CN103796447A - Reflow device - Google Patents
Reflow device Download PDFInfo
- Publication number
- CN103796447A CN103796447A CN201310513779.2A CN201310513779A CN103796447A CN 103796447 A CN103796447 A CN 103796447A CN 201310513779 A CN201310513779 A CN 201310513779A CN 103796447 A CN103796447 A CN 103796447A
- Authority
- CN
- China
- Prior art keywords
- air
- heater
- reflux
- conveyer
- cold water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a reflow device, and more specifically relates to a reflow device that prevents a non-heat-resisting product from being damaged due to a temperature difference between the upper portion and the lower portion of a substrate. The reflow device comprises a pre-heating zone and reflow zone, wherein welding is performed and electronic parts are mounted the surface, moving along a transfer machine, of a substrate. The reflow device comprises a heating component disposed under the transfer machine in the reflow zone and discharging hot air; a cooling component disposed above the transfer machine in the reflow zone and discharging cold air; and an air adjusting component arranged over the transfer machine in the reflow zone and discharging air and heat generated during installation of electronic parts in the substrate.
Description
Cross-reference to related applications
It is 10-2012-0120338 that the application requires the sequence number of submitting in Department of Intellectual Property of Korea S on October 29th, 2012, exercise question is the priority of the korean patent application of " Reflow Device(reflux) ", and its full content is incorporated into this by quoting mode as proof.
Background technology
1. technical field
The present invention relates to a kind of reflux, more particularly, relate to a kind of prevent nonrefractory product due to the temperature difference between the upper and lower of substrate impaired reflux.
2. the explanation of prior art
Usually, substrate welding equipment is for mounting electronic parts on substrate.Reflux is implemented welding.
Such reflux is divided into that in fact preheating zone, product are arranged on recirculating zone wherein and on substrate, implements the cooling zone before welding.
Although be not illustrated, heater and fan are arranged on respectively in preheating zone and recirculating zone.
Conveyer through preheating zone and recirculating zone is also installed in preheating zone and recirculating zone.
Therefore, substrate moves and electronic unit is installed on substrate and through the thermal source of the heater in preheating zone and recirculating zone along conveyer.
That is to say, scolder is applied on each position of substrate, before entering preheating zone, electronic product is arranged in described substrate.Scolder is by through preheating zone and recirculating zone and soldered, and electronic product is installed in welding position.
But, in traditional refluxing unit, heater is installed in the upper and lower of conveyer in recirculating zone, the heat of heater be passed on substrate by air blast and heater soldered, this causes being installed in the easy impaired problem of nonrefractory parts in the electronic unit in substrate.
That is to say, the thermal source that heater produces has the temperature of approximately 240～250 ℃ conventionally, and nonrefractory parts in power associated components have the critical temperature lower than the temperature of thermal source.Therefore, be applied directly on nonrefractory parts if be arranged on the heat of the heater in conveyer top, nonrefractory parts are just damaged, and this causes in-problem defective product.
[correlation technique document]
[patent documentation]
(patent documentation 1) Korean Patent Publication No. 2008-0004965
Summary of the invention
An object of the present invention is to provide a kind of reflux, in the time that electronic unit is installed in bilateral (both-sided) reflux, described reflux prevents that nonrefractory parts are damaged.
Another object of the present invention is at the conveyer top of reflux discharge cold air, thereby by reducing the temperature of nonrefractory electronic unit, the damage of parts is minimized.
According to one exemplary embodiment of the present invention, a kind of reflux is provided, it comprises preheating zone and recirculating zone, wherein carrying out welding and electronic unit is installed in the surface of the substrate moving along conveyer, this reflux comprises: heater is installed in conveyer downside heat release air side by side in recirculating zone; Cooling component is mounted conveyer upside and lets cool side by side air in recirculating zone; And air adjustment and member, in recirculating zone, be mounted gas and heat that conveyer top discharge produce in the time that electronic unit is installed in substrate.
Heater can comprise at least one heater and thermal source that this at least one heater is produced is discharged into the air blast of conveyer downside.
Cooling component can comprise: the housing with the header board that wherein has multiple discharge orifices, be arranged on housing inner side and arrive the cold water pipe of header board with close attachment, make to be filled in the cooler of cold water in cold water pipe circulation, and towards by the air blast of the cooling header board discharged air of cold water pipe.
Cooler can comprise the transducer of measuring cold water temperature, and in the case of by the temperature of the cold water of sensor measurement below or above predefined reference temperature, regulate temperature according to predefined reference temperature.
