthetics, the result in terms of the quality separated by peeling off is generally satisfactory.Example
As, when the GaN layer being deposited on sapphire substrate is separated, apply radiation 20 (typical case in a good condition
Under ground wavelength between 190nm and 250nm), and achieve in the case of there is no any particular difficulties point
From.
But, applicant have observed that, when this separation method is applied to other synthetic of composite construction 25
Time, result can be degenerated significantly.Such as, for SiO2The composite junction of/Si type (that is, the silicon dioxide on silicon)
Structure 25, it is more difficult for being separated by stripping.The applicant observed according to the batch studied
Carry out the big change in terms of the quality separated by stripping, and it is said that in general, less uniform separation requirement more
It is exposed to radiation.
Therefore, be currently needed for being better adapted to the composite construction of the method separated by stripping, and with discussed
The component of composite construction is unrelated.Specifically need to be suitable for carrying out separating very by stripping in a good condition
The composite construction of rule synthetic.
Summary of the invention
For this purpose it is proposed, the present invention relates to a kind of for manufacturing the composite construction of layer that includes being separated by irradiation
Method, described method includes the formation of the lamination including at least the following:
-the supporting substrates that formed by least part of transparent material under the wavelength determined；
-layer to be separated；And
-it being clipped in the stratum disjunctum between described supporting substrates and described layer to be separated, described stratum disjunctum is suitable at tool
Have the wavelength corresponding with the described wavelength determined radiation effect under by peel off separated,
Described manufacture method also includes that at least one processes step, described at least one process step be used for being formed multiple
The optical reflection attribute of interface between described supporting substrates and described stratum disjunctum is changed during closing the step of lamination
Or change the upper surface of the described supporting substrates on the opposite side in the face contacted with described stratum disjunctum of described substrate
On optical reflection attribute.
Then the composite construction of the present invention can be applied the method separated by stripping, to be separated
Layer separates with supporting substrates.For this purpose it is proposed, electromagnetic wave is applied in supporting substrates, described supporting substrates is by electromagnetic wave
Partly it is transmitted to following stratum disjunctum.
The process step changing optical reflection attribute advantageously allowed in the method phase carrying out separating by stripping
Between limit or avoid the reflection of light beam in one or more interface of processing by this way.
The composite construction of the present invention is hence in so that can be according to supporting substrates during the method separated by stripping
Thickness reduces the change of transmission potential, and can maximize the energy being actually transmitted to stratum disjunctum.In supporting
Carry out, by stripping, the quality that separates between substrate and layer to be separated and therefore renewable product is greatly carried
High.Described method specifically allow to have the component different from normally used component and to light educational circles
The especially sensitive composite construction in face performs to be separated by stripping.
According to the first embodiment of the invention, the treating step comprises in described supporting substrates and described stratum disjunctum
Between interface and/or on the upper surface of described supporting substrates, form at least one anti-reflecting layer.
The effect of this anti-reflecting layer be anti-phase two reflections of combination be cancellation with them, this advantageously makes logical
Cross peel off carry out the method separated during can reduce or prevent from being supported by light radiation any of substrate institute transmission
Reflection.Therefore light energy through the transmission of supporting substrates arrival stratum disjunctum is maximized, and this allows to significantly
Raising carries out the quality separated by stripping.
Refractive index n2 of anti-reflecting layer is preferably substantially equal toWherein n1 and n3 is supporting substrates respectively
Refractive index and the refractive index of stratum disjunctum.Even further preferably,
Optical index n2 it is disposed proximate in (such as, in ± 10% or even in ± 5%) or is equal to
Value at advantageously allow to during the irradiating step of the method carrying out separating by stripping unwanted
Reflection is restricted to minimum.
Additionally, stratum disjunctum can include heating sublayer and peeling off sublayer, peel off sublayer and be suitable for by heating sublayer institute
It is decomposed under the effect of the heating caused.
In certain embodiments, supporting substrates is made up of silicon, and heating sublayer is made up of silicon dioxide, peels off sublayer
By Si3N4Constitute and anti-reflecting layer be made up of SiON, the refractive index of described anti-reflecting layer be substantially equal to (or equivalent
In) 2.61.
According to the variant of the first embodiment, when anti-reflecting layer is formed between described supporting substrates and described stratum disjunctum
Described interface time, the component of described anti-reflecting layer little by little changes on its thickness so that described anti-reflecting layer
Refractive index n2 is equal to n1 and in described anti-reflecting layer and institute in the interface of described anti-reflecting layer with described supporting substrates
State the interface of stratum disjunctum equal to n3.
This variant advantageously allows to avoid the notable jumping of the optical index of the interface included in composite construction
Jump.Therefore the reflection of the interface between anti-reflecting layer and supporting substrates is minimized.
According to this variant, stratum disjunctum can include the heating sublayer being made up of silicon dioxide and by Si3N4The stripping constituted
Sublayer, described stripping sublayer is suitable for decomposing under the effect of heating caused by heating sublayer, supporting substrates by
Silicon is constituted, and the component of anti-reflecting layer can be by SiOxConstituting, wherein x gradually changes between 0 and 2.
