CN103802310A - Preparation method of workpiece and electric equipment containing workpiece - Google Patents
Preparation method of workpiece and electric equipment containing workpiece Download PDFInfo
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- CN103802310A CN103802310A CN201210451099.8A CN201210451099A CN103802310A CN 103802310 A CN103802310 A CN 103802310A CN 201210451099 A CN201210451099 A CN 201210451099A CN 103802310 A CN103802310 A CN 103802310A
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Abstract
The invention provides a preparation method of a workpiece. The preparation method comprises the following steps: providing a first molding board and a second molding board, wherein the first molding board is prepared from a first material, the second molding board is prepared from a second material and/or a third material, and the first material and the third material can be molten under a first condition; connecting the first molding board with the second molding board under the first condition; and melting the first material or the third material under the first condition, and forming a connection part at the junction of the first molding board and the second molding board. When the workpiece prepared by the method is used by electric equipment, the electric equipment is not thickened.
Description
Technical field
The present invention relates to composite processing field, the electronic equipment that is specifically related to a kind of preparation method of workpiece and comprises this workpiece.
Background technology
Along with scientific and technological development, intelligent and attractive in appearanceization become two developing directions of mobile terminal, especially take touch screen smart mobile phone, panel computer, video/audio player etc. as main, again especially with intelligent touch-screen mobile phone for very.Along with the screen of touch-screen mobile phone is increasing, thickness is more and more thinner, just more careful to the protection of mobile phone screen.
The Optimal action of protection mobile phone is to add containment vessel or protective sleeve to mobile phone at present; there is the over cap that covers described mobile phone screen; but no matter be that over cap, protective sleeve or over cap are all need to be at electronic equipment nested or stick to wherein; increase the thickness of mobile terminal; be unfavorable for attractive in appearancely, be inconvenient to carry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of preparation method of workpiece, makes workpiece prepared by the method when for electronic equipment, can not increase electronic equipment thickness.
In order to solve above technical problem, the invention provides a kind of preparation method of workpiece, comprising:
The first profiled sheeting and the second profiled sheeting are provided; Described the first profiled sheeting is made up of the first material; Described the second profiled sheeting is made up of the second material and/or the 3rd material; Described the first material and described the 3rd material can meltings under first condition;
Described the first profiled sheeting is connected under first condition with described the second profiled sheeting; Described the first material or the 3rd material under first condition melting and described the first profiled sheeting and described second profiled sheeting lap-joint form connecting portion.
Preferably, the one side between described the first profiled sheeting and described the second profiled sheeting is connected.
Preferably, described the first material, the second material, bending strength a, the b of the 3rd material, c meet following relation: a >=c>b.
Preferably, described first condition is ultrasonic wave hot pressing.
Preferably, the ultrasonic intensity of described ultrasonic wave hot pressing is 15 ~ 1010kHz.
Preferably, described the first profiled sheeting can relatively rotate along the described parallel direction that is connected trace with described the second profiled sheeting.
Preferably, the one side of described the first profiled sheeting is provided with sidewall and connects the rib of described sidewall.
Preferably, described in described the second profiled sheeting comprises that at least one aspect layer and at least one layer interlayer be positioned at; Described surface layer is made up of the second material, and described interlayer is made up of the 3rd material.
The present invention also provides a kind of electronic equipment, comprising:
Apparatus body;
Over cap comprises the first profiled sheeting and the second profiled sheeting, and the one side between described the first profiled sheeting and described the second profiled sheeting is connected;
Described the first profiled sheeting is fixed on described apparatus body by snap fit;
Described the first profiled sheeting is made up of the first material; Described the second profiled sheeting is made up of the second material and/or the 3rd material; Described the first material and described the 3rd material can meltings under first condition;
Described the second profiled sheeting is with respect to described apparatus body when the primary importance, and described over cap hides the first surface of described apparatus body; Described over cap is with respect to described apparatus body when the second place, and the first surface of described apparatus body appears.