Air adjustment and member can form with cooling component, and can be included in the gas vent that the both sides of the header board of housing form and the gas of introducing by gas vent is discharged to the scavenger fan of hull outside.
Air adjustment and member may further include the heat outlet of the heat discharge that heater is produced, and may further include and will export the sending out the hot fan of the heat being introduced into outside being discharged to by heat.
Accompanying drawing explanation
Fig. 1 is for explaining according to the schematic diagram of the welding process of the reflux of exemplary embodiment of the present invention;
Fig. 2 is the schematic diagram for the welding process of key-drawing 1 and the process of mounting electronic parts;
Fig. 3 is according to the schematic diagram of the device that is installed in recirculating zone of exemplary embodiment of the present invention; And
Fig. 4 is according to the curve chart of the whole Temperature Distribution of the reflux of exemplary embodiment of the present invention.
Embodiment
To describe embodiments of the invention in detail at hereinafter with reference accompanying drawing now.
Fig. 1 is for explaining according to the schematic diagram of the welding process of the reflux of exemplary embodiment of the present invention.Fig. 2 is the schematic diagram for the welding process of key-drawing 1 and the process of mounting electronic parts; Fig. 3 is according to the schematic diagram of the device that is installed in recirculating zone of exemplary embodiment of the present invention; And Fig. 4 is the resultant curve figure according to the whole Temperature Distribution of the reflux of exemplary embodiment of the present invention.
As shown in the figure, can be divided into preheating zone 10 and recirculating zone 20 according to the reflux 100 of exemplary embodiment of the present invention, and may further include cooling zone 40.
Preheating zone 10 and recirculating zone 20 are the regions that are applied to the scolder on substrate for welding.Cooling zone 40 is the regions for be mounted the scolder (not shown) that after-hardening welds at electronic unit 65.
Conveyer 50 is mounted in such a way in each region, makes to carry out mounting electronic parts 65 by transmitting substrate 60.
Heater (not shown) is also installed in preheating zone 10, to provide hot-air for upper surface and the lower surface of the substrate 60 that transmits by conveyer 50.Air blast can optionally be installed according to equipment design.
Be difficult to the temperature of the heater that accurately stipulates preheating zone 10, because described temperature is slightly different for the manufacturing company of each production reflux.But, there is identical pre-hot substrate until be applied to the function that the scolder on substrate does not melt completely due to heater, therefore the description of accurate temperature has been omitted.
The scolder of the substrate 60 of preheating in preheating zone 10 is in the interior thawing in recirculating zone 20, and electronic unit 65 is installed on substrate 60 thus.
For this reason, cooling component 21 can be arranged on the top of conveyer 50, and on the contrary, heater 25 can be installed in the bottom of conveyer 50 in preheating zone 10.
Housing 22 inside have formed spatial accommodation.Housing 22 is installed in the upside of conveyer.Multiple discharge orifice 22b pass in the header board 22a of conveyer 50 housing 22.
Discharge orifice 22b has size and the layout of following mode, makes air can flow into reposefully the inner side of housing 22 and flows out to outside from housing inner side.
Cold water pipe 23 is closely attached to the header board 22a that discharge orifice 22b therefrom passes.Cold water pipe 23 is installed into do not hide as far as possible the discharge orifice 22b of header board 22a.
This can promote Air Flow, and can more promptly the temperature of cold water pipe 23 be delivered to header board 22a by increasing the contact area of header board 22a and cold water pipe 23.
Cooler (not shown) is connected to the both sides of cold water pipe 23.Cooler is for circulating continuously the cold water being filled in cold water pipe 23.In addition, cooler for by the temperature of transducer (not shown) sensing cold water and in the temperature of cold water higher than the temperature that reduces cold water predefined reference temperature.
Air blast can further be installed to housing interior 22 so that the low temperature that is delivered to header board 22a by cold water pipe 23 is delivered to conveyer 50 by discharge orifice 22b.Air blast 24 can mounted in pairs in housing 22 or be arranged in the unit volume at its center.
The position that air blast 24 is mounted can with respect to be arranged on housing 22 inner sides various parts position and change.
Meanwhile, except cooling component 21, air adjustment and member 27 also can be integrally formed in housing 22.Air adjustment and member 27 can be installed separately, but air adjustment and member 27 also needn't be integrally formed with cooling component 21.But air adjustment and member 27 can integrally be manufactured, to expect the limited installing space of parts and to simplify volume.