As indicated above, anti-reflecting layer can be formed on the upper surface of supporting substrates.If this
The situation of kind, then the component of anti-reflecting layer can gradually change on its thickness so that the refractive index of described anti-reflecting layer
N2 is equal to n1 and in described anti-reflecting layer and described supporting in the interface of described anti-reflecting layer with described supporting substrates
Being equal to n0, n0 at the upper surface of the opposite side at the described interface of substrate is described composite construction quilt during described irradiation
The refractive index of the medium put into.
This gradually changing of component advantageously allows to avoid being placed into composite construction on supporting substrates
Surrounding medium between the notable jump of optical index of interface.Reflection at the upper surface of supporting substrates because of
This will be minimized, and this allows to allow maximum light energy be transmitted to stratum disjunctum during separation method.
Additionally, when anti-reflecting layer is formed on the interface between supporting substrates and stratum disjunctum, the thickness of anti-reflecting layer
Degree (being expressed as e1) be preferably substantially equal to (2M+1) λ/4, M be greater than or equal to 0 odd-integral number and λ be
Determined by wavelength.Even further preferably, e1=(2M+1) λ/4.By adjusting anti-reflecting layer by this way
Thickness, can be reflected and be reduced to minimum.
Second embodiment of the invention, the treating step comprises the boundary between supporting substrates and stratum disjunctum
Forming at least one rough layer at face and/or on the upper surface of supporting substrates, described rough layer is equal to described
Have in the measured zone of the size at least three times in the region of the described upper surface that radiation is irradiated and be more than or equal toThe mean roughness level of rms.
The formation of such rough layer advantageously allows to change the physical attribute in the interface discussed, the latter
Diffusive condition is converted to from mirror status.This makes the composite construction of the present invention to both constructive and destructive optical interference
Insensitive or be not very sensitive (seeing below).
The formation of rough layer can perform at least through mechanical lapping or chemical etching.
About this, the invention still further relates to a kind of for making layer separate from the composite construction of the present invention as described above
Method.Described separation method includes by means of being transparent wavelength at least in part under it with described supporting substrates
Corresponding incident illumination carrys out sub irradiation absciss layer, with the stripping by described stratum disjunctum through the supporting substrates of described structure
Cause abatement or separate.
The invention still further relates to the composite construction of a kind of composite laminate including and being formed by least the following:
The supporting substrates formed by transparent material at least part of under the wavelength determined；
The layer to be separated by irradiation；And
Being clipped in the stratum disjunctum between described supporting substrates and described layer to be separated, described stratum disjunctum is suitable for having
Separated by stripping under the effect of the radiation of the wavelength corresponding with the described wavelength determined,
Described composite construction also includes at least one layer, at least one layer described change described supporting substrates with described point
The optical reflection attribute of the interface between absciss layer or change described substrate in the face contacted with described stratum disjunctum
Optical reflection attribute on the upper surface of the described supporting substrates on opposite side.
With reference to manufacturing method according to the invention, embodiment stated above and advantage are similarly applicable for the present invention
Composite construction.
According to specific embodiment, change each layer of optical reflection attribute correspond respectively to anti-reflecting layer and/or
Have on the region of 5 μ m 5 μm and be more than or equal toThe rough layer of the mean roughness level of rms.
Additionally, described structure may include that at least one layer changing the optical reflection attribute relevant to anti-reflecting layer；
And change at least one layer of the optical reflection attribute relevant to rough layer.
Accompanying drawing explanation
Referring to the drawings and according to description given below, other features and advantages of the present invention will be apparent from, accompanying drawing example
Show the illustrative embodiments of the present invention not implying that restriction.In the drawings:
Fig. 1 schematically shows the known method (step S1 and S2) for manufacturing composite construction, and is applied to
The method (step S3 and S4) separated by stripping of described structure；
Fig. 2 schematically illustrates optical interference generation mechanism in the supporting substrates of composite construction；
Fig. 3 A and 3B schematically shows the side for manufacturing composite construction according to the first embodiment of the invention
Method (step S10-S14), and be applied to described structure carry out, by stripping, the method (S16-S18) that separates；
Fig. 4 A and 4B schematically shows the side for manufacturing composite construction second embodiment of the invention
Method (step S110-S114), and it is applied to the method carrying out separating by stripping of described structure
(S116-S118)；
Fig. 5 A and 5B schematically shows the composite construction of two kinds of variants second embodiment of the invention
Irradiate.
Detailed description of the invention
The present invention relates to the composite construction that can be separated under good conditions by peeling off, even for generally not carrying
Component for good result is also suitable.
The applicant has been carried out research so that can demonstrate and cause execution to be run into by the method that stripping separates
The physical mechanism of difficulty.This research the most specifically demonstrates the optical interference occurred in supporting substrates at composite junction
Effect during the irradiation of structure.
Now with reference to Fig. 2, this mechanism is described.The figure shows composite construction as described above in reference to Figure 1
25。
Fig. 2 arrives the incident ray of the surface 5a exposed to the open air of supporting substrates 5 during being represented in particular in irradiating step S3
22a.For running into any light of semi-absorbing medium, upper at substrate 5 of a part of (not shown) of light 22a
Being reflected at the 5a of surface, the most a part of 22b is transmitted in supporting substrates 5.At it through supporting substrates 5
During Ceng, a part of the light 22b of transmission is absorbed and remaining part arrives in supporting substrates 5 and stratum disjunctum
Interface 8 between 10.Interface 8 again acts as optical foresight, so that light 22b is partially reflected (reflection light
Line 22d), and remainder 22c is transmitted in stratum disjunctum 10.Reflection light 22d runs into upper surface 5a again,
And cause the new internal reflection process in supporting substrates 5.
But, through supporting substrates 5 layer various light (22b, 22d, 22e ...) with interact with each other,
Produce with the phase offset according to them have the ripple (this is referred to as constructive interference) of higher intensity or have the lowest by force
The ripple (this is referred to as destructive interference) of degree.These interference cause by the applicant viewed with by supporting base
Plate is transmitted to the relevant strong change of the emittance of stratum disjunctum and significantly reduces.
More specifically, research is it has been shown that the grade interfered largely depends on by radiation on the surface exposed to the open air
The jump of the optical index (or refractive index) run at 5a and at interface 8.It is desirable that should make to be comprised
Various materials between optical index difference minimize.Component (that is, GaN/Al about conventional composite construction2O3
Or Si3N4/Al2O3), situation is particularly preferred, this is because index jumps for having at 150nm and 300nm
Between wavelength radiation for be at most 0.87 (sapphire and Si3N4Optical index be 1.87 and 2.27 respectively).
On the other hand, for SiO2/ Si component, wherein, the optical index of silicon dioxide and silicon exceedes for having
The radiation of the wavelength of 1.5 μm is 1.992 and 3.42 respectively, and situation is not so good.If the surface 5a exposed to the open air and air
(having the index equal to 1) contacts, the most such as, obtain the biggest for having the radiation of the wavelength of 9.3 μm
The jump (the most about 2.4 or 1.4) of optical index.These big jumps in optical index cause
The change produced strongly it is transmitted in the light intensity of stratum disjunctum 10 during step S3.
Additionally, the stratum disjunctum being made up of silicon dioxide and the supporting substrates that is made up of silicon above-mentioned in the case of, interfere
Level of sensitivity about the thickness of supporting substrates is extreme.Specifically, see under the silicon thickness stage of 1.35 μm
Observe the intensity in transmission of maximum.In other words, when considering for the supporting being made up of silicon having reached transmission maximum
During the thickness L of substrate, generally will obtain transmission minima for thickness L+1.35/2 μm, and for thickness
L+1.35 μm is up to new transmission maximum.This means to control to have than the 0.675 more preferable precision of μm
The thickness of the supporting substrates being made up of silicon of level, to avoid the notable change of the transmission being radiated in stratum disjunctum.So
Control level the supporting substrates being made up of silicon is currently not it is contemplated that, for 200mm's and 300mm
Diameter wafer, the thickness of the supporting substrates being made up of silicon amplitude of variation with about 5 μm and 1.5 μm generally the most respectively is (total
Thickness change or " TTV ").
Therefore, the construction quality for the such as thickness of those substrates being made up of silicon is not enough, and this causes as above
The problem of the illustrated change in transmission potential.
The problem of transmission and optical interference is the most not yet solved effectively, especially because they are to traditional synthesis
The composite construction of thing has limited impact.The applicant therefore have been developed for allowing to overcoming aforesaid drawbacks and
The new composite construction unrelated with the component of the structure discussed.
Now with reference to Fig. 3 A and 3B, composite construction according to the first embodiment of the invention is described.These charts
Show the example (step S10 to S14) of the manufacture method being obtained in that this composite construction, and be applied to described structure
Carry out, by stripping, the method (step S16 to S18) that separates.
As represented by figure 3 a, the anti-reflecting layer 106 of thickness e 1 first passes through deposition and is formed on
Hold (step S10) on the surface 105b of substrate 105.Any applicable deposition technique (such as, PECVD can be passed through
Or LPCVD deposition) or any other be suitable for layer formed technology generate anti-reflecting layer 106.It will also be appreciated that logical
Cross joint to be assemblied on the face 105b of supporting substrates 105 by anti-reflecting layer 106.This be will be discussed in further detail below
The purpose of layer 106 and characteristic.
In example described here, supporting substrates 105 is made up of silicon.
Stratum disjunctum 110 is by engaging on the face of the exposure being assembled in anti-reflecting layer 106 subsequently, i.e. with supporting base
On the face of the face opposite side of plate 105 contact (step S12).
Layer 115 to be separated is also by the face engaging the exposure being assembled in stratum disjunctum 110, to form composite construction
125 (steps S14).
