CN103794520B - A kind of bonding apparatus aid and method thereof - Google Patents
A kind of bonding apparatus aid and method thereof Download PDFInfo
- Publication number
- CN103794520B CN103794520B CN201210428564.6A CN201210428564A CN103794520B CN 103794520 B CN103794520 B CN 103794520B CN 201210428564 A CN201210428564 A CN 201210428564A CN 103794520 B CN103794520 B CN 103794520B
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- CN
- China
- Prior art keywords
- electronic equipment
- car body
- bonding apparatus
- image
- chopper
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/781—Means for controlling the bonding environment, e.g. valves, vacuum pumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/789—Means for monitoring the connection process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Closed-Circuit Television Systems (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention provides a kind of aid and the method thereof of aluminum wire bonding, this aid includes that go-cart, wherein go-cart include the cabinet type car body of rectangle, in the cabinet type car body of rectangle, it is provided with multiple drawer, the upper surface of the cabinet type car body of rectangle is provided with electronic equipment, image display software is wherein installed in electronic equipment and there is wireless connecting function, the cabinet type car body of rectangle is additionally provided with the mobile wireless photographic head coordinated with electronic equipment.The instrument of the present invention is when carrying out aluminum wire bonding, photographic head is installed on bonding apparatus, carry out imaging on an electronic device, the equipment of para-linkage is adjusted, the drawer of the cabinet type car body of rectangle can place various instrument simultaneously, and whole instrument can arbitrarily move, and can use in turn for multiple devices, add the utilization rate of a whole set of image documentation equipment, reduce the cost of investment of the whole series.
Description
[technical field]
The present invention is about field of semiconductor package, especially with regard to the wire bonding aid of semiconductor chip.
[background technology]
Semiconductor chip has one procedure to be that with lead frame, the conducting strip in wafer is passed through gold or aluminum in encapsulation process
Lead-in wire be attached, this by the way of lead-in wire connects, be referred to as wire bonding.Usual this wire bonding apparatus can include
Cutting knife and chopper, because semiconductor chip is small-sized, when carrying out wire bonding, for being directed at the conduction to be bonded by chopper
Position, it is necessary to use display device to amplify display cutting knife, chopper and the position of metallic channel, by observing image documentation equipment
In the image of cutting knife, chopper and metallic channel adjust the position of cutting knife and chopper.
Existing bonding apparatus, its display device is typically fixed on wire bonding apparatus, and includes permissible
The display screen rotated.As it is shown in figure 1, when not using display device, the display screen 11 of image documentation equipment is received in bonding apparatus
Inner side, as in figure 2 it is shown, when using display device, rotate the display screen 11 of display device to bonding apparatus
The lower section of soldering tip 12.The assisted image equipment that existing this bonder is supporting, needs to be fixed on equipment, a set of assisted image
Equipment is merely able to install and use for a soldering tip.And expensive, multiple devices support the use relatively costly.
And, existing this bonder assisted image equipment, the normal place of image system, the image of making needs people
Member goes according to the cutting knife harmonized and metallic channel position, manual outline line, and workload same effect that is big and that make is poor, mark
The determination that level is put depends on the technical merit of the people installing and portraying at software profile for the first time.Setter level is not
One, producer is also difficult to ensure that the concordance of picture.
It addition, chopper, cutting knife and metallic channel and the relevant installation tool etc. used in existing bonding apparatus, it is not easy to
Employee carries.
It is therefore desirable to existing bonding apparatus is improved, to overcome the aforementioned drawback of prior art.
[summary of the invention]
It is an object of the invention to provide one to improve service efficiency, be easy to finishing tool and image adjusts consistent
Bonding apparatus aid.
Another object of the present invention is to provide the bonding method of a kind of bonding apparatus.
For reaching object defined above, one bonding apparatus aid of the present invention, it includes go-cart and is placed in go-cart
Electronic equipment and wireless camera, wherein said go-cart is transportable, and described electronic equipment includes display screen and installation
Image display software in electronic equipment, is provided with the wireless receiving and dispatching dress corresponding with wireless camera in described electronic equipment
Put, by wireless transmitter, electronic equipment and the mutual wirelessly transmitting data of wireless camera, receive what wireless camera gathered
Image shows, by image display software, the image that wireless camera gathers on a display screen.
According to one embodiment of present invention, described go-cart includes the cabinet type car body of rectangle, and the bottom of car body is provided with rolling
Wheel, being provided with in the side of car body can be so that the handle of push-and-pull vehicle body.
According to one embodiment of present invention, in car body, multiple drawer it is provided with.
According to one embodiment of present invention, the upper surface at the cabinet type car body of rectangle is provided with one and places described wireless take the photograph
Fluting as head.
For reaching another object of the present invention, the bonding method of a kind of semiconductor chip of the present invention, it uses aforesaid key
Conjunction equipment aid, comprising:
Wireless camera is installed on bonding apparatus；
Open the image display software in electronic equipment, image display software presets the chopper being intended to bonding chip
Appearance profile normal line, and cutting knife and the standard point of reference of metallic channel；
Wireless camera gathers the cutting knife of bonding apparatus, chopper and the image of metallic channel and sends electronic equipment to；
Regulation chopper, cutting knife and the position of metallic channel so that chopper shadow in the image display software of electronic equipment
As profile overlaps with the appearance profile normal line of chopper, cutting knife and metallic channel shadow in the image display software of electronic equipment
As control point overlaps with canonical base point；
Carry out bonding operation.
According to one embodiment of present invention, the image display software inner cutter of described electronic equipment and the standard of metallic channel
Datum mark is that the standard state calculating of the appearance profile normal line according to chopper and cutting knife, metallic channel gets.
Compared with all must configuring an image documentation equipment with every equipment of existing bonding apparatus, the bonding auxiliary work of the present invention
Tool can be moved easily, and can use in turn for multiple devices, adds the utilization rate of a whole set of image documentation equipment, reduces the whole series
Cost of investment.And the normal place of the image of the present invention is to calculate according to standard state in the image display software of electronic equipment
Predetermined, that each same equipment of specification is installed concordance.And the various bonding tool the most not used time can put
Put on the platform of aid go-cart, can be placed in the drawer of go-cart when of making to be finished, it is simple to carry and arrange.
[accompanying drawing explanation]
Figure 1A is the image documentation equipment of existing bonding apparatus view when not using.
Figure 1B is the view during image documentation equipment use of existing bonding apparatus.
Fig. 2 is the schematic perspective view of the bonding aid of the present invention.
Fig. 3 is to set cutting knife, chopper and metallic channel standard in the electronic equipment being bonded aid using the present invention
The schematic diagram of position.
Fig. 4 be according to the present invention bonding aid electronic equipment receive image regulation cutting knife, chopper and
The schematic diagram of metallic channel position.
[detailed description of the invention]
" embodiment " or " embodiment " referred to herein refers to may be included at least one implementation of the present invention
Special characteristic, structure or characteristic.Different in this manual local " in one embodiment " occurred not refer both to same
Individual embodiment, is not single or the most mutually exclusive with other embodiments embodiment.In the drawings upper and lower, left,
The explanation of the directionality such as right, forward and backward the most simply combines the explanation that accompanying drawing is carried out, and not concrete to the flesh and blood of the present invention
Limit.
Refer to shown in Fig. 2, the schematic diagram of the aid of the bonding apparatus of its display present invention.As shown in Figure 2, originally
The bonding apparatus aid of invention includes a go-cart 2 and the electronic equipment 3 being placed in go-cart and wireless camera (not
Diagram).
Wherein this go-cart 2 includes the cabinet type car body of rectangle 21, is provided with multiple drawer 22, sets in the bottom of car body in car body
Being equipped with roller 23, being provided with in the side of car body can be so that the handle 24 of push-and-pull vehicle body, at the upper surface of the cabinet type car body of rectangle
It is provided with a fluting 25.
Wherein the upper surface 211 of the cabinet type car body of the rectangle of go-cart 21 is smooth plane, instrument commonly used during bonding,
Such as cutting knife, chopper etc., the most the used time can not be placed on the upper surface 211 of this car body.The multiple drawers arranged in car body
22, make the instrument being finished can be placed in drawer 22, convenient arrangement, and be easy to carry.And the bottom of car body arranges roller
23, be provided with the handle 24 being easy to push-and-pull car body in the side of car body, the most whole go-cart 2 can easily arbitrarily push-and-pull to product
Line Anywhere, conveniently operates.The fluting 25 arranged at cabinet type car body 21 upper surface 211 may be used for placing and fixed wireless
Photographic head.
The aforementioned electronic equipment 3 being placed in go-cart can be notebook computer or desktop computer, or IPAD flat board
Apparatus such as computer, these electronic equipments all include the display screen being displayed for image, are wherein provided with shadow in electronic equipment
As display software.The wireless transmitter (not shown) corresponding with wireless camera is installed, by wireless receipts in electronic equipment
Transmitting apparatus, these electronic equipments can wirelessly transmitting data mutual with wireless camera, be used for driving wireless camera, and receive
The image that wireless camera gathers.About the principle being wirelessly transferred and each module related to, same as the prior art, the present invention
No longer describe in detail.
The bonding apparatus aid of the present invention in use, can be by wireless camera fixing in fluting on cabinet type car body
Head is taken off from car body, is installed on bonding apparatus (to arrange on bonding apparatus and image for fixed wireless accordingly
The draw-in groove of head), wireless camera is for gathering the image of the parts such as the chopper of bonding apparatus, cutting knife, metallic channel and being wirelessly transferred
To electronic equipment 3.Open the image display software in electronic equipment, split as it is shown on figure 3, preset in image display software
The appearance profile normal line 31 of cutter, and it is intended to standard point of reference 32 and the standard point of reference of metallic channel of the cutting knife of bonding chip
33, wherein these cutting knifes, the standard point of reference 32,33 of metallic channel be can according to the appearance profile normal line 31 of chopper, according to
Cutting knife, the standard state of metallic channel calculate gained.
As shown in Figure 4, when regulating the position of each instrument, chopper is first moved, by contour line and the display of the image 4 of chopper
On screen, chopper delineator directrix 31 regulation of standard is to overlapping, and then the mechanical location of regulation cutting knife and metallic channel is by cutting knife image
5 and the corresponding image control point of image 6 of metallic channel regulate respectively to the standard point of reference with display screen upper cutter and metallic channel
32,33 overlap.Bonding operation can be carried out with normal place after cutting knife, chopper, metallic channel all align.
After making to be finished image documentation equipment, wireless camera can be taken off from bonding apparatus, be placed into cabinet type car body
On fluting 25 in, the instrument such as various cutting knifes, chopper can also take off and be placed in go-cart 2, continues to move to next bonding
Equipment, carries out the operation of next bonding apparatus.After final utilization is complete, the instrument such as cutting knife, chopper can be put into car body
In drawer, it is simple to arrange.
Compared with all must configuring an image documentation equipment with every equipment of existing bonding apparatus, the bonding auxiliary work of the present invention
Tool can be moved easily, and can use in turn for multiple devices, adds the utilization rate of a whole set of image documentation equipment, reduces the whole series
Cost of investment.And the normal place of the image of the present invention is to calculate according to standard state in the image display software of electronic equipment
Predetermined, that each same equipment of specification is installed concordance.And the various bonding tool the most not used time can put
Put on the platform of aid go-cart, can be placed in the drawer of go-cart when of making to be finished, it is simple to carry and arrange.