Air adjustment and member 27 be included in housing 22 header board 22a both sides form gas vent 28, and by the gas discharging being introduced into by gas vent 28 the scavenger fan 28a to outside.
Gas vent 28 can be installed to be in the face of the both sides of header board 22a and be configured to from header board 22 outstanding.
Air adjustment and member 27 may further include the outwards heat outlet 29 of discharge of the heat of the heater 25a of the heater 25 of describing subsequently, and are arranged in housing 22 promptly to discharge the sending out the hot fan 29a that exports 29 heats that are introduced into by heat.
Heat outlet 29 can be installed in the position outstanding from gas vent 28.But the position of heat outlet 29 is not necessarily outstanding from gas vent 28, and can change according to equipment design.
In this respect, sending out the hot fan 29a can be included in separately in housing 22, and also can be omitted and do not comprised separately.That is to say, if heat outlet 29 and gas vent 28 are configured to come from unitary catheter and operate by sending out the hot fan 29a simultaneously, can use heat outlet 29 and gas vent 28 and omit scavenger fan 28a simultaneously.
On the contrary, can scavenger fan 28a be only installed and omit sending out the hot fan 29a simultaneously.
But, not to use a fan to absorb the situation of heat and gas simultaneously, can comprise that gas vent 28a and sending out the hot fan 29a are promptly outwards to discharge gas and heat.
The heater 25 that is used for the lower surface that heats the substrate 60 transmitting by conveyer 50 is installed in the bottom of conveyer 50.
Now will be described below according to the operating process of the reflux 100 of the embodiment of the present invention.
After solder coating is on substrate 60, substrate 60 is placed in conveyer 50.The substrate 60 being placed in conveyer 50 moves together according to the operation of conveyer 50 together with conveyer 50.
If substrate 60 moves and enters preheating zone 10 together with conveyer 50, make scolder slowly start to melt by the heater being arranged in conveyer 50.
If substrate 60 is through preheating zone 10 and move to recirculating zone 20, is arranged on the heater 25 that the cooling component 21 in conveyer 50 upsides moves and be arranged on simultaneously in conveyer 50 downsides and brings into operation.
That is to say, the low temperature of cooling component 21 can be cooling with respect to conveyer 50 upper surface at the substrate 60 of upside, and the lower surface of substrate 60 can be heated by the heat of the heater 25a at downside.
On substrate 60, carrying out after welding by heater 25, electronic unit 65 is mounted.
In this, in the process in execution welding with mounting electronic parts 65, lead is melted by the heat of heater 25, and it produces waste gas and high heat, and therefore the air blast 24 of cooling component 21 arrives gas discharging to pass through the cooling header board 22a of cold water pipe 23.
Emission gases is blown to the upper surface of substrate 60 by the discharge orifice 22b of header board 22a.Meanwhile, by the operation of scavenger fan 28a and sending out the hot fan 29a, the heat of emission gases and heater 25a is introduced into and is discharged into outside by gas vent 28 and heat outlet 29.
That is to say, air is discharged at housing 22 center, and air is introduced at two side surface places of housing 22, and therefore air can circulate.
Therefore, substrate 60 can prevent that electronic unit 65 is because Cryogenic air is damaged, and the bottom of substrate 60 keeps high temperature by the heat of heater 25a.
The substrate 60 that electronic unit 65 is wherein installed moves continuously along conveyer 50, and air cooled cooling zone 40 is lentamente carried out in arrival.
The scolder of substrate 60 of wherein carrying out welding is hardened lentamente in cooling zone 40, and therefore electronic unit 65 keeps and the stable coupling access status of substrate 60.
As mentioned above, if low temperature cold air rather than heat of high temperature be the interior top that is intensively applied to electronic unit 65 in recirculating zone 20, the damage of electronic unit 65 can be prevented from and the operation of heater 25a can be minimized, thereby reduces power consumption widely.
Especially, in the time comprising that multiple electronic units 65 as the nonrefractory parts of power product are applied to substrate 60, the parts damages that cause due to heat can reduce significantly.
Although described reflux 100 according to an embodiment of the invention above, the present invention is not limited to this, and those skilled in the art can apply and revise this reflux 100.
Reflux permission transmits cold air and hot-air in the upper and lower of the conveyer of bilateral reflux structure simultaneously according to an embodiment of the invention, thereby prevents that nonrefractory parts are damaged.
Detailed description for example understands the present invention above.In addition, content above only illustrates and has described the preferred embodiments of the present invention, and the present invention can use in various combinations, variation and environment.That is to say, what person of skill in the art will appreciate that is, in the case of the principle and spirit that do not deviate from total inventive concept, can replace these embodiment, modifications and changes, scope of the present invention is limited by claims and equivalent thereof.Although for illustrative object exemplary embodiment of the present invention disclosed, but those skilled in the art will appreciate that, in the case of not deviating from scope and spirit of the present invention as disclosed in claims, various modifications, interpolation and replacement are possible.Therefore, detailed description of the present invention is not intended to the present invention to be limited to disclosed embodiment.In addition, it should be understood that claims even comprise other embodiment.
Claims (8)
1. a reflux, comprises preheating zone and recirculating zone, and wherein carry out welding and electronic unit be installed in the surface of the substrate moving along conveyer, described reflux comprises:
Heater is installed in the downside of described conveyer and discharges hot-air in described recirculating zone;
Cooling component is installed in the upside of described conveyer and discharges cold air in described recirculating zone; And
Air adjustment and member are installed in the top of described conveyer and gas and the heat that discharge produces in the time that described electronic unit is arranged in described substrate in described recirculating zone.
2. reflux according to claim 1, wherein, described heater comprises at least one heater and the thermal source producing in described at least one heater is discharged into the air blast of the downside of described conveyer.
3. reflux according to claim 1, wherein, described cooling component comprises: the housing with the header board that wherein has multiple discharge orifices; Be arranged in described housing to be closely attached to the cold water pipe of described header board; Make to be filled in the cooler of the cold water circulation in described cold water pipe; And towards by the air blast of the cooling described header board discharged air of described cold water pipe.
4. reflux according to claim 3, wherein, described cooler comprises the transducer of the temperature of measuring cold water, and below or above predefined reference temperature, described cooler regulates described temperature according to described predefined reference temperature in the temperature of the described cold water by described sensor measurement.
5. reflux according to claim 1, wherein, described air adjustment and member and described cooling component integrally form, and described air adjustment and member are included in gas vent that the both sides of the described header board of described housing form and the scavenger fan to described hull outside by the gas discharging being introduced into by described gas vent.
6. reflux according to claim 3, wherein, described air adjustment and member and described cooling component integrally form, and described air adjustment and member are included in gas vent that the both sides of the described header board of described housing form and the scavenger fan to described hull outside by the gas discharging being introduced into by described gas vent.
7. reflux according to claim 1, wherein, described air adjustment and member further comprise the heat outlet of the heat that produces of the described heater of discharge.
8. reflux according to claim 7, wherein, described air adjustment and member further comprise the sending out the hot fan that the heat being introduced into by described heat outlet is discharged into outside.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0120338 | 2012-10-29 | ||
| KR1020120120338A KR20140054627A (en) | 2012-10-29 | 2012-10-29 | Reflow device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103796447A true CN103796447A (en) | 2014-05-14 |
Family
ID=50671574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310513779.2A Pending CN103796447A (en) | 2012-10-29 | 2013-10-25 | Reflow device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20140054627A (en) |
| CN (1) | CN103796447A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106112179A (en) * | 2016-08-22 | 2016-11-16 | 京信通信技术(广州)有限公司 | Entirety adds hot welding equipment and method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5763854A (en) * | 1992-11-16 | 1998-06-09 | International Business Machines Corporation | Machine for laser reflow soldering |
| CN1203512A (en) * | 1997-05-08 | 1998-12-30 | 松下电器产业株式会社 | Electronic unit soldering apparatus |
| CN101637837A (en) * | 2008-08-01 | 2010-02-03 | 威海信诺威电子设备有限公司 | Hot air reflow soldering furnace |
-
2012
- 2012-10-29 KR KR1020120120338A patent/KR20140054627A/en not_active Application Discontinuation
-
2013
- 2013-10-25 CN CN201310513779.2A patent/CN103796447A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5763854A (en) * | 1992-11-16 | 1998-06-09 | International Business Machines Corporation | Machine for laser reflow soldering |
| CN1203512A (en) * | 1997-05-08 | 1998-12-30 | 松下电器产业株式会社 | Electronic unit soldering apparatus |
| CN101637837A (en) * | 2008-08-01 | 2010-02-03 | 威海信诺威电子设备有限公司 | Hot air reflow soldering furnace |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106112179A (en) * | 2016-08-22 | 2016-11-16 | 京信通信技术(广州)有限公司 | Entirety adds hot welding equipment and method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140054627A (en) | 2014-05-09 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140514 |