The most necessarily assemble layer 110 and 115 to form composite construction 125 by joint.As variant, layer 110
With 115 at least one can be formed by means of applicable deposition technique.Such as can by PECVD or
LPCVD deposition forms stratum disjunctum 110.
Once define structure 125, it is possible to stratum disjunctum 110 separated by stripping, make layer 115 can with
Hold substrate 105 separately (step S16 and S18).It should be noted that, composite construction 125 can pass through in execution
Peel off and experience supplementary technical step before carrying out the method separated., the back side of layer 115 is held alternatively
Having gone after technical step (forming element etc.), one or more layer can be specifically form or be assemblied in layer 115
On the face of the exposure of (such as, final substrate).
In order to make layer 115 separate with supporting substrates 105, first electromagnetic radiation 120 is applied through supporting substrates 105
In stratum disjunctum 110 (step S16).This radiation of form of beams has wavelength X, at described wavelength X lower support
Substrate 105 is transparent at least in part.At that wavelength, substrate 105 has at least 10% and is preferably more than
Or the absorbance equal to 50%.However, it is possible to by the energy (example improving the wave beam applied during step S16
As, by concentrating wave beam) compensate low transmissivity.
In example contemplated herein, stratum disjunctum 110 can include that so-called first heating sublayer is (such as, by two
Silicon oxide constitute) and so-called second stripping sublayer (such as, by Si3N4Constitute).Heating sublayer function be
Heating is caused under the effect irradiated during step S16.The function peeling off sublayer is from adding heater (passing through conduction of heat)
Stratum disjunctum 110 is caused to separate by peeling off under the effect of the heat energy of layer transmission.Peel off sublayer to be suitable for by heating
Decompose under the effect of the heating that sublayer is caused during irradiating or cut down.
In variant, stratum disjunctum 110 includes at least one sublayer simultaneously realizing the function of heating and stripping.
For anti-reflecting layer 106, it has the effect that, i.e. combines anti-phase two and reflects so that they are phases
Disappear, this any reflection advantageously allowing to reduce or prevent the light radiation by 105 transmissions of supporting substrates,
The transmission going to stratum disjunctum 110 is maximized simultaneously.Therefore, the merit of the layer of the function of anti-reflecting layer and mirror type
Can be contrary, the reflection of the interface made between supporting substrates 105 and stratum disjunctum 110 is maximized by this.This point
On, layer 106 constitutes such layer, i.e. this layer changes the interface between supporting substrates 105 and stratum disjunctum 110
The optical reflection attribute at place.
As indicated by reference composite structure 25, by the separation that caused of radiation 120 in stratum disjunctum 110 not
Necessarily cause separately or actual separation, but the abatement of layer 110 can be only resulted in, it is desirable to after-applied additional energy
Amount (such as, with the form of mechanical force), to obtain actual the separating between supporting substrates 105 with layer 115.
Once substrate 105 and layer 115 are completely separated from (step S18), it is possible in order to form new composite junction
Structure recycles supporting substrates 105.This recycling can comprise the removal of anti-reflecting layer 106 alternatively.
Connect to prevent unwanted reflection, anti-reflecting layer 106 to have during irradiating step S16 as much as possible
It is bordering on and is preferably equivalent to positioned at subduplicate optical index n2 of product of optical index of each layer of either side.
In other words, index n2 should meet following condition (1):
Wherein, n1 and n3 corresponds respectively to supporting substrates 105 and the optical index of stratum disjunctum 110.
Index n2 is preferably selected so as according to following condition (2):
In example contemplated here, it is assumed that n1 and n3 is 3.42 and 1.992 respectively.The light of anti-reflecting layer 106
Therefore learn index n2 is about 2.61, and preferably equivalent to this value.
Additionally, the reflectance of anti-reflecting layer 106 depends on its thickness e 1.For layer thickness e1=(2M+1) λ/4,
Achieving the ideal situation that reflectance is minimum, wherein, M is greater than or equal to the integer of 0.
In example contemplated here, the wavelength X of radiation 120 is 9.3 μm.In order to make the anti-of anti-reflecting layer 106
Rate of penetrating is minimum, preferably make its thickness be about e1=4.6 μm (as n1 > n3 time situation).
And, as indicated above, the level of reflection depends greatly on the light between comprised material
Learn the jump (that is, the difference between n1, n2 and n3) of index.According to the variant of this first embodiment,
Anti-reflecting layer 106 is such, i.e. its optical index n2 little by little changes along with the thickness of layer 106 so that
The value of n1 it is equal in the interface with supporting substrates 105, and in the interface with stratum disjunctum 110 equal to n3.For
This purpose, being formed by of the anti-reflecting layer 106 here imagined gradually deposits the denselyest
Si-OxLayer to reach SiO2Stoichiometry (x changes progressively between 0 and 2).
This variant advantageously allows to avoid the significant jump of the optical index in the interface comprised, and
Therefore the reflection minimized of interface between anti-reflecting layer 106 and supporting substrates 105 is made.
