CN103792791A - Packaged arc-shaped hot acid distributing disc frame structure - Google Patents
Packaged arc-shaped hot acid distributing disc frame structure Download PDFInfo
- Publication number
- CN103792791A CN103792791A CN201210431404.7A CN201210431404A CN103792791A CN 103792791 A CN103792791 A CN 103792791A CN 201210431404 A CN201210431404 A CN 201210431404A CN 103792791 A CN103792791 A CN 103792791A
- Authority
- CN
- China
- Prior art keywords
- disk body
- unit
- hot acid
- framed structure
- packaging type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a gluing development apparatus for obtaining a uniformly-distributed photoresist and the shape of the photoresist from semiconductor wafers, and concretely relates to a packaged arc-shaped hot acid distributing disc frame structure. The packaged arc-shaped hot acid distributing disc frame structure comprises a plurality of technological units arranged in a vertical superposing manner, all the technological units adopt disc frames respectively, the front end of each of the disc frames is an arc-shaped front end, the rear portion of each of the disc frames is square, the internal of each of the disc frames is a chamber, the upper edge of the arc-shaped front end is provided with a window in a radial direction, the end portions at two sides of the rear portion are provided with air discharge channels in a direction vertical to the window direction, and the inner sides of the two-side air discharge channels are respectively provided with an exhaust vent connected with the chamber. The structure realizes the multi-angle transfer-in-and-out of the wafers, is general in interunited mixing matched modules, and enables heat treatment exhaust gas and chemical treatment exhaust gas to be respectively discharged.
Description
Technical field
The present invention relates to obtain from semiconductor wafer the glue-spreading development equipment of uniform photoresist and photoetching offset plate figure, specifically a kind of packaging type camber hot acid divides row's disk body framed structure.
Background technology
At present, the gluing development TRACK equipment of advanced technology is mainly made up of three kinds of chunks such as loading and unloading chunk, technique chunk 1, technique chunk 2, interface chunks, and wherein loading and unloading chunk is mainly made up of upper and lower magazine, He Zhan robot (or claiming CS-R), support body etc.; It is different that technique chunk 1 and technique chunk 2 include technical module, technical module mainly contains and covers compositions such as being coated with unit (or claim COT/BAC/TAC) and/or developing cell (or claiming DEV), technique robot (or claiming PS-R), process heat treating column (or claiming OVEN RACK), support body, has loaded cold dish unit, heat dish unit, tackify unit, compound thermal dish unit, other functional unit etc. in process heat treating column; Interface chunk is mainly made up of interface input and output material carrier (or claiming IFS), interface machine people's (or claiming IF-R), limit portion exposure device (or claiming WEE), input and output material snubber assembly (or claiming IFB), support body etc.
According to production technology demand and manufacturer's technology difference, each chunk in board, module, the configuration of unit with arrange different, wherein loading and unloading chunk, the difference of interface chunk is little, module in technique chunk and the configuration of unit and the technical support of arranging and having nothing in common with each other, basic point of departure has four, the one, guarantee good high-quality production technology node, the 2nd, meet the demand of high production production capacity, the 3rd, there is good maintainability, the 4th, cost performance wafer is sent to centering unit or intermediate carrier by He Zhan robot from wafer case, after being taken out from centering unit or intermediate carrier by technique robot again, deliver to each technique unit, wafer after PROCESS FOR TREATMENT is sent to centering unit or intermediate carrier by technique robot, then sends back to wafer case after being taken out from centering unit or intermediate carrier by He Zhan robot.
Along with the requirement that production capacity strengthens, the centrifugal unit of TRACK equipment (or claiming SPIN) will increase, and the cold dish of thermal treatment unit, hot dish, tackify unit etc. also must correspondingly increase, the centering unit of wafer turnover, and technique robot workload strengthens.
Now, meet the requirement that strengthens production capacity and quality raising, method one is to increase TRACK equipment; Method two is device structure adjustment, uses and increases technique robot quantity, or apply new and effective technique robot at process section.
