CN103792019B - A kind of manufacturing method of temperature sensor - Google Patents
A kind of manufacturing method of temperature sensor Download PDFInfo
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- CN103792019B CN103792019B CN201410042690.7A CN201410042690A CN103792019B CN 103792019 B CN103792019 B CN 103792019B CN 201410042690 A CN201410042690 A CN 201410042690A CN 103792019 B CN103792019 B CN 103792019B
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- temperature sensor
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- temperature
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Abstract
The present invention relates to a kind of manufacturing method of temperature sensor, belong to technical field of electronic devices.The inner of thermistor chip and two adjacent wires is respectively welded by the method；Again by thermistor chip and adjacent wires need insulated part insert insulation dip liquid is dipped after take out, formed except exposing except wire pin section, remainder is coated with the temperature sensor of integral insulation outer layer；Then by welding insertion depth requirement, the pin section of two wires is inserted in the temperature molten metal bath higher than insulating outer layer softening temperature so that it is after the insulating barrier softening of end, pushed up against formation end bosses by metal bath surface.Ingenious the solving of the present invention is adopted to dip the problem that insulating barrier end forms abrupt changes in thickness step, thus the insertion positioning welding for temperature sensor in the future is provided convenience, and due to pin leads in the molten metal of scolding tin etc dipped, be therefore more beneficial for the electrical connection quality ensureing in the future to weld.
Description
Technical field
The present invention relates to the manufacture method of a kind of sensor, especially a kind of manufacturing method of temperature sensor, belong to technical field of electronic devices.
Background technology
Application number be 200920047772.5 Chinese patent disclose a kind of temperature sensor, this product contains thermistor chip, and the inner of thermistor chip and two adjacent wires is respectively welded.Wherein, the insulated part that needs of thermistor chip and adjacent wires is flexible-epoxy integral coating, forms integral insulation outer layer.Owing to having broken the manufacture method adding insulated sleeve on wire of routine, define the integral insulation Rotating fields of uniqueness, not only save loaded down with trivial details peeling operation, significantly improve work efficiency, and the insulating barrier outside final temperature sensor is formed by dipping flexible-epoxy completely, therefore insulating outer layer good integrity, it does not have gap, crackle not easily occurs, helps to ensure that the reliable and stable of temperature sensor performance.
But, compared with adding the traditional product that insulated sleeve is made in pin leads, adopt the integral insulation two that similar said method is made to separate pin temperature sensor and run into problems with in practical application in the future: when temperature sensor is welded on a printed circuit, owing to the insulating barrier in its pin leads is by dipping formation, therefore its end thickness can be naturally thinning gradually because dipping sagging, fails to be formed because of abrupt changes in thickness end step as insulated sleeve；Pin leads is inserted in the jack of printed circuit board (PCB) and cannot rely on step naturally positions by result, need when being not only due to weld artificially control insertion depth to be operated inconvenience, and slightly do not note, it is easy to initial insulating segment is inserted jack, the electrical connection quality after impact welding.
Summary of the invention
It is an object of the invention to: for above-mentioned prior art Problems existing, it is proposed to a kind of manufacturing method of temperature sensor that can make to dip insulating barrier end formation abrupt changes in thickness step, thus for carrying out being welded on the first-class operation offer facility of printed circuit board (PCB) in the future.
In order to reach object above, the basic step of the manufacturing method of temperature sensor of the present invention is as follows:
The first step, the inner of thermistor chip and two adjacent wires is respectively welded；
Second step, by thermistor chip and adjacent wires need insulated part insert insulation dip liquid is dipped after take out, formed except exposing except wire pin section, remainder is coated with the temperature sensor of integral insulation outer layer；
3rd step, by welding insertion depth requirement, the pin section of two wires is inserted in the temperature molten metal bath higher than insulating outer layer softening temperature so that it is after the insulating barrier softening of end, pushed up against formation end bosses by metal bath surface.
It is that described insulating outer layer is softening temperature is the epoxy resin of 150 ± 10 DEG C, and described metal is the scolding tin of melt temperature 380-400 DEG C that the present invention further improves.
Ingenious the solving of the present invention is adopted to dip the problem that insulating barrier end forms abrupt changes in thickness step, thus the insertion positioning welding for temperature sensor in the future is provided convenience, and due to pin leads in the molten metal of scolding tin etc dipped, be therefore more beneficial for the electrical connection quality ensureing in the future to weld.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the present invention is further illustrated.
Fig. 1 is the temperature sensor finished product structure schematic diagram of one embodiment of the invention.
Detailed description of the invention
Embodiment one
The manufacturing method of temperature sensor of the present embodiment, referring to Fig. 1, completes to manufacture by step in detail below:
The first step, the inner of thermistor chip 1 and two adjacent wires 2 is respectively welded, it is achieved required electrical connection；
Second step, need insulated part the to insert epoxy resins insulation that softening temperature is 150 ± 10 DEG C of thermistor chip 1 and adjacent wires 2 is dipped liquid is dipped after take out, formed except exposing except wire pin section, the temperature sensor of remainder cladding integral insulation outer layer 3, the now end thickness meeting of insulating outer layer 3 forms nature thinning section 3-2 because dipping sagging；Under 80 ± 5 DEG C of conditions, it is incubated 30 minutes, makes insulating outer layer 3 surface cure；Again the acetone that insulating barrier volumetric mixture ratio is 2～1.5:1 outside two wires and ethanol diluent are soaked 30 ± 5 minutes；So contribute to the projection that insulating barrier at high temperature comparatively fast softens and is rolled into " trouser " shape；
3rd step, by welding insertion depth requirement, the pin section of two wires 2 is inserted in the gun-metal tin soldering liquid of melt temperature 380-400 DEG C of argentiferous 3%, the severity control of tin soldering liquid is equal to required pin segment length H, pushed up against h by tin soldering liquid face after making the insulating barrier nature thinning section 3-2 softening of pin end and highly form the protruding 3-1 of end " trouser " shape, expose the pin section that length is H；
4th step, make insulating outer layer 3 be fully cured, the manufacture of temperature sensor can be completed.
In addition to the implementation, the present invention can also have other embodiments.All employings are equal to replacement or the technical scheme of equivalent transformation formation, all fall within the protection domain of application claims.
Claims (4)
1. a manufacturing method of temperature sensor, it is characterised in that comprise the following steps:
The first step, the inner of thermistor chip and two adjacent wires is respectively welded；
Second step, by thermistor chip and adjacent wires need insulated part insert insulation dip liquid is dipped after take out, formed except exposing except wire pin section, remainder is coated with the temperature sensor of integral insulation outer layer；
3rd step, by welding insertion depth requirement, the pin section of two wires is inserted in the temperature molten metal bath higher than insulating outer layer softening temperature so that it is after the insulating outer layer softening of end, pushed up against formation end bosses by metal bath surface.
2. manufacturing method of temperature sensor according to claim 1, it is characterised in that: described insulating outer layer is softening temperature is the epoxy resin of 150 ± 10 DEG C, and described metal is the scolding tin of melt temperature 380-400 DEG C.
3. manufacturing method of temperature sensor according to claim 2, it is characterised in that: before described 3rd step, the acetone that insulating outer layer volumetric mixture ratio is 2～1.5:1 outside two wires and ethanol diluent are soaked 30 ± 5 minutes.
4. manufacturing method of temperature sensor according to claim 3, it is characterized in that: thermistor chip and adjacent wires are needed insulated part to insert after insulation dips and dip taking-up in liquid by described second step, under 80 ± 5 DEG C of conditions, it is incubated 30 minutes, makes insulating outer layer surface cure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410042690.7A CN103792019B (en) | 2014-01-28 | 2014-01-28 | A kind of manufacturing method of temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410042690.7A CN103792019B (en) | 2014-01-28 | 2014-01-28 | A kind of manufacturing method of temperature sensor |
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| Publication Number | Publication Date |
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| CN103792019A CN103792019A (en) | 2014-05-14 |
| CN103792019B true CN103792019B (en) | 2016-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410042690.7A Active CN103792019B (en) | 2014-01-28 | 2014-01-28 | A kind of manufacturing method of temperature sensor |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104501988B (en) * | 2014-12-16 | 2017-09-08 | 南京时恒电子科技有限公司 | A kind of preparation method of wide warm area high accuracy NTC temperature sensors |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3815074A (en) * | 1972-05-02 | 1974-06-04 | Shibaura Electronics Co Ltd | Thermistor for temperature measurement |
| EP0243097A2 (en) * | 1986-04-24 | 1987-10-28 | Richard A. Falk | Improvements in thermocouples |
| CN101583858A (en) * | 2007-06-19 | 2009-11-18 | 株式会社村田制作所 | Temperature sensor with lead wires |
| CN201434734Y (en) * | 2009-07-16 | 2010-03-31 | 汪洋 | ntc temperature sensor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60210729A (en) * | 1984-04-04 | 1985-10-23 | Chino Works Ltd | Temperature sensor |
| JP4963311B2 (en) * | 2009-03-31 | 2012-06-27 | 株式会社芝浦電子 | Temperature sensor for measurement |
-
2014
- 2014-01-28 CN CN201410042690.7A patent/CN103792019B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3815074A (en) * | 1972-05-02 | 1974-06-04 | Shibaura Electronics Co Ltd | Thermistor for temperature measurement |
| EP0243097A2 (en) * | 1986-04-24 | 1987-10-28 | Richard A. Falk | Improvements in thermocouples |
| CN101583858A (en) * | 2007-06-19 | 2009-11-18 | 株式会社村田制作所 | Temperature sensor with lead wires |
| CN201434734Y (en) * | 2009-07-16 | 2010-03-31 | 汪洋 | ntc temperature sensor |
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| CN103792019A (en) | 2014-05-14 |
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