CN103805101A - Low-formaldehyde high-strength adhesive and preparation method thereof - Google Patents

Low-formaldehyde high-strength adhesive and preparation method thereof Download PDF

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Publication number
CN103805101A
CN103805101A CN201310749371.5A CN201310749371A CN103805101A CN 103805101 A CN103805101 A CN 103805101A CN 201310749371 A CN201310749371 A CN 201310749371A CN 103805101 A CN103805101 A CN 103805101A
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formaldehyde
add
sodium hydroxide
polyvinyl alcohol
low
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CN201310749371.5A
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蒙献芳
周子茜
马庆
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GUANGXI JISHUN ENERGY TECHNOLOGY Co Ltd
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GUANGXI JISHUN ENERGY TECHNOLOGY Co Ltd
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Abstract

The invention discloses a low-formaldehyde high-strength adhesive and a preparation method thereof. The adhesive comprises the following raw materials: deionized water, formaldehyde, urea, polyvinyl alcohol, biomass, acetic acid, sodium hydroxide, a curing agent and tannin. The preparation method comprises the following steps: adding the deionized water and the polyvinyl alcohol to a reaction pot according to the ratio; heating to completely dissolve the polyvinyl alcohol; adding the biomass and evenly agitating after completely dissolving; dropwise adding the acetic acid to agitate after the solution is cooled; adding the formaldehyde to carry out condensation reaction; dripping the sodium hydroxide to adjust the pH value to neutral property after cooling; adding the urea to carry out amination treatment; adding the tannin and the curing agent to evenly agitate; dropwise adding the sodium hydroxide to adjust the pH value after sampling and checking out; and cooling, filtering and discharging, bulking by a barrel, so as to obtain the low-formaldehyde high-strength adhesive. An adhesive prepared by adopting a traditional technical formula is high in free formaldehyde content in general, and generates a great harm to a human body. The adhesive disclosed by the invention has the advantages of low free formaldehyde, high bonding strength, rapid curing, low cost and the like according with the standards.

