CN103812530A - Intelligent automatic communication method and system - Google Patents
Intelligent automatic communication method and system Download PDFInfo
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- CN103812530A CN103812530A CN201210461000.2A CN201210461000A CN103812530A CN 103812530 A CN103812530 A CN 103812530A CN 201210461000 A CN201210461000 A CN 201210461000A CN 103812530 A CN103812530 A CN 103812530A
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- 238000004891 communication Methods 0.000 title claims abstract description 346
- 238000000034 method Methods 0.000 title claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 71
- 238000010586 diagram Methods 0.000 description 8
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
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Abstract
The invention discloses an intelligent automatic communication method and an intelligent automatic communication system; the method is applied to a first electronic device and a second electronic device; the first electronic device comprises a first near field communication chip and a first far field communication chip, and the second electronic device comprises a second near field communication chip and a second far field communication chip. The first electronic device generates a communication package with a communication setting file, and moves towards the second electronic device until the distance therebetween is short enough for the first near field communication chip to trigger the second near field communication chip, and then the communication package is transmitted from the first electronic device to the second electronic device; the second electronic device analyzes the communication package to obtain the communication setting file, for building a first far field communication path between the second far field communication chip and the first far field communication chip.
Description
Technical field
The present invention relates to a kind of intelligent automatic means of communication and system, relate in particular to application and there is the communication between near-field communication chip and multiple electronic installations of far field communication chip.
Background technology
In prior art, the communication of electronic installation for providing user to carry out different modes is provided with multiple communication chip in this electronic installation.Wherein, these communication chips, according to communication distance, can further be divided into again near-field communication and far field communication.
Generally speaking, this near-field communication refers to for example, to carry out transfer of data by short distance (10 centimetres ~ 10 meters), and the distance of comparing far field communication due to the communication distance of this near-field communication is short, therefore this electronic installation is without using larger these data of power delivery.
Again, this far field communication refers to lead to long-distance (being for example more than or equal to 10 centimetres) and carries out transfer of data, need to use larger power although this electronic installation transmits these data under this length distance, can be by this transfer of data to farther distance.
But, with regard to near-field communication, generally set up near-field communication path by the way of contact of induction coil, but for the communication of far field, owing to there is no the action of any contact, therefore this electronic installation must be by the mode of pairing, in order to judge the object (being another one electronic installation) of transfer of data, therefore be necessary to propose a kind of device that solves prior art defect.
Summary of the invention
An object of the present invention is to provide a kind of intelligent automatic means of communication, can start the object to far field communication by near-field communication simply for the first electronic installation and second electronic device.
Another object of the present invention is according to the above-mentioned intelligent automatic means of communication, after this first electronic installation and this second electronic device are set up the first far field communication path, this second electronic device further provides the 3rd electronic installation can set up the second far field communication path with this first electronic installation equally.
A further object of the present invention is to provide a kind of intelligent automatic communication system, make after the first electronic installation and second electronic device are set up the first near-field communication path in near-field communication mode, the near-field communication of this first electronic installation and this second electronic device is changed and becomes far field communication, and form the first far field communication path.
For achieving the above object and other object, the invention provides a kind of intelligent automatic means of communication, be applied to the first electronic installation and second electronic device, and this first electronic installation has the first near-field communication chip and the first far field communication chip and this second electronic device and has the second near-field communication chip and the second far field communication chip, the method is included in this first electronic installation and produces a communication bag, so that the communications setting file of this first far field communication chip is encapsulated in to this communication bag; This first electronic installation is moved towards this second electronic device, to allow this first near-field communication chip trigger this second near-field communication chip, and set up the first near-field communication path between this first near-field communication chip and this second near-field communication chip in a distance; This communication bag is sent to this second electronic device by this first near-field communication path; This second electronic device is resolved this communication bag, to obtain this communications setting file and to be sent to this second far field communication chip; And between this second far field communication chip and this first far field communication chip, set up the first far field communication path according to this communications setting file.