Optimize the transmission of the radiation going to stratum disjunctum 110 to minimize reflection simultaneously, can be at anti-reflecting layer 106
The sublayer of middle one or more nanostructured of generation, the sublayer of described nanostructured is with term " moth eye
(moth-eye) " known and its principle be comprise have more much smaller than the wavelength X of the radiation 120 used
The pattern of size.Specifically, these " moth eye " layers have low-down reflection levels for omnidirectional's incident illumination.
The layer of these moth ocular forms being particularly used in solaode is such as at document " Characterization of
antireflection moth-eye film on crystalline silicon photovoltaic module”,(Noburu Yamada
Et al.Optics Express, Vol.19, Issue S2, pp.A118-A125) in be described in detail.Such as can lead to
Cross Cement Composite Treated by Plasma or produced the nanostructured of moth ocular form by complicated holographic optics method in the form of a film.
For different variant described above, it is noted that anti-reflecting layer 106 can be arranged in supporting
On the face 105a of the exposure of substrate 105 rather than be positioned the interface between supporting substrates 105 and stratum disjunctum 110
Place.But, this variant is less preferably, because in it allows at least one in supporting substrates 105 of light
Portion is reflected, i.e. arrive the reflection of the light at interface between supporting substrates 105 and stratum disjunctum 110 first.
In order to most preferably, the variant of the latter should meet mentioned above to optical index n1, n2 and n3 relevant
Condition (1) and preferably condition (2).In example contemplated here, n2 therefore should be equal to 2.61.
Additionally, thickness (being expressed as e1 ') is the most such, i.e. e1 '=(2P+1) λ/4, wherein P is greater than
Or the integer equal to 0.Therefore, for the wavelength X of 9.3 μm, it is arranged on the face 105a of supporting substrates 105
Anti-reflecting layer 106 preferably has the optical index of 2.61 and the SiON of the thickness of 2.32 μm, 6.98 μm etc.
Alloy.
Alternatively, when anti-reflecting layer 106 is formed on the above 105a of supporting substrates, the component of anti-reflecting layer
Little by little can change on its thickness so that its refractive index n2 in its interface with supporting substrates 105 equal to n1,
And it is equal to upper surface (that is, its surface exposed) place of the opposite side at the described interface of supporting substrates 105 at it
N0, n0 are the refractive indexs of the surrounding medium that described composite construction is put into during irradiating.
This exponential gradient advantageously allows to the notable saltus step avoided in the optical index of the interface comprised,
And therefore can be by the reflection minimized of the interface between anti-reflecting layer 106 and supporting substrates 105.
Now with reference to Fig. 4 A, 4B, 5A and 5B, composite construction second embodiment of the invention is described.
More specifically, these figures represent example (step S110 allowing to obtain the manufacture method of composite construction 225
To S114), and be applied to described structure carry out, by stripping, the method (step S116 to S118) that separates.
As represented by Figure 4 A, first supporting substrates 205 experiences and allows to improve one surface (table
Be shown as 205b) the rough grinding step S110 of roughness.The mean roughness reached on the 205b of surface preferably more than or
It is equal torms(Expression angstromAnd rms represents " root-mean-square "), and even more preferably still exist
It is equal to the measured zone (or surface) of the size at least 3 times in the region that (during subsequent irradiation step S116) irradiates
On at least equal torms.Specifically, the level of roughness should have the size of such as laser facula (i.e.,
Such as 1 μ m 1 μm) region on be high.This measured zone can be such as 5 μ m 5 μm.
Such as by means of the chemistry side of etch pattern (such as, the TMAH etching when supporting substrates 5 is made up of silicon)
The method of method or chemical type produces this corase grind, such as mechanical wear or " grinding ", sandblasting, polishing etc..Alternative
Ground, it is possible to use the combination of at least two in these methods realizes desired roughness levels and surface strip
Part.
Then, stratum disjunctum 210 is assembled in (step on the matsurface 205b of supporting substrates 205 by engaging
S112).Therefore obtaining the interface 206 between supporting substrates 205 and stratum disjunctum 210, it is by equal to illuminated
On the region (such as, the region of 5 μ m 5 μm) at least 3 times of district at least equal toRms or even
The roughness of the increase of rms characterizes.This high-caliber roughness spreads all over and is located at supporting substrates 205 with to be separated
Floor 210 between interface 206 at the floor (or district) 207 of thickness e 2.This district 207 is corresponding to by supporting substrates
The material of 206 and be located at the interface 206 exceeding thickness e 2 either side stratum disjunctum 210 material constitute layer.
This thickness e 2 can be such as to exceedAnd such as reachValue.
In example described here, supporting substrates 205 is made up of silicon.Additionally, stratum disjunctum 210 and stratum disjunctum
110 is identical.It such as includes the heating sublayer being made up of silicon dioxide and by Si3N4The stripping sublayer constituted (does not exists
Figure represents).
Once executed step S112, layer 215 is just assembled in the face of the exposure of stratum disjunctum 210 by joint
(that is, at the back side of the face opposite side contacted with supporting substrates 205) is upper (step S114).