Summary of the invention
For the problems referred to above, the object of the present invention is to provide a kind of packaging type camber hot acid to divide row's disk body framed structure.The multi-angle that this packaging type camber hot acid divides row's disk body framed structure to realize wafer is imported into and is spread out of, and between unit, mix and match module is general, and thermal treatment waste gas and chemical treatment waste gas discharge respectively.
To achieve these goals, the present invention is by the following technical solutions:
A kind of packaging type camber hot acid divides row's disk body framed structure, comprise the technique unit that multiple vertical stacks arrange, each technique unit all adopts disk body framework, the front end of each disk body framework be arcuate front ends, rear portion be square, inner be chamber, in arcuate front ends, radially offer window, the both side ends at rear portion is along being provided with air exhaust passage perpendicular to window direction, and the inner side of described both sides air exhaust passage is equipped with the exhausr port being communicated with chamber.The front end of described window is semicircle, and rear portion is square.The two ends, rear portion of described window and the line angle in the anterior center of circle are greater than 180 degree, and the height of window is 30mm.
Described exhaust outlet is provided with air door.Described air door place is provided with the sensor of measuring heat and chemical concentration.Described air door is by cylinder or Electric Machine Control.
Described each technique unit superposes up and down, and the air exhaust passage of each disk body framework both sides is interconnected, and forms a shared ventilating duct.Described each technique unit is all arranged on process wall take disk body framework as outside framework.
Described technique unit is tackify unit, heat dish unit, high warm dish unit, cold dish unit, compound dish unit or centering unit.
Advantage of the present invention and beneficial effect are:
1, camber import of the present invention forms and passs transmission technology mode, break through the traditional wafer transmission mode of glue-spreading development equipment, reduce the bottleneck in wafer transmission path, also reduced the work station of process section robot, each technique unit effective rate of utilization of whole process wall equipment is improved.
2, the present invention passs the leap that transmission technology mode has brought device structure thoroughly, and device structure of the present invention has met the production requirement of extensive, high production capacity gluing developing process.
3, apply structural device of the present invention, floor area is little, has effectively reduced environment pollution in transmitting procedure to wafer; Thoroughly pass the enforcement of transmission technology mode and injected cardiotonic for multi-track stack production, effectively reduced the cost of investment of equipment, production efficiency is improved.
4, the unified disk body framed structure of the present invention is conducive to exchange between each unit, and on framework, integrated exhaust duct is effectively saved space, and in unit, inner accurate control exhaust is flexibly conducive to technique realization.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is schematic perspective view of the present invention;
Fig. 4 is that the present invention is assemblied in the structural representation in unit;
Fig. 5 is the structural representation of the process wall that assemblies of the present invention.
Wherein: 1 is arcuate front ends, 2 is exhaust duct, and 3 is window, and 4 is exhausr port, and 5 is wafer turnover position, and 6 is disk body framework, and 7 is driver installation site, and 8 is technique unit.
Embodiment
Below in conjunction with accompanying drawing, invention is further described.
As Figure 1-5, the present invention includes the technique unit 8 that multiple vertical stacks arrange, technique unit 8 is tackify unit, heat dish unit, high warm dish unit, cold dish unit, compound dish unit or centering unit.Each technique unit 8 all adopts disk body framework 6, the front end of each disk body framework 6 be arcuate front ends 1, rear portion be square, inner be chamber.Arcuate front ends 1 at disk body framework 6 radially offers window 3 at wafer turnover 5 places, position, the front end of window 3 is semicircle, rear portion is square, and the two ends, rear portion of window 3 and the line angle in the anterior center of circle are greater than 180 degree (overlook and be greater than 180 degree), and the height of window 3 is 30mm.The both side ends at the rear portion of disk body framework 6 is along being provided with air exhaust passage 2 perpendicular to window direction, and the inner side of both sides air exhaust passage 2 is equipped with the exhausr port 4 being communicated with chamber, and exhaust outlet 4 is provided with the air door by driver control.Described air door place is provided with the sensor of measuring heat and chemical concentration, controls air door switch size and is determined by the sensor feedback calorie value or the chemical concentration value that are arranged on opening part.The driver of controlling air door size is arranged on 7 places, driver installation site of technique unit both sides, and driver adopts cylinder or motor.
Each technique unit 8 superposes up and down, is also all arranged on process wall take disk body framework 6 as outside framework.The air exhaust passage 2 of each disk body framework 6 both sides is interconnected, and the exhaust duct 2 being communicated with up and down forms a large exhaust duct, and the different units being assemblied in each disk body framework 6 has just become the take-off point on this pipeline.And each take-off point has acid vapour and two mouths of hot air discharge, can effectively control two kinds of gas dischargings in each take-off point by the air door being arranged on each exhaust outlet 4.
Principle of work of the present invention is:
Normal process route is that wafer passes through He Zhan robot (CS-R) and takes out from wafer case, be sent to tackify unit (ADB), cold dish unit (CPC) or heat dish unit (LTB), after being taken out from tackify unit (ADB) or heat dish unit (LTB) by He Zhan robot (CS-R) and/or technique robot (PS-R) again, deliver to each technique unit, as cold dish unit (CPC), centering unit (CA), centrifugal unit (SPIN), heat dish unit (LTB), high heat dish unit (HLTB), limit portion exposure device (WEE) etc., be sent to heat dish unit (LTB) through gluing developing process wafer after treatment by technique robot (PS-R) or He Zhan robot (CS-R), cold dish unit (CPC) or centering unit (CA), again by He Zhan robot (CS-R) from heat dish unit (LTB), after taking out in cold dish unit (CPC) or centering unit (CA), send back to wafer case.
The present invention is designed to each unit wafer entrance end of process wall the pass-through type mechanism of camber structure, each technique unit 8 adopts same disk body framework 6, make the position of each technique unit 8 in process wall not be subject to the restriction of fixed position in the past, because each disk body framework 6 adopts identical waste gas waste heat discharge system, so can arrange arbitrarily as required; Meanwhile, we change the transmission route of wafer, adopt wafer to see through many mouthfuls of process walls and enter process section, and wafer sees through the process route of many mouthfuls of outputs of process wall at process section, meet the needs that increasing production capacity and quality improve.
In technological process, equipment operating platform, various control system device, equipment appurtenance and explained hereafter annex etc. are prior art.Due to glue-spreading development equipment type selecting and the technique difference of each semiconductor factory, machining process route is just different so, and production capacity is also just different, and this is relevant with the factor such as the structure of equipment, process route, logistics and distribution management.Therefore, for meeting the demand of high production capacity, consider that semiconductor factory purifies the restriction in region, reduce the pollution of wafer in the time of non-PROCESS FOR TREATMENT, the main equipment that integrates many rails equipment just has required.The device structure that the present invention is mentioned and machining process route are one of schemes addressing this problem, the present invention is not only suitable for the process equipment of gluing and development hybrid process, is also suitable for the multi-track equipment of single coating technique and the multi-track equipment of single developing process.
Claims (9)
1. a packaging type camber hot acid divides row's disk body framed structure, it is characterized in that: comprise the technique unit (8) that multiple vertical stacks arrange, each technique unit (8) all adopts disk body framework (6), the front end of each disk body framework (6) is arcuate front ends (1), rear portion is square, inside is chamber, in arcuate front ends (1), radially offer window (3), the both side ends at rear portion is along being provided with air exhaust passage (2) perpendicular to window direction, the inner side of described both sides air exhaust passages (2) is equipped with the exhausr port (4) being communicated with chamber.
2. divide row's disk body framed structure by packaging type camber hot acid claimed in claim 1, it is characterized in that: the front end of described window (3) is for semicircle, and rear portion is square.
3. divide row's disk body framed structure by packaging type camber hot acid claimed in claim 2, it is characterized in that: the two ends, rear portion of described window (3) and the line angle in the anterior center of circle are greater than 180 degree, and the height of window (3) is 30mm.
4. divide row's disk body framed structure by packaging type camber hot acid claimed in claim 1, it is characterized in that: described exhaust outlet (4) is provided with air door.
5. divide row's disk body framed structure by packaging type camber hot acid claimed in claim 4, it is characterized in that: described air door place is provided with the sensor of measuring heat and chemical concentration.
6. divide row's disk body framed structure by the packaging type camber hot acid described in claim 4 or 5, it is characterized in that: described air door is by cylinder or Electric Machine Control.
7. divide row's disk body framed structure by packaging type camber hot acid claimed in claim 1, it is characterized in that: described each technique unit (8) superposes up and down, the air exhaust passage (2) of each disk body framework (6) both sides is interconnected, and forms a shared ventilating duct.
8. divide row's disk body framed structure by packaging type camber hot acid claimed in claim 1, it is characterized in that: described each technique unit (8) is all arranged on process wall take disk body framework (6) as outside framework.
9. divide row's disk body framed structure by the packaging type camber hot acid described in claim 1,7 or 8 any one claims, it is characterized in that: described technique unit (8) is tackify unit, heat dish unit, high warm dish unit, cold dish unit, compound dish unit or centering unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210431404.7A CN103792791A (en) | 2012-11-01 | 2012-11-01 | Packaged arc-shaped hot acid distributing disc frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210431404.7A CN103792791A (en) | 2012-11-01 | 2012-11-01 | Packaged arc-shaped hot acid distributing disc frame structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103792791A true CN103792791A (en) | 2014-05-14 |
Family
ID=50668610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210431404.7A Pending CN103792791A (en) | 2012-11-01 | 2012-11-01 | Packaged arc-shaped hot acid distributing disc frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103792791A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2812052Y (en) * | 2005-07-27 | 2006-08-30 | 沈阳芯源先进半导体技术有限公司 | Structure of photoresist coating developing equipment |
| CN101615561A (en) * | 2008-06-25 | 2009-12-30 | 沈阳芯源微电子设备有限公司 | The process wall of glue-spreading development equipment |
-
2012
- 2012-11-01 CN CN201210431404.7A patent/CN103792791A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2812052Y (en) * | 2005-07-27 | 2006-08-30 | 沈阳芯源先进半导体技术有限公司 | Structure of photoresist coating developing equipment |
| CN101615561A (en) * | 2008-06-25 | 2009-12-30 | 沈阳芯源微电子设备有限公司 | The process wall of glue-spreading development equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101938041B1 (en) | Substrate treating apparatus | |
| CN206790842U (en) | Container | |
| EP0634699A1 (en) | Clustered photolithography system | |
| CN1877451B (en) | Substrate processing system and substrate processing method | |
| CN102064123B (en) | Vacuum processing system and vacuum processing method of semiconductor processing substrate | |
| CN103080658B (en) | Air handling system | |
| US20210051820A1 (en) | Data center rack system | |
| CN103037665A (en) | Electronic device cooling system with auxiliary cooling device | |
| CN106678966A (en) | Low-noise modular air purification system | |
| JP3213748B2 (en) | Processing system | |
| CN101615561B (en) | Process wall for glue spreading development equipment | |
| US11585600B2 (en) | Softgel drying machine | |
| WO2010054206A2 (en) | Improved process equipment architecture | |
| CN103792791A (en) | Packaged arc-shaped hot acid distributing disc frame structure | |
| CN1904730B (en) | Gluing developing apparatus and chip transmission process | |
| US20120034860A1 (en) | Data center and computer storing rack therefor | |
| US11116111B2 (en) | Method and arrangement for air-conditioning a cold aisle | |
| CN104571426B (en) | A kind of cooling system and cooling means of server | |
| CN109110372A (en) | A kind of low damage power idler wheel and the package part flow arrangement with the idler wheel | |
| CN102820243B (en) | Semiconductor wafer production device | |
| CN209355407U (en) | Modularization air conditioner in machine room and its system | |
| CN2812052Y (en) | Structure of photoresist coating developing equipment | |
| CN220913199U (en) | Aging test system | |
| JP2001093828A (en) | Treatment system | |
| CN109520265A (en) | A kind of horizontal drying unit in pole plate tunnel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140514 |
|
| RJ01 | Rejection of invention patent application after publication |