Description

A kind of low formaldehyde high-strength structureal adhesives and preparation method thereof
Technical field
The tackiness agent and the manufacturing process field that the present invention relates to bonding timber, relate in particular to a kind of low formaldehyde high-strength structureal adhesives and preparation method thereof.
Background technology
Tackiness agent, is mainly used in wood-based plate and building material industry.Due in recent years, the harm of formaldehyde more and more comes into one's own, and formaldehyde is a kind of colourless easily molten irritant gas, and human body is had compared with major injury.The woodwork that contains the making of glutol stick is for indoor, and formaldehyde release period is 15 years.Research shows: Long Term Contact low dosage formaldehyde can cause chronic respiratory tract disease, cause nasopharyngeal carcinoma, colorectal carcinoma, brain tumor, menoxenia, nuclear transgenation, reparation, the pregnancy syndrome of commissure and DNA and protein commissure and inhibition DNA damage in DNA single chain, cause neonatal chromosome disorder, leukemia, cause that teenager's memory and intelligence decline.In all contactees, children and pregnant woman's PARA FORMALDEHYDE PRILLS(91,95) are particularly responsive, and harm is also just larger.Formaldehyde is more highly toxic material, preferentially controls formaldehyde on list be in second at China's noxious chemical.Formaldehyde is defined as carcinogenic and causes deformed material by the World Health Organization, is generally acknowledged allergen, is also one of potential strong mutagen.
On market, for the main urea-formaldehyde glue of artificial board adhesive, phenolic glue and carbamide glue all must be take formaldehyde as one of main raw material.Current Formaldehyde Pollution of Indoor Air is mainly from carboxaldehyde radicals tackiness agent and the coating used such as furniture, decoration, and its formaldehyde release period reaches 3-15, had a strong impact on our healthy living.
The tackiness agent of a kind of low formaldehyde of now development is current trend, the tackiness agent that adopts now traditional technology formula to make, free formaldehyde content is generally higher, and the artificial board of manufacturing is as for furniture and interior decoration, free formaldehyde just can evaporate, and human body is produced to harm greatly.
Summary of the invention
For the problems referred to above, the object of the present invention is to provide a kind of low formaldehyde high-strength structureal adhesives and preparation method thereof, solve that existing polymer adhesive intensity is lower, the problem such as the formaldehyde of poor water resistance and content overproof, obtain tackiness agent up to standard.
The technical solution used in the present invention is as follows:
A kind of low formaldehyde high-strength structureal adhesives, are made up of the formula of following raw materials by weight: deionized water 65~75%, formaldehyde 3.8~4.5%, urea 5~10%, polyvinyl alcohol 10~15%, biomass 5~7%, acetic acid 0.1~0.2%, sodium hydroxide 0.12~0.25%, solidifying agent 0.05~0.1%, tannin 0.02~0.05%.
Further, described biomass be a kind of in wheat-flour, peanut hull meal, tree bark powder and bean powder or and composition thereof.
A kind of prepare low formaldehyde high-strength structureal adhesives method, comprises the following steps:
A) in reactor, add deionized water by proportioning, while being warming up to 60~65 ℃, add polyvinyl alcohol, then be warming up to 85~95 ℃, polyvinyl alcohol is dissolved completely, after dissolving completely, add biomass and stir;
B) treat that solution is cooled to 70~80 ℃, drip acetic acid and stir 20min simultaneously, add formaldehyde to carry out condensation reaction; While being cooled to 60~65 ℃, add sodium hydroxide to regulate pH value to 7.0~8.0;
C) add urea to carry out amination processing, then add tannin, solidifying agent to stir, after inspection by sampling is qualified, drip sodium hydroxide adjust pH to 8.0~9.0, lower the temperature 40~50 ℃, filter discharging, filling with bucket, to obtain final product.
Owing to adopting such scheme, the invention has the beneficial effects as follows:
(1) add the biomass such as bean powder, peanut hull meal, tree bark powder or wheat-flour, and add urea and tannin to mix, the layer and the high tackiness agent of intensity that obtain, and good combination property, have advantages of that bonding strength is high, quick solidifying; Initial viscosity is large, water white transparency and do not pollute timber-work;
(2) starting material source is abundant, cheap, and preparation method is simple; Reach national 1 class glued board standard-required with the offset plate material of this glue production;
(3) acetalation is thermo-negative reaction, temperature of the present invention be controlled at 85 ℃~88 ℃ comparatively suitable.If temperature is higher than 90 ℃, such as reaction acidity is slightly low again, easily occurs implode and forms the gel group aqueous solution that dissociates.When the present invention adopts deionized water to make reaction medium, the key technical indexes of product is entirely qualified, and property indices is good.
(4) reduce the free formaldehyde in tackiness agent by the ratio that changes formaldehyde and urea; Adjust the structure of tackiness agent by pH value and the temperature of reaction controlled in reaction process, and manufacture and produce qualified artificial board.
Embodiment
Embodiment 1
The technical scheme that the present embodiment 1 adopts is:
A kind of low formaldehyde high-strength structureal adhesives, is characterized in that being made up of the formula of following raw materials by weight: deionized water 65%, formaldehyde 4.5%, urea 10%, polyvinyl alcohol 10%, wheat-flour 7%, acetic acid 0.2%, sodium hydroxide 0.25%, solidifying agent 0.1%, tannin 0.05%.
A kind of prepare low formaldehyde high-strength structureal adhesives method, comprises the following steps:
A) in reactor, add deionized water by proportioning, while being warming up to 60 ℃, add polyvinyl alcohol, then be warming up to 85 ℃, polyvinyl alcohol is dissolved completely, after dissolving completely, add wheat-flour and stir;
B) treat that solution is cooled to 70 ℃, drip acetic acid and stir 20min simultaneously, add formaldehyde to carry out condensation reaction; While being cooled to 60 ℃, add sodium hydroxide to regulate pH value to 7.0;
C) add urea to carry out amination processing, then add tannin, solidifying agent to stir, after inspection by sampling is qualified, drip sodium hydroxide adjust pH to 8.0, lower the temperature 50 ℃, filter discharging, filling with bucket, to obtain final product.
Embodiment 2
The technical scheme that the present embodiment 2 adopts is:
A kind of low formaldehyde high-strength structureal adhesives, are made up of the formula of following raw materials by weight: deionized water 75%, formaldehyde 3.8%, urea 5%, polyvinyl alcohol 10%, wheat-flour 5%, acetic acid 0.2%, sodium hydroxide 0.12%, solidifying agent 0.1%, tannin 0.05%.
A kind of prepare low formaldehyde high-strength structureal adhesives method, comprises the following steps:
A) in reactor, add deionized water by proportioning, while being warming up to 65 ℃, add polyvinyl alcohol, then be warming up to 85 ℃, polyvinyl alcohol is dissolved completely, after dissolving completely, add wheat-flour and stir;
B) treat that solution is cooled to 70 ℃, drip acetic acid and stir 20min simultaneously, add formaldehyde to carry out condensation reaction; While being cooled to 65 ℃, add sodium hydroxide to regulate pH value to 8.0;
C) add urea to carry out amination processing, then add tannin, solidifying agent to stir, after inspection by sampling is qualified, drip sodium hydroxide adjust pH to 9.0, lower the temperature 40 ℃, filter discharging, filling with bucket, to obtain final product.
Embodiment 3
The technical scheme that the present embodiment 3 adopts is:
A kind of low formaldehyde high-strength structureal adhesives, are made up of the formula of following raw materials by weight: deionized water 70%, formaldehyde 4.0%, urea 5%, polyvinyl alcohol 15%, biomass 5%, acetic acid 0.15%, sodium hydroxide 0.2%, solidifying agent 0.08%, tannin 0.03%.
A kind of prepare low formaldehyde high-strength structureal adhesives method, comprises the following steps:
A) in reactor, add deionized water by proportioning, while being warming up to 60 ℃, add polyvinyl alcohol, then be warming up to 85 ℃, polyvinyl alcohol is dissolved completely, after dissolving completely, add biomass and stir;
B) treat that solution is cooled to 75 ℃, drip acetic acid and stir 20min simultaneously, add formaldehyde to carry out condensation reaction; While being cooled to 60 ℃, add sodium hydroxide to regulate pH value to 7.0;
C) add urea to carry out amination processing, then add tannin, solidifying agent to stir, after inspection by sampling is qualified, drip sodium hydroxide adjust pH to 8.0, lower the temperature 45 ℃, filter discharging, filling with bucket, to obtain final product.
In other embodiment, biomass can be selected bean powder, peanut hull meal, tree bark powder or wheat-flour.
The tackiness agent obtaining with above-described embodiment 1~3 is respectively made three layers of glued board, board selection birch veneer, the present invention of other sheet material is all suitable for: resin added is 250g/m, 110 ℃ of hot pressing temperatures, hot pressing time 7min, three layers of glued board producing are detected, detect the detected results such as bonding strength and burst size of methanal according to GB/T 17657-1999 " wood-based plate and face artificial board physicochemical property experimental technique " as shown in table 1.
Table 1 embodiment is tackiness agent and control group physical properties contrast experiment data for 1~3 glued board
Figure 2013107493715100002DEST_PATH_IMAGE002
In table, control group is normal plywood sizing agent, as urea-formaldehyde glue.
Through consulting a large amount of data and test many times, contriver obtains tackiness agent of the present invention, and wherein the weight proportion of each component is the preferably value range that the each side factors such as water tolerance, bonding strength, burst size of methanal and period of storage, the production cost of considering tackiness agent obtain.Experiment shows that sizing agent of the present invention has the advantages that water-tolerant, bonding height, burst size of methanal are low, period of storage is long.Substitute the production of urea-formaldehyde glue for wood-based plate, fundamentally solve the formaldehyde pollution problem that industry of artificial boards exists.
Contriver is also by having done related experiment to above-described embodiment, show: add the biomass such as bean powder, peanut hull meal, tree bark powder or wheat-flour, and add urea and tannin to mix, the layer and the high tackiness agent of intensity that obtain, and good combination property, has advantages of that bonding strength is high, quick solidifying; Initial viscosity is large, water white transparency and do not pollute timber-work; Starting material source is abundant, cheap, and preparation method is simple; Reach national 1 class glued board standard-required with the offset plate material of this glue production; The present invention reduces the free formaldehyde in tackiness agent by the ratio that changes formaldehyde and urea; Adjust the structure of tackiness agent by pH value and the temperature of reaction controlled in reaction process, and manufacture and produce qualified artificial board.
Therefore, this sizing agent has that bonding strength is high, quick solidifying, manufacture are simple, excellent property and with low cost, the advantage such as raw material sources are extensive.

Claims (3)

1. low formaldehyde high-strength structureal adhesives, is characterized in that being made up of the formula of following raw materials by weight: deionized water 65~75%, formaldehyde 3.8~4.5%, urea 5~10%, polyvinyl alcohol 10~15%, biomass 5~7%, acetic acid 0.1~0.2%, sodium hydroxide 0.12~0.25%, solidifying agent 0.05~0.1%, tannin 0.02~0.05%.
2. the low formaldehyde high-strength structureal adhesives of one as claimed in claim 1, it is characterized in that described biomass be a kind of in wheat-flour, peanut hull meal, tree bark powder and bean powder or and composition thereof.
3. the method for preparation a kind of low formaldehyde high-strength structureal adhesives claimed in claim 1, is characterized in that comprising the following steps:
A) in reactor, add deionized water by proportioning, while being warming up to 60~65 ℃, add polyvinyl alcohol, then be warming up to 85~95 ℃, polyvinyl alcohol is dissolved completely, after dissolving completely, add biomass and stir;
B) treat that solution is cooled to 70~80 ℃, drip acetic acid and stir 20min simultaneously, add formaldehyde to carry out condensation reaction; While being cooled to 60~65 ℃, add sodium hydroxide to regulate pH value to 7.0~8.0;
C) add urea to carry out amination processing, then add tannin, solidifying agent to stir, after inspection by sampling is qualified, drip sodium hydroxide adjust pH to 8.0~9.0, lower the temperature 40~50 ℃, filter discharging, filling with bucket, to obtain final product.
CN201310749371.5A 2013-12-31 2013-12-31 Low-formaldehyde high-strength adhesive and preparation method thereof Pending CN103805101A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109135624A (en) * 2018-08-08 2019-01-04 阜南盛原木业有限公司 A kind of glued board adhesive of shelf-stable low-methoxyl aldehyde
CN113462321A (en) * 2021-07-15 2021-10-01 阳信瑞鑫毛制品有限公司 Fastening glue for bonding carpet and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101709206A (en) * 2009-10-29 2010-05-19 曲阜市慧迪化工有限责任公司 Modified urea-formaldehyde resin glue and production method thereof
JP2011086667A (en) * 2009-10-13 2011-04-28 Asahi Kasei E-Materials Corp Die bonding paste and semiconductor device
CN102618210A (en) * 2012-03-26 2012-08-01 田志壮 Formaldehyde-free adhesive and method for producing formaldehyde-free palm fiber mattress by using same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011086667A (en) * 2009-10-13 2011-04-28 Asahi Kasei E-Materials Corp Die bonding paste and semiconductor device
CN101709206A (en) * 2009-10-29 2010-05-19 曲阜市慧迪化工有限责任公司 Modified urea-formaldehyde resin glue and production method thereof
CN102618210A (en) * 2012-03-26 2012-08-01 田志壮 Formaldehyde-free adhesive and method for producing formaldehyde-free palm fiber mattress by using same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109135624A (en) * 2018-08-08 2019-01-04 阜南盛原木业有限公司 A kind of glued board adhesive of shelf-stable low-methoxyl aldehyde
CN113462321A (en) * 2021-07-15 2021-10-01 阳信瑞鑫毛制品有限公司 Fastening glue for bonding carpet and preparation method thereof

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Application publication date: 20140521