It should be noted that, layer 210 and 215 not necessarily assembles to form composite construction 225 by joint.Make
For variant, at least one in layer 210 and 215 can be formed by means of applicable deposition technique.Stratum disjunctum 210
Such as can be formed by PECVD or LPCVD deposition.
Once define structure 125, it is possible to by performing and above with reference to the method described by composite construction 125
The identical method being carried out by stripping separating, make layer 215 and supporting substrates 205 separate (step S114 and
S116)。
Composite construction 225 can be performed before, in the method carrying out separating by stripping, the technology step that experience is supplemented
Suddenly.Alternatively after the back side of layer 215 is performed technical step (forming element etc.), one or more layer
On the face of the exposure that can specifically be formed or be assemblied in layer 215 (such as, final substrate).
In order to make layer 215 separate with supporting substrates 205, first pass through supporting substrates 205 and electromagnetic radiation 220 is executed
It is added to (step S116) in stratum disjunctum 210.This radiation has wavelength X, at described wavelength X lower support substrate 205
It is transparent at least in part.At that wavelength, substrate 205 have at least 10% and preferably more than or etc.
In the absorbance of 50%.But, as indicated by with reference to substrate 105, can be by improving in irradiating step
The energy of the wave beam applied during S116 compensates the low transmissivity of supporting substrates 205.
The effect of the corase grind previously performed is to change the physical attribute at interface 206, and the latter is turned from mirror status
It is changed to diffusive condition.Rough layer 207 specifically changes the optical reflection at the interface 206 of composite construction 225 and belongs to
Property.By means of this rough layer 207, composite construction 225 is insensitive to mutually long optical interference and cancellation optical interference
Or be not very sensitive.Therefore layer 106 constitutes such layer, i.e. this layer changes at supporting substrates 205 and divides
The optical reflection attribute of the interface between absciss layer 210.
It should be noted that according to the scheme of alternative, can make to separate before being assembled together with supporting substrates 205
Layer 206 is roughening.The surface 205b of supporting substrates and the stratum disjunctum 210 to contact can also be made with surface 205b
Surface roughening.In all cases, the level of the roughness obtained on layer 207 is as described above
As.
As represented by fig. 5, when in step S116, incident ray 222a arrives composite construction 225
The surface 205a of exposure time, a part of 222b of light is transmitted in supporting substrates 205 until interface 206.
The effect of layer 206 is to make interface 206 diffusion so that light 222b is scattered on the different directions at interface 206.
The light 222c being scattered partly is had an X-rayed in stratum disjunctum 210 hence along multiple directions, and remainder is dissipated
It is mapped in supporting substrates 205.This scattering allows to avoid multiple reflections that the supporting substrates 205 at composite construction occurs
In, these reflections cause unwanted optical interference.
Although a part for incident radiation energy is not transmitted to stratum disjunctum 210, but this embodiment is favourable,
Because it allows to the thickness according to supporting substrates and suppresses the composite construction sensitivity to the change of the energy of transmission
Property.
As indicated by reference composite structure 25 and 125, radiation 220 separation caused is in stratum disjunctum 210
In not necessarily cause separately or the separation of reality, but can only cause the abatement of layer 210, need with after-applied attached
The energy (such as, with the form of mechanical force) added is to obtain actual the separating between supporting substrates 205 with layer 215.
Once substrate 205 and layer 215 have been completely separated from (step S118), it is possible to new in order to be formed
Composite construction recycles supporting substrates 205.This recycling can comprise alternatively by polishing supporting substrates
Surface 205b (or by any other be suitable for method) remove rough layer 207.
Variant represented in Fig. 5 B according to this second embodiment, it be composite construction 225 formation it
Before, period and/or afterwards by roughening for the surface 205a of the exposure of supporting substrates 205.Therefore, on the surface exposed
The layer obtaining roughness increase on the region of the thickness e 3 on 205a (has and for value defined in the first variant
Identical value).This district constitutes the floor 227 of the optical reflection attribute changing composite construction.Thickness e 3 has about
The value identical with thickness " e2 ".
In this variation, the effect of rough surface 205a (and more generally rough layer 207) is to be scattered in step
Each light 224a irradiated in a plurality of directions during S116.Among the light 224b being scattered, light 224c
It is transmitted to interface 206.Then, a part of 224d of this light is transmitted in stratum disjunctum 210.But, should
Variant has the shortcoming relevant with the shortcoming of Fig. 5 A, because cannot be between supporting substrates 205 and stratum disjunctum 210
Reflection is avoided at interface 206.Therefore, interface 206 the light 224e reflected is not to be transmitted to stratum disjunctum 210
Radiation energy.
Light 224e is scattered by the rough layer 227 on the 205a of surface subsequently, and this allows to be avoided multiple reflection to occur
In supporting substrates 205.Therefore, this variant makes it also possible to prevent from generating disadvantageous light in the thickness of supporting substrates
Learn and interfere.
