CN103809143A - Arrangement method of WAT (wafer acceptance test) head - Google Patents
Arrangement method of WAT (wafer acceptance test) head Download PDFInfo
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- CN103809143A CN103809143A CN201310612743.XA CN201310612743A CN103809143A CN 103809143 A CN103809143 A CN 103809143A CN 201310612743 A CN201310612743 A CN 201310612743A CN 103809143 A CN103809143 A CN 103809143A
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- wat
- measuring head
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- fluid pressure
- hydraulic driving
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Abstract
The invention discloses an arrangement method of a WAT head. The method comprises a hydraulic driving device and a control device, wherein the hydraulic driving device comprises four hydraulic driving lifting rods, the upper surface of a probe machine table is fixedly provided with the four hydraulic driving lifting rods, and the four hydraulic driving lifting rods are fixedly connected to the four corners of the bottom surface of the test head; the control device is electrically connected with the hydraulic driving device. When the test head is maintained, a rotating type scheme is replaced by a test head lifting type scheme, so that space occupation can be reduced.
Description
Technical field
The present invention relates to semiconductor test field, relate in particular to a kind of method for arranging of novel WAT measuring head.
Background technology
WAT machine as shown in Figure 1, can acceptance test for current (WAT) wafer, board is by Tester(tester table) and Prober(probe board) two parts form, wherein Tester is divided into rack and measuring head: normal condition board floor area is about 6m^2.Wherein measuring head is turnover structure, hinge by Prober drives, can Rotate 180 degree by turning axle: in the time that service work is done to measuring head part by equipment or manufacturer, can need measuring head to turn over turnback, be used for measuring head part to do corresponding maintenance job.But after upset, laterally can take ground space more, take floor area more and be about 9m^2, have more 50% floor area.Along with the demand of production capacity is increasing, WAT board can constantly increase, and arranging of board is more and more tightr, and the floor area of each is more and more less like this, if when the floor area of every board is less than 9m^2, the upset scheme of measuring head just cannot realize because take up an area the reason in space.
Chinese patent WAT probe intelligent processing system and method (publication number CN103336256A) disclose a kind of WAT probe intelligent processing system and method, and this system comprises the steps: real time record and adds up probe pricking times; The accumulation pricking times of detector probe card; Judge whether the accumulative total pricking times of probe exceedes the upper limit of setting, if do not exceed, continue test, otherwise enter next step; Send information.But this invention is during for WAT upkeep operation, the particular location of measuring head gives technical scheme
Summary of the invention
The defect existing for technique scheme, the invention provides a kind of method for arranging of WAT measuring head, wherein, comprise: fluid pressure drive device, described fluid pressure drive device comprises four hydraulic-driven elevating levers, at fixing described four the hydraulic-driven elevating levers of upper surface of probe board, described four hydraulic-driven elevating levers are fixedly connected on respectively four drift angle places of described measuring head bottom surface; Also provide a control device, described control device and the electrical connection of described fluid pressure drive device.
The method for arranging of above-mentioned WAT measuring head, wherein, described fluid pressure drive device also comprises miniature hydraulic pump, described four driving elevating levers connect described miniature hydraulic pump.
The invention has the beneficial effects as follows in sum: in maintenance measuring head, the scheme of a use test lift replaces convertible scheme, is used for saving extra occupation of land space.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that the jacking condition of hydraulic actuator changes;
Fig. 2 is the structural representation of the measuring head of Rotate 180 degree in prior art;
Fig. 3 is the layout schematic diagram of WAT measuring head;
Fig. 4 is the layout schematic diagram of WAT measuring head;
Fig. 5 be WAT measuring head overlook layout schematic diagram.
Embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described, but not as limiting to the invention.
As shown in Figures 1 to 5, a kind of method for arranging of WAT measuring head, wherein, comprise: fluid pressure drive device 5, described fluid pressure drive device 5 comprises four hydraulic-driven elevating levers 4, at fixing described four the hydraulic-driven elevating levers 4 of upper surface of probe board 2, described four hydraulic-driven elevating levers 4 are fixedly connected on respectively four drift angle places of described measuring head 1 bottom surface; One control device (not in the accompanying drawings mark) is also provided, and described control device and described fluid pressure drive device 5 are electrically connected.
WAT machine comprises tester table 3 and Prober probe board 2, at probe board 2(Prober board) 4 hydraulic actuators 5 of increase, and be connected with measuring head 1, when need to rising measuring head 1, send instruction by control device, hydraulic actuator 5 is extended, reach to extend after maximum rating and stop; After measuring head maintenance finishes, send instruction by control device, hydraulic actuator 5 is shortened, stop after being reduced into original state, complete.