For achieving the above object and other object, the invention provides a kind of intelligent automatic communication system, this system comprises the first electronic installation and second electronic device.Wherein this first electronic installation has the first processing unit, the first near-field communication chip and the first far field communication chip, and this first processing unit connects this first near-field communication chip and this first far field communication chip, this first processing unit is for producing a communication bag again, and this first electronic installation transmits this communication bag by this first near-field communication chip, wherein in this communication bag, is packaged with the communications setting file of this first far field communication chip; And this second electronic device has the second near-field communication chip, the second processing unit and the second far field communication chip, and this second processing unit connects this second near-field communication chip and this second far field communication chip, this second electronic device is connected with this first electronic installation by this second near-field communication chip, in order to receive this communication bag, this second processing unit is resolved this communication bag to obtain this communications setting file, and according to this communications setting file, between this second far field communication chip and this first far field communication chip, form the first far field communication path.
Compare with prior art, intelligent automatic communication system of the present invention can provide multiple electronic installations by near-field communication chip enable far field communication chip, makes to reduce these electronic installations and also can set up easily far field communication.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the intelligent automatic means of communication of first embodiment of the invention;
Fig. 2 is the schematic flow sheet of the intelligent automatic means of communication of second embodiment of the invention;
Fig. 3 is the block schematic diagram of the intelligent automatic communication system of first embodiment of the invention;
Fig. 4 is the block schematic diagram of the intelligent automatic communication system of second embodiment of the invention;
Fig. 5 is the block schematic diagram of the intelligent automatic communication system of third embodiment of the invention; And
Fig. 6 is the block schematic diagram of the intelligent automatic communication system of fourth embodiment of the invention.Critical piece Reference numeral:
10,10 ', 10 ", 10 " ' intelligent automatic communication system
12 first electronic installations
122 first processing units
124 first near-field communication chips
126 first far field communication chips
14 second electronic devices
142 second near-field communication chips
144 second processing units
146 second far field communication chips
148 first projecting cells
16 the 3rd electronic installations
162 the 3rd processing units
164 the 3rd near-field communication chips
166 the 3rd far field communication chips
168 second projecting cells
CP communication bag
CSF communications setting file
FNFCP the first near-field communication path
FFFCP the first far field communication path
D1, d2 distance
SNFCP the second near-field communication path
SFFCP the second far field communication path
PD data for projection
S11-S15 method step
S21-S24 method step
Embodiment
For fully understanding object of the present invention, feature and technique effect, here by following specific embodiment, and by reference to the accompanying drawings, the present invention is elaborated, be described as follows:
With reference to Fig. 1, it is the schematic flow sheet of the intelligent automatic means of communication of first embodiment of the invention.In Fig. 1, these intelligent automatic means of communication are applied to the first electronic installation and second electronic device, and this first electronic installation has the first near-field communication chip and the first far field communication chip and this second electronic device and has the second near-field communication chip and the second far field communication chip.
These intelligent automatic means of communication originate in step S11, produce a communication bag at this first electronic installation, for the communications setting file of this first far field communication chip of encapsulation.
Then step S12, this first electronic installation is moved towards this second electronic device, to allow this first near-field communication chip trigger this second near-field communication chip in a distance, and set up the first near-field communication path at this first near-field communication chip and this second near-field communication chip, for example this distance is approximately less than 10 centimetres, and (for example this first communication chip of marching into the arena is near-field communication agreement (Near Field Communication protocol, ) or be less than 10 meters (for example this first communication chip of marching into the arena is bluetooth communication agreement (Bluetooth communication protocol)) NFC).
Follow step S13, this communication bag is sent to this second electronic device by this first near-field communication path again.
Follow again step S14, this second electronic device is resolved this communication bag, to obtain this communications setting file and to be sent to this second far field communication chip.
Another then step S15, between this second far field communication chip and this first far field communication chip, set up the first far field communication path according to this communications setting file, the communication modes of this first electronic installation and this second electronic device changes this far field communication into by this near-field communication.
