CN103801866A - Sheet semiconductor pushing and feeding device for wire bonder - Google Patents

Sheet semiconductor pushing and feeding device for wire bonder Download PDF

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Publication number
CN103801866A
CN103801866A CN201410080245.XA CN201410080245A CN103801866A CN 103801866 A CN103801866 A CN 103801866A CN 201410080245 A CN201410080245 A CN 201410080245A CN 103801866 A CN103801866 A CN 103801866A
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CN
China
Prior art keywords
cylinder
tablet
slide block
track
guideway
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410080245.XA
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Chinese (zh)
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CN103801866B (en
Inventor
王利华
薛振坤
罗天秀
李真高
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LESHAN RADIO CO Ltd
Chengdu Advanced Power Semiconductor Co Ltd
Original Assignee
LESHAN RADIO CO Ltd
Chengdu Advanced Power Semiconductor Co Ltd
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Publication date
Application filed by LESHAN RADIO CO Ltd, Chengdu Advanced Power Semiconductor Co Ltd filed Critical LESHAN RADIO CO Ltd
Priority to CN201410080245.XA priority Critical patent/CN103801866B/en
Publication of CN103801866A publication Critical patent/CN103801866A/en
Application granted granted Critical
Publication of CN103801866B publication Critical patent/CN103801866B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Medicinal Preparation (AREA)

Abstract

The invention discloses a sheet semiconductor pushing and feeding device for a wire bonder. The sheet semiconductor pushing and feeding device for the wire bonder comprises a sheet semiconductor box (1) and further comprises a guideway (2), a cylinder (3), and a slide block (4), wherein a guide slot (5) is arranged in the side surface of the guideway (2) along the length direction of the guideway (2), a slide slot (6) is arranged at the top of the guideway (2) along the length direction of the guideway (2), the slide slot (6) is communicated with the guide slot (5), the cylinder (3) and the sheet semiconductor box (1) are respectively arranged at the two ends of the guideway (2), the cylinder (3) is installed at the top of the guideway (2), the cylinder (3) and the slide slot (6) are arranged in parallel, the slide block (4) is arranged in the slide slot (6), the slide block (4) abuts against an action end of a piston rod of the cylinder (3), and the width of the slide block (4) is less than the width of the slide slot (6). The sheet semiconductor pushing and feeding device for the wire bonder has the beneficial effects that the scrap rate of products is low, the processing accuracy of a sheet semiconductor is high, the degree of automation is high, the processing procedures are reduced, the labor intensity of a worker is reduced, and the production efficiency of an enterprise is improved.