Therefore, the composite construction of the present invention advantageously allows to the thickness minimizing according to supporting substrates in the irradiating step phase
Between the change of energy of transmission, and the energy being actually transmitted in stratum disjunctum can be maximized.Supporting substrates with
Carry out, by stripping, the quality that separates between layer to be separated and therefore renewable product is greatly improved.This
Invention specifically allows to having that be different from those components of being used generally and the quickest to optical interference
The composite construction of sense performs to be separated by stripping.
As other variant, it is contemplated that anti-reflecting layer 106 to be arranged in each of supporting substrates of composite construction
On, to change substrate optics on each of which face (i.e. on its surface exposed and in the interface with stratum disjunctum)
Reflecting attribute.
Two faces can also making supporting substrates are roughening, and (supporting substrates includes rough layer 207 and thick in this case
Rough layer 227).But, this variant causes more significantly losing in terms of radiation energy transmission during irradiating step.
Alternatively, supporting substrates can have anti-reflecting layer, above another surface picture on its face of multiple
Described in become coarse.
In addition, it should be noted that supporting substrates and formation are according to each layer in the layer of the composite construction of the present invention
Can be made up of multiple sublayers.Specifically, as it is described above, anti-reflecting layer 106 can by two or more
Multiple sublayers are formed.
According to another variant of the present invention, composite construction can be included in the interface between supporting substrates and stratum disjunctum
Anti-reflecting layer 106 and both the rough layers 227 on upper (i.e. exposing to the open air) face of supporting substrates, or relatively,
The rough layer of the interface between supporting substrates and stratum disjunctum and the anti-reflecting layer on the upper surface of supporting substrates.
Claims (14)
1. for manufacturing the layer (115 including being separated by irradiation；215) composite construction (125；225)
Method, described method includes forming the lamination (S10-S14 including at least the following；S110-S114):
-the supporting substrates (105 that formed by transparent material at least part of under the wavelength determined；205)；
-layer (115 to be separated；215)；And
-it is clipped in the stratum disjunctum (110 between described supporting substrates and described layer to be separated；210), described stratum disjunctum
It is suitable in the radiation (120 with the wavelength corresponding with the described wavelength determined；220) under effect
Separated by peeling off,
Described manufacture method is characterised by also including that at least one processes step (S10；S110), described at least one
Process step changing between described supporting substrates and described stratum disjunctum during forming the step of composite laminate
Interface (106；206) the optical reflection attribute at place or change contacting with described stratum disjunctum at described supporting substrates
Upper surface (the 105a of the described supporting substrates on the opposite side in face；Optical reflection attribute on 205a),
Wherein, the described interface that at least one process step described is included between described supporting substrates and described stratum disjunctum
Place and/or form at least one anti-reflecting layer (106) on the described upper surface of described supporting substrates.
Method the most according to claim 1, wherein, refractive index n2 of described anti-reflecting layer (106) is substantially
It is equal toWherein, n1 and n3 is refractive index and the refractive index of described stratum disjunctum of described supporting substrates respectively.
3. according to the method described in any one in claim 1 to 2, wherein, described stratum disjunctum includes heating
Sublayer and stripping sublayer, described stripping sublayer is suitable for being divided under the effect of the heating caused by described heating sublayer
Solve.
Method the most according to claim 3, wherein, described supporting substrates is made up of silicon, described heating sublayer
Being made up of silicon dioxide, described stripping sublayer is by Si3N4Constitute and described anti-reflecting layer is made up of SiON, described
The refractive index of anti-reflecting layer is substantially equal to 2.61.
Method the most according to claim 1, wherein, when anti-reflecting layer (106) is formed at described supporting substrates
And during described interface between described stratum disjunctum, the component of described anti-reflecting layer little by little changes on its thickness, makes
Refractive index n2 of described anti-reflecting layer in the interface of described anti-reflecting layer and described supporting substrates equal to n1 and
Described anti-reflecting layer is equal to n3 with the interface of described stratum disjunctum.
Method the most according to claim 1, wherein, described stratum disjunctum includes the heating being made up of silicon dioxide
Sublayer and by Si3N4The stripping sublayer constituted, described stripping sublayer is suitable for being caused by described heating sublayer
Being decomposed under the effect of heating, described supporting substrates is made up of silicon, and
Wherein, the component of described anti-reflecting layer is by SiOxConstituting, wherein x little by little changes between 0 and 2.
Method the most according to claim 1, wherein, when anti-reflecting layer is formed at described in described supporting substrates
When upper surface (105a) is upper, the component of described anti-reflecting layer gradually changes on its thickness so that described anti-reflecting layer
Refractive index n2 in the interface of described anti-reflecting layer and described supporting substrates equal to n1 and described anti-reflecting layer with
Equal to n0 at the upper surface of the opposite side at the described interface of described supporting substrates,
N0 is the refractive index of the medium that described composite construction is placed into during described irradiation.
Method the most according to claim 1, wherein, described anti-reflecting layer described supporting substrates with described point
The thickness (e1) of the described interface between absciss layer is substantially equal to (2M+1) λ/4, M be greater than or equal to 0 strange
Integer, and λ is the described wavelength determined.