With reference to Fig. 2, it is the schematic flow sheet of the intelligent automatic means of communication of second embodiment of the invention.In Fig. 2, these intelligent automatic means of communication are applied to the first electronic installation, second electronic device and the 3rd electronic installation, and this first electronic installation has the first near-field communication chip and the first far field communication chip, this second electronic device and has the second near-field communication chip and the second far field communication chip and the 3rd electronic installation and have the 3rd near-field communication chip and the 3rd far field communication chip.
In the present embodiment, these intelligent automatic means of communication, except step S11 ~ S15 is identical with Fig. 1, also comprise step S21 ~ S24.
This step S21, after step S13, moves to the 3rd electronic installation by this second electronic device, and sets up the second near-field communication path by the 3rd near-field communication chip and this second near-field communication chip of the 3rd electronic installation.
Follow step S22, this communication bag is sent to the 3rd electronic installation by this second near-field communication path again.
Follow again step S23, the 3rd electronic installation is resolved this communication bag, to obtain this communications setting file and to be sent to the 3rd far field communication chip.
Another then step S24 sets up the second far field communication path according to this communications setting file between the 3rd far field communication chip and this first far field communication chip, and for example this second far field communication path can be internet.
With reference to Fig. 3, it is the block schematic diagram of the intelligent automatic communication system of first embodiment of the invention.In Fig. 3, this intelligent automatic communication system 10 comprises the first electronic installation 12 and second electronic device 14, and for example this first electronic installation 12 can be intelligent mobile device, panel computer or notebook computer etc. with this second electronic device 14.
This first electronic installation 12 has the first processing unit 122, the first near-field communication chip 124 and the first far field communication chip 126.This first processing unit 122 connects this first near-field communication chip 124 and this first far field communication chip 126, this first processing unit 122 produces communication bag CP (communication packet) again, and this first electronic installation 12 transmits this communication bag CP with this first near-field communication chip 124.This communication bag CP is packaged with the communications setting file CSF (communication setup file) of this first far field communication chip 126.
This second electronic device 14 has the second near-field communication chip 142, the second processing unit 144 and the second far field communication chip 146, again when being not more than (being less than or equal to) one between this first electronic installation 12 and this second electronic device 14 for example, during apart from d1 (be approximately less than 10 centimetres or be approximately less than 10 meters), this the first near-field communication chip 124 triggers this second near-field communication chip 142, to set up the first near-field communication path FNFCP (first near field communication path).
This second processing unit 144 connects this second near-field communication chip 142 and this second far field communication chip 146, and by this second near-field communication chip 142, this second electronic device 14 is connected with this first electronic installation 12 and receives this communication bag CP, this second processing unit 144 is resolved this communication bag CP to obtain this communications setting file CSF again.According to this communications setting file CSF, this second far field communication chip 146 forms the first far field communication path FFFCP (first far field communication path) with this first far field communication chip 126.
Moreover, in above-mentioned, this first near-field communication chip 124 meets near-field communication agreement or bluetooth communication agreement with this second near-field communication chip 142, and this first near-field communication chip 124 is selected this identical communications protocol with this second near-field communication chip 142, in order to carry out near-field communication.
In addition, this first far field communication chip 126 and this second far field communication chip 146 meet bluetooth communication agreement, Wireless Fidelity communications protocol (Wi-Fi communication protocol), radio universal serial bus (Wireless Universal Serial Bus) at least one of them.
With reference to Fig. 4, it is the block schematic diagram of the intelligent automatic communication system of second embodiment of the invention.In Fig. 4, this intelligent automatic communication system 10 ', except this first electronic installation 12 and this second electronic device 14 of comprising in Fig. 3, also comprises the 3rd electronic installation 16.
The 3rd electronic installation 16 has the 3rd processing unit 162, the 3rd near-field communication chip 164 and the 3rd far field communication chip 166.
When being not more than one between this second electronic device 14 and the 3rd electronic installation 16 for example, during apart from d2 (being approximately less than 10 centimetres or 10 meters), this the second near-field communication chip 142 triggers the 3rd near-field communication chip 164, in order to set up the second near-field communication path SNFCP (second near field communication path).
The 3rd processing unit 162 connects the 3rd near-field communication chip 164 and the 3rd far field communication chip 166, and the 3rd electronic installation 16 is connected with this second electronic device 14 by the 3rd near-field communication chip 164, this communication bag CP receiving in order to receive this second processing unit 144.Again, the 3rd processing unit 162 is resolved this communication bag CP to obtain this communications setting file CSF, the 3rd far field communication chip 162 forms the second far field communication path SFFCP (second far field communication path) according to this communications setting file CSF and this first far field communication chip 126, and for example this second far field communication path SFFCP is internet.
With reference to Fig. 5, it is the block schematic diagram of the intelligent automatic communication system of third embodiment of the invention.In Fig. 5, this intelligent automatic communication system 10 " comprise the first electronic installation 12 and second electronic device 14 '.Wherein, the description of this first electronic installation 12, with identical described in Fig. 3, is not repeated herein.
This second electronic device 14 ' has this second near-field communication chip 142, this second processing unit 144, this second far field communication chip 146 and the first projecting cell 148.
This first projecting cell 148 by this second processing unit 144 produce data for projection PD (projected data) be projected to a carrier (not shown).The data DA that this first far field communication path FFFCP is certainly obtained this first electronic installation 12 by this second processing unit 144 converts this data for projection PD to.
With reference to Fig. 6, it is the block schematic diagram of the intelligent automatic communication system of fourth embodiment of the invention.In Fig. 6, this intelligent automatic communication system 10 " ' comprise outside this first electronic installation 12 and this second electronic device 14 ' in Fig. 5, also comprise the 3rd electronic installation 16 with the second projecting cell 168.
The data for projection PD that this second projecting cell 168 produces the 3rd processing unit 162 is projected to a carrier.Wherein, the data DA that this second far field communication path SFFCP is certainly received this first electronic installation 12 by the 3rd processing unit 162 converts this data for projection PD to.
The present invention discloses with preferred embodiment hereinbefore, but it will be understood by those skilled in the art that this embodiment is only for describing the present invention, and should not be read as and limit the scope of the invention.It should be noted, variation and the displacement of every and this embodiment equivalence, all should be considered as being covered by category of the present invention.Therefore, protection scope of the present invention is when being as the criterion with the content that claims were limited.
Claims (11)
1. intelligent automatic means of communication, it is characterized in that, be applied to the first electronic installation and second electronic device, and this first electronic installation has the first near-field communication chip and the first far field communication chip and this second electronic device and has the second near-field communication chip and the second far field communication chip, and the method comprises:
Produce a communication bag at this first electronic installation, so that the communications setting file of this first far field communication chip is encapsulated in to this communication bag;
This first electronic installation is moved towards this second electronic device, to allow this first near-field communication chip trigger this second near-field communication chip, and set up the first near-field communication path between this first near-field communication chip and this second near-field communication chip in a distance;
This communication bag is sent to this second electronic device by this first near-field communication path;
This second electronic device is resolved this communication bag, to obtain this communications setting file and to be sent to this second far field communication chip; And
Between this second far field communication chip and this first far field communication chip, set up the first far field communication path according to this communications setting file.
2. the intelligent automatic means of communication as claimed in claim 1, is characterized in that, after this communication bag is sent to this second electronic device step by this first near-field communication path, also comprise:
This second electronic device is moved to the 3rd electronic installation with the 3rd near-field communication chip and the 3rd far field communication chip, and set up the second near-field communication path between the 3rd near-field communication chip and this second near-field communication chip;
This communication bag is sent to the 3rd electronic installation by this second near-field communication path;
The 3rd electronic installation is resolved this communication bag, to obtain this communications setting file and to be sent to the 3rd far field communication chip; And
Between the 3rd far field communication chip and this first far field communication chip, set up the second far field communication path according to this communications setting file.
3. the intelligent automatic means of communication as claimed in claim 2, is characterized in that, this first far field communication path and this second far field communication path are internet.
4. an intelligent automatic communication system, is characterized in that, this system comprises:
The first electronic installation, there is the first processing unit, the first near-field communication chip and the first far field communication chip, and this first processing unit connects this first near-field communication chip and this first far field communication chip, this first processing unit is for producing a communication bag again, and this first electronic installation transmits this communication bag by this first near-field communication chip, wherein in this communication bag, is packaged with the communications setting file of this first far field communication chip; And
Second electronic device, there is the second near-field communication chip, the second processing unit and the second far field communication chip, and this second processing unit connects this second near-field communication chip and this second far field communication chip, this second electronic device is connected with this first electronic installation by this second near-field communication chip, in order to receive this communication bag, this second processing unit is resolved this communication bag to obtain this communications setting file, and according to this communications setting file, between this second far field communication chip and this first far field communication chip, form the first far field communication path.
5. intelligent automatic communication system as claimed in claim 4, it is characterized in that, also comprise the 3rd electronic installation, there is the 3rd processing unit, the 3rd near-field communication chip and the 3rd far field communication chip, and the 3rd processing unit connects the 3rd near-field communication chip and the 3rd far field communication chip, the 3rd electronic installation is connected with this second electronic device by the 3rd near-field communication chip, this communication bag receiving in order to receive this second processing unit, the 3rd processing unit is resolved this communication bag to obtain this communications setting file, and between the 3rd far field communication chip and this first far field communication chip, form the second far field communication path according to this communications setting file.
6. intelligent automatic communication system as claimed in claim 5, is characterized in that, this first near-field communication chip, this second near-field communication chip and the 3rd near-field communication chip meet near-field communication agreement and bluetooth communication agreement at least one of them.
7. intelligent automatic communication system as claimed in claim 5, it is characterized in that, this first far field communication chip, this second far field communication chip and the 3rd far field communication chip meet bluetooth communication agreement, Wireless Fidelity communications protocol, radio universal serial bus at least one of them.
8. intelligent automatic communication system as claimed in claim 5, is characterized in that, this first far field communication path and this second far field communication path are internet.
9. intelligent automatic communication system as claimed in claim 5, it is characterized in that, when between this first electronic installation and this second electronic device, be not more than one apart from time, this first near-field communication chip triggers this second near-field communication chip, in order to set up this first near-field communication path.
10. intelligent automatic communication system as claimed in claim 4, it is characterized in that, this second electronic device also comprises the first projecting cell and is connected with this second processing unit, and the data for projection that this first projecting cell produces this second processing unit is projected to a carrier, wherein the data transaction that this first far field communication path receives this first electronic installation is certainly become this data for projection by this second processing unit.
11. intelligent automatic communication systems as claimed in claim 5, it is characterized in that, the 3rd electronic installation also comprises the second projecting cell and is connected with the 3rd processing unit, and the data for projection that this second projecting cell produces the 3rd processing unit is projected to a carrier, wherein the data transaction that this first far field communication path receives this first electronic installation is certainly become this data for projection by the 3rd processing unit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210461000.2A CN103812530A (en) | 2012-11-15 | 2012-11-15 | Intelligent automatic communication method and system |
| CN201510379819.8A CN105007101A (en) | 2012-11-15 | 2012-11-15 | Intelligent automatic communication method and system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210461000.2A CN103812530A (en) | 2012-11-15 | 2012-11-15 | Intelligent automatic communication method and system |
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| CN201510379819.8A Division CN105007101A (en) | 2012-11-15 | 2012-11-15 | Intelligent automatic communication method and system |
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| CN103812530A true CN103812530A (en) | 2014-05-21 |
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| CN201210461000.2A Pending CN103812530A (en) | 2012-11-15 | 2012-11-15 | Intelligent automatic communication method and system |
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| CN105007101A (en) | 2015-10-28 |
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Application publication date: 20140521 |