Preferably, described over cap is prepared by following methods:
The first profiled sheeting and the second profiled sheeting are provided; Described the first profiled sheeting is made up of the first material; Described the second profiled sheeting is made up of the second material and/or the 3rd material; Described the first material and described the 3rd material can meltings under first condition;
Described the first profiled sheeting is connected with the melting under first condition of described the second profiled sheeting; Described the first material or the 3rd material under first condition melting and described the first profiled sheeting and described second profiled sheeting junction form connecting portion.
The first profiled sheeting and the second profiled sheeting are passed through bond vitrified under first condition by preparation method provided by the invention, after connecting, form an entirety, this workpiece is used for after electronic equipment, can not increase again electronic equipment thickness, and because the first profiled sheeting is different from the material that the second profiled sheeting uses, can obtain different feels and decorative effect.
Accompanying drawing explanation
Schematic diagram inside the first profiled sheeting that Fig. 1 embodiment of the present invention provides;
The second profiled sheeting structural representation that Fig. 2 embodiment of the present invention provides;
The first profiled sheeting that Fig. 3 embodiment of the present invention provides and the second profiled sheeting machining sketch chart;
Another kind the first profiled sheeting that Fig. 4 embodiment of the present invention provides and the second profiled sheeting machining sketch chart;
The position view of induced magnet and hall device in embodiment of a kind of electronic equipment of Fig. 5 the present invention;
The position view of induced magnet and hall device in embodiment of a kind of electronic equipment of Fig. 6 the present invention;
The first profiled sheeting and the second profiled sheeting schematic diagram in an embodiment of Fig. 7 a kind of electronic equipment provided by the invention.
The specific embodiment
In order further to understand the present invention, below in conjunction with embodiment, the preferred embodiments of the invention are described, but should be appreciated that these are described is the restriction for further illustrating the features and advantages of the present invention rather than patent of the present invention being required.
The invention provides a kind of preparation method of workpiece, the method can be applied to mobile phone, panel computer, notebook computer, video/audio player etc. and have the shell on the back of electronic equipment and the over cap design of touch screen displays.Described shell on the back and over cap are formed to an entirety, guaranteeing, under the prerequisite of hot strength and bending strength, not increase the thickness of electronic equipment as far as possible.
The method comprises:
The first profiled sheeting and the second profiled sheeting are provided; Described the first profiled sheeting is made up of the first material; Described the second profiled sheeting is made up of the second material and/or the 3rd material; Described the first material and described the 3rd material can meltings under first condition;
Described the first profiled sheeting is connected under first condition with described the second profiled sheeting; Described the first material or the 3rd material under first condition melting and described the first profiled sheeting and described second profiled sheeting lap-joint form connecting portion.
According to the present invention, described the first profiled sheeting is preferably has high tensile and high composite bending modulus sheet material, more preferably has the sheet material compared with minimal thickness.
In addition, a side of described the first profiled sheeting preferably includes sidewall and connects the gusset of described sidewall, and described gusset is preferably included in the housing of described sidewall and the formation of plate face, and described sidewall and described plate face are preferably arc transition.
Described the first profiled sheeting is made up of the first material, described the first material will meet all requirements that described the first profiled sheeting meets, so described the first material should have good tensile property and anti-bending strength, concrete can be the composite with polymeric material, metal or alloy material and metal or alloy and the polymer of the bending resistance of high strength high-impact.More preferably almag or Merlon.Use this different materials in providing intensity and protective value to electronic equipment, can make the profiled sheeting of thinner thickness, reduce the thickness of electronic equipment.
In a specific embodiment, as shown in Figure 1, described the first profiled sheeting is preferably the bonnet of described electronic equipment, for sealing and protecting the electronic device in described electronic equipment, prevents that the part causing because colliding with is scattered, and prevents that dust from entering electronic equipment.In this embodiment, described the first profiled sheeting comprises sidewall 1, gusset 2, and preferred gusset one side also preferably includes the equipment mechanism 3 matching with described electronic equipment, and described equipment mechanism is preferably snap fit.