Method the most according to claim 1, wherein, the treating step comprises in described supporting substrates (205)
And (206) place, described interface between described stratum disjunctum (210) and/or at the described upper surface of described supporting substrates
(205a) upper at least one rough layer of formation (207), described rough layer is equal to being irradiated with described radiation
Described upper surface region size at least three times measured zone on have and be more than or equal toAverage
Roughness levels.
Method the most according to claim 9, wherein, the formation of described rough layer at least through mechanical lapping or
Chemical etching performs.
11. for the composite construction manufactured from the method limited according to any one claim 1 to 10 by layer
Separate method, described for separate method include by means of with described supporting substrates under it at least partly transparent
The corresponding incident illumination of wavelength irradiates described stratum disjunctum, with by described point through the described supporting substrates of described structure
The stripping of absciss layer causes abatement or separates.
12. composite constructions including the composite laminate formed by least the following:
-the supporting substrates that formed by material at least partly transparent under the wavelength determined；
-the layer that will be separated by irradiation；And
-be clipped in the stratum disjunctum between described supporting substrates and layer to be separated, described stratum disjunctum be suitable for have with
Separated by stripping under the effect of the radiation of the wavelength that the described wavelength determined is corresponding,
Described multiple structural features is, described composite construction also includes at least one layer, and at least one layer described changes
The optical reflection attribute of the interface between described supporting substrates and described stratum disjunctum or change are at described supporting base
Optical reflection attribute on the upper surface of the described supporting substrates on the opposite side in the face contacted with described stratum disjunctum of plate,
Wherein, described composite construction is included between described supporting substrates and described stratum disjunctum described interface and/or
At least one anti-reflecting layer (106) on the described upper surface of described supporting substrates.
13. structures according to claim 12, wherein, each layer that changes optical reflection attribute the most corresponding
It is more than or equal in anti-reflecting layer and/or have on the region of 5 μ m 5 μmMean roughness water
Flat rough layer.
14. structures according to claim 13, wherein, described structure includes: change relevant to anti-reflecting layer
At least one layer of optical reflection attribute；And change at least one of the optical reflection attribute relevant to rough layer
Layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1158330A FR2980279B1 (en) | 2011-09-20 | 2011-09-20 | METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE TO BE SEPARATED BY EXFOLIATION |
| FR1158330 | 2011-09-20 | ||
| PCT/IB2012/001405 WO2013041926A1 (en) | 2011-09-20 | 2012-07-18 | Method for fabricating a composite structure to be separated by exfoliation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103814436A CN103814436A (en) | 2014-05-21 |
| CN103814436B true CN103814436B (en) | 2016-11-30 |
Family
ID=
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1897219A (en) * | 1996-08-27 | 2007-01-17 | 精工爱普生株式会社 | Transferring method |
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1897219A (en) * | 1996-08-27 | 2007-01-17 | 精工爱普生株式会社 | Transferring method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101962312B1 (en) | Method for fabricating a composite structure to be separated by exfoliation | |
| EP3529646B1 (en) | Device and method for shielding at least one sub-wavelength-scale object from an incident electromagnetic wave | |
| CN100381838C (en) | Laser surface treatment | |
| TWI597568B (en) | Phase grating for mask inspection system | |
| US7455957B2 (en) | Blazed holographic grating, method for producing the same and replica grating | |
| KR20070013313A (en) | Light scattering euvl mask | |
| JP2014123747A (en) | Reflective optical element and process of manufacturing the same | |
| EP0660140A1 (en) | Method for making a relief structure on a substrate from semiconductor material | |
| US20090262900A1 (en) | X-ray focusing device | |
| US20130069086A1 (en) | Method for producing a plurality of optoelectronic semiconductor chips | |
| KR20210105333A (en) | Photomask having a reflective layer with non-reflective areas | |
| TWI594297B (en) | Method for separating a layer from a composite structure | |
| JP2016525711A (en) | Solar management | |
| CN103814436B (en) | For the method manufacturing the composite construction separated by stripping | |
| Mildner et al. | Plasmonic trapping potentials for cold atoms | |
| Prasciolu et al. | Extended asymmetric-cut multilayer X-ray gratings | |
| JP2005083862A (en) | Optical thin-film and mirror using it | |
| EP2544236B1 (en) | Method for producing an soi wafer | |
| Chen et al. | Plasmonic roller lithography | |
| KR101430635B1 (en) | Target Structure For Generating Charged Particle Beam, Method Of Manufacturing The Same And Medical Appliance Using The Target Structure | |
| CN109715386B (en) | Method for carrying out delamination of polymer film | |
| TWI471912B (en) | Method for producing an optoelectronic component and such a produced component | |
| JP2007163191A (en) | Multilayer-film reflector and optical system equipped with multilayer-film reflector | |
| Lecler et al. | Plasmonic effect of Ag nanoparticles in a SiON antireflective coating: engineering rules and physical barrier | |
| Chen et al. | Gratings in GaN membranes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |