CN103811613A - 发光二极管磊晶结构 - Google Patents

发光二极管磊晶结构 Download PDF

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CN103811613A
CN103811613A CN201210459151.4A CN201210459151A CN103811613A CN 103811613 A CN103811613 A CN 103811613A CN 201210459151 A CN201210459151 A CN 201210459151A CN 103811613 A CN103811613 A CN 103811613A
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Prior art keywords
emitting diode
light
epitaxial structure
diode epitaxial
active layer
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连亚琦
洪梓健
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Priority to CN201210459151.4A priority Critical patent/CN103811613A/zh
Priority to TW101143515A priority patent/TW201419577A/zh
Priority to US13/962,956 priority patent/US20140131725A1/en
Publication of CN103811613A publication Critical patent/CN103811613A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
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  • Led Devices (AREA)

Abstract

本发明涉及一种发光二极管磊晶结构,其包括N型半导体层、设置在该N型半导体层上的活性层、以及设置在该活性层上的P型半导体层。该活性层的横截面为平行四边形,且该平行四边形的内角均不为直角。

Description

发光二极管磊晶结构
技术领域
本发明涉及一种磊晶结构,尤其涉及一种发光二极管磊晶结构。
背景技术
参见图1与图2,一般的半导体磊晶结构,如发光二极管磊晶结构100,包括依次形成在基板10上的N型半导体层20,活性层30与P型半导体层40。现有的半导体磊晶结构一般呈长方体状,活性层30的横截面31为长方形。由于活性层30的横截面31为长方形,因此,活性层30的四个角落的出光角度均为90度直角,因此,活性层30发出的光,经过活性层30的侧面反射后角度固定,从而容易在侧面上反复反射,并造成全反射,进而导致侧面出光效率低。
发明内容
有鉴于此,有必要提供一种具有较高侧面出光效率的发光二极管磊晶结构。
一种发光二极管磊晶结构,其包括N型半导体层、设置在该N型半导体层上的活性层、以及设置在该活性层上的P型半导体层。该活性层的横截面为平行四边形,且该平行四边形的内角均不为直角。
该发光二极管磊晶结构的活性层的横截面为平行四边形,活性层发出的光,经侧面反射后,光线的反射路径发生了改变,不容易造成全反射,而是从与其相邻的侧面出射,从而可以提高该发光二极管磊晶结构的侧面出光效率。进一步地,当活性层的横截面的面积不发生变化时,而横截面的形状由现有技术中的矩形改变成本发明中的内角均不为直角的平形四边形时,平形四边形的周长大于矩形的周长,从而使得该发光二极管磊晶结构的侧面出光面积增加,也可以进一步提高侧面出光效率。
附图说明
图1是现有技术提供的发光二极管磊晶结构的剖面示意图。
图2是图1中光线在活性层中的反射的俯视图。
图3是本发明实施例提供的发光二极管磊晶结构的剖面示意图。
图4是图3中光线在活性层中的反射的俯视图。
主要元件符号说明
发光二极管磊晶结构 100、200
基板 10、50
N型半导体层 20、60
活性层 30、70
P型半导体层 40、80
底面 201
侧面 202、203、204、205
顶面 206
上表面 71
下表面 72
横截面 31、73
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
图3所示为本发明实施例提供的发光二极管磊晶结构200。该发光二极管磊晶结构200包括依次形成在基板50上的N型半导体层60、活性层70以及P型半导体层80。
在本实施例中,该N型半导体层60为氮化镓半导体层(                                               
Figure 2012104591514100002DEST_PATH_IMAGE001
Figure 2012104591514100002DEST_PATH_IMAGE002
),该P型半导体层80为氮化镓半导体层。该活性层70为该发光二极管磊晶结构200的主发光层。
该发光二极管磊晶结构200包括一个底面201、四个侧面202、203、204、205以及一个顶面206。在本实施例中,该底面201为该N型半导体层60的底面,其与该基板50相接触。该顶面206为该P型半导体层80的顶面。该四个侧面202、203、204、205分别垂直于该发光二极管磊晶结构200的底面201与顶面206。
请一并参见图4,该活性层70包括一个上表面71与一个与该上表面71相对的下表面72,该上表面71与该下表面72分别平行于该发光二极管磊晶结构200的底面201与顶面206。该活性层70的横截面73为平行四边形,且该平行四边形的内角均不为直角。该活性层70可以为氮化镓层()或者氮化铝镓铟层(
Figure 2012104591514100002DEST_PATH_IMAGE003
)等。
氮化镓层(
Figure 814801DEST_PATH_IMAGE002
)与氮化铝镓铟层(
Figure 483679DEST_PATH_IMAGE003
)的折射系数均为2.3,相对于空气的折射率1而言,当光线由活性层70入射至空气时,其临界角度为25度。因此,当入射角均小于或者等于25度时,光线均可以从活性层70出射至空气中。由于在制作过程中,无法制作并封装出入射角小于或者等于25度的发光二极管磊晶结构。因此,本实施例中,取临界角度
Figure 414726DEST_PATH_IMAGE004
为25度的余角65度作为临界角。同理,当角度均大于或者等于65度时,光线均可以从活性层70出射至空气中。当然,在本实施例中,该角度需要小于90度。因此,当该活性层70为氮化镓层(
Figure 169056DEST_PATH_IMAGE002
)或者氮化铝镓铟层(
Figure 906068DEST_PATH_IMAGE003
)时,该活性层70的横截面73的其中一个内角θ为大于或者等于65度且小于90度。但同时,考虑到制程的方便,该活性层70的横截面73的其中一个内角θ的大小范围为大于等于65且小于等于80度。
由于该发光二极管磊晶结构200的活性层70的横截面73为平行四边形,且该平行四边形的内角均不为直角,因此,活性层70发出的光,经该活性层70的侧面反射后,光线的反射路径发生了改变,不容易造成全反射,而是从与其相邻的侧面出射,从而可以提高该发光二极管磊晶结构200的侧面出光效率。进一步地,当活性层70的横截面73的面积不发生变化时,而横截面73的形状由现有技术中的矩形改变成本发明中的内角均不为直角的平形四边形时,平形四边形的周长大于矩形的周长,从而使得该发光二极管磊晶结构200的侧面出光面积增加,也可以进一步提高侧面出光效率。
可以理解的是,本领域技术人员还可于本发明精神内做其它变化,只要其不偏离本发明的技术效果均可。这些依据本发明精神所做的变化,都应包含在本发明所要求保护的范围之内。

Claims (8)

1.一种发光二极管磊晶结构,其包括N型半导体层、设置在该N型半导体层上的活性层、以及设置在该活性层上的P型半导体层,其特征在于:该活性层的横截面为平行四边形,且该平行四边形的内角均不为直角。
2.如权利要求1所述的发光二极管磊晶结构,其特征在于,该活性层为氮化镓层或者氮化铝镓铟层。
3.如权利要求2所述的发光二极管磊晶结构,其特征在于,该活性层的横截面的其中一个内角大小范围为大于等于65度且小于90度。
4.如权利要求3所述的发光二极管磊晶结构,其特征在于,该活性层的横截面的其中一个内角大小范围为大于等于65度且小于等于80度。
5.如权利要求1所述的发光二极管磊晶结构,其特征在于,该发光二极管磊晶结构包括一个底面、四个侧面以及一个顶面,该四个侧面分别垂直于该底面与顶面。
6.如权利要求5所述的发光二极管磊晶结构,其特征在于,该活性层包括一个上表面与一个下表面,该上表面与该下表面分别平行于该发光二极管磊晶结构的底面与顶面。
7.如权利要求1所述的发光二极管磊晶结构,其特征在于,该N型半导体层为N型氮化镓半导体层。
8.如权利要求1所述的发光二极管磊晶结构,其特征在于,该P型半导体层为P型氮化镓半导体层。
CN201210459151.4A 2012-11-15 2012-11-15 发光二极管磊晶结构 Pending CN103811613A (zh)

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TW101143515A TW201419577A (zh) 2012-11-15 2012-11-21 發光二極體磊晶結構
US13/962,956 US20140131725A1 (en) 2012-11-15 2013-08-09 Light emitting diode epitaxy structure

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Citations (2)

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Publication number Priority date Publication date Assignee Title
CN102270717A (zh) * 2011-07-15 2011-12-07 华灿光电股份有限公司 一种弯曲衬底侧面的发光二极管芯片及其制备方法
CN102376834A (zh) * 2010-08-10 2012-03-14 亚威朗光电(中国)有限公司 非矩形发光器件

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JP3557011B2 (ja) * 1995-03-30 2004-08-25 株式会社東芝 半導体発光素子、及びその製造方法
JPH11340576A (ja) * 1998-05-28 1999-12-10 Sumitomo Electric Ind Ltd 窒化ガリウム系半導体デバイス
DE10032838B4 (de) * 2000-07-06 2015-08-20 Osram Opto Semiconductors Gmbh Strahlung emittierender Halbleiterchip und Verfahren zu dessen Herstellung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102376834A (zh) * 2010-08-10 2012-03-14 亚威朗光电(中国)有限公司 非矩形发光器件
CN102270717A (zh) * 2011-07-15 2011-12-07 华灿光电股份有限公司 一种弯曲衬底侧面的发光二极管芯片及其制备方法

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Application publication date: 20140521