According to the present invention, described the second profiled sheeting is preferably has deflection and the figuratum sheet material of tool.Described the second profiled sheeting is made up of the second material and/or the 3rd material.Described the second material is preferably the material with excellent handle, more preferably corium, PU skin or flexible PVC, preparation technology is preparation technology well known to those skilled in the art, described the 3rd material is preferably the material with hot strength and deflection, more preferably one or more in glass mat, poly-carbonic acid acid esters, metal alloy, and described the 3rd material is can described the first material identical, also can be different.Preferred, described in described the second profiled sheeting comprises that at least one aspect layer and at least one layer interlayer be positioned at; Described surface layer is made up of the second material, and described interlayer is made up of the 3rd material.
According to the present invention, described the first material, the second material, bending strength a, the b of the 3rd material, c meet the following a of relation >=c>b.While using on electronic equipment due to the first profiled sheeting and the second profiled sheeting, play different effects, so the material using can be variant.
In addition, described the first material, the second material, the 3rd material all can be in meltings under first condition, preferred, described the first material, the 3rd material melting under described first condition.
Described the second profiled sheeting structure preferably as shown in Figure 2, comprising: surface layer 21, interlayer 22.Described surface layer is formed by PU skin or corium, and described interlayer is glass mat.
The over cap that described the second profiled sheeting is described electronic equipment, and described the second profiled sheeting and described the first profiled sheeting form entirety under first condition.The connecting portion that described the second profiled sheeting can form around itself and the first profiled sheeting rotates.The over cap that described the second profiled sheeting is described electronic equipment, over cap can be protected the screen of electronic equipment, avoids being scratched because of the exposed of screen.The another side of the surface layer of described the second profiled sheeting and the first profiled sheeting preferably contains pattern in addition, can make described electronic equipment have appearance attractive in appearance, more the class of improving product.
First condition of the present invention is preferably ultrasonic wave hot pressing.Thereby ultrasonic wave hot pressing is one makes the local high vibration melted by heating of workpiece by ultrasonic vibration, exerts pressure simultaneously, the technique that two workpiece are connected by puddle.In prior art, conventional ultrasonic wave hot pressing is the ultrasonic wave hot pressing between same material, for example nonwoven, plastics.But the present invention will use ultrasonic wave hot pressing must need between different materials, to carry out combination, so adding melt temperature and the part that needs melt process different between man-hour requirement consideration material, for example the first material is metal alloy, the second material is PU skin, the application point of ultrasonic wave hot pressing should be on described PU skin, more easily make the melting of PU skin portion, puddle is formed at the connecting portion of described the first profiled sheeting; For example the first material is Merlon, the second material is corium, and the site of action of ultrasonic wave hot pressing should be on Merlon, because contain a large amount of animal origins and muscle fibre in corium, not conventional fusible macromolecular material, so if hot pressing function position should be Merlon.And active position difference, in process, should be reserved with the part of overlap joint accordingly, as shown in Figure 3 and Figure 4, be the schematic diagram before the ultrasonic wave hot pressing of connecting portion.Wherein a is the first profiled sheeting, and b is the second profiled sheeting, and the direction of arrow is ultrasonic wave hot pressing action direction, and the contact position of the first profiled sheeting and the second profiled sheeting is clinch, and after ultrasonic wave hot pressing, described clinch can form connecting portion.
According to the present invention, described ultrasonic wave hot pressing is used ultrasonic heat press, and the die head of use is preferably V-shape, semicircle or flat mouth shape die head, according to the different-thickness of sheet material, regulates different die heads, and the spacing of described two die heads is 0.1 ~ 1mm.According to the thickness difference of sheet material, regulate time delay, hot pressing time, dwell time and the compressed-air actuated pressure of ultrasonic equipment.In the time that products thickness is 2 ~ 3.5mm, be 0.1 ~ 1s the time delay of ultrasonic equipment, and hot pressing time is 0.1 ~ 3.5s, and the dwell time is 0.1 ~ 5.0s, and compressed-air actuated pressure is 1.0 ~ 7.0kg.Described ultrasonic intensity is 15kHz ~ 1010kHz, more preferably 15 ~ 50kHz.
Use ultrasonic wave hot pressing by the first profiled sheeting and the second profiled sheeting in conjunction with forming workpiece, product the first profiled sheeting obtaining and the connecting portion impression of the second profiled sheeting are less, peel strength is high, due to inapplicable other adhesives, make described workpiece can not produce because of long-term use problems such as separating fracture.
The present invention also provides a kind of electronic equipment that comprises above-mentioned workpiece, and concrete scheme is as follows:
Apparatus body;
Over cap comprises the first profiled sheeting and the second profiled sheeting, and the one side between described the first profiled sheeting and described the second profiled sheeting is connected;
Described the first profiled sheeting is fixed on described apparatus body, and can dismantle;
Described the first profiled sheeting is made up of the first material; Described the second profiled sheeting is made up of the second material and/or the 3rd material; Described the first material and described the 3rd material can meltings under first condition;
Described the second profiled sheeting is with respect to described apparatus body when the primary importance, and described over cap hides the first surface of described apparatus body; Described over cap is with respect to described apparatus body when the second place, and the first surface of described apparatus body appears.
Preferably, described over cap is prepared by following methods:
The first profiled sheeting and the second profiled sheeting are provided; Described the first profiled sheeting is made up of the first material; Described the second profiled sheeting is made up of the second material and/or the 3rd material; Described the first material and described the 3rd material can meltings under first condition;
Described the first profiled sheeting is connected with the melting under first condition of described the second profiled sheeting; Described the first material or the 3rd material under first condition melting and described the first profiled sheeting and described second profiled sheeting junction form connecting portion.
In order to make described over cap have more function, as preferred embodiment, a kind of electronic equipment, comprises apparatus body, is arranged on the processor in described apparatus body, and is arranged on the display screen of described apparatus body first surface, also comprises:
Hall device, is arranged at described apparatus body inside, and connects described processor;
Over cap, is arranged on described apparatus body, and described over cap is with respect to described apparatus body when the primary importance, and described over cap hides the first surface of described apparatus body; Described over cap is with respect to described apparatus body when the second place, and the first surface of described apparatus body appears;
Described over cap comprises two surface layers and at least one interlayer;
Induced magnet, is arranged at described over cap inside, and is embedded in the interlayer of described over cap and hole that described induced magnet shape matches; When described over cap is with respect to described apparatus body during in primary importance, described hall device is positioned at the magnetic field of described induced magnet; When described over cap is with respect to described apparatus body during in the second place, described hall device is positioned at outside described induced magnet magnetic field.
Electronic equipment provided by the invention is provided with hall device on apparatus body, on over cap surface or containment vessel inside be provided with induced magnet.Relative position by over cap and described apparatus body changes; and when described over cap is with respect to described apparatus body during in primary importance; described hall device is positioned at the magnetic field of described induced magnet; being subject to Lorentz force by the electronics of described hall device assembles; thereby produce an electric field in the direction of assembling at electronics; this electric field will make electronics afterwards be subject to electric power effect and balance the Lorentz force that cause in magnetic field; make electronic energy afterwards smoothly by not being offset, this is called Hall effect.And the built-in voltage producing is called Hall voltage.
Suppose that described hall device is a cuboid, length is respectively a, b, d, and magnetic field is perpendicular to ab plane.When electric current is through the direction of ad plane, electric current I=nqv (ad), and n is charge density.If Hall voltage is V
h, hall device is V along the electric field of Hall voltage direction
h/ a.If magnetic field intensity is B, v is electric charge speed, q is the quantity of electric charge.Calculating can obtain Hall voltage, is below the computing formula of Hall voltage.In the time that electric field force equates with Lorentz force when Fe=Fm
F
e=F
m
qV
H/a=qvB
V
H/a=BI/(nqad)
V
H=BI(nqd)。
When hall device obtains after magnetic field intensity, current and voltage signals, described voltage signal is transferred to processor, then described processor calculates according to above-mentioned formula, draws Hall voltage and carries out the output of control signal by default value, controls touch screen displays and automatically wakes up or close.When described over cap is with respect to described apparatus body during in primary importance; described hall device is positioned at the magnetic field of described induced magnet; hall device obtains the parameter signals such as magnetic field intensity; and be transferred to processor; processor is by calculating Hall voltage; compare as non-zero with Hall voltage value default in processor, can make touch screen display screen close.When described over cap is with respect to described apparatus body during in the second place; described hall device is positioned at outside the magnetic field of described induced magnet; now; the magnetic field intensity parameter that hall device obtains is 0; hall sensing voltage is also 0; processor by with default Hall voltage value be relatively 0, touch screen displays is waken up.
Preferred described Hall voltage is a series of preset value, and processor compares by size and its preset value of the Hall voltage that draws, adjusts screen intensity thereby realize, and in the time reaching maximum preset value, touch screen displays is closed completely, and brightness is minimum.Otherwise along with magnetic field intensity weakens gradually, Hall voltage value also reduces gradually, touch screen show value is adjusted brightness gradually to maximum.In the time that hall device progresses into and exit magnetic field, processor can be adjusted the brightness of touch screen displays gradually like this, thereby makes described touch screen displays can not cause short circuit because of unexpected waking up and close, and has extended the service life of screen.
In the present invention, described over cap comprises two surface layers and at least one interlayer; Induced magnet, is arranged at described over cap inside, and is embedded in the interlayer of described over cap and hole that described induced magnet shape matches; As preferred example, the surface layer of described over cap is plastics surface layer, corium surface layer, PU surface layer, superfine fibre surface layer.Make the surface of described over cap there is certain pliability and good feel; The interlayer of described over cap is metal forming interlayer or glass fibre layered, and more preferably glass layer, for described over cap provides support, makes described over cap have deflection and hardness, can not bend easily and damage.
Described interlayer is preferably more than 2 layers, and all has the hole matching with described induced magnet shape, can make described induced magnet slip in the hole of described interlayer formation;
Described interlayer is preferably 1 ~ 2 layer, and has the hole matching with described induced magnet shape, and described surface layer has the groove matching with described induced magnet shape, when making described induced magnet slip into described interlayer, can slip in described surface layer.
The embedded mode of above-mentioned two kinds of induced magnets all can reduce the gross thickness 0.1 ~ 0.5mm of described over cap.Hole in described induced magnet, interlayer and the groove shapes of surface layer do not have particular provisions, can be that circle can be also rectangle, or other irregular figures.Concrete shape is cut out according to the requirement of electronic equipment.
A kind of may situation be: described over cap and this apparatus body are hinged, thereby by turning cover or do not hide the first surface of described apparatus body.
Another kind of possibility situation be: described over cap comprises, nesting part and panel; Described nesting part comprises the housing with an opening of base plate and sidewall and described base plate and sidewall formation, and described apparatus body is nested in described housing, and the opening of described housing and the first surface of described apparatus body match;
Described panel comprises two surface layers and at least one interlayer;
Induced magnet, is arranged at described panel inside, and is embedded in the interlayer of described panel and hole that described induced magnet shape matches;
Described panel is with respect to described apparatus body when the primary importance, and described panel hides the first surface of described apparatus body; Described panel is with respect to described apparatus body when the second place, and the first surface of described apparatus body appears by described opening.
Panel rotates along apparatus body one side, makes it in closing, seal described apparatus body, blocks the state of its first surface, or in opening, the state that apparatus body first surface is exposed.
Certainly the structural relation of over cap and apparatus body is not limited in above-mentioned two situations.Described over cap can also be integrated with described apparatus body.
According to the present invention, described over cap can be plastic protection cover, corium over cap or PU over cap, and the present invention is not specifically limited.In addition as shown in Figure 5; described induced magnet 201 is preferably embedded in described over cap inside; described hall device 103 is preferably disposed on the upper right corner of described apparatus body; when described over cap relative with described apparatus body during in the second place; described induced magnet and described hall device relative position also match; and preferably under the described second place; described induced magnet is also positioned at the upper left corner of described over cap; and in the time that over cap is positioned at the second place, described hall device is all arranged in the magnetic field of described induced magnet.
As shown in Figure 6, be the structural representation of embedded induced magnet 201 and surface layer 202 and interlayer 203 in over cap 200.By surface layer and a layer interlayer strip off, can see the induced magnet 201 being embedded in hole.
PU skin over cap and Merlon battery of mobile phone back cover are provided, described back cover there is rib and sidewall, described sidewall thickness is 1.3mm, rib height is 0.8mm.PU skin over cap is 1.8mm.The spacing that over cap and cell rear cover is placed in to two die heads on the workbench of ultrasonic solution press is 0.1mm.Be 0.5s the time delay of ultrasonic equipment, and hot pressing time is 1s, and the dwell time is 2s, and compressed-air actuated pressure is 2kg.Described ultrasonic intensity is 15kHz.Obtain connecting the battery backshell of over cap.As shown in Figure 7, the schematic diagram of the workpiece of preparing for the inventive method wherein a is over cap, and b is battery of mobile phone back cover, and c is reinforcement, and d is decorative pattern.
Corium over cap and Merlon panel computer are provided, described back cover there is rib and sidewall, described sidewall thickness is 1.3mm, rib height is 0.8mm.Corium over cap is 1.8mm.The spacing that over cap and cell rear cover is placed in to two die heads on the workbench of ultrasonic solution press is 0.1mm.Be 0.5s the time delay of ultrasonic equipment, and hot pressing time is 1s, and the dwell time is 2s, and compressed-air actuated pressure is 2kg.Described ultrasonic intensity is 15kHz.Obtain connecting the battery backshell of over cap.
Flexible PVC over cap and almag battery of mobile phone back cover are provided, described back cover there is rib and sidewall, described sidewall thickness is 1.3mm, rib height is 0.8mm.PU skin over cap is 1.8mm.The spacing that over cap and cell rear cover is placed in to two die heads on the workbench of ultrasonic solution press is 0.1mm.Be 0.5s the time delay of ultrasonic equipment, and hot pressing time is 1s, and the dwell time is 2s, and compressed-air actuated pressure is 2kg.Described ultrasonic intensity is 15kHz.Obtain connecting the battery backshell of over cap.
Embodiment 4
PU skin over cap and almag battery of mobile phone back cover are provided, described back cover there is rib and sidewall, described sidewall thickness is 1.3mm, rib height is 0.8mm.PU skin over cap is 1.8mm.The spacing that over cap and cell rear cover is placed in to two die heads on the workbench of ultrasonic solution press is 0.1mm.Be 0.5s the time delay of ultrasonic equipment, and hot pressing time is 1s, and the dwell time is 2s, and compressed-air actuated pressure is 2kg.Described ultrasonic intensity is 15kHz.Obtain connecting the battery backshell of over cap.
Embodiment 5
Corium over cap and Merlon battery of mobile phone back cover are provided, described back cover there is rib and sidewall, described sidewall thickness is 1.3mm, rib height is 0.8mm.PU skin over cap is 1.8mm.The spacing that over cap and cell rear cover is placed in to two die heads on the workbench of ultrasonic solution press is 0.1mm.Be 0.5s the time delay of ultrasonic equipment, and hot pressing time is 1s, and the dwell time is 2s, and compressed-air actuated pressure is 2kg.Described ultrasonic intensity is 15kHz.Obtain connecting the battery backshell of over cap.
Preparation method to a kind of workpiece provided by the invention and the electronic equipment that comprises this workpiece are described in detail above; having applied specific case herein sets forth principle of the present invention and embodiment; the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof; should be understood that; for those skilled in the art; under the premise without departing from the principles of the invention; can also carry out some improvement and modification to the present invention, these improvement and modification also fall in the protection domain of the claims in the present invention.
Claims (10)
1. a preparation method for workpiece, is characterized in that, comprising:
The first profiled sheeting and the second profiled sheeting are provided; Described the first profiled sheeting is made up of the first material; Described the second profiled sheeting is made up of the second material and/or the 3rd material; Described the first material and described the 3rd material can meltings under first condition;
Described the first profiled sheeting is connected under first condition with described the second profiled sheeting; Described the first material or the 3rd material under first condition melting and described the first profiled sheeting and described second profiled sheeting lap-joint form connecting portion.