Preferably, described fluid pressure drive device also comprises miniature hydraulic pump (not in the accompanying drawings mark), and described four driving elevating levers connect described miniature hydraulic pump.
It should be appreciated by those skilled in the art that those skilled in the art can realize described variation example in conjunction with prior art and above-described embodiment, do not repeat them here.Such variation example does not affect flesh and blood of the present invention, does not repeat them here.
Above preferred embodiment of the present invention is described.It will be appreciated that, the present invention is not limited to above-mentioned specific implementations, the equipment of wherein not describing in detail to the greatest extent and structure are construed as and give any those of ordinary skill in the art of reality with the common mode in this area, do not departing from technical solution of the present invention scope situation, all can utilize method and the technology contents of above-mentioned announcement to make many possible variations and modification to technical solution of the present invention, or being revised as the equivalent embodiment of equivalent variations, this does not affect flesh and blood of the present invention.Therefore, every content that does not depart from technical solution of the present invention,, all still belongs in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.
Claims (2)
1. the method for arranging of a WAT measuring head, it is characterized in that, comprise: fluid pressure drive device, described fluid pressure drive device comprises four hydraulic-driven elevating levers, at fixing described four the hydraulic-driven elevating levers of upper surface of probe board, described four hydraulic-driven elevating levers are fixedly connected on respectively four drift angle places of described measuring head bottom surface; Also provide a control device, described control device and the electrical connection of described fluid pressure drive device.
2. the method for arranging of WAT measuring head as claimed in claim 1, is characterized in that, described fluid pressure drive device also comprises miniature hydraulic pump, and described four driving elevating levers connect described miniature hydraulic pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310612743.XA CN103809143B (en) | 2013-11-26 | 2013-11-26 | Arrangement method of WAT (wafer acceptance test) head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310612743.XA CN103809143B (en) | 2013-11-26 | 2013-11-26 | Arrangement method of WAT (wafer acceptance test) head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103809143A true CN103809143A (en) | 2014-05-21 |
| CN103809143B CN103809143B (en) | 2017-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310612743.XA Active CN103809143B (en) | 2013-11-26 | 2013-11-26 | Arrangement method of WAT (wafer acceptance test) head |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111190091A (en) * | 2019-12-26 | 2020-05-22 | 华虹半导体(无锡)有限公司 | Test head of WAT equipment and diagnosis and repair method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008170194A (en) * | 2007-01-09 | 2008-07-24 | Yamaha Corp | Test method of electronic device, tester of electronic device, and test system of electronic device |
| CN101477961A (en) * | 2008-01-03 | 2009-07-08 | 京元电子股份有限公司 | Wafer raising platform and wafer test machine |
| CN102539852A (en) * | 2012-03-14 | 2012-07-04 | 中南大学 | Test head for automatically detecting wafer-level packaged chips and implementing method for test head |
| CN202423247U (en) * | 2011-12-21 | 2012-09-05 | 上海华虹Nec电子有限公司 | Tray of probe table with changeable height |
| CN203019050U (en) * | 2012-11-22 | 2013-06-26 | 天津滨海龙泰科技发展有限公司 | Lifting carrier roller |
| CN203266384U (en) * | 2013-05-31 | 2013-11-06 | 鉅仑科技股份有限公司 | Wafer grinding machine |
-
2013
- 2013-11-26 CN CN201310612743.XA patent/CN103809143B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008170194A (en) * | 2007-01-09 | 2008-07-24 | Yamaha Corp | Test method of electronic device, tester of electronic device, and test system of electronic device |
| CN101477961A (en) * | 2008-01-03 | 2009-07-08 | 京元电子股份有限公司 | Wafer raising platform and wafer test machine |
| CN202423247U (en) * | 2011-12-21 | 2012-09-05 | 上海华虹Nec电子有限公司 | Tray of probe table with changeable height |
| CN102539852A (en) * | 2012-03-14 | 2012-07-04 | 中南大学 | Test head for automatically detecting wafer-level packaged chips and implementing method for test head |
| CN203019050U (en) * | 2012-11-22 | 2013-06-26 | 天津滨海龙泰科技发展有限公司 | Lifting carrier roller |
| CN203266384U (en) * | 2013-05-31 | 2013-11-06 | 鉅仑科技股份有限公司 | Wafer grinding machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111190091A (en) * | 2019-12-26 | 2020-05-22 | 华虹半导体(无锡)有限公司 | Test head of WAT equipment and diagnosis and repair method thereof |
| CN111190091B (en) * | 2019-12-26 | 2021-11-09 | 华虹半导体(无锡)有限公司 | Test head of WAT equipment and diagnosis and repair method thereof |
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| Publication number | Publication date |
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| CN103809143B (en) | 2017-01-18 |
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