Description

A kind of bonding equipment push jack blanking device
Technical field
The present invention relates to semiconductor tablet surface soldered technical field, particularly a kind of bonding equipment push jack blanking device.
Background technology
The rectangular sheet that in electronic component there is semiconductor used, this flaky semiconductor is called as tablet.Workman with bonding equipment on tablet surface when weld seam, need to stablize and move to bonding equipment heading slowly, thereby bonding equipment head could be by the seam of lip-deep tablet gap, the scrappage of the machining accuracy of final guarantee tablet, reduction product, after processing, tablet is collected in magazine.
At present, traditional device for mobile tablet comprises track, magazine and pull needle, the top of track is provided with guide groove, when processing before tablet with bonding equipment, first need on tablet, offer two tiny towing pads, two towing pads are parallel to the edge setting of tablet, then utilize two pull needle to insert respectively in two towing pads, again the end of two pull needle is all placed in guide groove, workman is held in respectively the front end of two pull needle with two hands again to adjust tablet and bonding equipment head welding initial position, finally slowly mobile pull needle makes tablet slowly by bonding equipment head, just completed the processing of tablet, guarantee by this method the machining accuracy of tablet.But, when workman is in the time adjusting the welding initial position of tablet and bonding equipment head, all need the distance of measuring head and tablet edge with assurance welding precision at every turn, there is like this positioning action difficulty, shortcoming that the large machining accuracy of position error is low.And, workman in guide groove when mobile tablet, thereby conventionally there will be tablet to touch the phenomenon that causes tablet card on bonding equipment head, increased the scrappage of tablet.
In addition, tablet of every processing all needs manually to promote tablet by pull needle and moves in orbit, has increased so beyond doubt the amount of labour, has had a strong impact on the production efficiency of enterprise.
Summary of the invention
The object of the invention is to overcome the shortcoming of prior art, provide that a kind of product rejection rate is low, tablet machining accuracy is high, automaticity is high, reduce manufacturing procedure, reduce labor strength, improve the bonding equipment push jack blanking device of enterprises production efficiency.
Object of the present invention is achieved through the following technical solutions: a kind of bonding equipment push jack blanking device, it comprises magazine, it also comprises track, cylinder and slide block, length direction along track in described track side surfaces is provided with guide groove, track top is provided with chute along the length direction of track, described chute is communicated with guide groove, described cylinder and magazine lay respectively at the two ends of track, cylinder is arranged on track top and cylinder and chute and be arranged in parallel, described slide block is placed in chute and slide block leans against the effect end of cylinder piston rod, the width of slide block is less than the width of chute, the width of guide groove is greater than the thickness of tablet.
It also comprises bonding equipment, and the head of described bonding equipment is positioned at the top of track.
It also comprises controller, and described controller is connected with cylinder.
The present invention has the following advantages: (1) chute of the present invention is communicated with guide groove, cylinder and magazine lay respectively at the two ends of track, cylinder is arranged on track top and cylinder is parallel to chute setting, slide block is placed in chute and slide block leans against the effect end of cylinder piston rod, the width of slide block is less than the width of chute, therefore, only need be in advance by the piston rod of cylinder in retracted mode to adjust the initial position of piston rod effect end and bonding equipment head and to process a towing pad on the outward flange at tablet in advance, in the time of processing tablet, first will be inserted in guide groove with the outward flange of towing pad, again the edge adjacent with outward flange leaned against on slide block, then pull needle is inserted on chute through towing pad, last control cylinder piston rod stretches out tablet is pushed through to bonding equipment head, tablet has just completed the push jack of tablet after by bonding equipment head, the process of processing, therefore, all need to repeat to adjust the welding initial position of tablet and bonding equipment head without tablet of every processing, just can guarantee the machining accuracy of tablet, improved production efficiency simultaneously.(2) width of slide block of the present invention is less than the width of chute, in the time that cylinder piston rod is released, piston rod promotes slide block and moves on chute, and slipper push tablet moves to bonding equipment heading in guide groove, because the contact area of tablet and slide block is large, pull needle has played the effect of guiding, therefore, make tablet can steadily, at the uniform velocity pass through bonding equipment head, finished product tablet after processing, thereby prevent that tablet from touching the phenomenon that causes tablet card on bonding equipment head, reduced product rejection rate extremely low, its product rejection rate is almost nil.(3) controller of the present invention is connected with cylinder, and workman can, by operate stretching out or retracting of cylinder on controller, therefore, move tablet without manually holding pull needle, therefore, reduces labor strength, improves enterprises production efficiency.
Accompanying drawing explanation
Fig. 1 is top view of the present invention;
Fig. 2 is the front view of Fig. 1;
Fig. 3 is the A-A cutaway view of Fig. 2;
In figure, 1-magazine, 2-track, 3-cylinder, 4-slide block, 5-guide groove, 6-chute.
The specific embodiment
Below in conjunction with accompanying drawing, the present invention will be further described, and protection scope of the present invention is not limited to the following stated:
As Figure 1-3, a kind of bonding equipment push jack blanking device, it comprises magazine 1, it also comprises track 2, cylinder 3 and slide block 4, on described track 2 sides, be provided with guide groove 5 along the length direction of track 2, track 2 tops are provided with chute 6 along the length direction of track 2, described chute 6 is communicated with guide groove 5, described cylinder 3 and magazine 1 lay respectively at the two ends of track 2, cylinder 3 is arranged on track 2 tops and cylinder 3 be arranged in parallel with chute 6, described slide block 4 is placed in chute 6 and slide block 4 leans against the effect end of cylinder 3 piston rods, the width of slide block 4 is less than the width of chute 6, the width of guide groove 5 is greater than the thickness of tablet.It also comprises bonding equipment, and the head of bonding equipment is positioned at the top of track 2.It also comprises controller, and controller is connected with cylinder 3, and workman can carry out by controller the stretching out or retract of piston rod of control cylinder 3.
The course of work of the present invention is as follows: tablet is shown in the rectangular broken line frame in Fig. 1 or Fig. 2, workman is before processing tablet, in advance by the piston rod of cylinder 3 in retracted mode to adjust the initial position of piston rod effect end and bonding equipment head, and on the outward flange of tablet, process in advance a towing pad, towing pad is as the circular dashed line frame in Fig. 1.In the time of processing tablet, first artificial being inserted in guide groove 5 with the outward flange of towing pad, again the edge adjacent with outward flange leaned against on the side of slide block 4, then pull needle is inserted on chute 6 through towing pad, last workman's control cylinder 3 piston rods on controller stretch out, piston rod promotes slide block 4 and moves on chute 6, because the contact area of tablet and slide block 4 is large and pull needle has played the effect of guiding, therefore, it is interior steadily at guide groove 5 that slide block 4 promotes tablet, moving to bonding equipment heading at the uniform velocity, in the time of tablet process bonding equipment head below, bonding equipment head carries out soldering to tablet upper surface, in the time that cylinder 3 piston rods stretch out completely, finished product tablet has been fallen in magazine 1, thereby just complete the push jack of tablet, the process of welding and blanking.When in processing when next tablet, control cylinder 3 piston rods are in complete retracted mode on controller for workman, and same method is installed this tablet in orbit, just can produce continuously, thereby improve production efficiency, reduced workman's labour intensity.

Claims (3)

1. a bonding equipment push jack blanking device, it comprises magazine (1), it is characterized in that: it also comprises track (2), cylinder (3) and slide block (4), on described track (2) side, be provided with guide groove (5) along the length direction of track (2), track (2) top is provided with chute (6) along the length direction of track (2), described chute (6) is communicated with guide groove (5), described cylinder (3) and magazine (1) lay respectively at the two ends of track (2), cylinder (3) is arranged on track (2) top and cylinder (3) be arranged in parallel with chute (6), described slide block (4) is placed in chute (6) and slide block (4) leans against the effect end of cylinder (3) piston rod, the width of slide block (4) is less than the width of chute (6), the width of guide groove (5) is greater than the thickness of tablet.
2. a kind of bonding equipment push jack blanking device according to claim 1, is characterized in that: it also comprises bonding equipment, and the head of described bonding equipment is positioned at the top of track (2).
3. a kind of bonding equipment push jack blanking device according to claim 1, is characterized in that: it also comprises controller, and described controller is connected with cylinder (3).
CN201410080245.XA 2014-03-06 2014-03-06 Sheet semiconductor pushing and feeding device for wire bonder Expired - Fee Related CN103801866B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410080245.XA CN103801866B (en) 2014-03-06 2014-03-06 Sheet semiconductor pushing and feeding device for wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410080245.XA CN103801866B (en) 2014-03-06 2014-03-06 Sheet semiconductor pushing and feeding device for wire bonder

Publications (2)

Publication Number Publication Date
CN103801866A true CN103801866A (en) 2014-05-21
CN103801866B CN103801866B (en) 2015-07-01

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CN201410080245.XA Expired - Fee Related CN103801866B (en) 2014-03-06 2014-03-06 Sheet semiconductor pushing and feeding device for wire bonder

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107234397A (en) * 2017-08-03 2017-10-10 合肥市华林模具有限公司 A kind of horizontal welding tooling of box body
CN107369637A (en) * 2017-07-11 2017-11-21 苏州通博半导体科技有限公司 The inclined blend stop device of magazine in one kind prevention AD8312 equipment

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3863827A (en) * 1972-11-10 1975-02-04 Mech El Ind Inc Tailless wire bonder
JPS5870539A (en) * 1981-10-23 1983-04-27 Hitachi Ltd Ultrasonic bonding apparatus
JPS58164234A (en) * 1982-03-25 1983-09-29 Toshiba Corp Wire bonding device for semiconductor
CN101976714A (en) * 2010-09-13 2011-02-16 深圳市因沃客科技有限公司 Material feeding and baiting device of light emitting diode (LED) wire wiring machine
CN202292243U (en) * 2011-07-18 2012-07-04 广州市精伦机电设备有限公司 Feeding and discharging device of light-emitting diode (LED) welding wire machine or die bonder
CN203343626U (en) * 2013-07-01 2013-12-18 合肥市奥比特电气有限公司 Discharging mechanism used for switch box side boards in full-automatic welding machine
CN203726022U (en) * 2014-03-06 2014-07-23 成都先进功率半导体股份有限公司 Push blanking device of welding wire machine

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3863827A (en) * 1972-11-10 1975-02-04 Mech El Ind Inc Tailless wire bonder
JPS5870539A (en) * 1981-10-23 1983-04-27 Hitachi Ltd Ultrasonic bonding apparatus
JPS58164234A (en) * 1982-03-25 1983-09-29 Toshiba Corp Wire bonding device for semiconductor
CN101976714A (en) * 2010-09-13 2011-02-16 深圳市因沃客科技有限公司 Material feeding and baiting device of light emitting diode (LED) wire wiring machine
CN202292243U (en) * 2011-07-18 2012-07-04 广州市精伦机电设备有限公司 Feeding and discharging device of light-emitting diode (LED) welding wire machine or die bonder
CN203343626U (en) * 2013-07-01 2013-12-18 合肥市奥比特电气有限公司 Discharging mechanism used for switch box side boards in full-automatic welding machine
CN203726022U (en) * 2014-03-06 2014-07-23 成都先进功率半导体股份有限公司 Push blanking device of welding wire machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107369637A (en) * 2017-07-11 2017-11-21 苏州通博半导体科技有限公司 The inclined blend stop device of magazine in one kind prevention AD8312 equipment
CN107234397A (en) * 2017-08-03 2017-10-10 合肥市华林模具有限公司 A kind of horizontal welding tooling of box body

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Publication number Publication date
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Granted publication date: 20150701

Termination date: 20170306