2. preparation method according to claim 1, is characterized in that, the one side between described the first profiled sheeting and described the second profiled sheeting is connected.
3. preparation method according to claim 1, is characterized in that, described the first material, the second material, bending strength a, the b of the 3rd material, c meet following relation: a >=c>b.
4. preparation method according to claim 1, is characterized in that, described first condition is ultrasonic wave hot pressing.
5. preparation method according to claim 4, is characterized in that, the ultrasonic intensity of described ultrasonic wave hot pressing is 15 ~ 1010kHz.
6. preparation method according to claim 1, described the first profiled sheeting and described the second profiled sheeting can relatively rotate around the parallel direction of described connecting portion.
7. preparation method according to claim 1, is characterized in that, the one side of described the first profiled sheeting is provided with sidewall and connects the rib of described sidewall.
8. preparation method according to claim 1, is characterized in that, described in described the second profiled sheeting comprises that at least one aspect layer and at least one layer interlayer be positioned at; Described surface layer is made up of the second material, and described interlayer is made up of the 3rd material.
9. an electronic equipment, is characterized in that, comprising:
Apparatus body;
Over cap comprises the first profiled sheeting and the second profiled sheeting, and the one side between described the first profiled sheeting and described the second profiled sheeting is connected;
Described the first profiled sheeting is fixed on described apparatus body by snap fit;
Described the first profiled sheeting is made up of the first material; Described the second profiled sheeting is made up of the second material and/or the 3rd material; Described the first material and described the 3rd material can meltings under first condition;
Described the second profiled sheeting is with respect to described apparatus body when the primary importance, and described over cap hides the first surface of described apparatus body; Described over cap is with respect to described apparatus body when the second place, and the first surface of described apparatus body appears.
10. electronic equipment according to claim 9, is characterized in that, described over cap is prepared by following methods:
The first profiled sheeting and the second profiled sheeting are provided; Described the first profiled sheeting is made up of the first material; Described the second profiled sheeting is made up of the second material and/or the 3rd material; Described the first material and described the 3rd material can meltings under first condition;
Described the first profiled sheeting is connected with the melting under first condition of described the second profiled sheeting; Described the first material or the 3rd material under first condition melting and described the first profiled sheeting and described second profiled sheeting junction form connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210451099.8A CN103802310B (en) | 2012-11-12 | 2012-11-12 | Preparation method of workpiece and electric equipment containing workpiece |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210451099.8A CN103802310B (en) | 2012-11-12 | 2012-11-12 | Preparation method of workpiece and electric equipment containing workpiece |
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| CN103802310A true CN103802310A (en) | 2014-05-21 |
| CN103802310B CN103802310B (en) | 2017-04-19 |
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| CN201210451099.8A Active CN103802310B (en) | 2012-11-12 | 2012-11-12 | Preparation method of workpiece and electric equipment containing workpiece |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10234448A (en) * | 1997-02-26 | 1998-09-08 | Hiroko Konno | Leather case and manufacture thereof |
| US20030206396A1 (en) * | 1997-02-19 | 2003-11-06 | Cronk Peter J. | Portable computing device with leather grain |
| CN200993970Y (en) * | 2006-12-11 | 2007-12-19 | 慧洋科技股份有限公司 | Cell protective casing |
-
2012
- 2012-11-12 CN CN201210451099.8A patent/CN103802310B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030206396A1 (en) * | 1997-02-19 | 2003-11-06 | Cronk Peter J. | Portable computing device with leather grain |
| JPH10234448A (en) * | 1997-02-26 | 1998-09-08 | Hiroko Konno | Leather case and manufacture thereof |
| CN200993970Y (en) * | 2006-12-11 | 2007-12-19 | 慧洋科技股份有限公司 | Cell protective casing |
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|---|---|
| CN103802310B (en) | 2017-04-19 |
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