Above specific embodiment is the citing of one specific embodiment of the present invention, the present invention can not by all specifically
Embodiment enumerates, and therefore aforementioned embodiment is not the concrete restriction to the present invention, is familiar with the technology people in this field
Any change that the detailed description of the invention of the present invention is done by member is all without departing from the scope of claims of the present invention.Correspondingly,
The scope of the claim of the present invention is also not limited only to previous embodiment.
Claims (6)
1. a bonding apparatus aid, it includes go-cart and the electronic equipment being placed in go-cart and wireless camera, its
Described in go-cart be transportable, wireless camera can take off from the car body of described go-cart, is installed on bonding apparatus,
Described electronic equipment includes display screen and the image display software being installed in electronic equipment, peace in described electronic equipment
Equipped with the wireless transmitter corresponding with wireless camera, by wireless transmitter, electronic equipment is mutual with wireless camera
Wirelessly transmitting data, the image receiving wireless camera collection shows wireless camera on a display screen by image display software
The image gathered.
2. bonding apparatus aid as claimed in claim 1, it is characterised in that: described go-cart includes the cabinet type car body of rectangle,
The bottom of car body is provided with roller, and being provided with in the side of car body can be so that the handle of push-and-pull vehicle body.
3. bonding apparatus aid as claimed in claim 2, it is characterised in that: in car body, it is provided with multiple drawer.
4. bonding apparatus aid as claimed in claim 2, it is characterised in that: the upper surface at the cabinet type car body of rectangle is arranged
There is a fluting placing described wireless camera.
5. a bonding method for semiconductor chip, it uses the bonding apparatus auxiliary work of aforementioned claim 1-4 any one of item
Tool, comprising:
Wireless camera is installed on bonding apparatus；
Open the image display software in electronic equipment, preset in image display software outside the chopper being intended to bonding chip
Shape delineator directrix, and cutting knife and the standard point of reference of metallic channel；
Wireless camera gathers the cutting knife of bonding apparatus, chopper and the image of metallic channel and sends electronic equipment to；
Regulation chopper, cutting knife and the position of metallic channel so that chopper image wheel in the image display software of electronic equipment
Exterior feature overlaps with the appearance profile normal line of chopper, the image control in the image display software of electronic equipment of cutting knife and metallic channel
System point overlaps with canonical base point；
Carry out bonding operation.
6. bonding method as claimed in claim 5, it is characterised in that: the image display software inner cutter of described electronic equipment and
The standard point of reference of metallic channel is that the standard state of the appearance profile normal line according to chopper and cutting knife, metallic channel calculates
Come.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210428564.6A CN103794520B (en) | 2012-10-31 | 2012-10-31 | A kind of bonding apparatus aid and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210428564.6A CN103794520B (en) | 2012-10-31 | 2012-10-31 | A kind of bonding apparatus aid and method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103794520A CN103794520A (en) | 2014-05-14 |
| CN103794520B true CN103794520B (en) | 2016-08-31 |
Family
ID=50670062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210428564.6A Active CN103794520B (en) | 2012-10-31 | 2012-10-31 | A kind of bonding apparatus aid and method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103794520B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201107275Y (en) * | 2007-11-30 | 2008-08-27 | 杨德智 | Multifunctional checking instrument |
| CN101537553A (en) * | 2008-03-18 | 2009-09-23 | 韩国电力公社 | Welding joint conveying device on inner surface of piping |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7654436B2 (en) * | 2007-09-20 | 2010-02-02 | Asm Assembly Automation Ltd. | Wire bonding system utilizing multiple positioning tables |
| JP5755038B2 (en) * | 2010-06-28 | 2015-07-29 | キヤノン株式会社 | Assembly equipment and production system |
-
2012
- 2012-10-31 CN CN201210428564.6A patent/CN103794520B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201107275Y (en) * | 2007-11-30 | 2008-08-27 | 杨德智 | Multifunctional checking instrument |
| CN101537553A (en) * | 2008-03-18 | 2009-09-23 | 韩国电力公社 | Welding joint conveying device on inner surface of piping |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103794520A (en) | 2014-05-14 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |